Machine learning thermal circuit network model for thermal design
  optimization of electronic circuit board layout with transient heating chips
  This paper describes a method combining Bayesian optimization (BO) and a
lamped-capacitance thermal circuit network model that is effective for speeding
up the thermal design optimization of an electronic circuit board layout with
transient heating chips. As electronic devices have become smaller and more
complex, the importance of thermal design optimization to ensure heat
dissipation performance has increased. However, such thermal design
optimization is difficult because it is necessary to consider various
trade-offs associated with packaging and transient temperature changes of
heat-generating components. This study aims to improve the performance of
thermal design optimization by artificial intelligence. BO using a Gaussian
process was combined with the lamped-capacitance thermal circuit network model,
and its performance was verified by case studies. As a result, BO successfully
found the ideal circuit board layout as well as particle swarm optimization
(PSO) and genetic algorithm (GA) could. The CPU time for BO was 1/5 and 1/4 of
that for PSO and GA, respectively. In addition, BO found a non-intuitive
optimal solution in approximately 7 minutes from 10 million layout patterns. It
was estimated that this was 1/1000 of the CPU time required for analyzing all
layout patterns.
