Defect Detection on Semiconductor Wafers by Distribution Analysis
  A method for object classification that is based on distribution analysis is
proposed. In addition, a method for finding relevant features and the
unification of this algorithm with another classification algorithm is
proposed. The presented classification algorithm has been applied successfully
to real-world measurement data from wafer fabrication of close to hundred
thousand chips of several product types. The presented algorithm prefers
finding the best rater in a low-dimensional search space over finding a good
rater in a high-dimensional search space. Our approach is interesting in that
it is fast (quasi-linear) and reached good to excellent prediction or detection
quality for real-world wafer data.
