Breaking the Memory Wall for AI Chip with a New Dimension
  Recent advancements in deep learning have led to the widespread adoption of
artificial intelligence (AI) in applications such as computer vision and
natural language processing. As neural networks become deeper and larger, AI
modeling demands outstrip the capabilities of conventional chip architectures.
Memory bandwidth falls behind processing power. Energy consumption comes to
dominate the total cost of ownership. Currently, memory capacity is
insufficient to support the most advanced NLP models. In this work, we present
a 3D AI chip, called Sunrise, with near-memory computing architecture to
address these three challenges. This distributed, near-memory computing
architecture allows us to tear down the performance-limiting memory wall with
an abundance of data bandwidth. We achieve the same level of energy efficiency
on 40nm technology as competing chips on 7nm technology. By moving to similar
technologies as other AI chips, we project to achieve more than ten times the
energy efficiency, seven times the performance of the current state-of-the-art
chips, and twenty times of memory capacity as compared with the best chip in
each benchmark.
