Performance Assessment of different Machine Learning Algorithm for
  Life-Time Prediction of Solder Joints based on Synthetic Data
  This paper proposes a computationally efficient methodology to predict the
damage progression in solder contacts of electronic components using
temperature-time curves. For this purpose, two machine learning algorithms, a
Multilayer Perceptron and a Long Short-Term Memory network, are trained and
compared with respect to their prediction accuracy and the required amount of
training data. The training is performed using synthetic, normally distributed
data that is realistic for automotive applications. A finite element model of a
simple bipolar chip resistor in surface mount technology configuration is used
to numerically compute the synthetic data. As a result, both machine learning
algorithms show a relevant accuracy for the prediction of accumulated creep
strains. With a training data length of 350 hours (12.5% of the available
training data), both models show a constantly good fitting performance of $R^2$
of 0.72 for the Multilayer Perceptron and $R^2$ of 0.87 for the Long Short-Term
Memory network. The prediction errors of the accumulated creep strains are less
than 10% with an amount of 350 hours training data and decreases to less than 5
% when using further data. Therefore, both approaches are promising for the
lifetime prediction directly on the electronic device.
