Learning-based Application-Agnostic 3D NoC Design for Heterogeneous
  Manycore Systems
  The rising use of deep learning and other big-data algorithms has led to an
increasing demand for hardware platforms that are computationally powerful, yet
energy-efficient. Due to the amount of data parallelism in these algorithms,
high-performance 3D manycore platforms that incorporate both CPUs and GPUs
present a promising direction. However, as systems use heterogeneity (e.g., a
combination of CPUs, GPUs, and accelerators) to improve performance and
efficiency, it becomes more pertinent to address the distinct and likely
conflicting communication requirements (e.g., CPU memory access latency or GPU
network throughput) that arise from such heterogeneity. Unfortunately, it is
difficult to quickly explore the hardware design space and choose appropriate
tradeoffs between these heterogeneous requirements. To address these
challenges, we propose the design of a 3D Network-on-Chip (NoC) for
heterogeneous manycore platforms that considers the appropriate design
objectives for a 3D heterogeneous system and explores various tradeoffs using
an efficient ML-based multi-objective optimization technique. The proposed
design space exploration considers the various requirements of its
heterogeneous components and generates a set of 3D NoC architectures that
efficiently trades off these design objectives. Our findings show that by
jointly considering these requirements (latency, throughput, temperature, and
energy), we can achieve 9.6% better Energy-Delay Product on average at nearly
iso-temperature conditions when compared to a thermally-optimized design for 3D
heterogeneous NoCs. More importantly, our results suggest that our 3D NoCs
optimized for a few applications can be generalized for unknown applications as
well. Our results show that these generalized 3D NoCs only incur a 1.8%
(36-tile system) and 1.1% (64-tile system) average performance loss compared to
application-specific NoCs.
