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not too long ago, a man brought a trailer to me fro me to weld a piece of metal onto the tailgate. i cut and fit and pull out the machine to start welding. my hood is the miller elite '27 roadster and as i put it on, this man commented on my hood. i siad thanks. i then say cover and flip my hood down. after a few good tacks i hear the man yell "holy s**t" i look up quickly thinking that i started a fire and i see him holding his eyes. i said whats up and he said dang that light is bright. i told him that you are not supposed to look at the light. without missing a beat, he asked "well how are you looking at it?" resisting the urge of saying that keep my eyes shut while welding, i told him that the lens in the hood filters the light. he walked off, so i struck arc again. after about 5-10 more minutes, i hear him yell again and this time thinking "lesson learned" there really is a fire this time. i look at him and he is still holding his eyes and saying that it didnt work. "what didnt work" i asked. he handed me a pair of sunglasses. i asked him to leave and i would call him when the trailer was done. later he returns to pick up the trailer and i told him about potatoes and vicks rub for his eyes, we talked about drunk chickens. and how he had a hard time getting a beer can stuffed in a chicken. i told him about a can holder that i made that holds the can and has a leading edge to cut into the chicken and the push the can from the bottom while removing the tool. i made it out of aluminum. he said that he didnt want a chicken that had been in contact with a piece of aluminum. "what do you think a beer can is made of?" i asked. he said not aluminum. where do these people come from???
Results 1 to 10 of 98
a thread celebrating the "not so bright"welder_one
nothing fancy, just a few hot glue guns for metal
I was welding props for outboards a while back. An individual comes in with a prop and asks me how much to fix it. He had sheared 2/3 of one blade off which was lost to the water gods, but to keep the motor from vibrating and keep fishing for the weekend had hacksawed 2/3 off the other two blades which he had in hand. Sure kept the vibrations down and sold him a new one. The ingenuity of America.
09-03-2007, 04:56 PM #3Member
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09-03-2007, 05:18 PM #4Senior Member
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At the shop the other day, we were having a problem while tapping holes in aluminum. The holes are tapped from either side, leaving about 1/8th inch of space in between the 2 holes. Well, needless to say, their was alomost always a chip left inside this little space. One of the machinists suggested tapping all the way through the hole. One of the enginers said "If you do that, you will have a left hand thread on the opposite side!"
What a waste of a college education.
09-03-2007, 07:47 PM #5Senior Member
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Quite sometime ago when I used to work the counter for the same employer I have now, we had a guy come in carrying a welding hood and the clear cover plates for it. He handed me the spatter covered glass cover plate and asked if I could get him a couple of new ones. I told that I could, but asked him what type of welding he was doing and he told me he was MIG weling. I recommended he go with the cast resin lens' because the spatter would not stick to it. He thanked me and agreed on the cast resin. It was strange because I started to notice he was blinking quite a bit. I then asked him if the shaded lens in his hood needed to be replaced. He asked me "What are you talking about?" "What is a shaded lens?" I then asked him to hand me his hood and whata ya know? NO SHADED LENS!! I sheet you not!!! I asked him if he knew that he was supposed to have a shaded lens in the helmet he said no...then he said "I was wondering how people see when they weld." "The light was awful bright."I then looked a little closer at him and sure enough around his eye/nose area you could start to see a raccoon mask sunburn. I asked how long he had been welding and he told me a couple of hours. To which I told him he was in for the most uncomfortable night of his life.
Here's your sign!Rich Ferguson
Sales Technician
Jackson Welding Supply Co.
"Keep America Strong.....Weld It"
09-03-2007, 08:00 PM #6If necessity is the Mother of Invention, I must be the Father of Desperation!
John Blewett III 10-22-73 to 8-16-07
Another racing great gone but not to be forgotten.http://video.google.com/videoplay?do...modified&hl=en
thats some funny stuff.
you have to wonder how these people live so long???? its a good thing you don't have to remember to breath.thanks for the help
hope i helped
feel free to shoot me an e-mail direct i have time to chat. email@example.com
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09-04-2007, 07:52 AM #8Member
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P.S. I haven't been to church since I was a kid, but I remember a song that we used to sing: "This little light of mine...I'm gonna let it shine...this little light of mine...I'm gonna let it shine...let it shine...let it shine...let it shine!"
09-04-2007, 09:01 AM #9Senior Member
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this one happened at the begging of this year and before i start, i have to tell you that i work for the largest sign company in the world. it is very easy for me to say "what do we build here?" "here's your's, by the way"...lol... it starts out, i was working on a job for the logan international airport, in boston. the signs are 2x2 square tube frame, with 5 inch i-beam running horizontal, and 8 inch i-beam stacked on top running vertical(architect drawings). the plant production supervisor comes to me while i was working on this sign and asks a time frame for completion, i had lost my voice about a day or so before, so my fitter answered his question"all we lack is finishing up" this supervisor then asked what was wrong with my voice and the fitter said that the fumes from welding had burned my voice. supervisor then asked me" well stan, dont you wear a hood? i had hood, leathers, gloves, and respirator on and standing on the sign when he asked me. my fitter then said, nope he puts it on after he gets done welding. this supervisor know has the nickname"stupidvisor" i have many more stories to tell on stupidvisor, but i'll wait until this thread takes off a little more.welder_one
nothing fancy, just a few hot glue guns for metal


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An excellent sweet and mild yellow onion with brown skin. The SweetPak is an improved variety of the Stockton Yellow onion.
Ships FedEx Ground To Zones 2-5 Only, Zones 6-8 Ships Via FedEx 3 Day.
The best onions are grown from transplants set out in October-November and wintered over to mature in June-July. All of our transplant varieties are intermediate day (day neutral) which are best planted in the fall where winter temperatures stay above 0 F. Plant transplants right away, if possible. If you must wait, do not be alarmed if the roots & tops begin to dry out. As a member of the lily family, the onion can live for about 3 weeks off the bulb. Transplants are happy if you apply a light mulch to help conserve moisture for uniform growth.
You should read this before you order! Order transplants early because supply is limited and only available between mid-October and mid-November. They are perishable and must ship as soon as they are harvested, so your order cannot be canceled unless we locate another buyer. Also, the varieties & quantities you order may not become available at the same time, so plan to accept delivery as plants become available. This can result in additional shipments of back-ordered items at a higher cost, so inform us when you order if you will not accept any adjustments to shipping charges, so that any backorders will automatically be canceled. Sorry, we cannot make any special exceptions. Transplants ship separately, so figure shipping separately. Sold in 1 lb increments. Shipping weight = net weight of product + 10%.
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Graduate Snapshot - Accounting
Description of Program:
The graduate accounting program leads to the Master of Science (M.S.) in Accounting degree. The primary goal of the M.S. program is to prepare business and non-business majors for entry into the public accounting profession. It serves as the "fifth" year in preparing students for the 150 hours of postsecondary education required for AICPA membership and required (or scheduled to be required) to become a certified public accountant in most jurisdictions.
Degrees Offered: Master of Science in Accounting (M.S.)
Accounting Information Systems (AIS)
Program Website: https://www.jmu.edu/cob/accounting/masters/index.shtml
Catalog Website: http://www.jmu.edu/gradcatalog/15/masters/accounting.shtml
Application Requirements: http://www.jmu.edu/grad/programs/all-programs/accounting.shtml


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Recipe by big surprise
"Who would believe that beer would be the perfect solution to eradicating fluorescent green margaritas? Well, it is! Best to use not-so-micro brews to avoid an overpowering beer flavor. Use the limeade can to measure the ingredients, and adjust with extra water if the mixture seems too sweet. Straining the pulp is always a good idea, unless, of course, you like pulp!"
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1 (12 fluid ounce) can
frozen limeade concentrate
12 fluid ounces
12 fluid ounces
12 fluid ounces
lime, cut into wedges
I've been making this drink for years!! YUM!! You must try these changes. Use white tequila, use Corona Extra & instead of the water use 12 ounces of
7UP!! Big Difference!
Great recipe. However, we didn't use the water and added half a can of Triple Sec. Powerful!
1098 Ratings
Absolutely love this recipe - you can't taste the beer and everyone's surprised if you tell them it's in there. I've done several variations - one I like the best is to use the full can of frozen lemonade instead of the smaller lime ade and add the juice of a whole lime. just keep the ratios of water and tequila equal w/the size of the frozen juice - use the container to measure (still one beer). So simple! Also, sometimes I put in Cointreau or Grand Marnier in place of some of the tequila - maybe 1/4 cup - it's sweet so keep it minimal. I always serve mine on the rocks. Or you can use another carbonated bev, such as ginger ale or one of those Smirnoff drinks. If you won't drink the whole batch in one sitting, just don't put the beer in to the pitcher; add it to each glass - that way you can save the batch for weeks and drink it as you want. I think it's best if the mix is at room temperature so the ice melts some. One more thing - I recommend using a lighter color beer so you don't make it look funky. Enjoy!
Like others said, this is a STRONG recipe, but people raved like mad. I had to email the recipe to everyone that came to the party. Use a mexican beer, as someone else recommended. I accidentally used Corona Light (I hate light beers) and it was still just terrific. I went out and bought a set of margarita glasses on the strength of my belief that I will make these margaritas at EVERY party I ever throw for the rest of my life. Use the coarse kosher salt, by the way, for the glasses, because you can use that sort of salt in lots of other ways, rather than getting "margarita" salt. Much cheaper, just as good.
these are great! like other reviewers, i did not put the full amount of tequila... but they still pack a punch! i used Mike's Hard Lime instead of beer for a lime-ier taste... delish! tip for those who want to make it blended (it IS possible): do NOT blend it with the beer mixed in! it will foam and overflow your blender. instead, blend all ingredients except the beer with ice and make it thick. stir in beer and viola! blended frosty margaritas for your enjoyment!
If I could give this recipe 10 stars I would. Love, love, love Beer Margaritas. I have passed this recipe all over work. I have used both Sprite and Water, either works. Corona Light is the best beer by far to add to this concoction. I have also found that this is better if you let sit over night.
I made them first with Sprite as others have suggested and then as the recipe called for and used water. Water was by far better. It was much too sweet for us with the sprite. They were great.
I have made a recipe similar to this before but it didn't call for water and I always thought the limeade was a little overpowering. I tried this recipe with the 12 oz. of water and it was delicious. It makes one of the best margaritas I have tasted!
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Piaget Manufactures
Limelight Couture Précieuse necklace
Ref : Necklace G37LM200
Limelight Couture Précieuse necklace in 18K white gold set with 370 brilliant-cut diamonds (approx. 16.04 ct), 9 pear-cut diamonds (approx. 10.19 ct) and 18 drop-cut rubellites (approx. 38.73 ct).
Metal: White gold
Metal weight (gr): 47
Precious stones: Diamond
Semi-precious stones: Rubellite
Sizing guide: Download the Sizing Guide
Should you have any questions about Piaget luxury necklaces, please call us at 1-877-8PIAGET 1-877-8PIAGET or Email the concierge Email the concierge .
With elegance, luxury and refinement, this Piaget necklace is inspired by the decoration of male official dress uniforms. Representing a clearly-defined style, the detailed motifs found in ceremonial frogging are here employed in the cause of seduction. These magnificent decorations are the most striking examples of a style that marks all male clothing and also lends its charisma to female jewelry. The elegance of ceremonial frogging is brought into focus in this Limelight Couture Précieuse necklace in the form of an exceptional motif ringed with diamonds and rubellites. It highlights with exquisite delicacy the forms of a plunging neckline. With its intertwining, sensual curves, it thus enhances a dress through this motif of elegant nobility.
Limelight Couture Précieuse
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The Resource Finder has powerful filtering features — check out the tutorial to learn more.
Series: Responding to "Laudato Si'" by Pope Francis (4 entries)
Pope Francis's June 2015 encyclical has stirred international conversation on how science and faith come together on the question of ecology and climate change. This short series features several responses from friends of BioLogos, including world-renowned Christian climate scientist Katharine Hayhoe. The series concludes with closing thoughts by BioLogos content manager Jim Stump.
God's Extravagant Love in Creation
Critics of Christianity look to evolution to show how the emergence of human life on earth demanded enormous ruin and ravage, billions of years of apparent waste and futility, species extermination and organism road kill. Not only was the massive dying off rampant, it's mandatory too.
Hydrology of the Bow River
There's a word beneath the water, and the Bow River belongs to God. Have you been listening?
Series: Harmonizing Science, Ethics, and Praxis (4 entries)
In this three-part series, Cal DeWitt offers insights and examples of why science and ethics must work together to help us make informed, practical decisions within our society. DeWitt's science-ethics-praxis model provides a framework by which we can live more effectively as God's stewards.
Series: To Serve and Preserve—Genesis 2 and the Human Calling (4 entries)
In this series, David Buller pays careful attention to the original language and cultural context of Genesis 2, revealing that our responsibility to care for creation is a sacred task given to us by God, not merely a modern secular activity. By taking Scripture seriously, we learn that we have a God-given mandate to be diligent stewards of His creation.
Katharine Hayhoe: Evangelical Christian, Climate Scientist
As an Evangelical and a scientist, Katharine Hayhoe is already a member of a rare breed. As a climate change researcher who is also married to an evangelical Christian pastor, she is nearly one of a kind.
Being Fruitful
Many people use the words "dominion" and "subdue" as "unconditional permission to use the world as they please." I came to realize, like many, that such an interpretation is contradicted by the rest of the Bible.
For the Love of the World: John Stott and His Passion for Creation
Some criticized John for his theistic evolutionary position and even his appreciation for Darwin. But Stott saw no contradiction between his own commitment to the authority of Scripture and his openness to God's use of evolution in His creative process.
Saturday Sermon: Over and Above Naturalism, Part 2
Barkley suggests that material creation is not the end of our understanding (as Naturalists think), but a beginning that unveils the majestic and power of a Creator who loves us.
Saturday Sermon: Over and Above Naturalism
Pastor Joseph Barkley of Ecclesia Church extols the greatness of the God who has brought forth incredible works and engaged humankind in relationship. In the first part of the sermon "Over and Above Naturalism," Barkley admires the factual knowledge unlocked by science, and yet reminds the Church that those material descriptions fail to answer the question of ultimate significance.
Science as an Instrument of Worship, Part 3
Humanity faces tremendous moral dilemmas today, and science has relevance to most of them. As followers of Christ, we understand that our lives are entrusted to us for a short time, and that we will give an account for the things we do.
Vox Balaenae
In 1967, biologists Roger Payne and Scott McVay discovered that humpback whales "sing" and published recordings of the whales' complex vocalizations, after which "whale song" quickly entered the popular consciousness and helped propel the "save the whales" environmental movement forward.
Saturday Sermon: Gloriously Functional
Is Genesis 1 describing material creation or functional creation? Pastor Richard Dahlstrom of Bethany Community Church beautifully articulates the insights he has received through John Walton's book The Lost World of Genesis One and probes deep into the Biblical text with us.
Science and Faith: From Collision to Collaboration
in Genesis two, God calls humankind to know and study the surrounding world. The scriptures say that Adam took on the God-given task of naming the animals, which is, in fact, science: the exploration of the natural world.
Of all the blessings to be thankful for on Thanksgiving Day, none of them surpasses the riches of the eternal blessings which the Lord has bestowed on his sons and daughters in Christ Jesus.
Saturday Sermon: The Failure of Religion
In the last verses of Romans 2, the Apostle Paul relates the "failure of religion because of the terrible beauty of the Law" to the need for a regenerate heart.
Seeing the Flood Story Through an Ancient Israelite Lens
Pete Shaw highlights the story of Noah to explore how the story would have been understood in ancient times and from there he goes on to explore how we might consider it today.
Breaking Free of the Enlightenment's Shackles
Pete Shaw, the senior pastor of Crosswalk Community Church in Napa California, offers a brief history of the interactions between science and faith in the first segment of his sermon.
Series: Maker of Heaven and Earth (5 entries)
In his sermon, Dave Swaim discusses the early chapters of Genesis that seemingly contradict scientific evidence, and he suggests that Christians have simply asked the "wrong questions" about this ancient text, which has led to warfare between the two. In light of this, Swaim wraps up his sermon with the three concluding points that he feels sums up the Biblical truth of creation: there is an all-powerful God, he has a perfect plan, and he has given us his love through Jesus Christ.


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Charlie Sykes: Sykes Writes
Obamacare: The Reckoning
The stakes have never been higher, says Charles Krauthammer.
Obamacare dominated the 2010 midterms, driving its Democratic authors to a historic electoral shellacking. But since then, the issue has slipped quietly underground.
Now it's back, summoned to the national stage by the confluence of three disparate events: the release of new Congressional Budget Office cost estimates, the approach of Supreme Court hearings on the law's constitutionality, and the issuance of a compulsory contraception mandate.
Obamacare was carefully constructed to manipulate the standard ten-year cost projections of the CBO. Because benefits would not fully kick in for four years, President Obama could trumpet ten-year gross costs of less than $1 trillion — $938 billion, to be exact.
But now that the near-costless years 2010 and 2011 have elapsed, the true ten-year price tag comes into focus. From 2013 through 2022, the CBO reports, the costs of Obamacare come to $1.76 trillion — almost twice the phony original number.
It gets worse. Annual gross costs after 2021 are more than a quarter of a trillion dollars every year — until the end of time. That, for a new entitlement in a country already drowning in $16 trillion of debt.
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Nico Hulkenberg claims that Force India's potential as a team is the reason he returned to the Silverstone outfit for the 2014 season and beyond...
Nico Hulkenberg claims that Force India's potential as a Formula One team is the reason he returned to the Silverstone-based outfit for the 2014 season and beyond.
The highly-rated German confirmed his return to the team he represented in 2011 and 2012 on Tuesday, ending months of speculation that linked him with moves to several other teams.
"I think you understand we're not really wishing to speak about the contract, but the deal obviously means more than one year," Hulkenberg told Autosport about his plans past 2014.
"I'm happy coming back here. I think - and hope - they can put a competitive package together with which we can do something special next year.
"I know this place very well, therefore I think the bedding in and adapting time will go pretty quickly. I should integrate fairly quickly.
"I think [the team] has taken good future decisions in terms of engine partner, and the team is growing. The structure is getting bigger and bigger.
"I've obviously not been here for a year now but quite a lot has changed and I can see it is moving forwards."
Hulkenberg also denied that he was upset with Lotus after the Enstone team chose pay-driver Pastor Maldonado over him, adding that drivers that bring outside sponsorship to F1 teams is just another aspect of the sport to contend with.
"I think everyone will have their own opinion about it; their own individual thoughts," the 26-year-old continued.
"I don't think it is an entirely new situation, is has been around for a few years now that we have some drivers who come with financial backing. That is probably positive for them.
"I don't have something to offer like that, so I have to work around it. It is what it is.
"It's not the first time I have experienced something like that - I lost the seat at Williams [in 2010].
"To be honest I don't spend too much time thinking about it. I try to get my energy on the important subjects and to get my career in the right way."


text:
Why are people saying that X is not secure?
With X I mean: https://secure.wikimedia.org/wikipedia/en/wiki/X_Window_System
p.s.: The OpenBSD team succeeded with priviledge separation in 2003, WHY DIDN't the "Linux developers" do this?
UPDATE To be clear: What security design flaws doesn X has? Why doesn't the Linux developers separates priviledges in X?


text:
The Rakes
The Rakes were an English indie rock band from London who had a string of top 40 singles and albums in the mid-2000s. Forming in 2003, they split up in October 2009.
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Singer to team up with friend for new musical career
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statelinetack.com > Horse Boots & Wraps > Sport Boots & Splint Boots > Item # SLT900808
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It seems like a lot of other functions within ArcGIS are getting backwards compatibility (file geodb creation, MXD files). I'll still need to publish 9.3 PMF files for a few months and I couldn't find anything in the Publisher settings that would allow me to publish to a previous version. Is it possible?
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Geographic Information Systems Stack Exchange is a question and answer site for cartographers, geographers and GIS professionals. It's 100% free, no registration required.
Per this document (around halfway down, under the heading Saving from ArcGIS 10 to ArcGIS 9.2) you cannot publish a PMF for consumption via ArcGIS 9.2 if you're using ArcGIS 10. It does not mention this for 9.3, but if you're having difficulties reading a PMF in 9.3 that was published via 10, then that apparently doesn't work either (despite ESRI's not mentioning it in their documentation).
Their suggested workaround is:


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Goals: Earth science missions are designed to study our home world from above as a whole system and aid in our understanding how the planet is changing.
Accomplishments: Since the launch of Sputnik in 1957, more than a dozen nations have launched hundreds of spacecraft to study our home world from orbit. A half-century of progress in Earth observation from space has steadily changed our perception of Earth. Satellite measurements enabled understanding of the Earth as a system of interconnected parts. It is now clear the characteristics of Earth's atmosphere so critical to life are maintained by complex and tightly coupled circulation dynamics, chemistry and interactions with the oceans, ice and land surface; all of which are driven by solar radiation and gravitational forces.
Get the latest science news related to our home planet: NASA News Topics: Earth


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Get in and out of your car with ease! Swivel seat does the work for you! Comfy, lightweight seat rotates both clockwise and counter-clockwise, making it easier to get in and out of cars and chairs. Made with memory foam to contour and cradle your bottom and ease strain to back and hips. Raised nubs on bottom grip chair or vehicle's upholstery securely. Washable. 15" diam. x 3/4" thick.
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|Publication number
|Publication type
|Application number
|Publication date
|Jan 4, 2007
|Filing date
|Apr 7, 2005
|Priority date
|Dec 7, 2000
|Also published as
|Publication number
|Satyadev Patel, Andrew Huibers, Steve Chiang
|Original Assignee
|Patel Satyadev R, Huibers Andrew G, Chiang Steve S
|Export Citation
|BiBTeX, EndNote, RefMan
|Referenced by (2), Classifications (57), Legal Events (5)
|External Links: USPTO, USPTO Assignment, Espacenet
This is a continuation of U.S. patent application Ser. No. 10/005,308 filed Dec. 3, 2001, the subject matter being incorporated herein by reference.
A wide variety of micro-electromechanical devices (MEMS) are known, including accelerometers, DC relay and RF switches, optical cross connects and optical switches, microlenses, reflectors and beam splitters, filters, oscillators and antenna system components, variable capacitors and inductors, switched banks of filters, resonant comb-drives and resonant beams, and micromirror arrays for direct view and projection displays. Though the processes for making the various MEMS devices may vary, they all share the need for high throughput manufacturing (e.g. forming multiple MEMS devices on a single substrate without damage to the microstructures formed on the substrate).
The present invention is in the field of MEMS, and in particular in the field of methods for making micro electromechanical devices on a wafer. The subject matter of the present invention is related to manufacturing of multiple MEMS devices on a wafer, releasing the MEMS structures by removing a sacrificial material, bonding the wafer to another wafer, singulating the wafer assembly, and packaging each wafer assembly portion with one or more MEMS devices thereon, without damaging the MEMS microstructures thereon. More particularly, the invention relates to a method for making a MEMS device where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. A getter or molecular scavenger can be applied to one or both of the wafers before bonding, as can a stiction reducing agent. Except for coating of the MEMS structures to reduce stiction, it is preferred (though not required) that the MEMS structures are not altered physically or chemically (including depositing additional layers or cleaning) between release and wafer bonding.
As disclosed in U.S. Pat. No. 5,061,049 to Hornbeck, silicon wafers are processed to form an array of deflectable beams, then the wafers are diced into chips, followed by further processing of the individual chips. This process has disadvantages, as disclosed in U.S. Pat. No. 5,445,559 to Gale et al. Once the mirror is formed by etching the sacrificial material to form an air gap between the deflectable beam and a lower electrode, the device is very fragile. The device cannot be exposed to liquids during wafer cleanup steps, without destroying the mirror. "Therefore, the devices must be cut and the dicing debris washed away before etching the sacrificial layer away from the mirror. This requires that the cleaning and etching steps, and any following steps, including testing be performed on the individual chips instead of a wafer." To address this problem, Gale et al. propose using a vacuum fixture with a plurality of headspaces above the mirrors to prevent contact with the mirrors. The headspaces are evacuated through vacuum ports and the backside of the wafer is ground down to partially sawn kerfs in order to separate the devices. Then the separated devices and the vacuum fixture are washed to remove any debris from the separation operation. The devices with mirrors exposed are finally ready for packaging.
In U.S. Pat. No. 5,527,744 to Mignardi et al., it is likewise desired to avoid damaging the mirror elements when cutting the wafer into individual dies. In Mignardi et al., a partial saw or scribe is performed on the wafer after optionally putting a removable protective coating over the entire wafer to further limit debris from the partial saw or scribe from settling on the mirrors. Then, the protective coating if used and the debris from the partial saw is removed in a post-saw cleaning. Typically the sacrificial layer is then removed, and additional processes may also take place to cover or protect various surfaces of the device that were not exposed previous to removing the sacrificial layer. Last, in order to separate the wafer into individual devices, tape is aligned and applied to the wafer, covering the partially sawed areas. The wafer is broken and the tape is treated with UV light to weaken it and then is peeled away. The individual devices with exposed mirrors must then be carefully picked and placed off of the saw frame and packaged.
U.S. Pat. No. 5,872,046 to Kaeriyama et al., discloses partially fabricating a micromirror structure on a semiconductor wafer, followed by coating the wafer with a protective layer. Then, streets are sawed in the wafer (defining the individual dies), which is followed by cleaning the wafer with a solution of an alkyl glycol and HF. Further processing includes acoustically vibrating the wafer in deionized water. Finally the mirrors are released and the wafer broken along the streets.
What is needed in the field of MEMS and MEMS manufacturing is an easier and less expensive way to assemble and ultimately package a mirror array that avoids the problems of the prior art. In the present invention, a method is provided where the mirror elements on the wafer are released (the sacrificial layer is removed) followed by bonding the wafer to another wafer, which is in turn followed by scribing, scoring, cutting, grinding or otherwise separating the wafer into individual dies. By having the mirror elements encased between two wafers prior to any scoring, cutting, etc., the time that the mirrors are exposed is minimized, and there is no need to provide additional protective measures as in the prior art.
A method is thus provided for forming a MEMS device, comprising providing a first wafer, providing a second wafer, forming a sacrificial layer on the first or second wafer, forming a plurality of MEMS elements on the sacrificial layer, releasing the plurality of MEMS devices by etching away the sacrificial layer, mixing one or more spacer elements into an adhesive or providing one or more spacer elements separately from the adhesive for separating the wafers during and after bonding, applying the adhesive to one or both of the first and second wafers, bonding the first and second wafers together with the spacer elements therebetween so that the first and second wafers are held together in a spaced apart relationship as a wafer assembly, singulating the wafer assembly into individual dies, and packaging each die.
In another embodiment of the invention, a method for making a spatial light modulator comprises providing a first wafer; providing a second wafer; forming circuitry and a plurality of electrodes on or in the first wafer; forming a plurality of deflectable elements on or in either the first or second wafer; bonding the first and second wafers together to form a wafer assembly; and separating the wafer assembly into individual wafer assembly dies.
In another embodiment of the invention a method for forming a MEMS device, comprises: providing a first wafer; providing a second wafer; providing a sacrificial layer on or in the first or second wafer; forming a plurality of MEMS elements on the sacrificial layer; releasing the plurality of MEMS devices by etching away the sacrificial layer; mixing one or more spacer elements into an adhesive or providing one or more spacer elements separately from the adhesive for separating the wafers during and after bonding; applying the adhesive to one or both of the first and second wafers; bonding the first and second wafers together with the spacer elements therebetween so that the first and second wafers are held together in a spaced apart relationship as a wafer assembly; and singulating the wafer assembly into individual dies.
In a further embodiment of the invention, a method for making a MEMS device, comprising: providing a first wafer; providing a second wafer; forming circuitry and a plurality of electrodes on or in the first wafer; forming a plurality of deflectable elements on or in either the first or second wafer; applying an adhesion reducing agent and/or a getter to one or both of the wafers; aligning the first and second wafers; bonding the first and second wafers together to form a wafer assembly; and separating the wafer assembly into individual wafer assembly dies.
In a still further embodiment of the invention, a method for making a MEMS device, comprising: providing a wafer; providing a plurality of substrates that are transmissive to visible light, each smaller than said wafer, each substrate having a frame portion that is not transmissive to visible light; forming circuitry and a plurality of electrodes on or in the wafer; forming a plurality of deflectable elements on or in the wafer; aligning the substrates with the wafer; bonding the substrates and wafer together to form a wafer assembly; and separating the wafer assembly into individual wafer assembly dies.
Mirror Fabrication:
Processes for microfabricating a MEMS device such as a movable micromirror and mirror array are disclosed in U.S. Pat. Nos. 5,835,256 and 6,046,840 both to Huibers, the subject matter of each being incorporated herein by reference. A similar process for forming MEMS movable elements (e.g. mirrors) on a wafer substrate (e.g. a light transmissive substrate or a substrate comprising CMOS or other circuitry) is illustrated in FIGS. 1 to 4. By "light transmissive", it is meant that the material will be transmissive to light at least in operation of the device (The material could temporarily have a light blocking layer on it to improve the ability to handle the substrate during manufacture, or a partial light blocking layer for decreasing light scatter during use. Regardless, a portion of the substrate, for visible light applications, is preferably transmissive to visible light during use so that light can pass into the device, be reflected by the mirrors, and pass back out of the device. Of course, not all embodiments will use a light transmissive substrate). By "wafer" it is meant any substrate on which multiple microstructures or microstructure arrays are to be formed and which allows for being divided into dies, each die having one or more microstructures thereon. Though not in every situation, often each die is one device or product to be packaged and sold separately. Forming multiple "products" or dies on a larger substrate or wafer allows for lower and faster manufacturing costs as compared to forming each die separately. Of course the wafers can be any size or shape, though it is preferred that the wafers be the conventional round or substantially round wafers (e.g. 4″, 6″ or 12″ in diameter) so as to allow for manufacture in a standard foundry.
As can be seen in
At this point, as can be seen in
A second layer 20 (the "hinge" layer) is deposited as can be seen in
As also seen in
In the embodiment illustrated in
In one embodiment, the reinforcing layer is removed in the area of the hinge, followed by depositing the hinge layer and patterning both reinforcing and hinge layer together. This joint patterning of the reinforcing layer and hinge layer can be done with the same etchant (e.g. if the two layers are of the same material) or consecutively with different etchants. The reinforcing and hinge layers can be etched with a chlorine chemistry or a fluorine (or other halide) chemistry (e.g. a plasma/RIE etch with F2, CF4, CHF3, C3F8, CH2F2, C2F6, SF6, etc. or more likely combinations of the above or with additional gases, such as CF4/H2, SF6/Cl2, or gases using more than one etching species such as CF2Cl2, all possibly with one or more optional inert diluents). Of course, if different materials are used for the reinforcing layer and the hinge layer, then a different etchant can be employed for etching each layer. Alternatively, the reflective layer can be deposited before the first (reinforcing) and/or second (hinge) layer. Whether deposited prior to the hinge material or prior to both the hinge material and the reinforcing material, it is preferable that the metal be patterned (e.g. removed in the hinge area) prior to depositing and patterning the hinge material.
It should also be noted that materials and method mentioned above are examples only, as many other method and materials could be used. For example, the Sandia SUMMiT process (using polysilicon for structural layers) or the Cronos MUMPS process (also polysilicon for structural layers) could be used in the present invention. Also, a MOSIS process (AMI ABN—1.5 um CMOS process) could be adapted for the present invention, as could a MUSiC process (using polycrystalline SiC for the structural layers) as disclosed, for example, in Mehregany et al., Thin Solid Films, v. 355-356, pp. 518-524, 1999. Also, the sacrificial layer and etchant disclosed herein are exemplary only. For example, a silicon dioxide sacrificial layer could be used and removed with HF (or HF/HCl), or a silicon sacrificial could be removed with CIF3 or BrF3. Also a PSG sacrificial layer could be removed with buffered HF, or an organic sacrificial such as polyimide could be removed in a dry plasma oxygen release step. Of course the etchant and sacrificial material should be selected depending upon the structural material to be used. Also, though PVD and CVD are referred to above, other thin film deposition methods could be used for depositing the layers, including spin-on, sputtering, anodization, oxidation, electroplating and evaporation.
After forming the microstructures as in FIGS. 1 to 4 on the first wafer, it is preferably to remove the sacrificial layer so as to release the microstructures (in this case micromirrors). This release can be performed at the die level, though it is preferred to perform the release at the wafer level.
Also, though the hinge of each mirror can be formed in the same plane as the mirror element (and/or formed as part of the same deposition step) as set forth above, they can also be formed separated from and parallel to the mirror element in a different plane and as part of a separate processing step. This superimposed type of hinge is disclosed in
The second or "lower" substrate (the backplane) die contains a large array of electrodes on a top metal layer of the die. Each electrode electrostatically controls one pixel (one micromirror on the upper optically transmissive substrate) of the microdisplay. The voltage on each electrode on the surface of the backplane determines whether its corresponding microdisplay pixel is optically 'on' or 'off,' forming a visible image on the microdisplay. Details of the backplane and methods for producing a pulse-width-modulated grayscale or color image are disclosed in U.S. patent application Ser. No. 09/564,069 to Richards, the subject matter of which is incorporated herein by reference.
The display pixels themselves, in a preferred embodiment, are binary, always either fully 'on' or fully 'off,' and so the backplane design is purely digital. Though the micromirrors could be operated in analog mode, no analog capability is necessary. For ease of system design, the backplane's I/O and control logic preferably run at a voltage compatible with standard logic levels, e.g. 5V or 3.3V. To maximize the voltage available to drive the pixels, the backplane's array circuitry may run from a separate supply, preferably at a higher voltage.
One embodiment of the backplane can be fabricated in a foundry 5V logic process. The mirror electrodes can run at 0-5V or as high above 5V as reliability allows. The backplane could also be fabricated in a higher-voltage process such as a foundry Flash memory process using that process's high-voltage devices. The backplane could also be constructed in a high-voltage process with larger-geometry transistors capable of operating at 12V or more. A higher voltage backplane can produce an electrode voltage swing significantly higher than the 5-7V that the lower voltage backplane provides, and thus actuate the pixels more robustly.
In digital mode, it is possible to set each electrode to either state (on/off), and have that state persist until the state of the electrode is written again. A RAM-like structure, with one bit per pixel is one architecture that accomplishes this. One example is an SRAM-based pixel cell. Alternate well-known storage elements such as latches or DRAM (pass transistor plus capacitor) are also possible. If a dynamic storage element (e.g. a DRAM-like cell) is used, it is desirable that it be shielded from incident light that might otherwise cause leakage.
The perception of a grayscale or full-color image will be produced by modulating pixels rapidly on and off, for example according to the method in the above-mentioned U.S. patent application Ser. No. 09/564,069 to Richards. In order to support this, it is preferable that the backplane allows the array to be written in random-access fashion, though finer granularity than a row-at-a-time is generally not necessary.
it is desirable to minimize power consumption, primarily for thermal reasons. Decreasing electrical power dissipation will increase the optical/thermal power budget, allowing the microdisplay to tolerate the heat of more powerful lamps. Also, depending upon the way the microdisplay is assembled (wafer-to-wafer join+offset saw), it may be preferable for all I/O pads to be on one side of the die. To minimize the cost of the finished device it is desirable to minimize pin count. For example, multiplexing row address or other infrequently-used control signals onto the data bus can eliminate separate pins for these functions with a negligible throughput penalty (a few percent, e.g. one clock cycle for address information per row of data is acceptable). A data bus, a clock, and a small number of control signals (5 or less) are all that is necessary.
In use, the die can be illuminated with a 200 W or more arc lamp. The thermal and photo-carrier effects of this may result in special layout efforts to make the metal layers as 'opaque' as possible over the active circuitry to reflect incident optical energy and minimize photocarrier and thermal effects. An on-chip PN diode could be included for measuring the temperature of the die.
In one embodiment the resolution is XGA, 1024�768 pixels, though other resolutions are possible. A pixel pitch of from 5 to 24 um is preferred (e.g. 14 um). The size of the electrode array itself is determined by the pixel pitch and resolution. A 14 um XGA device's pixel array will therefore be 14.336�10.752 mm.
After the upper and lower substrates (wafers) are finished being processed (e.g. circuitry/electrodes on lower wafer, micromirrors on upper wafer), the upper and lower wafers are joined together. This joining of the two substrates allows micromirrors on one substrate to be positioned proximate to electrodes on the other substrate. This arrangement is illustrated in
The method for the assembly of the wafers and separation of the wafer assembly into individual dies and is similar in some ways to the method for assembly of a liquid crystal device as disclosed in U.S. Pat. No. 5,963,289 to Stefanov et al, "Asymmetrical Scribe and Separation Method of Manufacturing Liquid Crystal Devices on Silicon Wafers", which is hereby incorporated by reference. Many bonding methods are possible such as adhesive bonding (e.g. epoxy, silicone, low K material or other adhesive—described further herein), anodic bonding, compression bonding (e.g. with gold or indium) metal eutectic bonding, solder bonding, fusion bonding, or other wafer bonding processes known in the art. Whether the upper and lower wafer are made of the same or different materials (silicon, glass, dielectric, multilayer wafer, etc.), they can first be inspected (step 30 in the flow chart of
The mirrors are preferably released at this point (step 34). Releasing immediately prior to the application of epoxy or bonding is preferable (except for an optional stiction treatment between release and bonding). For silicon sacrificial layers, the release can be in an atmosphere of xenon difluoride and an optional diluent (e.g. nitrogen and/or helium). Of course, other etchants could be used, including interhalogens such as bromine trifluoride and bromine trichloride. The release is preferably a spontaneous chemical etch which does not require plasma or other external energy to etch the silicon sacrificial layer(s). After etching, the remainder of the device is treated for stiction (step 36) by applying an anti-stiction layer (e.g. a self assembled monolayer). The layer is preferably formed by placing the device in a liquid or gas silane, preferably a halosilane, and most preferably a chlorosilane. Of course, many different silanes are known in the art for their ability to provide anti-stiction for MEMS structures, including the various trichlorsilanes set forth in "Self Assembled Monolayers as Anti-Stiction Coatings for MEMS: Characteristics and Recent Developments", Maboudian et al., as well as other unfluorinated (or partially or fully fluorinated) alkyl trichlorosilanes, preferably those with a carbon chain of at least 10 carbons, and preferably partially or fully fluorinated. (Tridecafluoro-1,1,2,2-tetrahydro-octyl)trichlorosilane available from Gelest, Inc. is one example. Other trichlorosilanes (preferably fluorinated) such as those with phenyl or other organic groups having a ring structure are also possible. Various vapor phase lubricants for use in the present invention are set forth in U.S. Pat. Nos. 6,004,912, 6,251,842, and 5,822,170, each incorporated herein by reference.
In order to bond the two wafers together, spacers are mixed into sealant material (step 38). Spacers in the form of spheres or rods are typically dispensed and dispersed between the wafers to provide cell gap control and uniformity and space for mirror deflection. Spacers can be dispensed in the gasket area of the display and therefore mixed into the gasket seal material prior to seal dispensing. This is achieved through normal agitated mixing processes. The final target for the gap between the upper and lower wafers is preferably from 1 to 10 um, though other gaps are possible depending upon the MEMS device being formed. This of course depends upon the type of MEMS structure being encapsulated and whether it was surface or bulk micromachined. The spheres or rods can be made of glass or plastic, preferably an elastically deforming material. Alternatively, spacer pillars can be fabricated on at least one of the substrates. In one embodiment, pillars/spacers are provided only at the side of the array. In another embodiment, pillars/spacers can be fabricated in the array itself. Other bonding agents with or without spacers could be used, including anodic bonding or metal compression bonding with a patterned eutectic or metal.
A gasket seal material can then be dispensed (step 40) on the bottom substrate in a desired pattern, usually in one of two industry standard methods including automated controlled liquid dispensing through a syringe and printing (screen, offset, or roller). When using a syringe, it is moved along X-Y coordinates relative to the parts. The syringe tip is constrained to be just above the part with the gasket material forced through the needle by positive pressure. Positive pressure is provided either by a mechanical plunger forced by a gear driven configuration and/or by an air piston and/or pressed through the use of an auger. This dispensing method provides the highest resolution and process control but provides less throughput.
Then, the two wafers are aligned (step 42). Alignment of the opposing electrodes or active viewing areas requires registration of substrate fiducials on opposite substrates. This task is usually accomplished with the aid of video cameras with lens magnification. The machines range in complexity from manual to fully automated with pattern recognition capability. Whatever the level of sophistication, they accomplish the following process: 1. Dispense a very small amount of a UV curable adhesive at locations near the perimeter and off of all functional devices in the array; 2. Align the fiducials of the opposing substrates within the equipment capability; and 3. Press substrates and UV tack for fixing the wafer to wafer alignment through the remaining bonding process (e.g., curing of the internal epoxy).
The final cell gap can be set by pressing (step 44) the previously tacked laminates in a UV or thermal press. In a UV press, a common procedure would have the substrates loaded into a press where at least one or both of the press platens are quartz, in order to allow UV radiation from a UV lamp to pass unabated to the gasket seal epoxy. Exposure time and flux rates are process parameters determined by the equipment and adhesive materials. Thermally cured epoxies require that the top and bottom platens of a thermal press be heated. The force that can be generated between the press platens is typically many pounds. With thermally cured epoxies, after the initial press the arrays are typically transferred to a stacked press fixture where they can continue to be pressed and post-cured for 4-8 hours.
Once the wafers have been bonded together to form a wafer assembly, the assembly can be separated into individual dies (step 46). Silicon substrate and glass scribes are placed on the respective substrates in an offset relationship at least along one direction. The units are then separated, resulting in each unit having a bond pad ledge on one side and a glass electrical contact ledge on an opposite side. The parts may be separated from the array by any of the following methods. The order in which the array (glass first) substrate is scribed is important when conventional solid state cameras are used for viewing and alignment in a scribe machine. This constraint exists unless special infrared viewing cameras are installed which make the silicon transparent and therefore permits viewing of front surface metal fiducials. The scribe tool is aligned with the scribe fiducials and processed. The resultant scribe lines in the glass are used as reference marks to align the silicon substrate scribe lanes. These scribe lanes may be coincident with the glass substrate scribes or uniformly offset. The parts are then separated from the array by venting the scribes on both substrates. Automatic breaking is done by commercially available guillotine or fulcrum breaking machines. The parts can also be separated by hand.
Separation may also by done by glass scribing and partial sawing of the silicon substrate. Sawing requires an additional step at gasket dispense. Sawing is done in the presence of a high-pressure jet of water. Moisture must not be allowed in the area of the fill port or damage of the MEMS structures could occur. Therefore, at gasket dispense, an additional gasket bead must be dispensed around the perimeter of the wafer. The end of each scribe/saw lane must be initially left open, to let air vent during the align and press processes. After the array has been pressed and the gasket material cured, the vents are then closed using either the gasket or end-seal material. The glass is then aligned and scribed as described above. Sawing of the wafer is done from the backside of the silicon where the saw streets are aligned relative to the glass scribe lanes described above. The wafer is then sawed to a depth of 50%-90% of its thickness. The parts are then separated as described above.
Alternatively, both the glass and silicon substrates may be partially sawed prior to part separation. With the same gasket seal configuration, vent and seal processes as described above, saw lanes are aligned to fiducials on the glass substrates. The glass is sawed to a depth between 50% and 95% of its thickness. The silicon substrate is sawed and the parts separated as described above.
For an illustrated example of the above, reference is made to
As can be seen in
Referring again to
Reflective deflectable elements (e.g., mirrors 48, 48 a, 48 b and 48 c), each corresponding to a respective pixel cell 54, 54 a, 54 b and 54 c, are attached to the lower surface 14 of the optically transmissive substrate 52 in an undeflected position. Thus, mirrors 48, 48 a, 48 b and 48 c are visible through optically transmissive substrate 52 in
The optically transmissive substrate 52 is made of materials which can withstand subsequent processing temperatures. The optically transmissive substrate 52 may be, for example, a 4 inch quartz wafer 500 microns thick. Such quartz wafers are widely available from, for example, Hoya Corporation U.S.A at 960 Rincon Circle, San Jose, Calif. 95131. Or, the substrate can be glass such as Corning 1737 or Corning Eagle2000 or other suitable optically transmissive substrate. In a preferred embodiment, the substrate is transmissive to visible light, and can be display grade glass.
As can be seen in
The method for forming micromirrors as set forth above is but one example of many methods for forming many different MEMS devices (whether with or without an electrical component), in accordance with the present invention. Though the electrical component of the final MEMS device is formed on a separate wafer than the micromirrors in the above example, it is also possible to form the circuitry and micromechanical structures monolithically on the same substrate. The method for forming the MEMS structures could be similar to that described in
It is also possible to bond multiple substrates (smaller than a single wafer) to another wafer. In the embodiment illustrated in
The MEMS wafers could be made of any suitable material, depending upon the final application for the devices, including silicon, glass, quartz, alumina, GaAs, etc. Silicon wafers can typically be processed to include circuitry. For an optical MEMS application (e.g. micromirrors for optical switching or for displays), the "top" wafer of
Then, the two wafers are aligned, bonded, cured (e.g. with UV light or heat depending upon the type of adhesive used) and singulated as set forth above.
There are many alternatives to the method of the present invention. In order to bond the two wafers, epoxy can be applied to the one or both of the upper and lower wafers. In a preferred embodiment, epoxy is applied to both the circumference of the wafer and completely or substantially surrounding each die/array on the wafer. Spacers can be mixed in the epoxy so as to cause a predetermined amount of separation between the wafers after bonding. Such spacers hold together the upper and lower wafers in spaced-apart relation to each other. The spacers act to hold the upper and lower wafers together and at the same time create a space in which the movable mirror elements can move. Alternatively, the spacer layer could comprise walls or protrusions that are micro-fabricated. Or, one or more wafers could be bonded between the upper and lower wafers and have portions removed (e.g. by etching) in areas corresponding to each mirror array (thereby providing space for deflection of the movable elements in the array). The portions removed in such intermediate wafers could be removed prior to alignment and bonding between the upper and lower wafers, or, the wafer(s) could be etched once bonded to either the upper or lower wafer. If the spacers are micro-fabricated spacers, they can be formed on the lower wafer, followed by the dispensing of an epoxy, polymer, or other adhesive (e.g. a multi-part epoxy, or a heat or UV-cured adhesive) adjacent to the micro-fabricated spacers. The adhesive and spacers need not be co-located, but could be deposited in different areas on the lower substrate wafer. Alternative to glue, a compression bond material could be used that would allow for adhesion of the upper and lower wafers. Spacers micro-fabricated on the lower wafer (or the upper wafer) and could be made of polyimide, SU-8 photo-resist.
Instead of microfabrication, the spacers could be balls or rods of a predetermined size that are within the adhesive when the adhesive is placed on the lower wafer. Spacers provided within the adhesive can be made of glass or plastic, or even metal so long as the spacers do not interfere with the electrostatic actuation of the movable element in the upper wafer. Regardless of the type of spacer and method for making and adhering the spacers to the wafers, the spacers are preferably from 1 to 250 microns, the size in large part depending upon the size of the movable mirror elements and the desired angle of deflection. Whether the mirror arrays are for a projection display device or for optical switching, the spacer size in the direction orthogonal to the plane of the upper and lower wafers is more preferably from 1 to 100 microns, with some applications benefiting from a size in the range of from 1 to 20 microns, or even less than 10 microns.
Regardless of whether the microstructures and circuitry are formed on the same wafer or on different wafers, when the microstructures are released by removal of the sacrificial layer, a sticking force reducing agent can be applied to the microstructures (micromirrors, microrelays, etc) on the wafer to reduce adhesion forces upon contact of the microstructures with another layer or structure on the same or opposing substrate. Though such adhesion reducing agents are known, in the present invention the agent is preferably applied to the wafer before wafer bonding (or after wafer bonding but before singulation), rather than to the singulated die or package for the die. Various adhesion reducing agents, including various trichlorosilanes, and other silanes and siloxanes as known in the art for reducing stiction for micro electromechanical devices, as mentioned elsewhere herein.
Also, a getter or molecular scavenger can be applied to the wafer prior to wafer bonding as mentioned above. The getter can be a moisture, hydrogen, particle or other getter. The getter(s) is applied to the wafer around the released MEMS structures (or around, along or adjacent an array of such structures, e.g. in the case of a micromirror array), of course preferably not being in contact with the released structures. If a moisture getter is used, a metal oxide or zeolite can be the material utilized for absorbing and binding water (e.g. StayDry SD800, StayDry SD1000, StayDry HiCap2000—each from Cookson Electronics). Or, a combination getter could be used, such as a moisture and particle getter (StayDry GA2000-2) or a hydrogen and moisture getter (StayDry H2-3000). The getter can be applied to either wafer, and if adhesive bonding is the bonding method, the getter can be applied adjacent the epoxy beads or strips, preferably between the epoxy and the microstructures, and can be applied before or after application of the adhesive (preferably before any adhesive is applied to the wafer(s).
As can be seen from the above, the method of the present invention comprises making a MEMS device, e.g. a spatial light modulator, by providing a first wafer, providing a second wafer, forming circuitry and a plurality of electrodes on the first wafer, forming a plurality of deflectable elements on or in either the first or second wafer, aligning the first and second wafers, bonding the first and second wafers together to form a wafer assembly, separating the wafer assembly into individual dies, and packaging the individual dies. Each die can comprise an array of deflectable reflective elements. The reflective elements correspond to pixels in a direct-view or projection display. The number of reflective elements in each die is from 6,000 to about 6 million, depending upon the resolution of the display.
In the method of the invention, the first wafer is preferably glass, borosilicate, tempered glass, quartz or sapphire, or can be a light transmissive wafer of another material. The second wafer can be a dielectric or semiconductor wafer, e.g. GaAs or silicon. As noted above, the first and second wafers are bonded together with an adhesive (thought metal or anodic bonding are also possible, depending upon the MEMS structure and the type of micromachining.
The releasing can be performed by providing any suitable etchant, including an etchant selected from an interhalogen, a noble gas fluoride, a vapor phase acid, or a gas solvent. And, the releasing is preferably followed by a stiction treatment (e.g. a silane, such as a chlorosilane). Also, a getter can be applied to the wafer before or after the adhesion reducing agent is applied, and before or after an adhesive is applied (if an adhesive bonding method is chosen). Preferably the time from releasing to bonding is less than 12 hours, and preferably less than 6 hours.
As can be seen from the above, when the wafer singulation takes place, each die defining a mirror array (or other MEMS device) is already packaged and sealed from possible contamination, physical damage, etc. In the prior art, when the wafer is divided up into individual dies, the mirrors are still exposed and remain exposed while sent to packaging to finally be enclosed and protected (e.g. under a glass panel). By forming a plurality of mirror arrays directly on a glass wafer, bonding (preferably with epoxy and spacers) the glass wafer to an additional wafer comprising actuation circuitry, and only then cutting the wafer into individual dies/arrays, much greater protection of mirror elements is achieved.
The invention need not be limited to a direct-view or projection display. The invention is applicable to many different types of MEMS devices, including pressure and acceleration sensors, MEMS switches or other MEMS devices formed and released on a wafer. The invention also need not be limited to forming the releasable MEMS elements on one wafer and circuitry on another wafer. If both MEMS and circuitry are formed monolithically on the same wafer, a second wafer (glass, silicon or other material) can be attached at the wafer lever following release of the MEMS devices but prior to dividing the wafers into individual dies. This can be particularly useful if the MEMS devices are micromirrors, due to the fragility of such elements.
Though the invention is directed to any MEMS device, specific mirrors and methods for projection displays or optical switching could be used with the present invention, such as those mirrors and methods set forth in U.S. Pat. No. 5,835,256 to Huibers issued Nov. 10, 1998; U.S. Pat. No. 6,046,840 to Huibers issued Apr. 4, 2000; U.S. patent application Ser. Nos. 09/767,632 to True et al. filed Jan. 22, 2001; Ser. No. 09/564,069 to Richards filed May 3, 2000; Ser. No. 09/617,149 to Huibers et al. filed Jul. 17, 2000; Ser. No. 09/631,536 to Huibers et al. filed Aug. 3, 2000; Ser. No. 09/626,780 to Huibers filed Jul. 27, 2000; 60/293,092 to Patel et al. filed May 22, 2001; Ser. No. 09/637,479 to Huibers et al. filed Aug. 11, 2000; and 60/231,041 to Huibers filed Sep. 8, 2000. If the MEMS device is a mirror, the particular mirror shapes disclosed in U.S. patent application Ser. No. 09/732,445 to Ilkov et al. filed Dec. 7, 2000 could be used. Also, the MEMS device need not be a micromirror, but could instead be any MEMS device, including those disclosed in the above applications and in application 60/240,552 to Huibers filed Dec. 13, 2000. In addition, the sacrificial materials, and methods for removing them, could be those disclosed in U.S. patent application 60/298,529 to Reid et al. filed Jun. 15, 2001. Lastly, assembly and packaging of the MEMS device could be such as disclosed in U.S. patent application 60/276,222 filed Mar. 15, 2001. Each of these patents and applications is incorporated herein by reference.
The invention has been described in terms of specific embodiments. Nevertheless, persons familiar with the field will appreciate that many variations exist in light of the embodiments described herein.
|Citing Patent
|Filing date
|Publication date
|Dec 22, 2006
|Feb 17, 2009
|Honeywell International Inc.
|Dicing technique for flip-chip USP wafers
|Feb 15, 2011
|Aptina Imaging Corporation
|Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure
|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Jul 28, 2005
Owner name: VENTURE LENDING & LEASING IV, INC.,CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:REFLECTIVITY, INC.;REEL/FRAME:016800/0574
Effective date: 20050616
|Jul 10, 2006
Owner name: TEXAS INSTRUMENTS INCORPORATED,TEXAS
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:REFLECTIVITY, INC.;REEL/FRAME:017897/0553
Effective date: 20060629
|Jul 11, 2006
Owner name: REFLECTIVITY, INC.,CALIFORNIA
Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:VENTURE LENDING & LEASING IV, INC.;REEL/FRAME:017906/0887
Effective date: 20060629
|Sep 7, 2010
|Certificate of correction
|Jan 25, 2013
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Year of fee payment: 4


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Adesso Trapeze Balance-Arm Desk Lamp
The Trapeze Collection will be sure to light up your living space efficiently.
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- 19" Maximum height, 9" from table to balance joint (30" balance arm)
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Adesso Trapeze Balance-Arm Desk Lamp
Adesso Trapeze Balance-Arm Desk Lamp
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Brine Lacrosse 3 x 4 Rebound Wall (2013)
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- Model #LW220(Black), LW220-C(Carolina)
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Coronado Outdoor Floor Lamp
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Some product exclusions may apply. See product page details for more information. Clearance items are final sale. Price matching does not apply to this or any promotion. Offer is valid until September 13 at 11:59 PM PST. May not be combined with any other offer/discount (unless specified), including invitation credits, promotional gift cards and/or special discount links. Discount applied upon checkout. Log in to your account to see your savings.
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Ok I went to weld up my custom trailer hitch today and much to my surprise my Millermatic 175 MIG unit wouldn't operate..How can this be? it has less than 10 hours of use on it. ???
It has power, the fan turns, when I close the trigger argon flows out the torch. What I dont have is any wire feed or and Voltge at the torch, i.e. it wont even make and arc of any size, even with both knobs on MAX
I took the cover off and the thermal circuit breaker has voltage on both sides. I verified 230V is geting to the circuit board.. The board had a green LED that glows and a red one that blinks "on" when I squeeze the trigger..
Any IDEAS.. I'm calling th repair shop tomorrow?
Results 1 to 10 of 16
04-30-2006, 10:37 PM #1Junior Member
- Join Date
- Apr 2006
- Posts
- 2
Trailer hitch..Millermatic 175 230V problems?
don't knowOriginally Posted by trickard
thanks, FarrisGone But Never Forgotten!
Are the feed rollers going? Could be as simple as the wire fused to the tip.Syncrowave 250DX
Millermatic 250X
Hypertherm PowerMax 1100
05-10-2006, 07:41 PM #4Senior Member
Originally Posted by PAToyota
- Join Date
- Sep 2002
- Location
- Clark County, NV
- Posts
- 2,696
CALL Miller (920-734-9821) and ask for Tech Support. They will ask all the right questions and probably save you a trip to the shop.
fixedOriginally Posted by trickard
Thanks, farrisGone But Never Forgotten!
I'm sorry to hear you are having a problem with your machine. There are a number of things that could cause a no wire feed condition in the Millermatic 175. You have eliminated some of these possibilities with the checks you made and you can leave the rest to your local warranty service center. Get the unit over to them and we'll get it taken care of ASAP.
Sure wished it worked like that, Kevin. Around here, it is a two to three week wait, just for a diagnosis. Actual repairs will take longer...and btw, would you like a rental machine while you wait?. Drives me nuts. My last warranty work on my MM135 took three and a half weeks. It was diagnosed, and had parts ordered and recieved all in three to four days...it took the rest of the time to wait in line for repair.Don
'06 Trailblazer 302
'06 12RC feeder
Super S-32P feeder
HH210 & DP3035 spool gun
Esab Multimaster 260
Esab Heliarc 252 AC/DC
05-19-2006, 10:37 AM #8Junior Member
- Join Date
- Apr 2006
- Posts
- 2
MillerMatic MIG 175 230V Fixed!!
Ok here's the scoop. The welder is fixed. I did bring it to a Miller repair center. They confirmed my findings, No wire Feed, No OCV , Nothing to repair, needs a replacment PC (Main ) board. BTW the retail on the PC board is 1/2 the price of the welder!!! I was covered under warranty for the Board, but no the labor , travel expense...etc...etc. I was not provided an explaination as to why the original board failed, other than Miller Tech indicated they had a known problem w/ some of the boards. There are several obsoleted (down change) part numbers. It came with a new Amp/Wire speed setting chart to attach to the flip up cover., so there must be some changes/ improvments. Overall I am very pleased. The Cust Service was very great. The repair Center (Somersworth in New Hapshire) was alo excellent, 1 week turnaround, and 3 days was waiting for parts.
The unit seems to works fine again! I will be testing this weekend!
Glad to hear U got it fixed!Originally Posted by trickard
Glad to hear it was covered under warranty.
Thanks for the up-date,FarrisGone But Never Forgotten!
01-24-2009, 11:50 PM #10Junior Member
- Join Date
- Jan 2009
- Posts
- 2
Sorry to revive an OLD thread
Sorry for the bump on an ancient thread, but I am experiencing nearly this exact problem
I have a 175 machine that we've had for several years. It has operated flawlessly. This machine is a home "project machine" so hasn't seen much actual operating time. I would say ACTUAL weld time would be under 5 hours.
I have been working on a big project with my truck, and have welded several things over the last month or so. It's worked great.
Today, I go to begin welding some brackets up, and I make the first tack, but the line speed seems sluggish. I am able to get 2 tacks out before the wire feed motor stops completely. I measured voltage at the motor plug, and it was something like .05-.1 VDC. Not what I'd expect.
I did not check to see if I was getting arc at the tip.
however, I see the same progression as listed above: I pull the trigger, a red LED comes on on the main board, and gas comes out of the nozzle, but ZERO wire feed. I can hear a relay clicking on the board.
I'm on a tight schedule to get this done, and would LOVE to avoid a repair center.
Any advice? To me it looks as if I can either just call Miller, and get the Board, or wait for repair.


text:
Hang tight!
Recipe by Kathy Rose
"This is a quick and easy side dish, that my family loves with chicken!"
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1 pint
heavy whipping cream
1/2 cup
1 1/2 cups
grated Parmesan cheese
To all those who have criticized this recipe, here are a few notes:
1. Use fresh parmesan, grated (many reviewers say they HAVE, but...)
2. Add it SLOWLY -- don't dump the whole amount of cheese in at one time. Add it a half cup at a time, and keep stirring, and wait 3 or so minutes, and....
3. Put the heat on medium, not medium low, and....
4. Stir constantly, and...
5. Recognize it can be a BASE. For those of you who like more flavor, add garlic or onions or oregano or hot sauce or whatever you want.
It's fine as it is, when made properly. If you want more flavors, or want it thicker, or want it thinner, correct as you go.
This was not to my liking! I went out for dinner instead!
648 Ratings
I love this sauce! I melt the butter, then add the cream and get that all mixed in and then wisk constantly while I add the cheese one handful at the time. Once everything is mixed in I just go through my spice rack and add whatever I want. Usually I use garlic powder, italian seasonings, basil, and parsly. I could eat this all by itself! Better than Olive Garden!
My husband requested I make Chicken Fettuccine for his birthday. I used this sauce and he said it was better than the restaurant sauce. The trick is to heat the cream slowly until it is almost simmering, then whisk the butter into the cream in small pieces until melted. Then whisk the cheese in until melted and use freshly grated cheese if available. The sauce comes out creamy, thick and delightful. A great recipe....
Wonderful!!! I always add a clove of crushed garlic and a teaspoon of Italian seasoning to the butter. Be sure to add your parm. slowly, no more than half a cup at a time, as others have suggested. This will make all the difference! Toss with 12oz of fettuccine pasta and add a couple of grilled chicken breasts!
I am extremely picky with Alfredo sauces. I don't buy anything off the shelves, and I've tried the mixes, but nothing compares to this recipe. It's as good as The Olive Garden's (if not better) Alfredo sauce. Until this recipe came along, I didn't eat any Fettuccini Alfredo if it wasn't The Olive Garden's. I'll be saving money.
WOW! What can I say! This sauce is out of this world! And SO easy!! My kids and husband LOVED it too!!! I liked the texture of parm. cheese! Some of the best italian restaurants around here have the same texture in their alfredo sauce...the only change I made was I added about a 1/2 tsp. of garlic powder...really put it over the top! Thanks SO much!!!
I first made this over a year ago and I still make quite regularly. It is so easy to make. I get the best results by adding the butter and letting it melt, then add the cream let it heat up. Last add the cheese. I also add frozen spinach or chicken. I love the taste of this recipe.
* Percent Daily Values are based on a 2,000 calorie diet.
Easy Alfredo Sauce I
Serving Size: 1/8 of a recipe
Servings Per Recipe: 8
Amount Per Serving
Calories: 372
Calories from Fat: 340
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