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The Jobspring ExperienceRSS
Archive: February - 2015 (4)
2015 UI/UX Design Trends
Article by Daniel Urbaniak, Practice Manager in Jobspring Silicon Valley
Running a sales and recruiting team comes with many challenges; keeping up on technology trends typically falls on the back burner for most. However, those who keep up with the 'latest and greatest' trends have the upper hand in educating those you are assisting with their search. The UI/UX design world is no exception, with 88% of young adults being connected to a smartphone it has become imperative to deliver the best user experience to compete. (Creativeblog)
2014 brought us design trends like: The hamburger menu, pushing the limited when it comes to resolution, and the expansion of in-house design teams. With the end of the first quarter on the horizon, I thought it would be a great time to discuss a few of the design trends we will be seeing in 2015.
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Lean design has been leading the way in recent design trends. This will continue, but as companies and designers continue to hone lean design and how it lends itself to mobile applications, they also need to set themselves apart. In 2015, we will see (and we have already started to) skeuomorphic cues in lean design. Keep an eye out for additional physical presences; transparency and layers will become more common, apps will continue to look flat and conform to strict grids. The focus of design will revolve around movable objects within the screen. In the summer of 2014, Google transposed this design trend on Material Design.
Slippy UX
I am definitely guilty of (over) using the term sticky or stickiness when talking about design. I like the idea of creating applications that not only engage a user on their first use, but also ones that keeps the user interested over extended periods of times or uses. The more our devices become connected to our everyday lives, i.e. thermostats, home security, or digital experience with our cars, the greater the need is for efficient and effective delivery of information. Slippy UX is giving the user an application designed for "glance-ability". Coined by Jake Zukowski, Assistant Creative Director at Frog Design, "slippy UX is intended to be invisible-enough and non-distracting enough for the user while still delivering and absorbing information".
There are two emerging trends in connectivity, the first being something more apparent every day, even if we are not aware of it. The ability to send information to many devices, syncing with the cloud, and allowing users to maneuver their information has already started to be a driving force in design. Forrester Research found that 90% of users who own multiple devices start a task on one device and finish it on another. In 2015, we will see user experience that functions across all platforms seamlessly, regardless of device or screen size. The second connectivity trend will be an extension of what some of our mobile apps already do: accessing GPS and Bluetooth to respond better to user needs. The combination of these integrations, wearable technology, and the Internet of Things will result in apps that collect data on the user to deliver advice and infer when the device should be delivered. The term to look for here is Ambient Intelligence.
With worldwide IT on track to spend a total of 3.8 trillion in 2015, we will see the above trends and many more, become apparent in our every day lives.(Gartner.com) What trends are you excited about in UI/UX Design for 2015?
What NOT To Do In Your Technical Job Search
Article by Tom Parzych, Practice Manager in Jobspring DC.
There are a lot of articles on the World Wide Web that instruct potential job seekers on what they should do: how to conduct their search, format their resume, present themselves on interviews, and negotiate the right offer. Here, we discuss a different spin by discussing what potential seekers should NOT do in their efforts to find a new position.
There are certain misconceptions that people have when starting the search for the right role and making the wrong decision can sometimes make the search all that much harder. First, I will discuss what not to do while starting your search. Next, I will cover what not to do when formatting your resume. This can be especially critical since this is typically your first 'in' with a potential hiring manager. Lastly, I will cover how to not conduct yourself during the interview process, and how to handle some hard-to-answer questions.
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Do NOT expect the Resume Boards to find your next position...
In the technology field, there are more than enough positions open, which span various fields, niches, and locations. Many are under the impression that this means recruiters, HR, hiring managers, and others of the like are constantly checking the boards for talented resumes. While there is some truth to this, many positions get filled through networking and referrals. I'm sure every programmer, systems analyst, DevOps Engineer, DBA, etc. have gotten calls when posting their resume that are inappropriate for the basic requirements of what they are looking for (i.e. location, title, salary range, contract or permanent roles). This is because anyone has access to your profile and will try to make a square peg fit into a round hole.
In order to find the next position, you must be proactive rather than reactive. Technology is a very different industry than most other industries. You should be sending your resume to companies that you find interesting (regardless of a job posting or not). You should also be connecting with people at those companies through social media that is profession-friendly (LinkedIn, Google+, etc.), this is the tech industry; be creative! You should also be connecting with recruiters that are specific to your location and know the local market or have inside information. Furthermore, since the tech industry is very collaborative and sharing in their training, you should check out local tech-specific meetings and advocacy groups for introductions to others within the tech industry. Get yourself out there, connect with people who likely have similar interests, and market yourself to the open industry…do NOT expect your resume online to do all the work!
Do NOT make decisions for the individual considering your resume…
The first step in most job searches is to update your resume. This can be a very daunting task for some, as 'selling' yourself on a piece of paper is nearly impossible. You should have a copy of your resume that you update for specific positions, and use your experience to relay your qualifications for the duties of that specific posting. However, many people 'screen' themselves out of even applying for a job based on some 'requirements' of the posting. Most hiring managers understand the difficulty of conveying a skill set on a resume (remember: they are people too, and have probably even looked for a job themselves). If you make the decision that you are unqualified based on a 'job requirement', you are essentially making the decision for the person who is considering your resume, and that decision is 'no'.
Now, this advice shouldn't be taken too literally. I'm speaking to certain job requirements. Such as, if you have 5 years of experience and the posting calls for 7 years of experience, you should give yourself the shot. Perhaps you have had more diverse experience in those 5 years versus someone with the targeted 7 years. Additionally, if the role calls for 6-7 years of experience, and you only have 4-5/7 years, send in your application regardless! Most understand the room for potential and growth, which should be conveyed through your interview process.
Do NOT make your resume a Novel
(no matter how much experience you have)…
Any technical resume over 3 pages is not being read. Do NOT make your resume overly detailed. Especially in technology, most of the languages or systems you used 6 years ago may not be relevant to the current tech landscape. Technology is constantly evolving and those who work in the field need to do the same, and more importantly, show that evolution. This is directed towards those who would be considered senior in their career, of course, but you should not have to list every technology you've worked with since the beginning of your career. Instead, focus on those projects that are current, relevant, or that you've acquired on your own time (through mentorship, side projects, etc.).
When you are targeting a specific role, if the posting calls for a requirement you possess, but most other roles don't- make sure to put the skill on the resume for that role and move on. For example, if you are a Microsoft Web Developer, your C# experience should be applicable for 98% of the roles you are applying for. That VB.NET experience from 5 or 6 years ago may only be applicable for one posting. Additionally, if you have 4 years of JAVA and 3 years of C#, but want to work in a JAVA environment, tailor your resumes appropriately and apply for those positions. Most hiring managers will pass on those who 'walk the line', because it shows some experience in a couple of things, rather an expertise in one or two things. You should NOT just have one copy of your resume, there should be a couple variations.
Do NOT get in your own way through your interview process…
Phone screens are sometimes a necessary evil. While the industry is moving heavily towards first-round in-person interviews, there are still some companies, hiring managers, etc. that conduct phone screens as the initial point of contact. With this being the case, there are certain assumptions you should NOT be making. Within technology, there is a misconception that the recruiter or HR representative conducting the phone call may not be technical or may not really know how to 'screen' you. However, more and more technical positions call for someone to interface with people in the company, both who are technical and non-technical. These screens can be a great way to show your diversity and ability to work with different internal constituents. When speaking on the phone with a hiring manager, some assume there is no room for fault or difference. Make sure to conduct the interview in a conversational way, if they ask you a 'how to' question, and you get the feeling that isn't what they are looking for, clarify it with them! Do NOT assume that there are only black and white, yes or no answers.
A lot of people within technology are typically very good at what they do, but can have a hard time relaying this information in an appropriate way. For instance, one should never speak in absolutes and they should be very careful about the verbiage used. Recently, I had a candidate go to an in-person interview with a hiring manager for a local start-up. The candidate was a great fit for the role, and he was really excited about the position. When he met with the hiring manager, he was asked a question: "How would you rate your experience with ASP.NET". Now, the candidate was a Web Developer with tons of ASP.NET (and he really knew his stuff), and he answered "Expert level". Fatal mistake. The next question from the hiring manager was about some concepts of ASP.NET, and the candidate got all right but one. When the hiring manager was providing feedback, he said the candidate "shot himself in the foot". He explained that while he was very interested in the candidate, his concern is that the candidate wasn't an 'expert' and got a very simple (in his eyes) question wrong and that indicated a level of not only knowledge but naivetés that he could not justify. The candidate should have answered with "I'm very comfortable/confident with my experience, but I'm always learning". This probably would have allowed for a more positive dialogue vs. the one that resulted.
In addition to remembering what to do in your technical job search, remember what NOT do to!
I'm hoping that this information will be helpful to those who are looking for more than the typical 'how to get a job' articles. While there are very specific recommendations and information out there on what to do to get a job, there are also a lot of things NOT to do that are sometimes forgotten. These small, but sometimes costly, mistakes can be the difference between you landing the 'right' job and the 'next' job!
Best Practices to Keep Your Engineers Happy
Article by Charlotte Haun, Practice Manager in Jobspring LA.
There has been a lot of buzz in the tech community around companies doing whatever it takes to attract talent. From posting competitive salaries to offering candidates large bonuses, transportation, and equity, companies are stepping up their compensation and benefits package yearly to adjust to the fluctuation of demand for quality talent that are equally passionate about the idea, product, and team.
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It is important to make sure that engineers are comfortable, content, and happy at their current company. Most engineers will tell you that their voicemails and LinkedIn inboxes are probably full from being contacted by internal and external recruiters, hiring managers, and former colleagues on a daily basis. Engineers who state that they are happy with their jobs are usually open to hearing about new opportunities, especially opportunities that include better perks, compensation, benefits, bonuses and growth opportunity.
One of the most common things I hear as a recruiter, when speaking to engineers regarding their reason for their job search, are "growth, money, commute, and new technology." It is important to make sure that your engineers are cared for and are happy in order to maintain low job turnover and quality work.
Here are five tips on how to keep your engineers happy:
Growth: Make sure that potential engineers see growth opportunity/advancement in your company. This could be in various forms like growth in title, salary, or responsibility. Regardless of whether a higher level position is available at the time, make sure there is communication about when the company expands and what the future looks like for the employee. If they don't see advancement in the future, most engineers will eventually hit their ceiling and want to move on. Try to keep that ceiling as high as possible to keep engineers longer.
Work/Life Balance: It is important to offer your engineers a healthy work/life balance. You may not be able to physically move your office, but at least try to accommodate commuters. Offer flex hours. Allow one or two days a week remote work. Perhaps provide a "crash pad" for employees that are traveling to stay at a few nights a week if needed. When your employees are taken care of and are not burnt out, they will produce the best work! Investing in your employees is the most important investment one can make.
Recognize good work: Recognition can come in various forms. Good performance should be recognized in little ways, and on a daily basis with things as simple as a "nice job" or a thank you. Managers should also make a point to get direct one-on-one time to let engineers know that their contributions are appreciated. Celebrating over a nice dinner when they hit an achievement shows the engineers that they are appreciated. Allow them some freedom when good work is done-let them work from home if they prove they can deliver. Lastly, recognize good work with a positive review, raise or bonus, or increase in stock!
Take feedback: Check in with your team. Find out if they are starting to feel burnt out, frustrated, or bored. Ask what they think of the team and current projects. Take their ideas on new technologies, procedures, or things around the office. Be open to constructive criticism, as your engineers' feedback will allow you to become a better manager.
Innovation in all forms: Keep up to date with technology as much as possible. Engineers always want to be doing the latest and greatest, so if they are using the same tech stack that they started with 5 years ago, they will get bored and tempted to explore. If your projects are not compatible with new technology, then allow engineers some time to explore on their own. Encourage your employees to constantly seek growth and education and allow them to thrive in the things that they are personally interested in.
Your engineers are one of your company's most valuable assets. Make sure that they are taken care of, rewarded, and encouraged, and they will continue to be of the utmost value to your company.
Ask the Tough Question: "Why?"
Article by Keith Wilson, Practice Manager in Jobspring Philadelphia.
Do you want all of your questions answered? If so, start asking one simple question: Why. It's nothing revolutionary, but at the same time, it's also counterintuitive. Growing up, I was always instructed to do as I was told. This process served me well in both school and sports. Once I transitioned into recruiting after college, I was educated on the benefits of digging deeper and asking why I should do the things I was being asked to do. Over the years, I came to understand that all of the answers I wanted were right at my disposal. I just had to ask for them. So as an interviewer or interviewee, why do you need to ask the tough question?
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To Fully Understand the Situation
The ability to understand is fundamental to being successful as both an employer and employee. This sounds elementary, but I've experienced what happens when I dive head-first into a project/task without asking any questions. Mistakes are made, but lessons learned quickly. Your strategy should be to understand the full scope of the process and figure out how your actions are going to align with the end goal. Whether you are an employer or employee, these details will allow you to properly diagnose the situation and help you pivot accordingly.
To Get a Deeper Perspective
For example, if I am speaking with a client that's looking to hire 5 engineers over the next 2 months, I need to understand why. Obviously, your hiring spree is great news, but what's the driving force behind this need? Are these positions out of growth, or did the entire team quit because they are working 60 hours a week? This is just a basic example to illustrate a simple situation where the "why" is vital in moving forward. Once I know the underlying facts of the situation, I can move forward, properly educated, with an eye on the expectations that lie ahead.
Sidenote: There is no need to probe people on sensitive information that may not be professional. That is not the purpose behind these conversations. If you lay up the question properly, it will be well-received. Don't make it weird.
To Receive Feedback You May Not Want, But Still Need
You do not want to shy away from the tough questions in your own life, either. Asking your boss why you didn't get the promotion may not come easy, but it may be advice that will advance your career in the long run. Sometimes you just need to delve deeper than surface-level to understand what's going on. When you remove the roadblocks behind that "why", your vision will become clearer.
This isn't a fool proof plan, but it's a great exercise to practice. Try it the next time you're working on a new project with a co-worker or friend and see if you receive some feedback that you weren't previously aware of. This may allow the creative juices to flow a bit easier and lead you to your next breakthrough. Remember, sometimes nothing is more powerful than the three letter word: Why.


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Patent application title: METHODS OF AFFECTING MATERIAL PROPERTIES AND APPLICATIONS THEREFOR
Ludovic Godet (Boston, MA, US)
Ludovic Godet (Boston, MA, US)
Christopher Hatem (Hampton, NH, US)
Deepak Ramappa (Cambridge, MA, US)
Deepak Ramappa (Cambridge, MA, US)
Xianfeng Lu (Beverly, MA, US)
Xianfeng Lu (Beverly, MA, US)
Anthony Renau (West Newbury, MA, US)
Patrick Martin (Ipswich, MA, US)
IPC8 Class: AC23C1448FI
USPC Class:
Class name: Direct application of electrical, magnetic, wave, or particulate energy ion plating or implantation nonuniform or patterned ion plating or ion implanting (e.g., mask, etc.)
Publication date: 2012-11-15
Patent application number: 20120288637
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Methods of affecting a material's properties through the implantation of
ions, such as by using a plasma processing apparatus with a plasma sheath
modifier. In this way, properties such as resistance to chemicals,
adhesiveness, hydrophobicity, and hydrophilicity, may be affected. These
methods can be applied to a variety of technologies. In some cases, ion
implantation is used in the manufacture of printer heads to reduce
clogging by increasing the materials hydrophobicity. In other
embodiments, MEMS and NEMS devices are produced using ion implantation to
change the properties of fluid channels and other structures. In
addition, ion implantation can be used to affect a material's resistance
to chemicals, such as acids.
1. A method of affecting a workpiece's chemical resistance, comprising:
performing a low energy implant of a species into part of a surface of
said workpiece, wherein said species comprises a noble gas.
2. The method of claim 1, wherein said surface comprises a 3D feature.
3. The method of claim 2, where said part of said surface comprises a sidewall of said 3D feature.
4. A method of fabricating an inkjet print head, comprising: providing a workpiece, having a top surface, a bottom surface and an aperture passing therethrough, said aperture forming a nozzle; performing a focused ion implantation of said nozzle to affect hydrophobicity of said nozzle; and applying a cover to said top surface.
5. The method of claim 4, further comprising etching said aperture into said workpiece.
6. The method of claim 4, wherein said ion implantation is performed using CF.sub.4.
7. The method of claim 4, wherein said workpiece comprises an exit area where said aperture meets said bottom surface, and said method further comprises performing a focused ion implant on said exit area so that said exit area has a different hydrophobicity than said nozzle.
8. The method of claim 4, wherein said ion implantation is performed to a depth of less than 100 nm.
9. The method of claim 4, further comprising performing an ion second ion implantation on said top surface such that said top surface has a different hydrophobicity than said nozzle.
10. A method of fabricating an electromechanical device, comprising: identifying a first region of interest in said device, said first region being less than the entirety of said device, where affecting a first property of said first region of interest may be beneficial; and performing a focused ion implantation of said identified region to affect a property of said first region of interest.
11. The method of claim 10, wherein said first region of interest comprises a region where fluid passes through and said first property comprises hydrophobicity.
12. The method of claim 11, wherein said ion implantation is performed using CF.sub.4.
13. The method of claim 10, wherein said first region of interest comprises a movable part and said first property comprises adhesion.
14. The method of claim 10, wherein said ion implantation is performed to a depth of less than 100 nm in said region.
15. The method of claim 10, further comprising identifying a second region of interest; and performing a second focused ion implantation of said second region of interest.
16. The method of claim 15, wherein said second region of interest has a property to be affected different than said first property.
17. The method of claim 10, wherein said first region of interest comprises a region in contact with a chemical and said first property is resistance to said chemical.
[0001] This application claims priority of U.S. Provisional Patent
Application Ser. Nos. 61/486,296, 61/486,297 and 61/486,299, all filed
May 15, 2011, the disclosures of which are all incorporated by reference
in their entireties.
[0002] This invention relates to ion implantation and, more particularly, to ion implantation for precision material modification.
[0003] Ion implantation is a standard technique for introducing material into a workpiece. A desired implant material is ionized in an ion source, the ions are accelerated to form an ion beam of prescribed energy, and the ion beam is directed at the surface of the workpiece. The energetic ions in the beam penetrate into the bulk of the workpiece material and affect both the surface and depth of the workpiece material under certain conditions.
[0004] While ion implantation is typically used to alter the electrical properties of a workpiece, it can also be used to affect other material properties, such as resistance to specific chemicals, adhesion, hydrophobicity, hydrophilicity, and others.
[0005] Inkjet printing is a technique that ejects liquid ink onto paper. The inkjet print head (or cartridge) has nozzles that are about the size of a needlepoint through which the ink is ejected. FIG. 1 is a view of an embodiment of an inkjet printer head 1. In some embodiments, such as that shown in FIG. 1, the head 1 may include multiple nozzles 2 to accommodate a plurality of colored inks 3. The printing process may involve a nucleation step using the ink, bubble growth, ejection of an ink drop, and refilling of the inkjet head.
[0006] Printing resolution and lifetime are both limited by the inkjet aperture size. Smaller apertures can provide higher resolution, but the lifetime is reduced due to clogging of the aperture with the ink. Applying inkjet printing to new fields such as, for example, biochips, metal wiring, liquid crystal displays (LCDs), organic light-emitting diodes (OLEDs), or MEMS devices is being investigated. However, suitable printing heads are required for each application before widespread adoption can occur. For example, ejection of high viscosity ink droplets may need to provide high precision, high frequency, no chemical reaction, and no clogging. Thus, it may be beneficial to affect the properties of the material used to create the print head to minimize the interaction between the ink and the print head.
[0007] Another application where affecting material properties may be beneficial is MEMS and NEMS devices. MEMS devices relate to small mechanical devices driven by electricity. NEMS devices relate to devices integrating electrical and mechanical functionality on the nanoscale. Examples of these devices are accelerometers and gyroscopes, though there are countless others. MEMS and NEMS processing is extremely complex. One difficulty is that precise material modification to locally affect material properties has not been effectively demonstrated.
[0008] In addition, many materials would benefit from increased or modified chemical resistance. High energy ion implantation has been used in the past to affect chemical resistance of some materials. High energy implants may be time-consuming and may lead to increased manufacturing costs. These high energy implants also typically used exotic species such as Al, Mg, or Ti, which may be expensive. Furthermore, previous methods only treated a thick layer on the surface of the material and in some instances hardened the surface, which affected flexibility of the material.
[0009] Therefore, in each of these examples, it would be beneficial to have an improved method of precisely affecting material properties. Such an improved method could then be applied to various technologies, including inkjet printing, biochips and MEMS and NEMS devices, such as accelerometers, pressure sensors and gyroscopes.
[0010] Methods of affecting a material's properties through the implantation of ions, such as by using a plasma processing apparatus with a plasma sheath modifier. In this way, properties such as resistance to chemicals, adhesion, hydrophobicity and hydrophilicity, may be affected. These methods can be applied to a variety of technologies. In some cases, ion implantation is used in the manufacture of printer heads to reduce clogging by increasing the material's hydrophobicity. In other embodiments, MEMS and NEMS devices are produced using ion implantation to change the properties of fluid channels and other structures. In addition, ion implantation can be used to affect a material's resistance to chemicals, such as acids.
[0011] For a better understanding of the present disclosure, reference is made to the accompanying drawings, which are incorporated herein by reference and in which:
[0012] FIG. 1 is a view of an embodiment of an inkjet printer;
[0013] FIG. 2 is a block diagram of a plasma processing apparatus having a plasma sheath modifier;
[0014] FIG. 3 illustrates hydrophobic modulation;
[0015] FIG. 4 is a cross-sectional side view of an embodiment of a print head;
[0016] FIG. 5 is a cross-sectional side view of sidewall porous material formation;
[0017] FIG. 6 is a cross-sectional side view of a workpiece being implanted;
[0018] FIGS. 7A-B represents an embodiment of helium implantation into a structure;
[0019] FIGS. 8A-C show the results of implantation according to FIG. 7;
[0020] FIGS. 9A-D show a representative sequence to treat an inkjet print head;
[0021] FIG. 10 represents a typical biochip;
[0022] FIG. 11 represents a micropump;
[0023] FIG. 12 is an exploded view of the internals of an accelerometer; and
[0024] FIG. 13 is a cross-sectional side view of one embodiment of a 3D structure or feature being implanted.
[0025] The embodiments are described herein in connection with specific materials and devices, but these embodiments should not be limited merely to the materials and devices listed. For example, some of the embodiments are described herein in connection with MEMS and NEMS, but these embodiments also may be used with other devices. Similarly, some of the embodiments are described herein in connection with printers such as inkjet printers, but these embodiments also may be used with other printing devices. These inkjet printers or other printing devices can be used for paper or other applications known to a person skilled in the art. While a specific type of implanter is disclosed, other ion implantation systems known to those skilled in the art that can focus an ion beam or that can implant particular regions of a workpiece with or without a mask on, above, or a distance from the workpiece also may be used in the embodiments described herein. While the term "hydrophobic" is used, throughout, it may be advantageous to render a surface hydrophilic instead. Thus, the invention is not limited to the specific embodiments described below.
[0026] While a beamline or plasma doping tool may be used to implant ions to affect a material's properties, a plasma processing apparatus having a plasma sheath modifier may be used. This has an advantage that selective implantation of 2D or 3D surfaces may be performed without using photoresist, other hard masks, or proximity masks. This sort of patterned implant reduces processing time and manufacturing costs. Scanning the workpiece or device to be implanted may be combined with biasing such a workpiece or device or changing the plasma parameters to accomplish this selective implantation.
[0027] FIG. 2 is a block diagram of a plasma processing apparatus having a plasma sheath modifier. The plasma 140 is generated as is known in the art. This plasma 140 is generally a quasi-neutral collection of ions and electrons. The ions typically have a positive charge while the electrons have a negative charge. The plasma 140 may have an electric field of, for example, approximately 0 V/cm in the bulk of the plasma 140. In a system containing the plasma 140, ions 102 from the plasma 140 are attracted toward a workpiece 100. These ions 102 may be attracted with sufficient energy to be implanted into the workpiece 100. The plasma 140 is bounded by a region proximate the workpiece 100 referred to as a plasma sheath 242. The plasma sheath 242 is a region that has fewer electrons than the plasma 140. Hence, the differences between the negative and positive charges cause a sheath potential in the plasma sheath 242. The light emission from this plasma sheath 242 is less intense than the plasma 140 because fewer electrons are present and, hence, few excitation-relaxation collisions occur. Thus, the plasma sheath 242 is sometimes referred to as "dark space."
[0028] The plasma sheath modifier 101 is configured to modify an electric field within the plasma sheath 242 to control a shape of a boundary 241 between the plasma 140 and the plasma sheath 242. Accordingly, ions 102 that are attracted from the plasma 140 across the plasma sheath 242 may strike the workpiece 100 at a large range of incident angles. This plasma sheath modifier 101 may be referred to as, for example, a focusing plate or sheath engineering plate.
[0029] In the embodiment of FIG. 2, the plasma sheath modifier 101 includes a pair of panels 212 and 214 defining an aperture there between having a horizontal spacing (G). The panels 212 and 214 may be an insulator, semiconductor, or conductor. In other embodiments, the plasma sheath modifier 101 may include only one panel or more than two panels. The panels 212 and 214 may be a pair of sheets having a thin, flat shape. In other embodiments, the panels 212 and 214 may be other shapes such as tube-shaped, wedge-shaped, and/or have a beveled edge proximate the aperture. The panels 212 and 214 also may be positioned a vertical spacing (Z) above the plane 151 defined by the front surface of the workpiece 100. In one embodiment, the vertical spacing (Z) may be about 1.0 to 10.0 mm.
[0030] Ions 102 may be attracted from the plasma 140 across the plasma sheath 242 by different mechanisms. In one instance, the workpiece 100 is biased to attract ions 102 from the plasma 140 across the plasma sheath 242. In another instance, a plasma source that generates the plasma 140 and walls surrounding the plasma 140 are biased positively and the workpiece 100 may be grounded. The biasing may be pulsed in one particular embodiment. In yet another instance, electric or magnetic fields are used to attract ions 102 from the plasma 140 toward the workpiece 100.
[0031] Advantageously, the plasma sheath modifier 101 modifies the electric field within the plasma sheath 242 to control a shape of the boundary 241 between the plasma 140 and the plasma sheath 242. The boundary 241 between the plasma 140 and the plasma sheath 242 may have a convex shape relative to the plane 151 in one instance. When the workpiece 100 is biased, for example, the ions 102 are attracted across the plasma sheath 242 through the aperture between the panels 212 and 214 at a large range of incident angles. For instance, ions 102 following trajectory path 271 may strike the workpiece 100 at an angle of +θ° relative to the plane 151. Ions 102 following trajectory path 270 may strike the workpiece 100 at about an angle of 0° relative to the same plane 151. Ions 102 following trajectory path 269 may strike the workpiece 100 an angle of -θ° relative to the plane 151. Accordingly, the range of incident angles may be between +θ° and -θ° centered about 0°. In addition, some ion trajectories paths such as paths 269 and 271 may cross each other. Depending on a number of factors including, but not limited to, the horizontal spacing (G) between the panels 212 and 214, the vertical spacing (Z) of the panels 212 and 214 above the plane 151, the dielectric constant of the panels 212 and 214, or other process parameters of the plasma 140, the range of incident angles (θ) may be between +60° and -60° centered about 0°.
[0032] The plasma processing apparatus of FIG. 2 can be used to affect the properties of a material. This technique can then be applied to various technologies, as described in more detail below.
[0033] In one embodiment, use of multi-angle ion implantation can modify the property of a nozzle, channel, and inkjet printer head. These may be fabricated of, for example, silicon, polymers, semiconductors, poly(dimethylsiloxane) (PDMS), SU8 photoresist or conductors. FIG. 3 illustrates hydrophobic modulation can be caused by ion implantation. The hydrophobicity of a surface was modulated after implants of NF3 and CF4 using a plasma doping tool. A reference material, shown in the center of FIG. 3, has an initial contact angle of 41.58°. The accompanying illustration 22 depicts the shape of a droplet on the material. By implanting the material with NF3, the contact angle was reduced to 15.08°, indicating that the material has become more hydrophilic. As shown in the upper illustration 21, the droplet is more spread across the surface of the material. Conversely, the bottom illustration 23 shows the effect of a CF4 implant. In this case, the contact angle increases to 103.07°, indicating a high degree of hydrophobicity. Using a multi-angle ion implant can enable changing the hydrophobic or porosity properties of either a 2D or 3D surface. This will allow the correct inkjet droplet properties for a particular printing application.
[0034] As shown in FIG. 3, ion implant can change a surface to be hydrophobic or hydrophilic. Thus, the adhesion of the ink droplets to the surface can be changed. The chemical compatibility or chemical resistance of the surface also can be altered by physical changes to the implanted surface caused by ion implantation. Finally, different liquids may become suitable as inks using inkjet printing (polymers, special inks, metals, oils, nanoparticles, or others) by affecting adhesion or chemical compatibility. Besides enabling new printing applications, all this may lead to higher inkjet printer nozzle lifetimes.
[0035] FIG. 4 is a cross-sectional side view of an embodiment of a print head. Other designs known to those skilled in the art are possible. In one instance, the print head 300 is fabricated from a silicon workpiece through processes such as etching. The silicon devices or parts produced are then bonded to a cover 304 using an adhesion layer. This cover 304 may be metal, glass, SiO2, Si, PDMS, or SU8. In another instance, the print head 300 is made of plastic.
[0036] The print head 300 has multiple surfaces. It has a channel 301 that leads to the nozzle 302. It also has an exit area 303, where the nozzle 302 meets the external environment. All or some of the surfaces of the channel 301, the nozzle 302 and the exit area 303 may be implanted. These surfaces may be implanted with, for example, C, N, H, F, He, Ar, B, As, P, Ge, Ga, Si, Zn, Al, other noble gases, other p-type or n-type dopants, or other atomic or molecular species known to those skilled in the art. The implant depth may be less than 100 nm or, more particularly, between approximately 1 nm and 30 nm, with a surface peak or retrograde profile to modulate the surface energy.
[0037] In one instance, the entirety of the surfaces that contact the ink in the print head 300 is implanted. With a blanket implant, a multi-angle implant can enable implantation of a 3D structure. The nozzle 302 and the sidewalls and bottom of channel 301 may be implanted. The lower surface of the glass cover 304 also may be implanted. This enables liquid to flow without adhering or sticking to the bottom, sides, or top of the channel 301 or nozzle 302.
[0038] In another instance, only a portion of the surfaces that contact the ink in the print head 300 is implanted. This portion may coincide with areas where clogging is common, where ink transport is desired, or other areas. In one particular embodiment, any corners of the print head 300 are implanted to prevent ink from being retained. The corners also may be implanted with a higher dose than other regions of the print head 300.
[0039] Implanting the area where adhesion occurs between, for example, silicon and glass parts of the print head 300 may affect bonding between these two parts. Photoresist or selective implants may prevent this from occurring. In another instance, a selective implant is performed to render certain surfaces hydrophobic while a second selective implant is used to improve or enable the bonding step between the various workpieces.
[0040] The implant will reduce or prevent adhesion by the ink to the print head 300. The ion species that is implanted may in part affect the hydrophobicity, as shown in FIG. 3. Certain energy levels or doses during implantation may modify the lattice structure of the surfaces of the print head 300 in FIG. 4, which also may in part affect the hydrophobicity. Other mechanisms due to implant that affect the hydrophobicity may be possible. Since these regions are implanted, they will remain hydrophobic even if cleaned because these implanted regions are an integral part of the surface of the print head 300 instead of a coating on the surface of the print head 300 that may be eroded or washed off. To maintain the hydrophobic state, at least a few monolayers of the surface are implanted. Uniformity of the dose and depth implanted regions may be controlled. If certain areas of the surface are implanted in a non-uniform manner or are not implanted at all, this may affect adhesion of the ink. In one embodiment, CF4 is implanted at energies between 0.5 and 6.0 kV. In a further embodiment, the voltage is decreased over time to improve adhesion and provide interface mixing between the starting material and the new layer being created. In some embodiments, this material is implanted. In other embodiments, the material may be implanted and deposited.
[0041] In some instances, the inkjet printer head may need to be implanted to affect different regions in opposite ways. For example, referring to FIG. 9D, the ink is stored in an ink chamber 351. The path from the ink chamber 351 to the external environment passes through a nozzle 352, and ultimately through an exit area 353. Two important aspects of an inkjet print head 350 are the ability for the ink droplets to travel through the ink chamber 351 and nozzle 352 with minimal impedance, and the ability of the ink to not adhere to the exit area 353, thus causing unwanted stains on paper and a clogged nozzle. These requirements demand that the interior of the nozzle 352 has the highest ink wettability and the outside surface near the exit area 353 has the lowest ink wettability. Current practices often rely on materials selection combined with CVD/PVD processes to deposit a wetting and/or anti-wetting layers on these surfaces. These types of surface treatment often have poor adhesion between surface deposition and the substrate, and can be difficult to apply to the small nozzle features without clogging the orifice. According to one embodiment, ion implantation technology is utilized, which produces high-strength interfaces with long service life time. Ion implantation can be precisely controlled, making it possible to fine tune wettability on different parts of the inkjet print head 350. In addition, ion implantation can be used to process features in nanometer scales with excellent uniformity and is compatible with the existing microelectronics manufacturing processes. Ion implantation also enable longer lifetime of the inkjet print head 350.
[0042] In operation, the print heat 350 is formed from a processed workpiece 354 and a cover 358. The cover 358 may be glass or some other material and is applied to the workpiece 354 after processing. Referring to FIG. 9A, the workpiece 354 may be of any suitable material, including silicon. The workpiece 354 may be etched to form the nozzle 352, as shown in FIG. 9B. The nozzle 352 may be formed so as to be wider at the top surface 356 than at the exit area 353, which is defined as the area where the nozzle 352 meets the bottom surface. Often the dimension of the nozzle 352 is limited by the tendency of the ink to clog. After etching, it may be desirable to make the nozzle 352 hydrophobic. Thus, as shown in FIG. 9C, a focused ion implant 355 using the plasma processing apparatus of FIG. 2, for example, may be used to make this nozzle area 352 hydrophobic. As described earlier, an implant of CF4 may be used. In some embodiments, the exit area 353 is made to have a different level of hydrophobicity than the rest of the nozzle 352. In some embodiments, the hydrophobicity may be varied by controlling the implant angle of the ions. This may also be done by performing another ion implant from the top surface 356, or may be done via an ion implant from the bottom surface. Furthermore, in some embodiments, the rest of the top surface 356 may be treated to change the hydrophobicity of the top surface 356. For example, the rest of the top surface 356 may be less hydrophobic than the nozzle 352. After the implantation is performed, the print head 350 can be assembled by attaching the cover 358 to the workpiece 354, as shown in FIG. 9D.
[0043] The implanted region may densify the material of which the surface is composed. This densification is due to the material added to the lattice of the surface during implantation. The densification may affect hydrophobic or hydrophilic properties of the surface. For example in the case of polymer based MEMS/inkjet heads, such as PDMS and SU8, the implantation may break some of the bonds of the polymer and create a graphitic skin layer, which is denser than the original polymer. This can be done using inert gas or active species, such as carbon-based species.
[0044] Another application that would beneficial from affecting material properties is electromechanical devices, such as MEMS and NEMS devices. These devices use polymers of various designs and for various purposes. These polymers include, for example, SU8 photoresist, PDMS, polymethyl methacrylate (PMMA), or others known to those skilled in the art. All or part of the polymers may be frozen (i.e. the shape of the feature will not change after implantation) or hardened using ions. For example, in the case of implantation of resist, a conformal implant can freeze the resist such that it is capable of going through two litho processes for dual patterning lithography. In one instance, only part of a 2D or 3D polymer structure in a MEMS or NEMS device is implanted. For example, in a micro-valve, the fluid channel can be hardened or rendered more resistant to a liquid though implantation. The micro-valve membrane may be implanted with a different species or not implanted at all such that it does not get jammed. Thus, localized implantation and control of localized implantation is important both due to the scale of the devices and the different functions of these devices. This polymer hardening or freezing may involve implantation of inert species such as a noble gas or an active species such as Si, NF3, CxHy, CxFy, SiF4, SiH4, disilane or CF4. Of course, other species can be implanted.
[0045] MEMS and NEMS devices also may need sidewall smoothing. Masking steps or other processing steps may cause a large amount of roughness. Smoothing the sidewalls of, for example, a polymer can improve MEMS or NEMS device performance. A noble gas may be implanted to a depth between 1 nm and 100 nm, for example, and cause physical changes to the sidewall surface. Similar to polymer freezing or hardening, localized implantation and control of localized implantation is important both due to the scale of the devices and the different functions of these devices.
[0046] Metal films in the MEMS or NEMS device can be implanted to modulate the stress. These metal films may be extremely small. Patterned or selective implantation of these metal films can be accomplished without implanting neighboring or adjacent areas of the MEMS or NEMS device.
[0047] Localized processing of a MEMS or NEMS device can affect physical properties. For example, as described above for print heads, the hydrophobicity or porosity can be adjusted in all or part of a NEMS or MEMS device using ion implantation on either a 2D or 3D surface. The surfaces may be implanted with, for example, C, N, H, F, He, Ar, B, As, P, Ge, Ga, Si, Zn, Al, other noble gases, other p-type or n-type dopants, or other species known to those skilled in the art. These may be atomic or molecular ions that contain, for example, the ions previously listed or other species known to those skilled in the art.
[0048] In one instance, the entirety of a surface is implanted. In another instance, only a portion of a surface is implanted. For example, in a biochip or microfluidics device, a channel or region where a fluid will flow or collect can be implanted. This will affect whether the fluid adheres to the surface. Thus, to improve performance of a device, it may be desirable to identify regions where fluids pass, or are likely to get clogged. These identified regions can then be ion implanted to affect their hydrophobicity, reducing risk of clogging and improve device performance.
[0049] FIG. 10 shows a representative biochip. The biochip 800 may be used for single nucleotide polymorphism (SNP) detection in DNA. The biochip 800 includes a variety of different functions, which are physically separated in the device 800. For example, fluids may enter the device 800 via an entrance 801. This fluid may pass through a meander mixer with obstacles 802. After sufficient mixing, the fluid enters a thermal chamber 803. After being heated, the fluid enters a filter section, including a coarse filter 804 and a fast and selective micropillar filter 805. These sections are each created by processing a suitable workpiece 807. After the workpiece 807 is processed, it is covered, such as by a glass plate 806.
[0050] These different functions within the device 800 may have differing requirements. For example, to enhance the mixing ability, it may be beneficial to affect the properties of the material in the meander mixer, but not in other areas. Furthermore, enhanced mixing may occur if the hydrophobicity within different regions of the meander mixer differ. A focused or patterned ion implant to selectively affect the hydrophobicity (or hydrophilicity) of various portions of the material in the meander mixer may enhance mixing. Similarly, the micropillar filter 805 may benefit from increasing hydrophobicity. Since the micropillars are very small features with high aspect ratio, conformally coating each of them, as is currently done, is ineffective. A conformal ion implant, using the apparatus of FIG. 2, may affect the material properties without increasing the size of the individual micropillars. This ion implant enables a better control of the conformal treatment and the adhesion of the treatment to the micropillar with minimal increase of micropillar size. In addition, it may be advantageous to not affect the properties of other parts of the biochip 800. For example, the thermal chamber 803 may not be treated at all. Of course, other variations are also possible. This only serves to illustrate the ability to selectively affect a material's properties on a very small scale to improve device performance. In addition, it would be advantageous if these treatments do not affect the bonding of the workpiece 807 to the glass cover 806. These precise treatments of the regions may be important in this respect.
[0051] FIG. 11 shows another example of a MEMS device 850. This device is a micropump, and includes a number of individual workpieces 851a-d which all affixed to each other after processing to form the pump 850. The lower workpiece 851a includes an inlet area 852, an outlet area 853 and an outlet membrane, or flap 854. The first intermediate workpiece 851b includes an inlet membrane or flap 855, an inlet area 856, and an outlet area 857. The second intermediate workpiece 851c has a movable diaphragm 858. The top workpiece 851d has a counter electrode 859. In operation, the diaphragm 858 moves upward, creating a partial vacuum in the chamber 860. This causes liquid to push the inlet membrane 855 upward, allowing fluid to pass through the inlet areas 852, 856 and into the chamber 860. When the diaphragm 858 moves downward, it forces the fluid in the chamber 860 to push the outlet flap 854 downward, allowing the fluid to exit the outlet areas 857, 853. For proper operation, it may be beneficial to affect those parts of the device which are movable, such as the material that comprises the inlet membrane 855 and the outlet flap 854. It may be beneficial to insure that these portions do not adhere to the other portions of the workpieces 851a-d. This may involve changing the adhesion properties or hydrophobicity of the membranes 854, 855, or the portions of the workpieces that contact these membranes 854, 855. It may also be beneficial to treat the diaphragm 858 to insure that it does not adhere to the counter electrode 859. Alternatively, the counter electrode 859 may be treated. In some embodiments, treatments for the micropump are focused only on a portion of the workpiece so that other portions are not treated at all, or may receive a different treatment.
[0052] As described above, the implant will reduce or prevent adhesion by a fluid. The ion species that is implanted may in part affect the hydrophobicity. Certain energy levels or doses during implantation may modify the lattice structure of the surfaces, which also may in part affect the hydrophobicity. Other mechanisms due to implant that affect the hydrophobicity may be possible. The implanted regions will remain hydrophobic even if cleaned because the implanted regions are part of the surface instead of a coating on the surface that may be eroded or washed off. To maintain the hydrophobic state, at least a few monolayers of the surface may be implanted. Uniformity of the dose and depth implanted regions may be controlled.
[0053] MEMS and NEMS devices can include any micro or nano mechanical device. This includes accelerometers, gyroscopes, sensors, micro-actuators (such as micro-pumps, micro-flaps, micro-valves, optical switches, or mirrors), thermalactuators, micromirrors, micro-resonators, piezoelectric detectors, cantilevers, microbalances, pressure sensors, bio-MEMS, biosensors, chemosensory, microphones, electrostatic motors, microfluidics devices, interferometric modulator displays, pico projectors, RF MEMS antennas, RF filters, RF MEMS phase shifters, or other devices. Other localized blanket or patterned implants, etching, or deposition steps also can be performed on a MEMS or NEMS device. Electrical, optical, or magnetic properties also can be affected by these implants or treatments. Focused multi-angle processing can be performed on a 2D or 3D device. In some instance, localized regions down to approximately 5 μm feature size can be treated.
[0054] While much of this disclosure describes implanting ions into a surface, the disclosure is not limited to this embodiment. For example, the apparatus of FIG. 2 may be used to add coatings or layers to an existing feature or structure. FIG. 5 is a cross-sectional side view of sidewall porous material formation. Certain MEMS and NEMS devices require sidewall porous material formation, but the small dimensions make deposition difficult. For example, silicon, porous silicon, diamond-like carbon, or other materials may be formed on a sidewall. Ions 102 are used to form a layer 401 on the sidewalls of the feature 400. The layer 401 may be between 5 nm to 100 nm thick, for instance. This can be performed by adjusting the angles of the ions 102. In some instances, forming a layer on the base of the feature 400 or only on one sidewall of the feature 400 is possible. Different thicknesses of the layer 401 are possible on different surfaces by adjusting the angle spread of the ions 102 or the relative doses within the angle spread of the ions 102.
[0055] This porous material formation may occur on many types of device. For example in one embodiment, the sidewalls of an accelerometer 900 are treated to add porous material, as shown in FIG. 12. Capacitance, or sensitivity, of an accelerometer is proportional to surface area. Increased surface area of the accelerometer sidewall can make it more sensitive to movements. Since porous materials have a much larger surface area than planar surfaces, this can significantly increase the sensitivity of the device 900. In some embodiments, one or both of the SOI fixed parts 901 and the SOI moving parts 902 are treated to add porous material on their sidewalls.
[0056] Porous material deposition can be used to form a protective layer around a device. In one embodiment, devices intended for placement in the body may be coated using the apparatus of FIG. 2 to make them biocompatible. Devices can also be coating to change other properties, such as hydrophobicity.
[0057] In yet other embodiments, it may be beneficial to use ion implantation to affect the material's resistance to various chemicals. In one embodiment, the treatment disclosed herein uses a low energy implant, which is faster and less complex than a high energy implant. These embodiments also only may affect the first 0 to 100 nm of a material, though other depths are possible. By only affecting a small layer of the implanted material, less of the overall material will have its properties changed and the flexibility of the material is not negatively impacted. Thus, the properties at the surface of the material may be affected without affecting the entire workpiece. This may be advantageous, in that it is possible to change the chemical resistance of some materials or devices without affecting their flexibility.
[0058] FIG. 6 is a cross-sectional side view of workpiece being implanted. The workpiece 501 may be composed of, for example, polymer, glass, plastic, insulators, metals, or other materials. While the workpiece 501 may have a 2D or planar surface 504 as illustrated in FIG. 6, this implant also can apply to 3D structures. With such a 3D structure, a multi-angle implant can treat all surfaces of the 3D structure. Also, while the entire surface 504 is illustrated as being treated with the ions 500, a selective or patterned implant may be performed. A selective implant will scan the surface 504 with respect to the ions 500 and adjust the bias to the surface 504 (or workpiece 501 containing the surface 504) or plasma conditions such that only a portion of the surface 504 is implanted.
[0059] The ions 500 form an implant region 502 that penetrates the surface 504 of the workpiece 501. The depth of the implant region 502 (i.e. dimension 503) may be between approximately 0 to 100 nm, for example. The implant profile can be Gaussian or a surface peak to accommodate different chemical resistance properties. The ions 500 may be, for example, a noble gas or other inert species, though other species are possible. In one instance, the ions 500 are Ar, Ne, Kr, Xe or He and these ions break some of the bonds on the surface 504 and in the implant region 502 that make this surface 504 sensitive to certain chemicals. Thus, the workpiece 501 has its surface properties altered. Cross-linking of the surface 504 also may be affected by the low energy implantation. For example, lactone or ester groups of a polymer can be destroyed using such a low energy plasma treatment. In yet another embodiment, an active species is used for the implant, such as N2, H2, NF3 CxHy, CxFy, SiF4, SiH4, disilane or CF4. This active species can be implanted to cause a chemical change in the surface 504. This may be used instead of or to supplement the physical changes caused by the implant.
[0060] FIG. 13 is a cross-sectional side view of one embodiment of a 3D feature 1400 being implanted. The incidence angles of the ions 102 are used such that implant regions 1401 are formed only on the sidewalls of the 3D structure 1400. Of course, only the base of the 3D structure 1400 may be implanted in an alternate embodiment. In yet another embodiment, the sidewalls and base of the 3D structure 1400 are implanted to different depths or with different doses. This can be accomplished, for example, by adjusting the angle spread of the ions 102 or relative doses of ions 102 within the angle spread. Other 3D structures are possible and selective implant can be performed on only some surfaces while other surfaces are not treated. In some cases, only one side of the feature needs to be implanted. An example of this may be MEMS sensors.
[0061] In one particular embodiment, a sealing layer is placed on a surface using a helium (He) implant. This implant with He reduces sputtering and damage to the areas below the implant region. In one instance, this can be used with polymers. This sealing layer may be between 1 nm and 30 nm in one instance and may break some bonds of the surface to change the local composition.
[0062] Experiments have shown that implanting He into a polymer layer can affect chemical resistance. In the experiment, the polymer was not resistant to acetone prior to the implant but was resistant to acetone after the implant. FIGS. 7A-B represents an embodiment of He implantation into a structure. In FIG. 7A, the polymer, in this case photoresist, is patterned. In this embodiment, the photoresist patterning comprises a series of vertical walls 700. In FIG. 7B, the photoresist is then implanted with helium to harden the polymer. FIG. 8A shows the patterned photoresist. Vertical walls of various thicknesses are created on the workpiece. FIG. 8B shows a workpiece, which did not undergo the process of FIG. 7B, after a 5 second acetone rinse. Without treatment, the polymer was removed from the sample in acetone. FIG. 8C shows a workpiece, which underwent the process of FIG. 7B. With a He implant, the polymer remained intact after an acetone treatment. Thus, the pattern shown in FIG. 8C is the same as that of the unrinsed reference sample, shown in FIG. 8A. This He implant can be combined with CF4 to make the resulting polymer hydrophobic as well.
[0063] The ability to affect chemical resistance has other important applications as well. For example, for industrial printing technology, such as solar metal contact printing, printed electronics, flexible electronics and other application, there is a need for solvent based ink. Because of this, the material used in the printer heads needs to be also compatible with these aggressive liquids. Traditional polymer based cavity and channel may not be compatible. Thus, by introducing an ion implantation, as described above, the hydrophobicity requirement may be maintained while increasing the resistance to chemicals, such as these inks.
[0064] In some embodiments, ultraviolet (UV) light can be used to improve the chemical resistance. Plasma often generates light at various frequencies. Therefore, the light and UV emitted from the plasma additionally can affect chemical resistance by breaking some of the bonds in the polymer. The frequency of the light may be tunable by using different extraction plate materials. In some embodiments, the extraction plate acts as a light filter, when different materials will have different transparencies. Thus, selection of an appropriate material for the extraction plate may change the frequencies which the polymer is exposed to. Therefore, if the materials that surround the plasma or are disposed between the plasma and the implanted workpiece can be selected to transmit certain types of UV light, this energy can supplement the implanted ions.
[0065] One advantage of some of the embodiments described herein is that feature dimensions of the structure or surface may the same after the implant. Unlike other treatments, one or more layers are not added to the surface. Instead, the surface itself is affected. A second advantage is that the ions can smooth a surface using certain implant parameters. This may or may not affect the dimensions of the surface. The scale of the smoothing can vary with the implant parameters.
[0066] Print heads, microfluidics, MEMS devices, NEMS devices or biomedical applications may need chemical resistance when designed to transport liquid from one region to another. This liquid may be an industrial chemical, water, a bodily fluid, or other material. These devices may be 3D structures with high aspect ratios. A third advantage is that the embodiments described herein can enable the dimensions to remain small (or totally unaffected) while providing total or patterned chemical resistance.
[0067] Although reference is made to MEMS devices, NEMS devices and inkjet printer heads, other devices also can benefit. For example, organic light-emitting diodes (OLEDs) can be treated between each organic layer. During production of OLEDS, a first organic layer is deposited by spin coating and then baked. A second organic layer is then deposited. The solvent from the second organic layer may attack the first organic layer. Therefore, implantation of the first organic layer to render it more chemical resistant can improve OLEDs. Other devices that transport or carry liquids or have interfaces between organic layers can also benefit.
[0068] In addition, other materials, such as gloves, boots, fabric, protective clothing, or protective equipment, can be rendered more resistant to chemicals such as, for example, acid. Inkjet printer cartridges, heads, or nozzles can be rendered more resistant to certain inks or chemicals. Other devices or materials also can be implanted to affect chemical resistance.
[0069] The present disclosure is not to be limited in scope by the specific embodiments described herein. Indeed, other various embodiments of and modifications to the present disclosure, in addition to those described herein, will be apparent to those of ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Furthermore, although the present disclosure has been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize that its usefulness is not limited thereto and that the present disclosure may be beneficially implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be construed in view of the full breadth and spirit of the present disclosure as described herein.
Patent applications by Anthony Renau, West Newbury, MA US
Patent applications by Christopher Hatem, Hampton, NH US
Patent applications by Deepak Ramappa, Cambridge, MA US
Patent applications by Ludovic Godet, Boston, MA US
Patent applications by Xianfeng Lu, Beverly, MA US
Patent applications by VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
Patent applications in class Nonuniform or patterned ion plating or ion implanting (e.g., mask, etc.)
Patent applications in all subclasses Nonuniform or patterned ion plating or ion implanting (e.g., mask, etc.)
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Bridget Millar-Mills will make her debut as Scotland take on England in the opening round of the Six Nations
Lock Bridget Millar-Mills is to make her debut this Saturday against England in the Women's Six Nations.
Last Updated: 31/01/13 10:23am
The lock will be partnered by Lindsay Wheeler, playing in her 53rd Test match. Millar-Mills could also come up against her sister Hariet, who is on the England bench.
The pack includes experienced prop Heather Lockhart, winning her 59th cap. Joining her in the front-row is hooker Sarah Quick and tighthead Tracey Balmer.
In the back row, influential captain Susie Brown is flanked by Tess Forsberg and Mary Lafaiki, who is making her first start.
Winger Annabel Sergeant returns to the starting XV after a year with the Scotland Sevens. Sergeant is joined in the back three by Megan Gaffney on the other wing and Steph Johnston at full-back.
Sarah Dixon is set to partner Lisa Ritchie in the centres. Louise Dalgliesh and Tanya Griffith complete the starting line-up as the half-backs for the Scots.
The bench sees the addition of new faces, Becca Parker, Jade Konkel, Sarah Law and Leanne Neary.
Head coach Karen Findlay said: "Scotland against England always has that added edge and it'll be a really good opportunity to see how our training has progressed, how our squad has developed and will be an exciting start to the 2013 campaign.
Scotland: 15 Steph Johnston, 14 Annabel Sergeant, 13 Sarah Dixon, 12 Lisa Ritchie, 11 Megan Gaffney, 10 Tanya Griffith, 9 Louise Dalgliesh 1 Heather Lockhart, 2 Sarah Quick, 3 Tracey Balmer, 4 Lindsay Wheeler, 5 Bridget Millar-Mills, 6 Mary Lafaiki, 7 Tess Forsberg, 8 Susie Brown (captain)
Replacements: 16 Beth Dickens, 17 Suzanne McKerlie-Hex, 18 Lindsey Smith, 19 Becca Parker, 20 Jade Konkel, 21 Sarah Law, 22 Leanne Neary, 23 Lauren Harris


text:
When the body of Marie Rogêt is found in the Seine River, detective C. Auguste Dupin uses his superior deductive skills to discover the identity of the murderer. "The Mystery of Marie Rogêt" is based in part on the actual murder of Mary Cecilia Rogers in New York in the mid-nineteenth century, and is believed to be the first example of real-life crime used as a foundation for fictional narrative.
A pioneer of the short story genre, Poe's stories typically captured themes of the macabre and included elements of the mysterious. His better-known stories include "The Fall of the House of Usher", "The Pit and the Pendulum", "The Murders in the Rue Morgue", "The Masque of the Red Death" and "The Tell-Tale Heart".
HarperCollins brings great works of literature to life in digital format, upholding the highest standards in ebook production and celebrating reading in all its forms. Look for more titles in the HarperCollins short-stories collection to build your digital library.
About Edgar Allan PoeSee more books from this Author
Rogers worked at a cigar store and crossed paths with the literary agents and journalists with whom Poe worked.Mar 02 2008 | Read Full Review of The Mystery of Marie Rogêt: S...


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How To Shake The Salt Habit
June 22, 2016
Here are 7 fabulous ways to bring extraordinary flavor to your meals without using salt.
5 Fabulous Ways to get Plant Based Protein
June 15, 2016
Whenever people hear that I eat a plant based diet, the first questions they always ask is, "How do you get your protein?" In this video I count 5 fabulous and delicious way to get plant based protein, with a sweet surprise at the end of the video.
Please let me know how you get your plant based protein in the comments below. I'd love to hear from you!
The 5 Habits for Extreme Happiness
June 8, 2016
5 Habits For Extreme Happiness
Have you ever wondered what you could do to bring about a higher level of contentment, dare I say, happiness, to your life? So have I. I was in a deep funk 2 years ago and decided to do something about it. Permanently. This is what I discovered.
- Gratitude
When you are consistently, extremely grateful, I mean practicing gratitude like it's an Olympic, extreme sport, going all out, you have no choice but to experience happiness. When you are walking anywhere, in the house, on the street in your office, take a moment to realize that you are walking above the ground, not buried below it. I started to do this after I turned 50 when I became more aware of my mortality, realizing for the first time that this life will not last forever, I am so, so grateful I am still here. I get to still do what I want to do and make a difference in some small way every day. That makes me feel really grateful.
- Challenge
Try to do something you've never done before, get really frustrated because it's new and then figure it out. Gratitude beyond your wildest dreams. Last week I was implementing a new marketing system for my business with a platform I had never used before. It was not intuitive at all and I was emailing customer support every five minutes. I was frustrated, crying, ready to give up, lamenting at how stupid I am, and then after 2 days. Bam. After my thousandth email to customer support and a Facebook support group keeping me from taking my own life, I figured the damn thing out. I can't tell you what a sense of gratitude I felt. Relief, gratitude, an exhilaration that I can only compare to what it might feel like to win the lottery. It was a real high and it lasted many days. That sense of accomplishment and gratitude for figuring out something that seemed impossible.
- Random Act of Kindness
I've noticed that when I give a gift to someone for no special reason that they don't expect, it brings me so much joy. Much more than if I were the recipient of the gift. That's why Oprah used to give away cars and other small items on her show. Because she said she felt so happy making other people so happy. It works. And even if the person you give something to doesn't express appreciation, you will still feel a sense of contentment knowing that you did something kind for someone with no expectation for something in return. Even a thank you.
- Meditate
I used to not be able to meditate. Could not sit there for even five minutes just breathing. It was torture. Then someone introduced me to Deepak Chopra and Oprah 21—day meditations. This changed my life. I sear to God. The way these two guide you through a meditation makes it so easy. And what they say blows you away. It turned around a decades old mild depression for me into a long lasting uplifting of spirit that I did not think was possible for me.
- Exercise
By this I don't mean going to the gym and running on the treadmill for 2 hours, although if that makes you happy by all means. I mean do something with movement that exhilarates you. For me, that is ballroom dancing. I denied myself this pleasure for so long because it is an expensive hobby to do on a regular basis. But when I realized I was denying myself something that was part of me. I said "What am I waiting for? Until I can't do it and then regret not doing it?" So I signed up at a place near my house and it's the highlight of my week. So what does that for you? Yoga? Playing tennis? Taking a hike? Whatever it is, and you know what it is for you, do it. It totally rewires your brain to new circuitry of happiness.
So if you want to incorporate these habits into your daily routine over a span of 21 days in a row, they will become easier to do and you will automatically experience a heighted and happier way of being.
And please remember to live insatiably, forgive lavishly and love ferociously…especially yourself.
Roasted Carrot and Sweet Potato Hummus
June 1, 2016
Since my son has a severe sesame allergy, conventional or store-bought hummus is not an option for me. So I figured out a way to make the most flavorful and spiced up hummus I could muster, and believe me it cuts the mustard big time. So here's the recipe, and I encourage you to experiment with your own spices and vegetables that will make it even more unique and that would make any pita proud.
By Debbie Adler
Serves 4 – 6
Must Have
1 pound carrots, chopped into 1-inch chunks
1 sweet potato, chopped into 1-inch chunks
2 cloves of garlic, minced
1 (15 oz.) can chickpeas
3 tablespoons sunflower seed butter
2 tablespoons fresh lemon juice
1/4 cup water
1/2 teaspoon ground cumin
1/2 teaspoon ground ginger
1/2 teaspoon salt
1/4 teaspoon ground black pepper
1/4 teaspoon ground coriander
1/4 teaspoon ground cayenne
Must Do
Preheat the oven to 400°F.
Toss the chopped carrots and sweet potato and spread evenly on a parchment lined cookie sheet.
Roast in the oven until the carrots are tender and lightly browned, 18 to 20 minutes.
In the bowl of a food processor, combine the roasted carrots, sweet potato, garlic, chickpeas, sunflower seed butter, lemon juice, water and all of the spices.
With the motor running drizzle in the remaining 3 tablespoons of grapeseed oil.
Serve immediately with pita chips, tortilla chips or on a sandwich.
How to Reduce Your Risk of Breast Cancer By 90%
May 26, 2016
I recently came across a study in the International Journal of Cancer, that found that eating mushrooms, at least 1/3 of an ounce of cooked mushrooms every day, reduces your risk for developing breast cancer by 64%. And it further stated that combining mushrooms with drinking green tea reduces your risk by almost 90%.
That is a very impressive statistic. I thought, mmn, I wonder WHICH mushroom gives the greatest preventative benefit. There must be a hierarchy of fungi. I turned to the The Journal of Nutrition for the answer and it turns out that white button mushrooms are the ones you should be eating. They have the greatest prophylactic benefit.
So I ran to the kitchen and created this recipe incorporating both these ingredients into a simple and delicious ragu. I hope you enjoy it and live a long and healthy life.
Mushroom Herb Ragu
Must Have
1 medium yellow onion, chopped
½ cup coconut aminos
3 garlic cloves, minced
3 cups roughly chopped mixed mushrooms, (cremini, white button, oyster, shiitake)
2 tablespoons fresh rosemary, chopped
1 teaspoon freshly ground black pepper
¼ teaspoon fine sea salt
2 tablespoons tapioca flour
1½ cups green tea (I use Genmaicha or Matcha)
¼ cup coconut milk
1 tablespoons Grade B maple syrup
8 fresh basil leaves, finely sliced
Must Do
Heat the onions in a medium sauté pan over medium heat and stir until fragrant, about 1 minute.
Add the coconut aminos, garlic, mushrooms, rosemary, pepper and salt stir until the mushrooms are tender, about 8 minutes.
Add the tapioca flour to 2 tablespoons of room temperature green tea. Whisk together until a paste forms.
Add the tapioca mixture and remaining green tea to the sauté pan and stir vigorously to combine. Add the coconut milk and maple syrup and simmer for about a half hour, until the sauce thickens.
Take the pan off the stove and add the basil leaves. Serve warm over rice, kasha, quinoa or gluten-free noodles.
Serving size: 1 cup CALORIES 60; TOTAL FAT 0.5g; PROTEIN 2.9g; CHOLESTEROL 0.0g; SODIUM 180mg; FIBER 4.3g; SUGARS 4.1g; TOTAL CARBOHYDRATE 13.8g
Plant-Based, Allergy-free, Sugar-Free Reese's PB Cups
May 18, 2016
I've been craving candy a lot lately and it's been because of stress. The stress of having to wrap up my second cookbook, the pulling of teeth to get my son to read every night, the standing over the stove to make three meals a day and pack a lunchbox, the deadlines of making cupcakes on demand – you get the picture.
So the craving has been going on for several months now, and I finally decided to do something about it. As soon as I clicked 'send' two days ago, and my cookbook was in my editor's e-mail box, I got down to business.
I have been longing for the peanut butter and chocolate combo candy, but can't do the pb anymore due to my son's severe food allergies. So, of course, the next best thing is sunflower seed butter. I figured the easiest way to do the chocolate was to just melt some. I'm in agreement with myself that this was the best decision I ever made since yesterday. Here's the recipe, my friends. If there's another candy bar that you're hankering for a recreation of, please let me know in the comments below, and I'll get right to it and post it next week.
By Debbie Adler
Makes 12 buttercups
Must Have
12 ounces sugar-free/dairy-free chocolate chips (I use Lily's brand)
½ cup sunflower seed butter
Must Do
Line a 12-cup standard cupcake tin with paper baking cups.
Place the chocolate chips in a microwave safe bowl and heat them, 30 seconds at a time, until they melt.
Pour the melted chocolate, about 2 tablespoons, into each cup.
Spoon about 1 tablespoon of the sunflower seed butter on top of the chocolate.
Pour the remaining melted chocolate on top of the sunflower seed butter, dividing it evenly.
Place the cupcake tin in the fridge for 20 minutes and enjoy!
Keep in an airtight container in the fridge or freezer for up to 3 months.
Serving size: 1 cup CALORIES 150; TOTAL FAT 7.5g; PROTEIN 5.1g; CHOLESTEROL 0.0g; SODIUM 50mg; FIBER 3.0g; SUGARS 5.7g; TOTAL CARBOHYDRATE 18.3g
Dark Chocolate Covered Cherry Granola Bars
May 11, 2016
We're in the midst of cherry season, which lasts as long as the blink of an eye it seems, and I'm taking full advantage. I'm hoarding them like nobody's business at each organic vendor I can find at the farmer's market every Sunday. It takes such a long time to pick the ones I want, dark, of course, so I stand there with all the other pickers just nit picking away with a competitive arrogance that I'm surprised to find at such a communal place. It's not pretty. But people like their food the way they like it and will get it no matter what it takes.
I can't complain too much since I did get a few bushels full of really gorgeous dark cherries. Way too much in fact to just pop them in my mouth like candy which is so much fun. I decided to bake up some granola bars with them inside and add some chocolate which adds a slight reminiscence of those dark chocolate covered cherries I used to eat.
So here is the recipe, which is very simple and delicious and has numerous life-enhancing benefits that you will enjoy immensely.
By Debbie Adler
Must Have
1¾ cups gluten-free oats
⅓ cup all-purpose gluten-free flour
⅓ cup hemp seeds
¼ cup raw pumpkin seeds/roughly chopped
2 tablespoons cacao powder
1 tablespoon goji powder
⅜ teaspoon guar gum
¼ teaspoon fine sea salt
6 tablespoons coconut oil
6 tablespoons coconut nectar (I use Coconut Secret brand)
2 tablespoons cherries, pitted and roughly chopped
4 ounces sugar-free dark chocolate chips (I use Lily's brand)
Must Do
Preheat oven to 325°F. Line an 8 x 8-inch square baking pan with parchment paper, with a little extra over the sides.
Mix together the oats, flour, hemp seeds, pumpkin seeds, cacao powder, guar gum and salt in a large bowl.
Microwave the coconut oil and coconut nectar in a measuring cup for 20 seconds and stir to combine. Pour the coconut oil mixture into the oat mixture. Fold in the cherries.
Spoon the batter into the prepared pan and smooth it into the corners and on top with a wet baking spatula to cover the pan evenly.
Bake for 24 to 25 minutes, or until the oats are a light golden brown. Rotate the pan from front to back halfway through baking.
Remove the pan from the oven to a wire rack and let sit for about 15 minutes before putting in the freezer for at least 1 hour.
Transfer the parchment paper to a cutting board and cut into 16 bars.
For the topping, melt the chocolate chips in a microwave safe bowl, 30 seconds at a time until the chips are liquid. Drizzle the chocolate over the granule bars and set them on parchment paper. Put them in the freezer to firm up.
Wrap each bar individually in parchment paper or bakery tissue paper, place in seal-able plastic bag and keep frozen until ready to pack or eat.
Nutrition Information Per Serving (1 bar): 100 calories, 6 g total fat, 0.0 mg cholesterol, 19 g carbohydrates, 40 mg sodium, 2 g fiber, 2 g protein, 5 g sugars
Guacamole Rolls for Cinco de Mayo
May 4, 2016
Guacamole Rolls
By Debbie Adler
Makes 12 rolls
If Jefferson Starship built their city on rock and roll, just think about how much more
they could have accomplished if they'd had the good sense to put it together
with guac and roll. With a metropolis full of essential nutrients, phytochemicals
and vitamins such as A, B, C, E and K, as well as copper, iron, phosphorous,
potassium, folate, lutein and magnesium, avocado provides the building blocks
for one helluva healthy superstructure. So please don't let the life-enhancing
monosaturated fat count scare you away from this misunderstood fruit. Avocado
is a great foundation for any salad, dip, chip and bread roll. And Cinco de Mayo
is the perfect excuse to make them.
Must Have
Coarse-grind cornmeal,
for dusting the muffin tin
1¼ cups warm water (about 110°F)
2¼ teaspoons active dry yeast
1 tablespoon coconut nectar
1 cup sorghum flour
1 cup light buckwheat flour
1 cup tapioca flour
4 teaspoons dried minced onion
2 teaspoons fine sea salt
½ teaspoon garlic powder
½ teaspoon baking soda
½ teaspoon ground cumin
½ teaspoon xanthan gum
2 tablespoons smoothly mashed avocado
2 tablespoons ground chia seeds
(use a coffee grinder)
Must Do
1. Preheat oven to 200°F and then turn
it off. Dust the wells of a standard 12-cup
muffin tin with the cornmeal.
2. Combine the warm water and yeast in a
2-cup measuring cup. Add the coconut nectar
and stir to combine. Let the yeast mixture sit
for about 8 minutes, or until foamy.
3. Whisk together the two flours, minced
onion, salt, garlic powder, baking soda, cumin
and xanthan gum in a large bowl. Make a
well in the middle.
4. Add the yeast mixture, mashed avocado
and chia seeds and stir to combine.
5. Take about 3 tablespoons of the dough,
shape it into a ball, and place it into a well
of the prepared muffin tin. Repeat until you
have used up all the dough.
6. Cover the muffin tin with a clean dish
towel, place it in the oven for 1 hour and
allow the dough balls to rise.
7. Remove the dish towel and let the
dough balls continue to rise in the oven
while it preheats to 425°F.
8. Bake the rolls for 25 to 27 minutes,
or until they are golden brown and sound
hollow when tapped on the bottom.
Espress Yo'self Brownies
April 27, 2016
I truly believe it is imperative that each of us be able to express our true and authentic selves and not crumble like a cookie under the clutter of other people's expectations. That would be doing a disservice to the being you were born to be. So with these brownies I express my true love of everything espresso bean and mix it with a pinch of cacao so you become your true hyper self. I like to undercook my brownies just a tad and then freeze them so that they taste like fudge. And they are so immensely decadent this way that they are best without getting dressed with frosting.
Espress Yo'self Brownies
By Debbie Adler
Makes 9 brownies
Must Have
1¼ cups all-purpose gluten-free flour
½ cup cacao powder
2 tablespoons espresso powder
¼ teaspoon baking powder
¼ teaspoon baking soda
¼ teaspoon guar gum
¼ teaspoon fine sea salt
⅓ cup coconut nectar
¼ cup applesauce
1 teaspoon vanilla extract
¼ teaspoon stevia powder
½ cup room temperature espresso or strong coffee
Must Do
Preheat the oven to 325° F. Line an 8 x 8-inch square pan with parchment paper.
Whisk together the flour, cacao, baking powder, baking soda, guar gum and salt in a large bowl. Make a well in the middle.
Add the coconut nectar, applesauce, vanilla and stevia and stir to combine.
Add the espresso and stir until the liquid is absorbed and the batter is smooth.
Pour the batter into prepared tin and bake until the batter starts to pull away from the sides of the pan or when a toothpick inserted in the center comes out with just a few crumbs attached, about 10 minutes. Rotate the tin from font to back after 7 minutes of baking.
Transfer the pan from the oven to a wire rack and let sit for about 15 minutes before cutting into 9 squares.
Keep in an airtight container for 3 days or individually wrap and freeze for up to 3 months.
Serving size: 1 brownie CALORIES 90; TOTAL FAT 0.7g; PROTEIN 2.0g; CHOLESTEROL 0.0g; SODIUM 30mg; FIBER 2.3g; SUGARS 5.0g; TOTAL CARBOHYDRATE 18.5g
Green Radiance Smoothie
April 20, 2016
There is something magical about putting all the nutrients you need for the day into one jam-packed delicious smoothie and being ably to add some chocolate just for good measure. Smoothies have been my savior for some time now, in an effort to get my son some required nutrition since his severe food allergies restrict the variety of foods he can eat.
After I give my son the basic smoothie, I add some more sophisticated accents for myself such as grated ginger, black pepper and curry powder. The turmeric in the curry powder has anti-inflammatory properties that helps reduce the chances of any inconvenient diseases cropping up and the black pepper help your body absorb the turmeric. Who knew, right?
The curry part of the curry powder gives the smoothie a spicy kick which I absolutely love. Ginger helps in digestion and also has anti-inflammatory properties. Inflammation in the body causes us to get sick, so you definitely want to de-inflame as much as possible.
I discovered that if I want to have my smoothie on-the-go, the best place to put it is in a mason jar that has a lock lid. So here is the recipe and you can add or subtract according to your tastes. Have fun and be healthy!
Green Radiance Smoothie
By Debbie Adler
Must Have
1 cup frozen mango chunks
1 frozen banana, sliced
2 frozen Medjool dates, pitted
1/3 cup hemp seeds
1 capsule probiotic supplement (I use Jarro-Dophilus. Just open the capsule and pour the powder in)
2 cups baby spinach
2 tablespoons Grade B maple syrup
2 tablespoons freshly squeezed lemon juice
3 teaspoons grated ginger
1/2 teaspoon curry powder
1/2 teaspoon freshly ground black pepper
Sugar-free Dark Chocolate
Must Do
Add the mango, banana, dates, hemps seeds, probiotic powder, spinach, ginger, curry powder and black pepper to a high-speed blender. Process until the smoothie is smooth, about 1 minute.
Add whatever toppings your desire and you're good to go!


text:
Originally Posted on Holtzman Communications Blog
Silver Lining is one champion. I met Carissa Reiniger, CEO and President, about three years ago. She has dedicated Silver Lining to helping lifestyle businesses grow. Simple. It's a one year, mostly on line, program designed to grow your business. It's not a business plan but rather an action plan that relies on some of the same things in a business plan. There's nothing wrong with business plans…they are great for determining what direction you want to take your company in. Business plans are primarily used to raise capital however. The philosophy at Silver Lining is that action plans are a better way for lifestyle businesses to grow. Their action plan is called SLAP: Silver Lining Action Plan. It's a simple (because once you fill in the blanks, the plan program does all the calculations for you). Even if you're self motivated, sometimes taking care of your own business gets pushed to the side by you – like the shoemaker with barefoot kids. If you can relate to this, then maybe you should check Silver Lining out.www.Silverlininglimited.com
Carissa Reiniger, CEO and President of Silver Lining
Gale Brewer, Manhattan Borough President
who stopped by to cheer on the SLAP in the
City participants. http://www.galebrewer.com/


text:
The Premier League is back and what an opening weekend it was.
There were tonnes of talking points, plenty of penalty drama, goals galore and one over-eager fan on a thrilling start to the season.
Louis van Gaal got his Manchester United career off to the worst possible start as goals from Ki Sung-yueng and Gylfi Sigurdsson cancelled out a Wayne Rooney leveller to hand Swansea a surprise win.
New Tottenham boss Mauricio Pochettino got off to a better beginning as new boy Eric Dier struck late to seal the win against West Ham in a game where both Kyle Naughton and James Collins were sent off.
Aston Villa surprised Stoke with Andreas Weimann popping up to net a second half winner at the Britannia, while James Chester's goal was enough to see Hull past QPR at Loftus Road.
Fellow new boys Leicester impressed in holding Everton in an entertaining 2-2 draw, while West Brom were pegged back by Sunderland as they too shared the spoils with two goals apiece at the Hawthorns.
Arsenal left it late with talisman Aaron Ramsey popping up in the right place at the right time to seal an opening win against manager-less Crystal Palace.
Liverpool began the Luis Suarez-less era with an impressive win over Southampton thanks to goals from Raheem Sterling and Daniel Sturridge.
And champions Manchester City opened their title defence with victory at Newcastle, David Silva and Sergio Aguero on the scoresheet for Manuel Pellegrini's men.
Check out all the best photos in our gallery above.


text:
SnuzPouch Sleeping Bag 1.0 Tog – Pop Yellow
SnuzPouch Sleeping Bag 1.0 Tog – Pop Yellow
- Sleeping bag with clever Nappy Change zip
- Easier night-time changes
- Super soft OEKO-TEX 100 certified cotton
- British Safety tested – conforms to BS 8510:2009
- Also available in 2.5 Tog for all-year-round
SnüzPouch is the new collection of stylish sleeping bags by Snüz®, featuring a clever nappy change zip and a choice of modern designs.
With parents changing their baby's nappy on average three times every night, the SnuzPouch patent-pending nappy change zip makes changes quick and easy! Simply zip open and change with less disturbance, keeping them safe and snug all night long.
British safety tested to BS 8510:2009, SnüzPouch features double shoulder poppers to provide extra security and additional perfect-fit underarm poppers for correct sizing, creating a safe and secure sleeping environment for your baby.
Co-ordinate your Pop Yellow SnuzPouch with matching Snüz Designz sheets and bedding sets - SHOP NOW
- 0-6m - for babies weighing more than 4kg/8.8lb. Maximum baby length 68cm/27"
- 6-18m - for babies weighing more than 8.1kg/18lb. Maximum baby length 86cm/34"
- 1.0 Tog, for warm summer temperatures of 21-23 degrees C (69-74 degrees F)
- Outer: 100% cotton
- Filling: 100% polyester - Oeko-Tex 100 Class 1 (Baby) certified free from any harmful chemicals or substances
- Machine washable at 40 degrees & tumble dryer safe
- Sleeping Bag conforms to BS 8510:2009
As with all sleeping bags, always ensure that you buy the correct size for your baby, remembering to check that your baby's head cannot pass through the neck-hole when the product is fastened for use. Never use a duvet or quilt with a sleeping bag or your baby could overheat. Instead, select the correct tog rating, adjust what your baby wears and regularly check your baby is not too hot or too cold. For use in a cot or crib.
Product Reviews
Super nice quality love the packaging will definately buy again if my little one likes it too
Excellent product this is my third child and only wish the zip for access for night changes had been developed for the first two . Thank you for delivering such a clever design that is also very stylish Thank you snuz
Lovely sleeping bag I ordered for staying at the in laws who have the heating up high x kept my daughter cool but snug and sleeping happily x love the designs from snuz I also have the winter bag x other makes are just too babyish where as the snuz designs are great x my only criticism is the finish on the lighter bag wasn't as good as the heavier bag x the flap that protects from the zip on the light one doesn't cover the zip properly x


text:
Here's my HTML:
and the relevant CSS:HTML Code:

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stuff here

stuff here

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All the LI's are floated left to make a row (not shown in the CSS) and I want to make the entire row clickable so I figured I'd absolutely position an anchor which is the entire width and height of the row....works great in FF, Opera, Safari, and Chrome. But in IE7/8, the entire row is clickable except for the text nodes ("stuff here").Code:ul { position: relative; } ul a { position: absolute; display: block; width: 100%; height: 100%; z-index: 10; }
I realize there's no real point for the z-index declaration in the above css, but I was just trying random things at the point when I came up with it - it never helped. Does anyone know how to achieve this effect without putting the content in each li in separate  tags in addition to my absolutely positioned anchor?


text:
Here is a current review of all the forces of Briktopia. Some of it has been posted before, some stuff is new:
Here you see the leaders&heroes of Briktopia. From left to right: Mirduk, supreme ruler of Briktopia. Apollyon, chief strategos and leader of the Ghost Brigades. Colonel Raszack, infantry commander and General Lukas, commander of the Briktopian tank forces.
Standard infantry and a medic (design by Arkbrik), Colonel Raszack and to the right, close combat specialists.
Apollyon and the Ghost Brigades. They are still work in progress. In general they will be specialists, e.g. Heavys and such.
Briktopian "Jaguar" armored car.
Briktopian "Ozelot" 4WD truck (based on the Jaguar design).
Briktopian "Avenger" main battle tank. As you can see i built a second tank. Had to go with the colours/bricks i still had after the SHDT so it looks a bit funny.
Briktopian "Delta" siege tank. Heavily inspired, if not copied from Arkbrik. General Lukas was also invented by him. Kudos!
Briktopian "Schreck" light assault tank.
Briktopian "Prowler" variant.
In order to join the superpowers of the Brikverse what i still want to do in the future is built some speeder-/jetbikes, an apc, a helicopter, a mech and eventually a SHIP and an Armored Core. So this is far from done.