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Watch Featured Movies
Law & Order: Special Victims Unit: The SVU squad is reeling from the fallout after Captain Cragen wakes up with a dead escort - a potential witness in an SVU case - in his bed. Tensions run high at the precinct as the detectives contend with District Attorney Paula Foster's investigation of Cragen, as well as the arrival of a tough new captain, Steven Harris. Brian Cassidy treads an increasingly narrow line as an undercover cop in Bart Ganzel's escort organization, as Detective Nick Amaro struggles with the case and his marriage (Part 1).
|Lost Reputation
|Air Date:
|September 26, 2012
|60 mins
|Action Crime Drama
|BD Wong Christopher Meloni Dann Florek Ice-T Mariska Hargitay Richard Belzer Tamara Tunie
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Law & Order: Special Victims Unit ( S14 E1 ) Comments
|Posted by TastyTodger 3 years, 11 months ago
Another great start to a new season still think they should try get Christopher Meloni back as he and Benson ruled this show but still very watchable 4/5
|Posted by yassiebottTV 3 years, 11 months ago
now thats how you start off a season!!!!!
|Posted by carmen987654321 3 years, 10 months ago
that was an excellent start to the season,the plots in this show never gets old...i love this
|Posted by cbrodman29 3 years, 10 months ago
Great start to the season. For those claiming it was too slow and no action - What did you expect after the way they left off last season. In the end it was worth it and very surprising.
|Posted by irish69 3 years, 11 months ago
great start to a new season n great end to part 2,still not the same without stabler who now stars in trueblood,but still a great show...
|Posted by Aalexxx 3 years, 10 months ago
if this is part 2...and its the start of season 14...where is part 1?
|Posted by laylayforrya 2 years, 5 months ago
sucks without elliot. Sad that he's not returning to this series :(
|Posted by chanelicia 2 years, 8 months ago
Without Stabler, it's not so entertaining anymore.
|Posted by Sir_Boris 3 years, 11 months ago
Glad its back interesting mix of opinions for the first episode. Not sure what I think at the moment though will agree it was slow and I did check the time more than once still watched it all
|Posted by itsBA44 3 years, 11 months ago
Olivia and Cassidy had a miniature fling way back in season one which went absolutely nowhere which is why I was a bit surprised by things that happened between them in this episode. I feel like the writing spanned over 14 seasons has gotten really old and the characters are beginning to do things out of character because of it.. They need to get a fresh director in there to spice things up
|Posted by onetoughcrowd 3 years, 11 months ago
I've seen every single episode...and some twice..but this one?? And to open the season with? I'm very sorry, but I watched half and no more. Way too boring! Too much dialoge and courtroom.. not enough action at all! And it's a two hr episode! perhaps if they concentrated it into one hour it would have been exciting! Sigh
|Posted by lachanteuse76 3 years, 10 months ago
Obviously Delia has many playing cards and obviously when it comes to money with the district attorney she has a priority; her daughter. Life mimics film, music etc. and vice versa. I am not a Jesus freak but sins of the skin can Screw a person life path forever. The choices we make immensely effect our future; it is a given. I know this is a show but I have been watching this show from the beginning, and it is based on true happenings to an extent, no matter what they say. It is partly for legalities and privacy that in the beginning of the show and the end they contradict themselves. At the beginning they say not based on true happenings at the end it says differently. This is a prime example of the corruption in our country, government and legal system; no wonder the show has been running for so long. What an emotional roller coaster of reality and fiction intertwined. This show used to be filmed in the East Village, NY back in the day so much, seeing the cast was like seeing parents in the school yard. Part of the reason why we are all drawn to this phenomenal show is because it is so practical and messed up the way people can behave at the same time when tempted, it's No joke. What an emotional roller coaster.
|Posted by kevez1888 3 years, 11 months ago
where have all the putlocker and sockshare links went ??????????????
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Emergency Physician
6 years of experience
6 years of experience
Emergency/Trauma Center
1 Medical Park
Wheeling, WV 26003 Phone number & directions
1 Medical Park
Wheeling, WV 26003 Phone number & directions
License & Identifications
A medical license is required for a doctor to practice medicine in a particular state. Requirements vary by state but most require, at a minimum, post-graduate training in the doctor's specific specialty. An NPI number is a national identifier unique to an individual health care provider and is managed by the Center for Medicare & Medicaid Services (CMS).
Learn more about Dr. Jason Seungdamrong:
View the full profile to get information on:
- Qualifications
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Patient Reviews
Patient comments (4)
The overall average patient rating of Dr. Jason Seungdamrong is Good.
|Patient Ratings
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|Accurate Diagnosis
|Bedside Manner
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Education & Awards
Dr. Seungdamrong graduated from The University of Texas Southwestern, Dallas.
Dr. Seungdamrong has 5 hospital affiliations:
- Wheeling Hospital
- Lancaster Regional Medical Center
Home > Find an Emergency Physicians > WV > Wheeling Emergency Physicians > Dr. Jason Seungdamrong, MD
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- Additional Information
- Dr. Jason Seungdamrong MD is a male Emergency Medicine Specialist, has 6 years of experience and practices in Emergency Medicine.
- Where does Dr. Jason Seungdamrong practice?
- Dr. Jason Seungdamrong has 2 office locations.
Dr. Jason Seungdamrong practices Emergency Medicine near Wheeling, WV.
Additional practice locations include: Brooklyn, NY.
See Wheeling Emergency Physicians.

subset: commoncrawl


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Hi folks !
I have a shed full of ultralight aircraft and parts I'm willing to sell.
Check this website and if there is something you are interested to buy,
Note that I have more stock than is listed here so feel free to call me for more info.
Call me at 679-4990 regional code 613
or email me at firstname.lastname@example.com
It will be my pleasure to serve ya !
Subpages (9): AIRCRAFT CONTACT ENGINES EXHAUST FLOATS Learn to fly OTHER PARTS REDUCTION DRIVE WW II pilot


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A British sounding siren from World War II. This is the attack signal (imminent air raid).
Perfect - Exactly what I wanted!!
Yes really true
I am a maniac of air raid siren. I have one portable from the canadian army WWII. But the ultimate air raid siren is the Carter siren . The one we can hear from the genuine footage of the WWII.
Wow!! Awesome!
is that seriously synthesized?! marvelous!!!
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Children's Songbook (Words and Music)
by LDS Distribution Center
The compact discs include all the songs with words in the English edition of the Children's Songbook. Set of five CDs.
Product Description
Love it!
By Laura , Submitted on 2015-02-25
By Laura , Submitted on 2015-02-25
We love having our own copy of all the children's song from church! they are organized perfectly for us to listen to on the van... :0)


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Your Travel Guide To Discover Seville, A City To Love
Explore Seville's Most Fascinating HighlightsA heady mix of haunting sights, awe-inspiring art and vibrant street life, Seville is one of Europe's most beautiful and inspiring destinations. The result of 2,000 years of ad hoc urban development, Seville's cityscape is an exhilarating spectacle.
First Time In Seville? Start Here!Seville is the most rewarding city in Spain and a place all travelers should visit at least once in their lives. It's a great city, but it can be hard for a first-time visitor to know where to start. Here are my recommendations to plan the trip of a lifetime.
Purchase Your Bullfight Tickets OnlineAre you planning to get bullfight tickets during your trip to Spain? While it can be a challenging task, here is all the practical information to buy your tickets easily. Purchase them online and forget about the hassle of having to go to the bullring's ticket office.
Semana Santa – Tradition and RitualSemana Santa, or Holy Week, is elaborately celebrated each year in Spain. Did you know that up to a million visitors flock to Seville for the spectacle? Join Sevillanos to fill up the streets while watching dozens of solemn and incredibly beautiful processions.
Feria de Abril – A Colorful PartySpaniards are known for celebrating everything and anything with great gusto, pomp and ceremony, and none shows that more off than the Feria de Abril. Seville really comes alive in April with its own lavish fair full of parades, horses, parties, drinking, and more parties!
Get Your Sevilla Card Before You Leave HomeSeville is popular… and can be very busy. The Sevilla Card has been designed so you don't have to carry around cash or wait in line to buy tickets, saving you time and money. Place your order, get your pass, and start enjoying it as soon as you get to Seville.
Reader Opinions
A few days ago I returned back home after 3 awesome weeks in Spain. I'm in love! Thanks for all the useful and accurate information that you provide in your site. It has proved incredibly helpful both while planning the trip and onsite.
Thank you so much for making my first time in Seville so special. Your suggestions and answers to all my questions were sensational. Now I just want to go back.
My family and I recently finished a trip throughout Spain. After visiting your amazing country, we can definitely say that Sevilla is our favorite city thanks to your useful guide. We will be back!
The Best Walking ToursThe best way to see Seville is on foot. But even better is to see it on foot with someone who knows the city inside and out. Learn about the city, its food, its history and its culture.
Enjoy The Best Tapas in SpainWith so many bars and restaurants in Seville, choosing where to eat — and making the best choices — can be a bit confusing. But it's a good kind of confusing, if you know what I mean…
Private Photowalk (With Me!)Join me on one of my Seville photo walks. We will wander around some beautiful corners of the city and capture amazing images that will become everlasting memories of a unique trip.
Getting To & Moving Around SevilleSeville can be easily reached from abroad and other Spanish cities. Additionally, it is a relatively compact city, so combining your own two feet with low-cost public transportation is the best way of getting around. And forget about cars because parking in Seville is a nightmare!
Days Out From Seville – Explore More!There's a world of magnificent Spanish history, art and culture just beyond the gates of Seville. So many amazing destinations can be reached on a day trip that you should allow some time to explore other areas of Andalucía. There's a lot to discover.
Take A Flamenco Lesson And Feel The PassionA morning or afternoon spent at a flamenco class is a memorable experience that enhances your visit to Seville, the city considered the cradle of this passionate dancing style. It's one of the favorite activities of Seville Traveller readers and no wonder they are so popular.
Latest From The Blog
Sevilla Card: Great City Pass To Save Money And Time
The Sevilla Card is a city pass or tourist card. As soon as you start planning your trip to Seville you should get this city pass before you leave home.
Official Madrid Bullfight Schedule: Spanish Bullfighting At Las Ventas
Attending a Madrid bullfight must be included into your list of highlights. Have a look at the official bullfighting schedule and don't miss the chance to spend an exciting evening at the most important and biggest plaza de toros (bullring): Las Ventas. This schedule includes all the corridas that will be held during the season as well as the novilladas.
A Spanish Bullfight In Seville: Official Bullfighting Schedule
If you plan to attend a Spanish bullfight in Seville, you should have a look at the official bullfighting schedule. It includes all the corridas that will be held during the season as well as the novilladas.
La Maestranza (Seville's bullring) holds bullfights from March or April until October.


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Hi Everyone,
I'm new to wordpress and wondered if there is any tutorial videos out there that I can learn from. I'm fluent in XHTML and CSS but am still trying to get my head around this thing.
I've built a website in XHTML with a separate style sheet in CSS, how could I incorporate that into my wordpress blog for example?
Sorry if the question sounds stupid.
Thanks in advance


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Capital FM Arena Nottingham, Bolero Square, The Lace Market, Nottingham, NG1 1LA T: 0843 373 3000
Ticketing & Customer Services opening hours are Monday - Sunday, 8am - 9pm. Telephone opening hours are Monday - Sunday, 9am - 9pm.
The Arena is located near the centre of Nottingham, about half a mile from the station. Turn right on Station Street, left onto Trent Street, right onto Canal Street, right at London Road, then turn left at Lower Parliament Street. The Arena is on the left. Broadmarsh and Victoria bus stations are 10 minutes walk away.
Coming up at the Capital Arena: 10th September - Noel Gallaghers High Flying Birds, October 3rd - Lionel Richie, October 6th Cheryl Cole. The Killers announced their first UK tour in four years and will perform at Capital FM Arena on Saturday 3rd November.


text:
Obama's Lofty Goals on College Costs Face Long Odds
President Obama has promised to "shake up" higher education, and his college-affordability plan, unveiled last week in a speech at the University at Buffalo, would do just that.
If enacted by Congress, his proposals would transform how higher...
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Petrie is understood to be locked in discussions with Inverness boss Terry Butcher as he seeks to name the successor to Pat Fenlon.
If the former England captain accepts the Leith post, he will become the club's ninth manager since 2001.
Fenlon resigned on Friday just two days after administration-hit Hearts racked up their second shock Edinburgh derby win of the season.
But Riley, chairman of the Hibs Supporters Association, claims it is the man at the top who the capital club's faithful are running out of patience with.
He told Press Association Sport: "The fact we have been through so many managers in the last few years is a big concern to everyone who supports Hibs.
"The managers can't all be wrong and somebody has to take responsibility for that. Perhaps we need a director of football.
"I think we're already at the point where if Petrie doesn't get it right with Butcher there will be an almighty outcry.
"But we would rather that he got it right this time. Rather that than having to change the manager again or we end up getting relegated. We just want someone to come in and get the players working."
Riley led the calls for Fenlon to be replaced as boss after the 1-0 League Cup quarter-final defeat to the Jambos.
The Hibs fans association leader labelled the defeat a 'disgrace' as he said enough was enough following earlier embarrassments under the Irishman, which included losing last year's Scottish Cup final 5-1 to the Tynecastle side and the 7-0 Europa League humiliation at the hands of Malmo.
But he gave Caley Thistle boss Butcher - who is still to put pen to paper on a deal with Hibs after the Highlanders granted him permission to discuss a move on Tuesday - a cautious welcome.
"Terry Butcher is - alongside Stuart McCall - the leading manager in Scotland right now," said Riley.
"They are the two that have done well recently, along with Derek McInnes, although I don't think we would have much chance of getting him from Aberdeen.
"But there is no way of saying for sure if Terry Butcher is the right man or not right now. He will have faith in his ability but we just can't be sure.
"I remember a few years back we signed who everyone thought was the best manager in the league at that time and that was Bobby Williamson. He ended up being a disaster. His famous quote was: 'If you want entertainment, go to the cinema'.
"But at least with Butcher, he seems to play an attacking game and knows how to pick out a player - and Inverness certainly seem to beat us all the time. So if he can reverse that trend that would be progress."
Riley added: "Inverness under Terry have done well. They are flying high in the league and have reached a semi-final of the League Cup for the second year in a row.
"But it is difficult to say if he is the man to take us forward. I'll be worried if he turns the job down though, let me put it that way."
Fenlon did lead Hibs to an unbeaten campaign against Hearts last term - the first time the Easter Road club had achieved such a feat since 2001 - but could do nothing as his side's financially-stricken city rivals won both of this season's derbies.
Now Riley says if Butcher does land the job, the minimum he must do is restore the Edinburgh balance.
"With the pool of players we have got, we should be able to finish in the top six," he said. "There is no doubt in that.
"As for the derbies? We always need to win them. Anyone who says they are just another game isn't a Hibs or a Hearts supporters. It's never just another game.
"So we would expect him to win the last two or three derby games, depending how many are played this year. The bragging rights are important from these games and it would good to get the upper hand for once."
- Sports & Recreation
- Soccer
- Terry Butcher
- Pat Fenlon


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Definition of damage feasant in English:
damage feasant
English Law
noun[mass noun]
Damage done on one person's land by another person's trespassing animal, which justifies the landowner in retaining the animal until compensated.
Example sentences
- Another circumstance that may exclude unlawfulness is the consent of the aggrieved party if the damage feasant does not harm or violate public interest.
On grounds of damage caused to land or property: I can distrain the goods damage feasant
More example sentences
- Where animals are taken damage feasant and are replevied by the owner, the defendant in that action may recover the damages which he has suffered by reason of the trespass, and a separate action is not necessary.
- The defendants had no more right to destroy a neighbor's chickens when thus found damage feasant than they would his cattle.
Late 16th century: from Old French damage fesant 'doing damage'.
For editors and proofreaders
Line breaks: dam¦age fea|sant
What do you find interesting about this word or phrase?
Comments that don't adhere to our Community Guidelines may be moderated or removed.
= trending


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erm....once. last year was supposed to be my last time but training never went to plan. still did it but that sub 3hr is an itch i cant scratch and i feel im so much better than that.
east hull 20 a possibility but ashby could also do.
good stuff Carterusm
who still looks on here? hows everyone getting on?
saw Moz today and made me think of this thread
The idea, from a fat adapted athlete, is to not cut out cars entirely. I still eat cars that do fuel shorter faster runs but then on longer stretches my body has no problem moving to fay burning
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Eddie Murphy To Host Oscars
Actor and comedian Eddie Murphy has been named the host of this year's Academy Awards show.
The ceremony will take place on Sunday, February 26, 2012. Murphy was nominated in 2006 for his supporting role in the movie musical "Dreamgirls."
"I am enormously honored to join the great list of past Academy Award hosts from Hope and Carson to Crystal, Martin and Goldberg, among others," Murphy said in a statement.
What do you think? Is Murphy the right host for the Oscars? Leave your thoughts in the comments.


text:
Copper thieves target Ossipee food pantry
OSSIPEE — Police here are hoping the public has information that can help lead to the arrest of thieves who targeted the local food pantry.
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Even though we ARE Nikon lovers,we are NOT affiliated with Nikon Corp. in any way.
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Toronto, CA
43 posts
"book on Nikon D800"
Does anyone know about a really good book about using the Nikon D800, that is more than just a repetition of the manual?


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"Ragtime is syncopation gone mad," Edward Baxter Perry wrote in 1918. "Its victims, in my opinion, can be treated successfully only like the dog with rabies, with a dose of lead. Whether it is simply a passing phase of our decadent art culture or an infectious disease which has come to stay, like leprosy, time alone can tell. It is an evil music that has crept into the homes and hearts of our American people regardless of race, and must be wiped out as other bad and dangerous epidemics have been exterminated."
From 1895 until 1920, newspapers published hysterical editorials arguing that "maintaining a healthy organism requires a steady pulse," not the "ragged" beat of syncopated music. Doctors cited Plato to argue that "ragtime syncopation disrupts normal heart rhythms and interferes with the motor center of the brain and nervous system." Pseudo-science aside, ragtime cut the template for every musical controversy to follow because 1) it was made by black people and 2) it led to intoxication, especially drunken women.
Is there any type of controversial music today? The last time I remember music causing a stir was around 1990, back when N.W.A. was telling us about the dopeman and Ice-T released "Cop Killer" and it seemed like every local newscast expressed concern that our kids were eating ecstasy and raving. Today Ice-T plays a detective on Law & Order and techno provides the soundtrack for aspirational advertisements for luxury sedans and moisturizing lotions. But I'm old. Perhaps there's a new kind of dangerous music out there.


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About dean84
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- Birthday 12/25/1984
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Hey Dev, you say 2.2.1 is ready, when will it be updated in the MP.
I know its not always possible to answer, but do you have any sort of timeline for when the next update will be released? Just curious, as if its a while, I can work around it for now, if its soonish, then I can wait before building the site (new site)
When creating a new application form, and you set groups that can apply, it doesn't check secondary groups. To explain. We are creating a new gaming forum, all those who register are members. Thre is then an application to join one of the games (group1) this can only be applied to by the member group. Once accepted their secondary group is then "group1" We then offer a second application to become an officer of the group (leader) We only want those who are member of "group 1" to apply. However it won't work, as the group check only takes into account the primary group, which for all users is still set as "member". We need it to account for secondary groups as we are creating a multi game community, so changing the primary group will not work, as we need to allow them multiple rights, so secondary groups is the only way to do it the way we need. Any plans to allow secondary group checks in applications? Even if its just a tick option to ask whether we want secondaries in the group check.
Hi, With the application form view. How would I go about styling it a bit, I want to change the questions to be bold text. And adjust how the "drop down" answers show, as not too fond of how the "tick" pushes the main answer out of line with the answers not chosen.
If you delete /public_html/ and leave it blank, then save, it reverts to 21. But the moment you edit the box again, it goes back to /public_html/
Still not working, I have added my details, and it keeps changing the port field to "/public_html/" all by its lonesome.
So I can set which user can accept/decline applications, that's great. However does it work on a per application basis. i.e user 1 can accept applications for "application 1" users 2 and 3, can accept applications for "application 2" but user 1 could not accept an application from "application 2". As for part two, i think you may have misunderstood, its not the questions I am on about, its the automatic group change upon acceptance. ie a user in group 1, applies for "app1", upon acceptance, he is moved to group 2 user in group 1, applies for "app2", upon acceptance, he is moved to group 3. Or to better explain, application 1 is there for hiring a global moderator. So when the application is accepted, he would be moved into the "global moderator" group. application 2 is for hiring a forum mod, so when accepted, he would go into the "forum moderators" group. Is that how it works?
We are currently a group of 7 clans, and we are part of an alliance, to help with comms, we are looking at merging onto one site. I was looking at using content to create basic application forms, and they would post in their relevant sections. However member groups are an issue here as don't want too many with access to the ACP. So have come across your application. So a few questions. 1) With each created form, can you set which user groups can accept/decline the applications? We have 7 clans, so each clan will have groups set for each main position. We wouldn't want a recruiter from clan 1, to be able to accept applications for clan 2. 2) With each created form, can you select which group they go in? I know after reading your write that this is possible, however is it possible on a per form basis. Example Form 1 = Members -> Clan 1 Member Form 2 = Members -> Clan 2 Member Form 3 = Members -> Clan 3 Member
Thanks :) shall have a crack at it later tonight.
Where do i go to edit the member list layout? I have reqorked the navigation bar, to be horizontal rather than vertical, however cant seem to find the layout for the member list. I have gotten rid of the sidebar on the forum view, and have it working fine on the home pages and additional pages, just the member page now that I am having difficulty with. Trying to get it to look like this, so instead of a side bar, am loading it above the content area instead.
NVM, I had set the classes up wrong. Works fine now.
Ok, just given that a try, and when changing it from lareright and largeleft, to right and left. It comes back like this: Any idea, if there is something else that needs to be edited?
I am trying to change a few things with the app. Mainly changing the ipslayout partsof it to use the ipslayout_right, instead of the largeright. I have managed to do it on all bar the groups profile page. Could you tell me how I would go about changing the template for that? As I cannot seem to find it. Just want to make the right column "ipslayout_right" instead of the current "ipslayout_largeright" And possibly do the same ot the left column.
I also noticed, that when adding print_r($_POST); It shows as array ( ) On the content pages, so guess its nothing to do with shoutbox, but something to do with IPB itself.
Hi Michael, I have just set IP.Content as my default app, and used htaccess to remove the "page" part of the links. Now the shoutbox no longer accepts any content pages it in the "exclude" section of the settings. Any idea of what to place in there now? currently one of the excluded pages is app=ccs,module=pages,section=pages,folder=,page=football_menu.html What would I need to change, now that IPC is default and 'page' is removed?


text:
Generous donations push Shares fund close to the top
Nearly $2,900 was donated to the Gothenburg Shares fund this week bringing the total within $100 of the $5,000 goal.
Over 80 food baskets—an increase of 12 from 2012—will be distributed Saturday by members of the Gothenburg Rotary Club, the Gothenburg High School Interact Club and other volunteers.
Those making recent donations, in addition to numerous anonymous gifts, were: Hilltop Birthday Club, Doug and Merri Monkemeier, Anonymous in honor of Elaine Tollefson, Anonymous in honor of Gothenburg teachers, Two Ten Club, Don Derra, Anonymous in honor of Kayleen & Ron Ostergard, Gothenburg State Bank Santa Pictures, Getaways Extension Club, Sandy Bosch and Dawson Tire & Wheel.
Latest Headlines
- New hospital safety ratings now available to the public
- Mentees, others share value of TeamMates
- Playground equipment tops Lake Helen priority
- School administrators reorganize with one less
- Turning to the next page
- The Crossing gets special use permit
- Hotline brings sellers and buyers together


text:
Definition of cream of tartar in English:
cream of tartar
noun[mass noun]
A white crystalline acidic compound obtained as a by-product of wine fermentation and used chiefly in baking powder.
- Alternative name: potassium hydrogen tartrate; chemical formula: HOOC(CHOH)2COOK.
Example sentences
- The commercial production of tartaric acid begins with potassium hydrogen tartrate obtained as a waste product from the wine industry.
- Addition of an acid such as citric acid (found in lemon juice) or cream of tartar (which contains tartaric acid) also enhances inversion.
- Other examples are bicarbonate of soda, cream of tartar, calcium oxalate, and saltpetre.
For editors and proofreaders
Line breaks: cream of tar¦tar
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= trending


text:
Oracle Cloud Platform Launch Event on Monday June 22 - Integrate, Accelerate and Lead with the Oracle Cloud Platform
By Thanos Terentes Printzios-Oracle on Jun 18, 2015
Digital Disruption is influencing every Business!
The Digital Disruption wave is prevalent in all our partners and customers discussions today. Hence ORACLE has set the digital transormation to a top priority and a focus topic for the months to come.
At the Digital Transformation Partner Forum, very well set up and organized by Andrew Palmer and held in Budapest, international experts from the Oracle organization talked about Oracle's Digital proposition and how the Digital Business Platform can help change your's and Oracle's opportunity within your company's go to market proposition.
It was a great opportunity to listen to and understand the value of the complete Oracle Digital Business Platform that leverages our IaaS, PaaS and SaaS solutions.It was the first Digital Transformation EMEA Partner Community Summit.
Oracle executives driving the different product areas shared their insight on new products and market trends.Please find below the agenda and a short wrap up of the key session to give You a flavour of the event and the direction for the future.[Read More]
Be part of the Digital Disruption wave that is prevalent in all our partners and customers discussions today. Join us in Budapest to understand what Oracle's Digital proposition is and how the Digital Business Platform can help to change Oracle's opportunity within your company's go to market proposition.
This will be a great opportunity to understand the value of the complete Oracle Digital Business Platform that leverages our IaaS, PaaS and SaaS solutions.
[Read More]
Oracle Database 12c, a major release of Oracle's flagship product, is generally available as of 25 June 2013. Oracle Database 12c is officially launched http://www.oracle.com/goto/database12c/
Oracle Database 12c introduces a breakthrough, new multitenant architecture enabling customers to create multiple, pluggable databases for database consolidation and cloud deployments.
Customers will realize greater
efficiency and flexibility through innovations such as Oracle
Multitenant option and Automatic Data Optimization with Heat Map, for
compressing and tiering data at a higher density. These unique
advancements, combined with major enhancements in availability,
security, and big data support, make Oracle Database 12c the ideal platform for private and public cloud deployments.
As of 25/06/2013, the product is available for download on Linux x86-64, Solaris Sparc64 and Solaris (x86-64) via Oracle Technology Network.
A news release is planned for July 1st, and an external launch webcast, Plug into the Cloud with Oracle Database 12c, featuring Mark Hurd, Andy Mendelsohn, Tom Kyte and other experts is planned for July 10th.
We share our skills to maximize your revenue!
Adopt and implement the latest of Oracle Technology in your solutions.


text:
|Publication number
|Publication type
|Application number
|Publication date
|Feb 2, 1993
|Filing date
|Feb 4, 1991
|Priority date
|Feb 4, 1991
|Fee status
|Publication number
|Diana C. Duane, Eric L. Zilley, Robert C. Jordan
|Original Assignee
|Microelectronics And Computer Technology Corporation, Minnesota Mining And Manufacturing Company
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (25), Non-Patent Citations (18), Referenced by (31), Classifications (33), Legal Events (4)
|External Links: USPTO, USPTO Assignment, Espacenet
1. Field of the Invention
The invention relates to an interconnect structure utilizing copper conductive layer separated by a cured epoxy resin dielectric material, and more particularly to a high density circuit suitable for use as an interconnect device for integrated circuits.
2. Description of the Related Technology
Integrated circuit technology has advanced to where chip-to-chip interconnect delay and line density are limiting factors in the overall performance and size of an integrated module. A high density, high performance alternative to conventional printed circuit (PC) board interconnects is required to address certain deficiencies in printed circuit board chip-to-chip interconnect structures.
Conventional PC board interconnects have been constructed of laminated materials made from glass impregnated with epoxy resin, an example of which is designated "FR-4," a classification representing a flame retardant bisphenol-A-based epoxy resin with a glass transition temperature of 120-150� C. after curing. The line density of a single layer PC board is limited by surface characteristics, such as pits and dents in the laminated foil, print-through of the fabric weave pattern in the foil, and bow and twist features of the overall laminate, to about 200 lines per inch per level. Plated through-holes consume large amounts of board area, severely reducing the board area available for interconnect lines. Copper/organic polymer type structures made with 1970's integrated circuit fabrication equipment and techniques can be fabricated with densities of over 500 lines per inch per level, reducing line lengths and signal propogation delay, and allowing higher packaging density.
Microelectronics and Computer Technology Corporation (MCC), an assignee of the present invention, has developed high density, high performance interconnect systems in which integrated circuit interconnect circuits fabricated from a copper/polyimide structure are utilized to significantly reduce delays and cross-talk or noise. Such systems are described in U.S. Ser. Nos. 07/102,172 and 07/158,172, the disclosures of which are incorporated by reference. Copper/polyimide interconnects may be fabricated with either stacked of staggered vias and may be in a set or predetermined circuit pattern or customizable. The copper/polyimide interconnects represent a significant advance over the prior technology. However, they suffer certain fabrication limitations based on the material characteristics of the polyimide. Polyimide is hygroscopic and therefore requires in-process dehydration bake steps during fabrication. Furthermore, copper conductors require an overcoat in order to prevent undesirable copper/polyimide interactions, for instance oxidation and/or corrosion of the copper, and loss of adhesion strength of the polyimide to the copper.
It is an object of the present invention to provide a high density, high performance interconnect utilizing a copper/cured epoxy resin structure.
It is a further object of the present invention to enhance manufacturing ease of an electrical interconnect and to avoid the fabrication steps of in-process dehydration bakes and overcoating of the conductive copper structures by using a cured epoxy resin as a dielectric material.
A still further object of the present invention is an improved dielectric for use an as interfacial layer for multilayered circuit construction which comprises any cured epoxy resin comprised of one of more polyepoxides, one or more curing agents, and other optional compounds in which the glass transition temperature (Tg) of the cured epoxy resin composition is sufficiently high (at least 175� C.) to enable the cured composition to survive elevated processing temperatures, such as those encountered in the sputter deposition of metals, without undue adverse effects. Preferred compositions are comprised of a fluorene-containing component, such as the polyepoxide or the curing agent.
Unfortunately, universal agreement of the terminology used in the field of epoxy resins has not been reached. The term "epoxy resin" has been used to indicate not only molecules containing at least one group having a three-membered ring of which one member is oxygen, but also the cured compositions in which the three-membered ring no longer exists. As used herein for the present invention, the term "polyepoxide" will be used to mean a molecule that contains more than one ##STR1## The term "epoxy resin" will be used to mean uncured compositions comprising a polyepoxide, a curing agent, and other optional compounds that can be cured into a "cured epoxy resin".
According to another aspect of the present invention, the high density interconnect may advantageously be a multi-layer circuit residing on a carefully chosen substrate. The substrate utilized can be a ceramic, a semiconductor such as silicon, or a cured epoxy resin structure. The circuit or electrically conductive layers are preferably copper, although other suitable electrical conductors include gold, aluminum, silver or a refractory metal.
In accordance with still another aspect of the present invention, a line density of over 300 lines per inch per level, preferably 500 lines per inch per level, can advantageously be obtained over PC board technology conductor line densities which normally are limited to about 200 lines per inch per level.
A further object of the present invention includes a circuit made up of a plurality of circuit layers, thermal vias, power channels, and top level structures to accommodate a variety of integrated circuit configurations. The layers can be arranged so that they are connected in a predetermined and desirable fashion in order to define the desired circuit structure. Additionally, multiple reference or power layers can be utilized in the circuit.
Those epoxy resins suitable for the present invention which contain the fluorene structure either in the polyepoxide component or in the curing agent process in a manner similar to conventional high performance epoxy resins, but due to the structure of the fluorene moiety, provide for the formulation of cured materials with a unique combination of high glass transition temperature, increased ductility (crack resistance), and low moisture absorption. These resins, their properties, and their development have been disclosed by Minnesota Mining and Manufacturing Company (3M), an assignee of the present invention, in the papers "High Performance Fluorene Resins and Their Composites" by Portelli, Schultz, Jordan and Hackett, Twentieth International SAMPE Technical Conference, Sep. 1988, pp. 20-33; and "Moisture Effects in Fluorene Thermoset Resins" by Jordan, Baker, Schultz and Portelli, Twentieth International SAMPE Technical Conference, Sep. 1988, pp. 576-589, each of which is incorporated by reference.
A significant advantage of certain cured epoxy resins is that their moisture absorption is lower than cured polyimide. The weight change of a cured thin film of conventional polyimide such as DuPont 2525 is reported to be 3-4% after 24 hours of exposure at 25� C. and 100% relative humidity. The weight change of 3M's fluorene-containing cured epoxy resins, after exposure to conditions of high temperature and high humidity, have been found to be approximately 2% or less at equilibrium. This lower moisture absorption increases the manufacturability and reliability of copper/epoxy structures as compared to copper/polyimide constructions. An example of the improved manufacturability associated with cured epoxy resins is the elimination of in-process dehydration bakes that are required when polyimide is the dielectric.
Furthermore, it has been reported that the interfacial adhesion between copper and polyimide is weak due to the formation of copper oxide and other copper/polyimide reaction products at the interface. Deleterious reactions between the polyimide and the copper indicative of corrosion are often detected by discoloration of the copper after the polyimide is cured. As a result, it is frequently necessary to deposit an overcoat on the copper conductor surface to prevent such reaction products. Protective overcoats including copper oxides, nickel, and titanium are common. Unfortunately, these overcoats add complexity to the process sequence and can easily increase the number of fabrication steps by 30%, especially when considering that most overcoat processes require the removal of native copper oxide immediately prior to applying the overcoat.
An advantage of the present invention copper/cured epoxy resin device is the ability to resist oxidation/corrosion up to cure temperatures of 200� C. The lack of observable deleterious reactions between copper and epoxy resin during the epoxy cure allows for the elimination of protective overcoats.
Yet another advantage of a cured epoxy resin dielectric is its excellent adhesion both to itself and to numerous other materials, in particular copper conductors.
According to a particularly advantageous embodiment of the present invention, the same epoxy resin used as a dielectric can also be used to fabricate an underlying substrate or base. This feature results in a thermal coefficient of expansion of the dielectric is identical to that of the substrate, thereby eliminating substrate bow caused by thermal mismatch of materials, and reducing related concerns during thermal cycling. The small percentage of area covered by the metal conductor as compared to that covered by the dielectric in any particular layer will not have a significant effect on the thermal coefficient of expansion. Normally, even in high density interconnect systems, less than 30% of the available area is taken up by a metal conductor. The cured epoxy resin substrate may be fabricated by conventional procedures, such as curing the epoxy resin in a sheet-like structure or machining previously cured epoxy resin to an appropriate configuration.
Characteristic impedance, cross-talk, and line density are three of the most important considerations in the design of an electrical interconnect system. The characteristic impedance is affected by the dielectric constant, the dielectric thickness, the conductor width, and the conductor thickness. The performance of an interconnect is ultimately limited by the resistivity of the conductor and the dielectric constant of the dielectric material. If a dual stripline model is used, applicant has calculated a characteristic impedance of about 56 ohms for cured DuPont 2525 polyimide (dielectric constant ═ 3.5); and a characteristic impedance of about 51 ohms for cured epoxy resin (dielectric constant ═ 4.2). An epoxy dielectric material can be used to create a 60 ohm controlled impedance substrate by changing the distance between the conductor and reference planes, and the distance between the conductors on separate levels, each to 20 microns. A spacing of 20 microns between conductors can be achieved with a cured epoxy resin dielectric, so a dielectric constant as high as 4.2 provides for an acceptable system.
FIG. 1 shows a schematic drawing section of an interconnection device according to the invention.
FIG. 2 shows an alternative circuit structure.
FIGS. 3A-3L show elevational cross sectional views of a method of fabricating a copper/cured epoxy resin structure, illustrating successive stages in the manufacturing process.
Background information on epoxies can be found in U.S. Pat. Nos. 4,707,534 and 4,684,678 which are hereby incorporated by reference. The polyepoxides suitable for the present invention are compounds in which there is present more that one epoxy group, e.g., ##STR2## Such polyepoxides include, but are not limited to, polyglycidyl ethers of polyhydric phenols, for example pyrocatechol; resorcinol; hydroquinone; 4,4'-dihydroxydiphenyl methane; 4,4'-dihyroxydiphenyl dimethyl methane; 4,4'-hydroxy-3,3'-dimethyldiphenyl methane; 4,4'-dihydroxydiphenyl cyclohexane; 4,4'-dihydroxy-3,3'-dimethyldiphenyl propane; 4,4'-dihydroxydiphenyl sulfone; or tris-(4-hydroxyphenyl)methane; fluorene containing epoxies, e.g., Shell HPT™-1079 diglycidyl 9,9-bis[4-hydroxyphenyl]fluorene; polyglycidyl ethers of the halogenation (e.g., chlorination and bromination) products of the above mentioned polyvalent phenols; and polyglycidyl ethers of novolacs (i.e. reaction products of monohydric or polyhydric phenols with aldehydes, formaldehyde in particular, in the presence of acid catalysts).
Other suitable compounds include the di- and polyglycidyl derivatives of aromatic amines obtained from the reaction between these aromatic amines and an epihalohydrin. Examples of such glycidylamines include, but are not limited to, N,N'-diglycidyl aniline; N,N'-dimethyl-N,N'-diglycidyl-4,4'-diaminodiphenyl methane; N,N,N'-tetraglycidyl-4,4'-diaminodiphenyl methane (MY™-720, /Ciba-Geigy, Inc.); N,N-diglycidylnapthalenamine [given the name of N-1-napthalenyl-N-(oxiranylmethyl) oxiranemethanamine by Chemical Abstracts 9th Coll. 8505F (1982-1979)]; and N,N,N'N'-tetraglycidyl-1,4-bis [α-(4aminophenyl)-α-methylethyl]benzene (EPON HPT™-1072, Shell Chemical Co.). The polyglycidyl derivatives of aromatic aminophenols (glycidylamino-glycidyloxy benzene) as described in U.S. Pat. No. 2,951,825 are also suitable. U.S. Pat. No. 2,951,825 is hereby incorporated by reference. An example of these compounds is N,N-diglycidyl-4-glycidyloxybenzenamine (ERL™-0510, Ciba-Geigy, Inc.).
Glycidyl esters and/or epoxycyclohexyl esters of aromatic polycarboxylic acids, for example phthalic acid diglycidyl ester, and glycidyl esters of the reaction product of 1 mole of an aromatic dicarboxylic acid anhyride groups, are also suitable.
Epoxy resin curing agents that can be used in the curable epoxy resin composition of the present invention are well known in the art. Included among such curing agents are materials which are preferably acidic or alkaline. Examples of suitable curing agents include the polybasic acids and their anhydrides, for instance the di-, tri-, and higher carboxylic acids such as oxalic acid; pthalic acid; terepthalic acid; succinic acid; alkyl and alkenyl substituted succinic acids; tartaric acid; and polymerized unsaturated acids, such as those containing at least 10 carbon atoms, as for instance dodecendioic acid; 10,12-eicosadiendioic acid; polyhydric phenols such as resorcinol, catechol, hydroquinone, and phloroglucinol; novolacs and cresols such as D.E.H. 85 (Dow Chemical Co., Midland, Michigan); and anhydrides such as pthalic anhydride; succinic anhydride; malic anhydride; nadic anhydride; pyromellitic anhydride; and the like. Generally, from about 0.5 to 2.0 equivalents of acid, phenol, or anhydride are used per equivalent of epoxy group. With the phenols and anhydrides, an optional accelerator, in the range of 0.1 to 5.0 percent by weight of the total resin composition, may be present, e.g. an aromatic tertiary amine such as benzyldimethyl amine, or an imidazole such as 2-ethyl-4-methyl-imidazole.
Also useful as curing agents or supplementary curing agents are Lewis acids such as aluminum trichloride; aluminum tribromide; antimony pentafluoride; titanium tetrafluoride; boron trifluoride and its complexes such as BF3 -diethylether; and the like. It is also desirable at times that these Lewis acids be blocked to increase the latency of the compositions containing them. Representative of blocked Lewis acids are BF3 -monoethylamine and the adduct of HSbF5 X, in which X is --OH, halogen, or --OR in which R is an aliphatic or aromatic group, with aniline or a hindered amine as is described in U.S. Pat. No. 4,503,211 which is hereby incorporated by reference.
Other curing agents include the aliphatic amino-containing compounds, such as diethylenetriamine; triethylenetetraamine; dicyandiamide; imidazoles such as 2-ethyl-4-methyl-imidazole; melamine; pyridine; cyclohexylamine; benzyldimethylamine; benzylamine; diethylaniline; triethanolamine; piperidine; tetramethylpiperamine; N,N-dibutyl-1,3-propane diamine; N,N-diethyl-1,3-propane diamine; 1,2-diamino-2-methylpropane; 2,3-diamino-2-methyl-butane; 2,3-diamino-2-methylpentane; 2,4-diamino-2,6-dimethyl-octane; dibutylamine; and dioctylmine; and the aromatic polyamines such as o-, m-, and p-phenylene diamine; 4,4'-diaminodiphenyl sulfone; 3,3'-diaminodiphenyl sulfone; 4,4'-diaminodiphenyl sulfide; 4,4'-diaminodiphenyl ketone; 4,4'-diaminodiphenyl ether; 4,4'-diaminodiphenyl methane; 1,3-propanediol-bis(4aminobenzoate); 1,4-bis[α-4-aminophenyl)-α-methylethyl]benzene (EPON HPT™-1061, Shell Chemical Co.); 1,4-bis[α-4-amino-3,5-dimethylphenyl)-α-methylethyl]benzene (EPON HPT™-1062, Shell Chemical Co.); bis(4-amino-3-methylphenyl)sulfone; 1,1'-biphenyl-3,3'-dimethyl-4,4'-diamine; 1,1'-biphenyl-3,3'-dimethoxy-4,4'-diamine; and diaminonapthalenes.
The preferred curing agents are the aromatic fluorene polyamines, such as 9,9-bis(4-aminophenyl)fluorene; 9,9-bis(3-methyl-4-aminophenyl)fluorene; 9,9-bis(3,5-dimethyl-4-aminophenyl)fluorene; and 9,9-bis(3-chloro-4-aminophenyl)fluorene which are described in U.S. Pat. No. 4,684,678.
Where the curing agent is an amino compound there is generally used an amount of amino compound to provide an equivalent concentration of amine hydrogen and epoxy groups. However, amino-containing curing agent sufficient to provide 0.1 to 2.0 or more amine hydrogens per epoxy group can be used. Where the curing agent is based on a Lewis acid, there is used from about 0.1 to 5.0 percent by weight based on total weight of the composition, exclusive of any solvents.
Various adjuvants can also be added to the epoxy resin composition to alter the characteristics of either the uncured or cured composition, or both. Included among useful adjuvants are thixotropic agents such as fumed silica; pigments to enhance color tones such as ferric oxide, brick dust, carbon black, and titanium oxide; fillers such as silica, magnesium sulfate, calcium sulfate, and beryllium aluminum silicate; clays such as bentonite; glass, ceramic and polymeric hollow microspheres; glass beads; thermoplastic polymers, and rubbery heterophases. Amounts of up to about 100 parts by weight of adjuvant per 100 parts by weight epoxy resin composition can be used, depending on the particular adjuvant.
While any epoxy resin composition comprising one or more polyepoxides, one more curing agents, and optional adjuvants in which the Tg of the cured epoxy resin composition is at least 175� C. is useful in the present invention, certain compositions are preferred. Such preferred compositions are comprised of a fluorene-containing component such as the polyepoxide or the curing agent. The inclusion of a fluorene-containing component enables the formulation of epoxy resins which, when cured, are characterized by relatively high Tg's, increased ductility (crack resistance), and low moisture absorption. Furthermore, such compositions allow for rigid thick film processing as well as fabrication of the cured epoxy resin substrates.
FIG. 1 illustrates an interconnect device according to the preferred embodiment. The embodiment illustrated in FIG. 1 incorporates the stacked vias 9. Alternatively, staggered vias 8 (FIG. 2) may be utilized. The fabrication is performed on a base substrate 1 which may be ceramic, semi-conductor such as silicon, or a cured epoxy resin. If the base 1 is electrically conductive then an insulator such as polyimide layer 1A may be coated thereon. A bottom reference (ground/power) plane 2 may be utilized in connection with an X-conductor signal level 3 and a Y-conductor signal level 4. A top reference (ground/power) plane 5 (FIG. 2) may be incorporated along with a bonding/termination layer 6. The dielectric material 7 is a cured epoxy resin and preferably a fluorene-containing resin.
A method for making a Copper/epoxy structure is now described. Referring now to FIG. 3A, reference numeral 10 generally indicates any suitable substrate. Preferably substrate 10 includes a ceramic base 12, such as alumina ceramic or glass covered with a starting cured epoxy resin layer 14 having a polished surface 16. Cured epoxy resin layer 14 may have any suitable thickness, such as 10 um. However, substrate 10 may be of other materials, such as a silicon base with other dielectrics, or substrate 10 may be composed entirely of cured epoxy resin.
FIG. 3B shows a plating interconnect 24 consisting of layers 18, 20 and 22 deposited on surface 16. Preferably a sputter deposited titanium layer 18, copper layer 20, and titanium layer 22 is used. Bottom titanium layer 22 is used as an adhesion layer for the plating interconnect copper layer 20 and top titanium layer 22 is used as a protective coat to prevent copper layer 20 from oxidizing after deposition. For instance, titanium layers 18 and 22 can be 500 angstroms thick and copper layer 20 may be 2500 angstroms thick. Other suitable plating interconnects 24 may consist of trilayers of chromium/copper/chromium, chromium/copper/titanium, or refractory metal/gold.
FIG. 3C shows a conventional plating mask of photoresist 26 formed over top titanium layer 18. As shown in FIG. 3D, photoresist 26 can be patterned through standard lithographic methods to provide selected openings therein for pattern plating a copper feature, such as a reference plane, x-line or y-line. Top titanium layer 18 is stripped in a mild solution, such as 0.5% hydrofluoric solution using the plating mask 26 as a mask, thereby forming a pattern for a copper conductor to be electroplated to copper layer 20. Copper is the preferred electrical conductor.
In FIG. 3E copper feature 28, for example a conductor line, is plated to the copper layer 20 in the patterned openings formed by the photoresist 26. Copper feature 28 can be plated by any suitable method, including electroplating and electroless deposition. In FIG. 3F photoresist 26 has been stripped as is conventional.
In FIG. 3G a pillar plating mask shown as a thick layer of photoresist 30 is formed on top of copper feature 28. In FIG. 3H photoresist 30 is patterned as is conventional to form patterns for plating an electrically conductive metal pillar or via onto the copper feature 28. Applicant prefers the term "pillar" to "via" since vias are typically formed using substractive processes whereas pillars are typically formed using additive processes such as described herein.
As shown in FIG. 3I, copper pillar 32 is plated into an opening in photoresist 30 onto the top of copper feature 28. Pillar 32 can be plated by any suitable method, including electroplating and electroless deposition. In FIG. 3J photoresist 30 has been stripped as is conventional leaving pillar 32 securely attached to copper feature 28. Surfaces on copper pillar 32, copper feature 28, and top titanium layer 18 are exposed. In FIG. 3K the remaining plating interconnect 24 consisting of titanium 18, copper 20 and titanium 22 not beneath a copper feature 28 is stripped to disconnect connections between adjacent copper feature 28.
Thereafter, as shown in FIG. 3L substrate 10 is ready for conventional deposition of epoxy resin, curing, and polishing for planarization. The preferred method of applying the epoxy resin dielectric over the conductors is spin coating from a liquid suspension or solution. Alternative methods include even distribution of a powder to the conductor surface, application of an uncured or partially cured epoxy resin in a film form, and spray coating. Planarization methods for the cured epoxy resin include polishing and chemical etchback. Mechanical polishing is preferred and is well understood by those skilled in the art due to the widespread use of cured epoxy resins as encapsulants. Chemical etchback using a plasma reactive ion etch (RIE) system with oxygen/fluorine plasma is also suitable.
More levels of conductors and reference planes can be fabricated by repeating the above-described sequence of operations. A preferred multilayer structure includes a first set of essentially parallel wire segments arranged in a first layer, a second set of essentially parallel wire segments perpendicular to the first layer, and a dielectric separating the wire segments and the layers.
Additional details for additive substrate fabrication are disclosed in prior art methods for fabricating copper/polyimide multilayer structures, such as U.S. Pat. No. 4,810,332 and U.S. Ser. No. 07/426,629 filed Oct. 24, 1989. The disclosures for both references are hereby incorporated by reference. While an additive method of fabricating a copper/epoxy structure has been described, numerous substractive fabrication techniques well known to those skilled in the art can also be applied to fabricate the present invention copper/epoxy structures.
Initial copper/epoxy structures fabricated on epoxy substrates by the applicant were found to crack. Hot plate bakes were eliminated after it was discovered that the 65 mil thick epoxy substrates bowed while on hot plates due to the thermal gradient from the bottom to the top of the epoxy substrate. The cured epoxy resin substrates flattened out immediately when removed from the hot plate, but the copper conductors on the surface of the wafer could be affected (compressed) by the bow to cause cracking. Consequently, convection bakes replaced all hot plate bakes to eliminate substrate bow. A suitable cure profile was found to be 15 minutes at 60� C. in a vacuum oven, followed by 4 hours at 200� C. in a convection oven.
The cured epoxy resin substrate has a potential drawback in that the thermal conductivity of such a substrate is relatively poor. This mean that conventional "through-the-substrate" heat dissipation methods used for silicon and other thermally conductive materials cannot be used. To demonstrate a potential solution to the thermal transmission problem, 100 1 mm diameter holes were drilled into a cured epoxy resin substrate in a 10 hole by 10 hole array, with a 1 cm spacing between holes. A small stub of 50/50 indium/lead wire was placed in each hole and melted at 150� C. to form a solid metal plug therein. It is expected that thermal vias like metal plugs could be used to move heat through the epoxy substrate if through-the-substrate heat transfer is desired. The heat transfer efficiency using filled through-holes has not been quantified and will be highly dependent on the heat transfer properties of the thermal conductor used to fill the holes.
In one experiment applicant calculated the stress of the cured epoxy resin film from bow measurements on a silicon wafer. The film stress was calculated to be 3.03+/-0.28�108 dynes per square centimeter for a film cured at 200� C. The stress was tensile, causing the thin silicon wafer to bow towards the cured epoxy film. Assuming the observed wafer bow was caused only by thermal stress, the coefficient of thermal expansion (TCE) of the epoxy was calculated to be 60�10-6 /�C.
Applicant has found that by matching the TCE of the substrate to the TCE of the dielectric, TCE mismatch concerns within an interconnect system can be greatly reduced. However, there are still concerns about the TCE mismatch between a copper/epoxy interconnect module and the chips to be attached to the top of the module. The TCE of a copper/epoxy module is dominated by the TCE of the epoxy, at about 60�10-6 /�C. Silicon has a TCE of 2.5�10-6 /�C., and GaAs has a TCE of 5.8�10-6 /�C. To accommodate this TCE mismatch between a copper/epoxy interconnect and a silicon or GaAs chip mounted thereon, a compliant method of chip attachment is preferred. Compliant TAB or "flip chip"bonding are some of the possible chip attachment methods that allow for TCE differences. In the event a die attach is positioned between a chip and a copper/epoxy interconnect, the die attach materials should be carefully chosen to prevent cracking or separation of the die attach.
Applicant has also found that the adhesion of the cured epoxy resin film to itself and other materials is excellent. Applicant attempted to quantify adhesion, but in all cases the adhesion at the cured epoxy resin interface was better than the adhesion of any other interface in the test structure so no adhesion strengths at the cured epoxy resin interfaces could be measured. Although cured epoxy resin adheres to most materials, it was not found that most materials adhere to cured epoxy resin. For instance, sputtered metal films were not found to adhere well to cured epoxy resin films unless the cured epoxy resin films were pretreated with a plasma roughening step or a generous backsputter step just prior to sputter deposition. It was also found to be critical to clean the cured epoxy resin substrates with a solvent to remove all traces of mold release agent prior to sputter deposition.
The present invention copper/epoxy multilayer interconnect system has been tested by applicant to establish environmental stability and material system integrity. Environmental stress tests similar to those used for military qualification and based on MIL-STD-883C were used. The tests included thermal shock, moisture resistance, temperature 85� C./humidity 85� C. (TH), chemical resistance, high temperature storage, and autoclave testing. The tests demonstrated that the copper/epoxy substrates were visually unchanged and electrically continuous after environmental stress testing.
The invention described herein is by way of example. The invention is not limited to the embodiments illustrated in the drawings or the examples set forth. Numerous changes may be made and are contemplated as being within the spirit and scope of the invention as defined by the claims attached hereto. Furthermore the invention is not limited to integrated circuit interconnect devices. Utilization of the claimed method and structure for various other applications is within the scope of the invention.
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|Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms
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|Aug 22, 2012
|May 3, 2016
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|Jin-Chuan Bai
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|Nov 17, 2003
|Aug 5, 2004
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|Jun 21, 2005
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|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Feb 4, 1991
Owner name: MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATI
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Take some time to browse our new format and be sure to visit often, as we add new information!
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Browse the brand NEW Stay the Trail "Where To Go" OHV Trail Guide, the on-line companion to our printed OHV Opportunities Map. This interactive map shows exactly where each trail is located in the state, and our detailed trail pages give additional information including, photos, videos and GPS tracks!
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The tenth edition of Characteristics of Emotional and Behavioral Disorders of Children and Youth follows the text's long-standing reputation for trusted research, a teacher-focused presentation, and clear explanations of the concepts related to students with EBD.
Streamlined in this edition, the text offers a coherent conceptualization of the problems of students with emotional and behavioral disorders and the common challenges for teachers. Its four-part format examines the background of EBD, the origins of disordered behaviors, types of disorders and the procedures and problems associated with assessment. This edition includes over 150 new references, a unified chapter on assessment, a new emphasis on teaching social skills and a separately available companion casebook filled with cases and interviews from teachers in the field.
Enhance your learning experience with text-specific study materials.
Cases in Emotional and Behavioral Disorders of Children and Youth, 3rd Edition
$31.40 | Add to Cart
This title is also sold in the various packages listed below. Before purchasing one of these packages, speak with your professor about which one will help you be successful in your course.
Package ISBN-13: 9780132937306
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SACRAMENTO, Calif. -- Sacramento State tennis players Marek Marksoo and Oliver Andersen were both recipients of ITA Scholar-Athlete honors, it was announced by the Intercollegiate Tennis Association.
To receive ITA Scholar-Athlete status, a player must be a letterwinner, have a grade point average of at least 3.50 for the 2013-14 academic year, and have been enrolled at their present school for at least two semesters.
For Marksoo, it marked the second consecutive year he earned the academic honor. The junior from Tallinn, Estonia, was limited to 13 matches during the spring because of a knee injury and posted a 7-6 singles record including 3-0 in Big Sky Conference matches.
Marksoo posted a 4-4 record at No. 1, 2-1 at No. 2, and 1-1 at No. 3 in the team's lineup. The geology major missed nine straight matches with the injury before returning to play in the Big Sky Tournament where he went 1-1 at the No. 3 spot. Marksoo's three-year career singles record at Sacramento State is 40-12.
Andersen, a junior from Copenhagen, Denmark, played in his first season with the Hornets where he posted a 10-14 dual singles record, including a 6-3 mark against Big Sky competition. A psychology major, Andersen dropped his final four matches of the season, but three of those losses were played with a sprained ankle. Prior to the injury, he had won eight of 11 singles matches.


text:
Breaking News
Central African rivals agree on unity govt
- From: AAP
- January 12, 2013
CENTRAL African Republic rebel groups have signed a ceasefire deal with President Francois Bozize, who agreed to set up a government of national unity and call elections.
The accord was announced on Friday after three days of talks in the Gabon capital between the government and Seleka rebels.
The rebels, who launched an offensive on December 10, swept aside the impoverished country's army, but stopped just short of the capital Bangui.
The government and rebels signed a ceasefire accord. The Central African Republic's political opposition also signed two political accords allowing for the appointment of a prime minister from the opposition and setting out other power-sharing details, according to the United Nations.
The talks were organised by the Economic Community of Central African States (ECCAS) which had sent troops to the troubled country as Bozize faced mounting pressure.
Chad's President Idriss Deby, the current ECCAS head, said the opposition and Bozize should start work on the transitional government "from tomorrow".
Under the accord, Bozize will be allowed to finish his mandate which ends in 2016 but he cannot replace the new prime minister during the transition period. Bozize has said he will not stand for a new term.
The agreement also calls for the withdrawal of "all foreign military forces" except those sent by the ECCAS countries. Seleka made this demand specifically to secure the withdrawal of about 200 South African troops sent in December.
The UN Security Council welcomed the signature of the ceasefire, in a statement, which "emphasised the necessity of an expeditious implementation of these agreements and called on all parties to implement them in good faith."


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Golden Goose Deluxe Brand
'Paula' bag
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Unfortunately this item is out of stock
Paula bag in silver from Golden Goose. This crackled leather bag features two top handles, front hook and slip strap closure, removable front flap with zipper, and two front straps with push hook closure. Has an inner zipper pocket, and two side zipper pockets. Measures: 10.5" L x 16.5" W x 8.5" D.
Designer Style ID: GGS13205OSSPAULABAG
Farfetch ID: 10422642
- Composition:
- Leather 100%
Your order will be shipped directly from the boutique to you. Farfetch ships worldwide, and you will be able to track your order at any time. The cost of shipping your order will be calculated at the checkout.
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Delivery duties are not included in the item price when shipping to all other countries. This means you may be liable to pay import duties on receipt of your order.
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You have 14 days from receiving your order to return the item to the boutique using our free returns pick-up service. We strongly recommend that you book your free returns pick-up within 7 days of receiving your order to ensure that it arrives back to the boutique in time. Please note for standard orders we can only collect returns from the same country to which your order was delivered. For click and collect orders we can collect your return from the country your order was delivered to and also the country of the original boutique you ordered from. Click here to read our full returns policy.
Golden Goose Deluxe Brand was born out of the founders Francesca and Alessandro Gallo's shared love of fashion and art. They work with traditional Venetian tailors to produce elegant daywear.


text:
China, Japan, Great Britain, and other cultures offer a tea ceremony that is uniquely theirs. In the United States, we are a nation of immigrants and an American tea culture reflects this. As the American traditional approach to food has revolved around producing and consuming large quantities, there is a shift at play, demanding higher quality. With tea, we had a strong cultural bias early on because so many British came and settled here. Paul Revere was a silversmith and made teapots. The New England area was a little England. American colonists emulated the British style of tea-making to a degree up until the American war of Independence. Then, tea went from being the beloved drink of the country to a symbol of oppression. We became a coffee-drinking nation at that point, encouraged by the British-rival French who had already begun coffee cultivation in Martinique. In the 21st century, we are now becoming more well-versed in tea. The cultures of tea around the world are becoming more known and popular here too.
Americans like and want tea for what tea wants to give them: a moment of reflection and quiet. This characteristic of tea is different than that of coffee. There aren't elaborate cups or pots for coffee. Americans like that element and long for it because we are fundamentally impatient. We want convenience. We love iced tea even though for most of the rest of the world tea is drunk warm. American culture is less ceremonial than many cultures around the world. There's no such thing as an American tea ceremony. We pick and choose aspects of ceremonies and make them our own. Chai is a great example of this—can we prepare it quickly and with a big machine? We've got stuff to do and places to go.
Joane Filler-Varty, our VP of hospitality talks about how American culture impacts the tea programs she sets up for our four and five star hotel clients. "Our whole perspective is to celebrate the tea leaf which is why the tea pouches are important. People can have appreciation of the whole leaf whether through acknowledging the agricultural element to the amazing liquor in the cup that helps you slow down, relax, and enjoy the moment. In the U.S., perhaps not as much time is given as with the British afternoon tea, but if you're willing to spend more time brewing tea, the experience lasts longer than a cup of coffee. The goal is to reflect, be involved, and watch the tea leaves produce the end product. For my American hotel clients, tea pouches are quite popular, although a growing interest in loose tea has been cropping up too. The teapot size varies quite a bit, but they're often not quite as large as the British teapots. Tea is often served with dessert or pastry."
Mighty Leaf Tea has established itself as a modern American tea brand. Much of our success and business have come from our tea pouches because many Americans like to drink tea that way. Our tea line takes influences from different culinary backgrounds. Organic African Nectar is a good example of this, since it includes a South African herb that tea people in the United States didn't know about 25 years ago. Pull out your best teapot and serve any of our tea pouches for an exceptional experience. The tea pouches envelop high quality tea leaves that can be prepared conveniently. You can drink good tea on the go with them. People feel harried and why not? Email is calling for attention. Texts on the phone ask a person to be in 10 places at once. A cup of tea in hand invites you to stop and taste something from the other side of the world. If you have those moments in the day, you can get through our modern life.


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Gastroenterology, Therapeutic Endoscopy, Inflammatory Bowel Disease, Gastroenterology and Hepatology Research
On staff since July 2012
Children's Title: Director, Therapeutic Endoscopy; Director, Gastroenterology Fellowship Program
Academic Title: Assistant Professor of Pediatrics
Research Center: Center for Clinical and Translational Research
Dr. Giefer treated us with warmth and kindness. He honored our role in the decision making process by laying out the different options for treatment. He spoke to my child, never over her, and listened carefully, asking follow-up questions. He has a lovely manner, and we are very glad we were able to get into him. Everyone in the office is responsive and pleasant.
Our daughter had stopped growing, and blood work indicated Celiac as the culprit. We were very apprehensive about endoscopy, and Dr. Giefer was amazing as he talked us through it. He gave pros and cons of deciding to confirm the diagnosis through endoscopy. We felt supported rather than pressured while trying to make a decision about our daughter's health. The procedure itself was quick and once again, Dr. Giefer made us comfortable and walked us through the results. He has a very practical approach to living with Celiac, and we so appreciate him and his staff as we begin our journey.
My young daughter saw Dr. Giefer for persistent, stomach aches that she had been having for over a year. Dr. Giefer was both professional and kind with us and spoke gently and calmly to my little one. He put us all at ease. He was very thorough and when we decided as a team to do an endoscopy, Dr. Giefer showed the same kindness and calmness throughout the process. He gave us the results right away so that we did not have to wait days to know what the test showed. I would highly recommend Dr. Giefer!
Loyola University of Chicago, Maywood
Pediatrics, University of Vermont College of Medicine, Burlington
Pediatric Gastroenterology, University of Washington, Seattle
Advanced Therapeutic Endoscopy, University of Washington, Seattle
Therapeutic endoscopy and pancreatic disease
Pathogenesis, epidemiology, and treatment of recurrent and chronic pancreatitis. Safety and efficacy of endoscopic retrograde cholangiopancreatography (ERCP) in children.
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