Optimization of Passive Chip Components Placement with Self-Alignment
  Effect for Advanced Surface Mounting Technology
  Surface mount technology (SMT) is an enhanced method in electronic packaging
in which electronic components are placed directly on soldered printing circuit
board (PCB) and are permanently attached on PCB with the aim of reflow
soldering process. During reflow process, once deposited solder pastes start
melting, electronic components move in a direction that achieve their highest
symmetry. This motion is known as self-alignment since can correct potential
mounting misalignment. In this study, two noticeable machine learning
algorithms, including support vector regression (SVR) and random forest
regression (RFR) are proposed as a prediction technique to (1) diagnose the
relation among component self-alignment, deposited solder paste status and
placement machining parameters, (2) predict the final component position on PCB
in x, y, and rotational directions before entering in the reflow process. Based
on the prediction result, a non-linear optimization model (NLP) is developed to
optimize placement parameters at initial stage. Resultantly, RFR outperforms in
terms of prediction model fitness and error. The optimization model is run for
6 samples in which the minimum Euclidean distance from component position after
reflow process from ideal position (i.e., the center of pads) is outlined as
25.57 ({\mu}m) regarding defined boundaries in model.
