Cross-Layer Approximation For Printed Machine Learning Circuits
  Printed electronics (PE) feature low non-recurring engineering costs and low
per unit-area fabrication costs, enabling thus extremely low-cost and on-demand
hardware. Such low-cost fabrication allows for high customization that would be
infeasible in silicon, and bespoke architectures prevail to improve the
efficiency of emerging PE machine learning (ML) applications. However, even
with bespoke architectures, the large feature sizes in PE constraint the
complexity of the ML models that can be implemented. In this work, we bring
together, for the first time, approximate computing and PE design targeting to
enable complex ML models, such as Multi-Layer Perceptrons (MLPs) and Support
Vector Machines (SVMs), in PE. To this end, we propose and implement a
cross-layer approximation, tailored for bespoke ML architectures. At the
algorithmic level we apply a hardware-driven coefficient approximation of the
ML model and at the circuit level we apply a netlist pruning through a full
search exploration. In our extensive experimental evaluation we consider 14
MLPs and SVMs and evaluate more than 4300 approximate and exact designs. Our
results demonstrate that our cross approximation delivers Pareto optimal
designs that, compared to the state-of-the-art exact designs, feature 47% and
44% average area and power reduction, respectively, and less than 1% accuracy
loss.
