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Using a non-chemical nano-filtration hollow fiber membrane with 15 nanometer pores (it is designed to block viruses), the Lifesaver bottle can make the most revolting swamp water drinkable in seconds. Better still, a single long-lasting filter can clean 6,000 liters of water. Given the astronomical cost of shipping water to disaster areas, Pritchard's Lifesaver bottle could turn traditional aid models on their heads.
Posted on Nov 20, 2009

subset: commoncrawl


text:
|Numéro de publication
|Type de publication
|Numéro de demande
|Date de publication
|14 mars 1995
|Date de dépôt
|6 mai 1993
|Date de priorité
|23 aoűt 1991
|État de paiement des frais
|Autre référence de publication
|Numéro de publication
|David Tuckerman, Pradip Patel
|Cessionnaire d'origine
|Nchip, Inc.
|Exporter la citation
|BiBTeX, EndNote, RefMan
|Citations de brevets (15), Citations hors brevets (6), Référencé par (137), Classifications (38), Événements juridiques (5)
|Liens externes: USPTO, Cession USPTO, Espacenet
The invention herein described was developed in part in the course of or under contract with the U.S. Air Force, Contract No. F33615-90-C-1481. Accordingly, the government may have certain limited rights in the invention disclosed herein.
This is a continuation of application Ser. No. 07/749,246, filed Aug. 23, 1991, now abandoned.
The present invention relates to burn-in technology for integrated circuits and in particular to burn-in technologies for unpackaged integrated circuits for use in Multichip Modules.
A certain percentage of the integrated circuits (ICs) formed in a manufacturing process fail in the first hours or days of use. The infant mortality of the ICs results from latent defects in the device as manufactured. Semiconductor circuits having a relatively large die size and relatively thin gate oxides are particularly susceptible to infant mortality.
The bulk of early failures may be detected by applying power and then supplying a series of test signals to the circuit thereby extensively exercising the circuits at high temperature. Devices which do not respond properly to the test signals or otherwise fail can then be discarded before shipment. This test procedure is called burn-in.
In a typical burn-in process, a large number of packaged ICs are individually mounted on printed circuit boards having a circuit design that permits the ICs to be exercised in parallel. The printed circuit board loaded with ICs is then placed in a burn-in oven. The burn-in oven controls the ambient temperature during the test process. Generally, ICs are burned in for 72 hours or more at temperatures exceeding 100° C.
The burn-in process imposes many significant cost penalties on chip manufacturers. For example, the physical space required to mount individual packaged chips on a few printed circuit boards can consume several cubic feet. The facility space necessary to burn-in a significant number of test assemblies of this size can therefore easily occupy a city block. Furthermore, the power required to heat the burn-in oven and power the ICs is considerable. Assembly of the ICs into sockets onto printed circuit boards is also labor intensive and may damage ICs which might otherwise survive the burn-in process.
In addition to cost penalties, the conventional burn-in process is performance limited. The long lead lines of printed circuit boards and other conventional packaging can create electrical noise and limit the overall operating speed of the circuit to approximately 40 MHz. So long as the ICs being tested do not operate faster than the performance of the test circuit board or, alternately if the IC is ultimately to be packaged on a board having similar performance characteristics, the performance limitations of the burn-in test package are of minimal concern.
Modern ICs, however, are capable of operating in excess of 40 MHz. Therefore, multichip modules (MCMs) are emerging as the packaging and interconnection medium of choice for high performance and on high density electronics systems, both commercial and military. FIG. 1 is a cross-sectional view of one type of MCM. The MCM contains a high denity interconnect substrate (HDI) base 40 over which is located a conducting plane formed of power and ground planes 42 and 44. Power and ground planes 42 and 44 are in turn separated from each other by insulating layer 48. Contact to the power and ground planes may be directly made using vias (not shown). Positioned above the power and ground planes is a second dielectric layer 70 which insulates the power and ground planes 42 and 44 from metal interconnect layers 76 and 77. A plurality of ICs 90 attach to the surface of the HDI to form the MCM. ICs 90 contact interconnect layers 76 and 77 through vias 79. The surface of the typical MCM may contain a passivation layer 86. There are a variety of technologies which may be used to implement each of these elements and as stated above, the structure of FIG. 1 is but one example of an MCM structure. A system assembled using MCMs permits system operation at the faster operating speeds of modern ICs in addition to providing cost, size, weight, and reliability advantages over conventional packaging.
Two generic problems of great concern to current and prospective manufacturers of MCMs are test-at-speed and burn-in of the chips. If chips cannot be verified as functional under the desired operating speeds, assembling the chips into an MCM may not gain the desired performance advantages. Even if the chips can be assembled on an MCM and then tested at speed, removal and replacement of embedded chips exacerbates the difficulties of fault isolation, adds significant cost and yield risk to the module, and incurs the need for sophisticated tracking and handling capabilities. Furthermore, the reworked part cannot, in general, be of equal quality to the virgin part.
Even if chips can be satisfactorily pre-tested at speed, chip burn-in losses hinder the ability to manufacture MCMs with reasonable yields. Burn-in losses can be as high as 5% per chip for complex logic chips (e.g., state-of-the-art microprocessors), and are seldom much less than 1% per chip. For example, a 20-chip module in which all the chips have a 5% burn-in failure probability has only a 36% probability of surviving burn-in.
One proposed solution to burn-in losses is to use tape-automated bonding (TAB) technology to burn in the chips on tape prior to module assembly. The tape, however, can warp during extended high-temperature (125°-150° C.) operation, due to different stress relaxation processes in the various metal, adhesive, and polyamide layers of the tape/chip combination. This approach therefore does not satisfy many of the desired burn-in test apparatus criteria.
Manufacturers of MCMs therefore need a reliable method and device for testing individual ICs and conducting burn-in tests prior to assembling the chips onto an MCM. In particular, to minimize handling damage and cost of fixturing, the method and device can ideally be implemented on a wafer scale. In this manner, manufacturers could use a single, instead of multiple, fixturing device.
The present invention provides a burn-in test assembly and method which permits burn-in tests to be conducted at speed on bare chips.
According to one embodiment of the present invention, a high density interconnect substrate (HDI) is configured as a test substrate for the burn-in tests. The unpackaged ICs to be tested may be located as part of an unsawed device wafer. At those physical locations where an IC device pad is located, a deformable, electrically conductive bump, for example, solder, exists on the surface of the HDI. The device wafer is aligned with the test substrate and placed against the solder bumps. Electrical contact to the test substrate is thus made through the solder bumps. Because the bumps are deformable and not rigid, contact will be made to all bumps including the lowest, once a force to hold the wafer against the bumps is applied. Burn-in tests can then be performed at the desired operating speeds. Once the test is completed, the wafer is removed and sawed into IC chips also known as dice or die. Those chips failing the burn-in procedure are discarded. The solder bumps are then reflowed to restore their original shape and a new device wafer can be tested.
According to another embodiment of the present invention, the heat transfer from the device wafer/test substrate assembly can be actively controlled to provide the desired burn-in temperature. The burn-in oven required in typical burn-in tests therefore can be eliminated.
The present invention thus eliminates the need to conduct burn-in tests on an assembled multichip module. The test substrate of the present invention may also be reused many times thereby reducing test costs. In addition, the die tested by the present invention need not undergo potentially damaging wirebonding, removal and other handling since the die merely rests on the solder bumps. Reductions in test assembly volume and the ability to actively thermally manage the test assembly lead to reductions in the size of burn-in ovens or alternatively to complete elimination of the burn-in oven, thereby providing additional benefits in power consumption, equipment and facilities.
FIG. 1 is a cross-sectional view of a typical multichip module;
FIG. 2 is a cross-sectional view of a test substrate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a burn-in test substrate according to an embodiment of the present invention;
FIG. 4 is a top view of a device test wafer connected to a burn-in test substrate according to an embodiment of the present invention;
FIG. 5A is a view of a gold ball formed according to an embodiment of the present invention;
FIG. 5B is a view of a gold ball coined to form a planar surface according to an embodiment of the present invention;
FIG. 5C is a view of a gold ball dipped in solder according to an embodiment of the present invention;
FIG. 6A is a side view of a test wafer held in position on a burn-in test substrate by a pneumatic piston according to an embodiment of the present invention;
FIG. 6B is a side view of a test wafer held in position on a burn-in test substrate by an inflatable bladder according to an embodiment of the present invention; and
FIG. 7 is a cross-sectional view of a test wafer held in position on a burn-in test substrate by applying a vacuum pressure according to an embodiment of the present invention.
FIG. 2 is a cross-sectional diagram of a test substrate 100 having an HDI similar to that of the multichip module of FIG. 1. The HDI of FIG. 2 has a conducting plane 102 including power and ground planes 104 and 106, insulating layer 108 and layers of interconnect 177 and 176 for electrically contacting an integrated circuit 190. In the structure of FIG. 2, a hemispherical "soft dot", or bump 192 of electrically conductive material such as solder has been placed, for example on the surface of metal interconnect layer 177 at the locations where electrical contact is made between layer 177 and 190. The bumps 192 and conductors 177 are positioned on the substrate to align with the bonding pads of the IC's when the IC's are inverted. The chip is inverted and the IC bonding pads contact solder dots 192. IC 190 is merely held against the solder dots 192 with enough force to assure electrical contact and no permanent connection between solder dots 192 and IC 190 is formed. ICs 190 may be individually placed on the burn-in substrate or the ICs may be integral to an unsawed wafer.
With IC 190 pressed against dots 192, the burn-in tests can be performed. Once these tests are completed, integrated circuit 190 is removed and dots 192 are reworked (reflowed) to allow a second integrated circuit 190, or second wafer, to undergo burn-in tests. This process can be repeated several times before failure of the burn-in test assembly. Devices which satisfactorily complete the burn-in test can be assembled onto HDIs to form MCMs.
Test Apparatus
FIG. 3 is a schematic diagram of a burn-in substrate which connects ICs 200 and 201 in parallel so that each chip can be simultaneously and dynamically burned in while power, clock and test vectors are being exercised. In the circuit of FIG. 3, each integrated circuit 200 and 201 is coupled to power plane 202 of the test substrate through isolation resistors 206 and 208, respectively. Similarly, each integrated circuit 200 and 201 is coupled to ground plane 210 of the burn-in substrate through isolation resistors 212 and 214. Isolation resistors 206, 208, 212, and 214 prevent a short in a single test chip from shorting out the entire test circuit.
The output terminals of chips 200 and 201 should be properly loaded, for example with pull-up resistors 220 and 222, to prevent possible unwanted oscillations, without interfering with the test and operation of the remaining chips on the burn-in substrate. The reference voltage to which the pull-up resistor 220 and 222 are coupled may be supplied through an additional power plane or through a metal interconnection of the burn-in substrate.
Of course, not all chips may be functional during testing. Some chips may have faults and thus may have internal short circuits resulting from latch-up or fabrication defects which cause high current drain on specific bond pads. In the circuit of FIG. 3, these potential problems are addressed by inserting isolation resistors 230-232 in series with each integrated circuit output pad before ganging the pads together. Resistors 220-222 and 230-232 may be formed as thin film resistors integral with the burn-in substrate as described in U.S. patent application Ser. No. 07/629,746.
The type of circuit family and the nature of the pad determine what value of resistor is appropriate. For example, a resistance of ˜1 kΩ per pad isolates input terminals of ganged chips from each other, without consuming excess power or impairing the ability to apply high-frequency test vectors to the chips. Output pads may be wired together with 5 kΩ isolating resistors, so that the mean output level can be sensed at the periphery of the burn-in substrate, yet the isolating resistors are sufficiently high that this mean level does not act as an undesired pull-up or pull-down on individual output terminals. In addition, each output terminal can have its own personal pull-up or pull-down resistor to a power or ground rail, as required by the logic family. In a typical application, this resistor might be 500 or 1000 Ω. For pads which can act as either inputs or outputs (e.g., tri-state drivers used in bus structures), the circuitry is analyzed to determine the optimal resistor value. A potential inability to clock the chips at their maximum speed due to RC delays resulting from the use of isolation resistors is not likely to be important since dynamic burn-in is normally performed at a very nominal clock speed (for example, 1 MHz).
In contrast to the input and output pads, the power supply pads require a very low value of isolation resistance, on the order of 1 Ω per pad, to avoid excess voltage drop. Limiting voltage drops can be particularly critical for devices which draw DC current, for example, ECL technology. In order to provide a uniform voltage across the wafer, the effective resistance of the power distribution system (power and ground planes) should be substantially lower than the resistance of the isolation resistors. The magnitude of the voltage drop on the power feeds which can be tolerated during burn-in is greater than what would be tolerable in an actual system application. This difference is because, for burn-in, the only interest is in exercising the chips, and overall system noise margins are not a concern. However, if desired, the overall power supply voltage may be increased slightly to compensate for voltage drops in the isolation resistors 206-214, thereby ensuring that all chips receive a minimum specified burn-in voltage.
Isolation resistors are chosen so a dead short can be accommodated without disrupting the rest of the IC's and without burn-ing out the isolation resistor. Burning out the isolation resistor would make the test substrate nonreusable. The approach in which chips are ganged together in parallel, with isolation resistors on all the pins, also suffers from a potential problem if the die yield is low. For example, if the die yield is only 10%, then most of the chips on the wafer are nonfunctional. The nonfunctional chips could create a massive drain on the power supply (if short-circuited) and also make it impossible to evaluate whether the good chips are behaving correctly (since the output pins will be the mean of all the output levels, and if 90% of these output levels are incorrect then the result will be noise). Low-yielding wafers can be subjected to a selective laser ablation process (in which the bond pads are vaporized with a short-wavelength excimer laser, exposing the underlying glass) so that these chips do not get powered up (nor do any of the bond pads get connected) when mated to the burn-in test substrate. Alternatively, a coining tool can be used to coin those bumps necessary to disable chip operation. For example, a solder bump which provides contact to power or ground may be coined such that the bump height is sufficiently lower than the height of the other bumps such that the wafer does not contact the coined bump.
Possible routing difficulties in parallel ganging of the chips on the burn-in substrate may be avoided by providing multiple layers of interconnect on the burn-in substrate. Similarly, multiple power and ground planes may be used to increase the amount of current which can be supplied to the test wafer. Multiple power and ground planes may prove particularly useful in testing of emitter coupled logic (ECL) and gallium arsenic (GaAs) circuits having device wafer power consumptions in excess of lkW or multiple power supply voltage levels.
External electrical connections to the burn-in substrate supply test signals and power to pins or pads surrounding the burn-in substrate. The burn-in substrate thus is preferably physically larger than the device wafer. Various connectors, including a gold dot or fuzz button type connector mated to a high temperature flex circuit, or a "pogo" connector mated to a ceramic interface board can be used to connect to the burn-in substrate. Ideally, the connector chosen can tolerate high temperatures without welding to or contaminating the contact pads.
FIG. 4 is a top view of a test wafer 400 connected to burn-in substrate 402. The structure shown includes substrate 402 illustrating the ganged signal connections for two signal levels. Not seen in the top view diagram of FIG. 4 are the power and ground planes which lie underneath the signal level. Annular regions on the periphery of the substrate provide desired potential supplies, typically power and ground to appropriate connections traversing the substrate. As described above, the wafer is face to face against the burn-in substrate so bonding pads on each chip contact the substrate at desired locations to receive input signals, detect output signals, and supply necessary power levels.
Dot Fabrication Techniques
A variety of techniques can be used to form the solder dots on the contact pads of the burn-in substrate. (Alternatively, the solder dots may be formed on the contact pads of the IC.) One known technique for forming solder dots is electroplating through a photoresist mask. Another technique involves gold "ball bumping" followed by solder dipping. A third is directly forming the solder ball by ball bumping of solder wire. Gold ball bumping techniques are described in Kulicke and Soffa Industries, Willow Grove, Pa. wire bonder product literature, and in U.S. Pat. No. 4,717,066 to Goldenberg, et al. Palladium-doped gold wire is used in a conventional wire bonder (ball bonder). Wire from Hydrostatics, Inc. of Bethlehem, Pa. (98%+Au--Pd, 0.001" diameter, 1-3% elongation, 26.5-27.0 gm break strength) is also suitable for forming the solder bumps. A Kulicke and Soffa 1419 wire bonder with "Dawn G. 1" software has been found satisfactory for use with the Hydrostatics wire in the present invention to form the contact bumps.
Using the equipment and wire described, the presence of the palladium in the gold wire results in a brittle intermetallic at the neck of the ball bond, such that the wire "automatically" severs at the neck in the course of normal bonding. This yields gold balls 450 having the appearance shown in FIG. 5A. Bump 450 is then "coined" with a special tool, such as used in tape automated bonding, to produce a planar surface as seen in FIG. 5B for solder dipping. The ball may be coined with a 6-mil square tool from Gaiser Tool Company, Ventura, Calif., resbiting in a height distribution ranging from 35 to 37 μm (standard deviation=0.5 μm) as measured with a high-power optical measuring microscope. Balls made with this process had a 70 gm average shear strength after 24-hour storage at 150° C. The resultant ball diameter is approximately 2.5-2.75 mil, and has been proven useable with ICs having a pad pitch as small as 6 mil.
The gold balls are preferably coated with approximately 0.5 mil of electroless nickel prior to solder dipping, to reduce intermetallic formation. The coating reduces the tendency to form brittle intermetallics during subsequent flow and also enables the use of soft solder such as Pb--Sn.
After formation of the gold bumps and nickel plating, the substrate is fluxed with an "R" type (nonactivated) rosin, and manually dipped for 5 seconds in a 325° C. static solder pot (Marshall Industries) of 75-25 (wt.) lead-indium solder supplied by Indium Corporation of America. The Pb--In alloy minimizes gold leaching and enhances wettability of the gold balls when a nickel barrier is not used. Also, the Pb--In is believed less prone to oxidation than other alloys. A layer of tinning oil on the surface of the solder pot may be used to minimize solder oxidation. FIG. 5C shows the ball after solder dipping.
Mating of the Wafer/Chip to the Burn-In Substrate
Wafers and their associated ICs, or the individual chips themselves, are not fixedly mounted to the solder bumps, but are held against the solder bumps by applying an external force. Several techniques may be used to hold the electrically active surface of the wafer/die structure against the contact bumps with sufficient force to ensure excellent electrical contact. The exact amount of pressure required will vary with the type of material used to fabricate the bumps and with the coplanarity of the bumps. An average force of 30 grams per dot typically is sufficient to provide the desired contact.
One method for holding the die against the bumps is the use of a hydraulic or pneumatic piston as seen in FIG. 6. A liquid filled bag made of high strength plastic may be inserted between the piston and the wafer assembly to provide a uniform hydrostatic pressure loading on the device wafer. The liquid filled bag avoids problems of nonuniform loading caused by tilt of the chip or wafer with respect to the piston or the substrate. In FIG. 6A, the test wafer 519 is positioned on substrate 520. Fluid filled bag 521 is located between wafer 519 and piston 522.
Alternatively, an inflatable bladder as shown in FIG. 6B and described in U.S. Pat. No. 4,968,931 to Littlebury et al. may be used. Preferably, the bladder is liquid filled for improved safety. In FIG. 6B the test wafer 519 is positioned on substrate 520 and held in place by bladder 523. A heat sink 524 may be attached to substrate 521.
If the required contact pressure to secure test wafer 519 is less than 12 pounds per square inch (83 kPa), atmospheric pressure may be used by creating a vacuum between the device wafer and the electrically active surface of the burn-in substrate as shown in FIG. 7. To create the vacuum, a temporary seal is first fashioned between the edge of the device wafer 519 and the burn-in substrate 520 using an elastomer material 526. With the seal in place, the resulting interior cavity is evacuated through an opening 528 in the substrate, for example, as drilled by a laser. The magnitude of the force exerted on the device wafer also can be controlled by creating a partial vacuum. The vacuum approach requires less fixturing and thus permits more test wafer/burn-in substrate combinations to fit inside the burn-in oven than if an external bladder or piston is used.
Because the solder bumps deform under the contact loading, sufficient mechanical and electrical contact is made to all the solder bumps including the lowest upon application of sufficient contact loading. Furthermore, deformation of the solder balls under this loading may cause the thin oxide coating on the solder balls to crack. This cracked coating is somewhat brittle and serves as an abrasive to scrub away any oxide coating on the chip contact pad. This scrubbing action thereby improves electrical contact between the chip and the test substrate. Optionally, the solder balls may be loaded with an abrasive material such as tungsten powder. This abrasive material then scrubs away the oxide layer on the chip contact pad upon application of the contact loading.
Several techniques can be used to align the device wafer with the burn-in substrate. Infrared alignment may be used, however, this technique requires polishing the back side of the device to be contacted (i.e., the wafer or the IC) to make it transparent to infrared light. Alignment by X-ray examination may also be used. Normally, the wafer or chip is transparent to the X-ray. The solder bumps, however, are visible (absorbing X-rays) under X-ray illumination. To align the wafer with the test substrate, therefore, one or more gold solder bumps are placed on the surface of the wafer or chip. The bump(s) on the wafer or chip are then positioned so as to line up with similar bumps on the surface of the substrate. Optionally, pit(s) (laser drilled) may be drilled into the surface of substrate and the alignment bump(s) can protrude to mate with the pits.
Thermal Management
With the burn-in technology of the present invention, the burn-in oven itself may be eliminated through proper thermal management and active control loops. This active control of junction temperature is seldom achieved in burn-in of conventionally packaged ICs.
For low-power chips (less than 100 watts/wafer), the wafer's self-heating typically is inadequate to bring the assembly up to the desired temperature. The burn-in substrate may be mounted on a heat spreader such as a copper plate as shown in FIG. 6A. The burn-in substrate and burn-in wafer are thus thermally clamped together due to the thermal conduction path provided by the bumps. To provide the necessary heat, a small heater can be attached to or integrated in the copper plate to elevate the temperature. The heat spreader is instrumented with thermocouples 800 to verify operating temperature. Controlling the temperature to the desired level is accomplished by techniques well known to those of skill in the art.
In the medium-power case (100-1000 watts/wafer), the wafer's self-heating is such that the assembly would exceed the desired temperature without any external heat source. Thus, cooling must be provided. Air may be blown over the wafer using a variable-speed fan which is controlled by the thermocouple output. Alternatively, the copper block may be liquid cooled. In this situation it may be necessary to instrument the back of the wafer, because there can be a significant temperature differential between the wafer and the burn-in substrate.
In the high power case (typically≧1 kw/wafer), the wafer's self-heating is so high that even the solder bumps cannot transfer heat away fast enough. In this case, significant temperature gradients can build up in the horizontal plane of the wafer, that is, hot spots can form in the center of each chip when only perimeter bond pads are used. This problem will be most severe for ECL or GaAs devices which dissipate relatively high power (˜20 W/cm2) into a material having relatively poor thermal conductivity. To remove this heat, a liquid-cooled cold plate is pressed against the back of the wafer to obtain a spatially uniform heat-transfer coefficient of 0.5 W/cm2 -° C. or greater from the wafer to the cold plate. Commercially available cold plates and a thermal interface medium such as a conventional heat-sink paste may be used. The cooling fluid, for example, silicone oil or water, is recirculated through a radiator to dissipate the waste heat. A control system determines how much of the fluid should bypass the radiator to maintain the desired fluid temperature. The control system is analogous to a thermostat in an automobile engine cooling system.
Rework of Deformable Bumps
After testing a series of wafers, the deformable bumps may have deformed to the point where sufficient contact between the chips and the test substrate does not occur. At this point, it is possible to reflow the bumps to restore their original shape. The bumps may be reflowed by heating the material past the melting point in a nonoxidizing environment. Reflowing can be accomplished with a hot plate and using flux to prevent oxidation; dipping the substrate in a bath of hot oil; reflowing in a reducing atmosphere of forming gas preventing oxidation; or by using a laser to directly heat the material. To enable reflow without damaging the substrate, the deformable bump material should have a melting point less than the maximum temperature limit of the substrate. This limit value is typically 400° C. Conversely, the melting point must be higher than the burn-in temperatures (typically 125° C. or 150° C.) to prevent reflow or excessive deformation of the bumps during the burn-in process.
The bumps may also be reworked by reconstituting the bumps. The test substrate is dipped in a pot of molten solder and then withdrawn. Solder dipping has been described above under the heading Dot Fabrication Techniques. Reworking the solder bumps by solder dipping is likely to work best if the solder bumps were originally formed by solder dipping.
The ability to reflow the bumps after several test cycles allows the test device of the present invention to be employed many times. The cost of the test substrate is thus amortized over many uses and thereby significantly reduces test costs. In addition, rework capability of the deformable bumps may be employed advantageously in assembly of MCMs using adhesive flip chip processes (as described in U.S. Pat. No. 4,749,120 to Hatada). In the present invention a chip which is improperly attached or which later proves defective, may be removed and the solder dot reflowed. The chip may then be reattached or a new chip attached to complete the MCM assembly. The rework capability and the present invention can therefore also reduce the cost of assembling MCMs.
Table 1 lists many of the advantages of the invention as described above. Preferred embodiments of the present invention have now been described. Variations and modifications will be readily apparent to those of skill in the art. For this reason, the invention should be considered in light of the claims.
Tolerant of continual operation at junction temperatures 125° C.-150° C. or higher.
Suitable for wafer-scale use. The cost, complexity, and risk of damage associated with handling, aligning and fixturing large numbers of individual die is formidable. Wafer-scale burn-in avoids these difficulties, allowing the use of simple fixtures, and potentially large cost savings. Wafer-scale burn-in as described here includes capability of independently powering discrete chips.
Area array capability. While the vast majority of contemporary IC's use only a single row of perimeter I/O pads, multiple rows or full area array IC's can also be tested.
Fine-pitch capability. While present commercial applications seldom go below 100 μm pitch, the invention allows testing 50 μm pitches or smaller which will be in production by the end of the decade.
Reusability of the burn-in substrate.
Low cost.
Acceptable to the IC manufacturers. Because many manufacturers are reluctant to sell wafers (for reasons of yield data and test structure confidentiality), the burn-in capability can be a part of the IC manufacturer's process.
Tolerant of essentially uncontrolled atmospheres. For both economic and logistical reasons, it is desirable to avoid inert atmospheres for burn-in.
Zero pad contamination. The subsequent bondability of the I/O pads is not impaired.
Predictable heat transfer characteristics.
Modest compressive force requirements. Achieving good contact with a pressure of ≦12 psi is of particular value, because it makes possible the use of atmospheric pressure as the source of the compressive force.
|Brevet cité
|Date de dépôt
|Date de publication
|21 déc. 1979
|4 aoűt 1981
|Harris Corporation
|Method for qualifying biased burn-in integrated circuits on a wafer level
|7 juil. 1981
|12 juin 1984
|Hughes Aircraft Company
|Cable-to-cable/component electrical pressure wafer connector assembly
|6 avr. 1982
|5 mars 1985
|Canon Kabushiki Kaisha
|Semiconductor printing apparatus with multiple independent temperature control
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|Advanced Micro Devices, Inc.
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|Digital Equipment Corporation
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|Minnesota Mining And Manufacturing Company
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|19 mai 1988
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|Augat Inc.
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|30 sept. 1988
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|14 sept. 2006
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text:
My Iphone 4 does not allow me to turn on the Wi-Fi setting. It stays in OFF position, no matter where I am located. What can be done to fix this problem.? I have already tried updating to the latest version of software and it still reads "Off" with no ability to change it.
IOS: Wi-Fi or Bluetooth settings greyed out or dim.
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text:
By Jorge Sato
14 Dec 2009
Atibaia is a small town near to São Paulo. In the century XVII, it was an important place because of a group called Bandeirantes – adventurers who used to explore unknown places around Brazil looking for indigenous tribes and precious metal.
This group usually started its long and difficult journey from São Paulo and the very first town to rest it would be Atibaia, which was well-known for having great water for the adventurers.
VOTE: Do you like this story?
4 responses
Brian Betteridge gave props (14 Dec 2009):
tremendous series, thoughtful photos, well done all around!
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luv it !
Marco Martinez gave props (20 Dec 2009):
Beautiful photographs to depict the place. It makes me want to see more. Excellent work
Kelsey C said (20 Dec 2009):
love the series! great shots, beautiful story behind it.
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text:
Pictures of Youby Caroline Leavitt
View All Available Formats & Editions
Two women running away from their marriages collide on a foggy highway, killing one of them. The survivor, Isabelle, is left to pick up the pieces, not only of her own life, but of the lives of the devastated husband and fragile son that the other woman, April, has left behind. Together, they try to solve the mystery of where April was running to, and why. As… See more details below
Two women running away from their marriages collide on a foggy highway, killing one of them. The survivor, Isabelle, is left to pick up the pieces, not only of her own life, but of the lives of the devastated husband and fragile son that the other woman, April, has left behind. Together, they try to solve the mystery of where April was running to, and why. As these three lives intersect, the book asks, How well do we really know those we loveand how do we forgive the unforgivable?
Editorial Reviews
Tragedy leads to complicated love as a widower and the woman who accidentally killed his wife are united by a grieving child looking for an angel.
Compassion and a delicate narrative voice lift Leavitt (Girls in Trouble, 2003, etc.) over many if not all the hurdles of sentimentality in this heartstring-tugger, set in Cape Cod, that's shaped by loss and yearning. Photographer Isabelle Stein, fleeing from her unfaithful husband in foggy weather, suddenly encounters a car containing a woman and a child, the car facing the wrong way in the middle of the road. The unavoidable collision leaves April Nash dead; her nine-year-old asthmatic son Sam only slightly hurt but silent on what he witnessed; and Sam's father Charlie heartbroken and bewildered. Why was April three hours away from home and traveling with a suitcase? The aftermath of the crash is a struggle for all parties, especially Sam, who sees Isabelle as an angel connected to his mother. The two become friends through photography, and Charlie's initial anger subsides as he acknowledges childless Isabelle's genuine affection for the boy. But when Sam learns that the adults have become lovers, the emotional impact makes him ill. Separation follows, then an explanation which liberates Charlie to go after Isabelle. Crossed wires are eventually straightened out, but not predictably.
Heartfelt (everyone cries), deft and highly readable fiction.
The Washington Post
"Caroline Leavitt's compelling new Pictures of You unfolds as part literary mystery, part domestic drama, and part psychological examination. Leavitt beautifully paces the intertwining stories, meticulously unfurling bits of the back story, letting us put together the pieces just as the main characters do."
Boston Globe
"Leavitt's literary touch is so light . . . that only when the mystery is finally solved does the reader realize how taut she's kept the tension all along. The author's sure steady hand at the wheel makes the reading experience so engaging, its characters so irresistible, that Pictures of You is a novel I suspect I'll return to again and again."
San Francisco Chronicle
"Leavitt's formidable skill is evident from beginning to end as we piece these lives together to find out what brought them to this world-ending moment. It's like a somberly beautiful mystery that unfolds like a dark flower until we see the glowing heart. The characters are fully drawn and we immediately feel we know them, perhaps better than the people we spend our everyday lives with. It's an age-old story of great love and great loss that is told in these pages, but deftly woven and in a way that makes it almost impossible to stop until you reach the end. Leavitt tells a haunted yet revelatory tale and resists the urge to end it neatlyinstead it has the unmistakable agony and glory of real people living real lives."
Huffington Post
"A white-knuckle ride of lost love and longing. . . . Never disappoints for a second."
Minneapolis Star Tribune
"Robin Miles does her usual lilting reading which is filled with quiet emotion. . . . She carries [the characters] from the accident, through growing relationships and into the future."
Sound Commentary
—Boston Globe
—Minneapolis Star Tribune
—San Francisco Chronicle
—Huffington Post
—Sound Commentary
Product Details
- 9781565126312
- Publisher:
- Algonquin Books of Chapel Hill
- Publication date:
- 01/25/2011
- Pages:
- 336
- Sales rank:
- 302,938
- Product dimensions:
- 5.40(w) x 8.10(h) x 1.10(d)
What People are saying about this
—Robb Forman Dew, National Book Award winner
—Chris Bohjalian, author of Secrets of Eden
—Jodi Picoult
—Robert Olen Butler, Pulitzer Prize winner
—Dan Chaon
"I found it impossible to put this book down . . . [it's] as complicated, crushing, and joyous as life itself." —Robb Forman Dew
"A splendid writer at the peak of her powers." —Robert Olen Butler
"Heartbreaking, suspenseful, and moving, Pictures of You contains all the elements I long for in a great story." —Diana Abu-Jaber
"I have long admired Caroline Leavitt's pobing insight into people, her wit and compassion, her ability to find humor in dark situations, and conversely, her tenderness toward characters other writers might merely satirize." —Dan Chaon
"Caroline Leavitt is a masterful storyteller . . . this is a beautiful book." —Dani Shapiro
"Caroline Leavitt is a masterful storyteller . . . this is a beautiful book." —Dani Shapiro
"An enthralling amalgamation of a literary mystery and the story of one woman's search for self-fulfillment." —Binnie Kirshenbaum
—Dani Shapiro, author of Devotion
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Qatar Q2 GDP growth accelerates to 4.8 pct year/year
UAE says reforms will better protect foreign workers
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MIDEAST STOCKS-Saudi hit by weak oil, commodities; Egypt down modestly
MIDEAST STOCKS-UAE markets narrowly mixed in thin, early trade
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UAE bank ADCB opens books for 6-yr benchmark dollar bond
They're rarely spotted on front rows of fashion shows and favour discretion when placing orders, yet women from the Middle East have become the world's biggest buyers of high fashion.
October 6, 2011 12:15 by Reuters
…scratch that it is aiming to unveil next spring.
The secretive group, financially supported by the Qatar Foundation the Sheikha created, made its first acquisition this year when it snapped up Paris-listed leather goods maker Le Tanneur for 26 million euros, and is on the lookout for more European brands.
The group is headed by Gregory Couillard, a former executive at the world's biggest luxury group LVMH , which owns Dior and Louis Vuitton. Couillard declined several requests for an interview. ($1 = 0.753 Euros) (By Astrid Wendlandt and Martina Fuchs; Additional reporting by Regan Doherty in Doha and Asma Alsharif in Jeddah; Editing by Sonya Hepinstall)
Life after Jobs: The Challenge Ahead for Apple
October 6 2011
GITEX 2011: Redefine the Future
October 6 2011


text: Scram Jones ft Saigon, Nino Bliss, Crooked I – 3rd Degree Posted by Jason on December 18, 2009 & filed under Music Videos. [gnv]107487[/gnv] Share this story Tweet Hurricane Chris ft Bobby Valention – Touch Bases Game Says His R.E.D. Album Is Beef-Free Music Videos Related Stories Leave Your Comment Music Videos Related Songs & Videos › ‹ Cap 1 "Havin It" Video Tink "L.E.A.S.H." Video Trouble "Wet" Video Short Dawg Feat. 2 Chainz "Natural" Video Styles P "Other Side" Video DC Young Fly "Motivation" Video G-Eazy on Embracing His Image & His 3 Tour Essentials Ryan Hemsworth ft. Tinashe – One For Me Talib Kweli – Upper Echelon Music Video Busta Rhymes – Talks About Shrinking Music Video Budgets


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Very rude staffPosted on 08 / 16 / 2015
We arrived at 2:59 PM. By the time the hostess arrived, it was 3, closing time. We were turned away by a very rude and unfriendly hostess who did nothing to try and help, giving us no options or alternatives, even after we explained that we had come from very far. The restaurant itself was in a desolate corner of town and not worth the drive for the location. Can't speak for the food, and after the treatment I recieved, I don't plan on going back. I prefer eating my peaceful in a peaceful setting.
Cons: Rude staff, bad location


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Eric Wicklund | October 13, 2015 | 03:20 PM | Patient Engagement
Despite all the buzzwords and shiny new objects, the technologies available are secondary factors when it comes to engaging patients and improving outcomes. More
Healthcare IT News | October 13, 2015 | 11:37 AM | Privacy & Security
HIMSS Analytics is researching the concerns of IT security professionals, and the ways healthcare organizations secure their technology systems and applications. If you're a hospital or health system IT security professional, please provide your input... More
Bernie Monegain | October 13, 2015 | 10:58 AM | Mobile, Clinical, Patient Engagement
Americans are increasing their use of technology to improve their health, navigate the health system and flex their shopping muscles, according to a new report from The Deloitte Center for Health Solutions. More
Erin McCann | October 13, 2015 | 10:56 AM | Data Warehousing, Electronic Health Records, Analytics
Mining patients' social media data could provide enormous insight into overall health outcomes, according to a new study conducted by University of Pennsylvania researchers. More
Bernie Monegain | October 13, 2015 | 09:58 AM | Electronic Health Records, Health Information Exchange (HIE), Quality and Safety
Seamless data exchange across vendors and among health systems is critical, the American Hospital Association argues. Nonetheless, just 40 percent of hospitals can use the information they receive, AHA points out. More
Eric Wicklund | October 13, 2015 | 08:47 AM | Patient Engagement
Doctors and patients explain how the current practice of asymmetrical and "epistrophic" care can be transformed into a more collaborative relationship by harnessing available technologies. More
Healthcare IT News | October 13, 2015 | 06:10 AM | Quality and Safety, Clinical, Compliance & Legal
Healthcare IT News' focus is primarily on IT within the healthcare space, but there's also so much happening now within the broader realm of healthcare. Our headlines watch list is updated daily, so check back in with us for regular updates. More
Erin McCann | October 12, 2015 | 10:55 AM | Data Warehousing, Financial/Revenue Cycle Management, Cloud Computing
In one of the largest technology mergers in history, Dell announced Monday that it has inked a deal to acquire cloud computing and big data company EMC Corporation. More
Mike Miliard | October 12, 2015 | 10:29 AM | Electronic Health Records, Quality and Safety, Clinical
Bad EHR design can lead to data entry errors and risky workarounds that could jeopardize patient safety, according to a new document from NIST, which outlines ways to spot critical areas of risk and methods for improving user-centered design. More
Bernie Monegain | October 12, 2015 | 08:24 AM | Electronic Health Records, Quality and Safety, Interoperability
HIMSS Board Chair Dana Alexander, RN, describes herself as someone who has always been eager to embrace change, and also as someone who's always known healthcare was the right field for her. More
WASHINGTON | Tom Sullivan | October 12, 2015 | 08:06 AM | Electronic Health Records, Policy and Legislation, Interoperability
Healthcare IT News reported live from the nation's capital as policy makers were honored, keynote speakers compelled attendees, questions about the future were posed and progress was measured. Here's what we learned. More
Eric Wicklund | October 9, 2015 | 10:13 AM | Telehealth, Financial/Revenue Cycle Management, Policy and Legislation
A federal partnership with seven health systems is testing whether a new payment model that supports telemedicine can be used to reduce hospitalizations of long-term residents in nursing homes. More


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X-MEN: FIRST CLASS - Grading+Discussion **SPOILERS!**
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June 26 2011, 03:04 AM
Fleet Captain
Location: NJ, USA
Re: X-MEN: FIRST CLASS - Grading+Discussion **SPOILERS!**
Well if the world ends in 2012 we might not see all those movies!
I'm not sure what to think here. If Wolverine won't stand a chance in a packed year, how would a First Class sequel? Yet, considering the successful but considered soft box office of this one, you might think they'd rush the next one here before folks forget about it amid all the other comic book movies. Then again, if Wolverine does less than First Class, then they would in hindsight know they should have gone with 'Second Class'.
Who the heck knows? Fassbender so far is now out of the Trance film and McAvoy is in. However after the Jim Jarmusch vampire film, MF isn't signed on for anything else. Is he keeping his schedule clear for a reason after signing onto something like 6 projects in rapid succession? We know they are all contracted for 2 more films. Wonder if they would shoot them back to back?
And ugh, sidenote, I saw an MTV interview with Zoe joking there would be an Angel solo movie. <roll> Besides, what in the heck would you call a First Class sequel? Has anyone come up with anything good? See, this is why it is easier to focus elsewhere and call it Brotherhood of Mutants.
I need to find time to see this again! Times are getting really reduced now. How long will it even be in theaters?
FATE and FANGS: Tales from the Vampire Family
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I Think, Therefore I Review- Criticism, Conjecture, Rants
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Author has written 16 stories for Dengeki Daisy/電撃デイジー, Maid Sama!, Vampire Knight, Sket Dance, and Fairy Tail.
Okay, getting to write stuff on here:
I am a beta reader!!!!! If you would like me to edit your story please send it to me!
First of all, I'm not good at thinking of ideas for stories. I am weird, crazy, a horrible dancer, and sometimes annoying, etc. Basically, I am only me and no one else.
Gender: Girl
Age: Don't ask
Location: Do I look like I'll tell you? ( You probably don't know, cause you don't know what I look like and I won't show you)
What I love- manga, books, writing (duh), anime, food, milk chocolate, playing the violin, disguisting stuff, and a lot of other stuff
Favorite anime- Close tie between Kaichou wa maid sama and fairy tail
Anime I watch/ed- Kaichou wa maid sama, fairy tail, gosick, bleach, naruto, inuyasha + final act, sket dance,
Favorite manga- close tie between fairy tail, dengeki daisy, and kaichou wa maid sama(ongoing) and close tie between Shugo Chara, AAA and Hana to Akuma(completed)
Manga I read- Kaichou wa maid sama, dengeki daisy, fairy tail, bleach, naruto, hana to akuma, switch girl, strobe edge, AAA, chocolate, Beast Master, Love so Life, Shugo Chara
Favorite books- Secret Series, Things Not Seen, HUNGER GAMES- Anyone who hasn't read Suzanne Collin's AWESOME HUNGER GAMES TRILOGY, go and buy it, trust me it's worth it! Movie coming out March 23, 2012!
Favorite shows- icarly, victorious, drake & josh, Warehouse 13, Bones
Favorite movie- Don't have one, it might be the Hunger Games when it comes out
What I hate- cheese, nuts, peanut butter, ALWAYS having to wait for manga updates (especially the ones that take a month), hot pink
That's all for now.
Quotes and sayings:
"Go bald Kurosaki!"- Teru
"Usui you idiot!"- Misaki
"I already fell in love with him, a long time ago,"- Teru
"Prez is a masochist," -Usui
"Shut up you perverted stalker!" - Misaki
"I'll never give up! That is my ninja way!"- Naruto
"Do fairies have tails or don't they? An eternal mystery and eternal adventure,"- Makorav and Hades
"Hop, step, jump!"- Ran
"Drew, draw, drawn!"-Miki
"Chip, syrup, whip!"- Sue
"I'm also the happiest person in the world,"- Vivi
"What's with this tiny guild?" - Makorav (From ch 255 in Fairy Tail, not really a quote, but I thought it was funny ;D)
"It's become a great guild, third!" - Mavis ( She's my favorite Fairy Tail female character now! She's strong and cute!)
"Anyway, that guy, Usui Takumi is mine," -Misaki
"Fear isn't evil, it only allows us to learn our own weaknesses,"- Glidarts
"There's nothing to fear! We are not alone!" - Natsu (I'm surprised I didn't do a quote from the main character of Fairy Tail yet, although it's not like he says anything smart all the time, lol)
"Writing is a honor, in which you can only accomplish when you reach for your imaginations,"- Misstory5120
Work hard
Reach for your imaginations
Ignore the things that keep you away from writing
Tell your story in detail
Ideas are waiting to be unleashed
Never give up
Go for the greatest
Writing is a eternal adventure. You have endless ideas and imaginations. Just like your life, where you don't know what you'll become and when you'll fade.
-- READ THIS--I cdnuolt blveiee taht I cluod aulaclty uesdnatnrd waht I was rdanieg. The phaonmneal pweor of the hmuan mnid. Aoccdrnig to a rscheearch at Cmabrigde Uinervtisy, it deosn't mttaer in waht oredr the ltteers in a wrod are, the olny iprmoatnt tihng is taht the frist and lsat ltteer be in the rghit pclae. The rset can be a taotl mses and you can sitll raed it wouthit a porbelm Tihs is bcuseae the huamn mnid deos not raed ervey lteter by istlef, but the wrod as a wlohe. Amzanig huh? Yaeh and I awlyas toghuht slpeling was ipmorantt! tahts so cool! IF U COULD READ THAT PUT IT IN UR PROFILE!
Revenge is understandable, evil is not. When you revenge on something, the pain you do to the person is always less than the pain he or she caused to you. That is because, by doing something equal to the pain he or she caused you, then you become evil. You become an exact imitation of them by doing the same thing. By doing the exact something and causing the same pain, you are evil...and you can't change it.
This is a true story. A girl died in 1933. A man buried her when she was still alive. The murder chanted, "Toma Sota balcu," as he buried her. Now that you have read this chant, you will meet this little girl. In the middle of the night she will be on your ceiling. She will suffocate you like she was suffocated. If you post this on your profile, she will not bother you. Your kindness will be rewarded. Lucillia
Her name was Auroura
My name is sarah
I am but three,
My eyes are swollen
I cannot see,
I must be stupid
I must be bad,
What else could have made
My daddy so mad?
I wish I were better
I wish I weren't ugly,
Then maybe my mommy
Would still want to hug me.
I can't speak at all
I can't do a wrong
Or else I'm locked up
All the day long
When I awake I'm all alone
The house is dark
My folks aren't home.
When my mommy does come
I'll try and be nice,
So maybe I'll get just
One whipping tonight
Don't make a sound!
I just heard a car
My daddy is back
From Charlie's Bar.
I hear him curse
My name he calls
I press myself
Against the wall.
I try and hide
From his evil eyes
I'm so afraid now
I'm starting to cry.
He finds me weeping
He shouts ugly words,
He says its my fault
That he suffers at work.
He slaps me and hits me
And yells at me more,
I finally get free
And I run for the door.
He's already locked it
And I started to bawl,
He takes me and throws me
Against the hard wall.
I fall to the floor
With my bones nearly broken,
And my daddy continues
With more bad words spoken.
"I'm sorry!", I scream
But its now much too late
His face has been twisted
Into unimaginable hate.
The hurt and the pain
Again and again
Oh please God, have mercy!
Oh please let it end!
And he finally stops
And heads for the door,
While I lay there motionless
Sprawled on the floor.
My name is Sarah
And I am but three,
Tonight my daddy,
Murdered me.
These to kids had to suffer! Never! I hate child abuse!
August 23, 1:55 pm: Omg! An earthquake just hit! My first experience!
What does this word mean:
Four thing you need to be a awesome writer
Unique= Your writing is yours ONLY. No one can take it, and you can't take theirs.
Dependable= Your pencil depends on YOU. A pencil is meant to write, reach for your imaginations.
Confidence= If you don't have the confidence to write and share YOUR story, you are not a writer. Be confident, your writing will always be great as long as you put your mind into it.
Intelligence= Not as in a nerd. But to be writer, you have to know this:
You have to have a PASSION for writing. If you don't like writing, you can't become a writer.
Nakama, friends, bonds, best friends, family, lover. Whatever you call it, you can't live without it.
OMG! A Fairy Tail movie coming out Aug 18, 2012!~!!!!!!!!!!!! Translators please don't make us wait too long! There's a trailer out right now! It may be 30 sec, but it's awesome!!!!!!!!!!!!!
I heard that Mashima, author of Fairy Tail, is giving the plot of the movie and helping out with it, so a guarantee of epicness!!! My profile pic is the first scene Mashima thought of when he thought of the movie, so we will expect something about Natsu and Lucy!
Speaking of Fairy Tail, here are 5 reasons it's an awesome manga you should read:
5. Awesome battles and fights!
4. Funny, sad, emotional, happy, tragic (Erza and Gerard, very tragic)smiley scenes! Has it all!
3. Lots of twists, author will make you be like, "WHAT!" (I'm serious, if you read the manga)
2. Not great just because of plot, the characters are unique and the guild is very fun (I'll tell you now that you meet a dense dragon slayer, royal blonde, flying cats, stripper, female knight, and a shy sky maiden)
1. Has an awesome meaning! Fairy Tail literally holds up a flag saying: NAKAMA ARE IMPORTANT! NEVER GIVE UP! YOU ARE NOT ALONE! FRIENDS WILL SUPPORT YOU! LIVE FOR YOUR FRIENDS! AND MANY MORE!
Things I wanna do for the New Year of 2012
1. Watch the Hunger Games Movie
2. Celebrate my birthday
3. Watch the Fairy Tail movie in subs or learn Japanese
4. Continue to read Fairy Tail
5. Continue to watch Fairy Tail
6. Complete 6th grade
7. Get straight A's
8. Be a better friend
9. Finish my Sin and Soul fanfic
10. Learn new things
The sea
A tree's stump
The green, tall grass
Every vine
The air
The animals
I have no home
I think I live better than any other human in this world- Poem by Misstory5120


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Top Definition
Someone whose thuggish or unsophisticated demeanor masks sophisticated technical ability.
Don't fuck with him. If he finds out who you are he'll deface more than your homepage. Proper neandernerd.
by Dr Congo1 August 26, 2008
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text: previous next Fullscreen Uncategorized • March, 3 2008 • By David Fischer Johnny Cupcakes Boxers Shares Share Tweet Email Reddit Flipboard WhatsApp Comments Johnny Cupcakes has released their newest product last week, their own boxers. They offer three designs in this new product category. Filed under: boxers, highsnobiety, johnny cupcakes


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Stanford pulls upset at Oregon to derail Ducks' BCS title hopes
EUGENE, Ore. -- Jordan Williamson hit a 37-yard field goal in overtime and Stanford (No. 13 BCS, No. 14 AP) upset Oregon (No. 2 BCS, No. 1 AP) 17-14, denying the Ducks a chance to clinch the Pac-12 North and derailing their straight shot at the BCS title game.
If both Stanford and Oregon win in their final games next weekend, both will finish with one conference loss, which means Stanford will win the head-to-head matchup and go to the Pac-12 championship for a chance to play in the Rose Bowl.
After winning its fifth straight, Stanford (9-2, 7-1) will play its finale at No. 17 UCLA, which defeated USC (No. 18 BCS, No. 21 AP) 38-28 earlier in the day to claim the Pac-12 South. Oregon (10-1, 7-1) will play Oregon State (No. 16 BCS, No. 15 AP) in the annual Civil War rivalry game in Corvallis.
The loss snapped a 13-game winning streak for the Ducks, the longest in the nation coming into Saturday.
"It hurts and as I told them, you'd like to have some words that would take the pain out of it, but there aren't," Oregon coach Chip Kelly said. "We'll feel bad for a little bit of time and we'll bounce back from it."
Oregon's loss, coupled with Kansas State's (No. 1 BCS, No. 2 AP) -- they were also the top two teams in the BCS standings -- means third-ranked Notre Dame is now the lone unbeaten team in the race for the BCS title game.
The Fighting Irish control their national championship run, with No. 4 Alabama and a couple of other Southeastern Conference teams also in the thick of it.
Oddsmaker Danny Sheridan told ESPN.com's Darren Rovell that, at this point, Notre Dame would be a 10-point underdog to the Crimson Tide.
Oregon was the only Pac-12 team that Stanford hadn't defeated over the past two seasons. But the Cardinal's tough defense smothered the highest scoring team in the nation.
Alejandro Maldonado missed a 41-yard field goal for the Ducks to open overtime before Williamson's game winner.
Redshirt freshman Kevin Hogan threw for 211 yards and a game-tying fourth-quarter touchdown for Stanford, while Stepfan Taylor rushed for 161 yards on 33 carries.
Down 14-7, Stanford went for it on fourth-and-1 on the Oregon 12 with 2:17 left in regulation and Ryan Hewitt ran two yards for the first down. Hogan hit Zach Ertz with a 10-yard scoring pass to tie it at 14 with 1:35 to go. Ertz fought to gain control of the ball with a defender as he fell to the turf on top of a Ducks player. The play was initially ruled incomplete, but a video review overturned it for the game-tying touchdown.
Despite a pass interference call that gave them a crucial first down, the Ducks were forced to punt on the ensuing series and Stanford took over with 36 seconds to go and the game went to overtime.
The Cardinal had the nation's best run defense going into the game, allowing an average of just 54.8 yards a game. Oregon, meanwhile, had the country's third-best rushing offense, averaging 325 yards a game.
Stanford held Ducks running back Kenjon Barner, who was averaging 136 yards rushing a game, to just 66 yards. Overall, the Ducks managed only 198 yards on the ground.
Oregon's top rusher was quarterback Marcus Mariota, who ran for 89 yards. Mariota, a redshirt freshman who had been getting Heisman buzz, threw for 207 yards and a touchdown.
Stanford stuffed what appeared to be a sure first-quarter Oregon touchdown drive when Mariota took off on a 77-yard keeper to the Stanford 15. But the Ducks couldn't get much closer, and Stanford got the stop when Oregon went for it on fourth-and-2 on the Cardinal 7.
Stanford scored first on Hogan's 1-yard plow into the end zone early in the second quarter.
Oregon tried again on fourth-and-4 midway through the quarter, but was unsuccessful, this time when Mariota's pass to tight end Colt Lyerla fell incomplete.
When Oregon took over on downs from Stanford on the next series, the Ducks marched 59 yards in three plays -- capped by Mariota's 28-yard touchdown pass to Keanon Lowe -- to tie it at 7-all.
Oregon extended its lead to 14-7 on De'Anthony Thomas' 6-yard scoring run in the third quarter, but missed a chance when Maldonado's 42-yard field goal attempt went wide right.
Williamson missed a 43-yard field goal attempt for Stanford early in the fourth quarter.
The victory for Stanford is retribution for Oregon's dominance over the Cardinal for the past two seasons.
Last year, Stanford was ranked No. 3 and looking toward its own national championship bid with quarterback Andrew Luck when then-No. 6 Oregon visited Palo Alto and emerged with a 53-30 victory. Running back LaMichael James, who would join Luck's NFL draft class in the spring, ran for 146 yards and three touchdowns.
The year before, Oregon defeated the Cardinal and Luck 52-31 in an early October hurdle en route to an undefeated regular season and an appearance in the BCS title game against Auburn.
In both seasons, Oregon went on to win the conference titles. The Ducks have won three straight Pac-12 championships.
The Ducks went into the game hurting on defense after a 59-17 victory over California last weekend.
Oregon was without free safety Avery Patterson seriously injured his left knee in the second quarter and is believed to be out for the rest of the season. Patterson had taken over as starter for senior John Boyett, whose career at Oregon ended earlier this season when he needed surgery on both knees. Starting nose guard Wade Keliikipi did not play.
Because the Ducks do not disclose injuries, there was also uncertainty about the secondary, leading to speculation that the team might use Lowe or even multi-purpose sophomore back Thomas on defense. But they did not.
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2015 Pac 12 - North Standings
|Oregon State
|Washington State


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From the Quran
"O Mankind, We created you from a single (pair) of a male and a female and made you into nations and tribes, that you may know each other. Verily the most honored of you in the sight of God is he who is the most righteous of you" (Quran 49:13).
Explanation: There are several principles, which this verse presents:
- This message is not just for Muslims only because God is addressing all of humanity. While Muslims are one brotherhood, this is part of a larger brotherhood of humanity.
- God is telling us that He has created us. Therefore He knows the best about us.
- He says that He created us from one man and one woman meaning then that we are all the same.
- It also means that all human beings are created through the same process, not in a manner in which some are created with a better mechanism than others.
- God is the One who made human beings into different groups and people.
- These differences are not wrong, rather a sign from God ("And among His Signs is the creation of the heavens and the earth, and the difference of your languages and colors. Verily, in that are indeed signs for those who know" [Quran 30:22]).
- Note that no word equivalent to race is used in this ayah or any other verse of the Quran.
- Islam, however, limits the purpose of these distinctions to differentiation and knowing each other. This is not meant to be a source of beating each other down with an attitude of 'my group is better than your group' or false pride as is the case with tribalism, nationalism, colonialism, and racism.
- The only source of preference or greatness among human beings is not on a national or group level, but it is at the individual level.
- One individual who is (higher in Taqwa), more conscious of his Creator and is staying away from the bad and doing the good is better, no matter what nation, country or caste he is part of. Individual piety is the only thing that makes a person better and greater than the other one.
- However, the only criterion of preference, Taqwa, is not measurable by human beings. Indeed God is the One Who knows and is aware of everything so we should leave even this criterion to God to decide instead of human beings judging each other.
These are the deeply embedded ideals of Islam which still bring people to this way of life even though Muslims are not on the best level of Iman today. This is what changed the heart of a racist Malcolm X when he performed Hajj in Makkah. This is the power that brought Muhammad Ali to Islam. This is what still attracts the Untouchables of India towards Islam. This is the theory which convinced noted historian Professor A.J. Toynbee in 1948 to say that: "The extinction of race consciousness as between Muslims is one of the outstanding achievements of Islam, and in the contemporary world there is, as it happens, a crying need for the propagation of this Islamic virtue."
Let's ask ourselves if the Muslim Ummah today, in its individual and collective behavior is striving to adopt and promote these Islamic ideals?
From the Sunnah
1. Prophet's response to racist comments
A man once visited the Prophet's mosque in Madinah. There he saw a group of people sitting and discussing their faith together. Among them were Salman (who came from Persia), Suhayb who grew up in the Eastern Roman empire and was regarded as a Greek, and Bilal who was an African. The man then said:
"If the (Madinan) tribes of Aws and Khazraj support Muhammad, they are his people (that is, Arabs like him). But what are these people doing here?"
The Prophet became very angry when this was reported to him. Straightaway, he went to the mosque and summoned people to a Salat. He then addressed them saying:
"O people, know that the Lord and Sustainer is One. Your ancestor is one, your faith is one. The Arabism of anyone of you is not from your mother or father. It is no more than a tongue (language). Whoever speaks Arabic is an Arab." (As quoted in Islam The Natural Way by Abdul Wahid Hamid p. 125)
2. Statement of the universal brotherhood in the last Sermon
O people, Remember that your Lord is One. An Arab has no superiority over a non-Arab nor a non-Arab has any superiority over an Arab; also a black has no superiority over white, nor a white has any superiority over black, except by piety and good action (Taqwa). Indeed the best among you is the one with the best character (Taqwa). Listen to me. Did I convey this to you properly? People responded, Yes. O messenger of God, The Prophet then said, then each one of you who is there must convey this to everyone not present. (Excerpt from the Prophet's Last Sermon as in Baihiqi)
3. Don't take pride in ancestry
The Prophet said: Let people stop boasting about their ancestors. One is only a pious believer or a miserable sinner. All men are sons of Adam, and Adam came from dust (Abu Dawud, Tirmidhi).
4. Looking down upon other people will stop you from entering the Jannah
The Prophet said: Whoever has pride in his heart equal to the weight of an atom shall not enter Paradise. A man inquired about a person who likes to wear beautiful clothes and fine shoes, and he answered: God is beautiful and likes beauty. Then he explained pride means rejecting the truth because of self-esteem and looking down on other people (Muslim).
5. The Prophet condemnation of Arab racial pride
There are many hadith, which repeatedly strike on the Arab pride of jahiliyyah. Arabs before Islam used to look down upon others specially blacks. The Prophet repeatedly contrasted the believing Africans versus non-believing Arab nobles.
The Prophet said: You should listen to and obey your ruler even if he was an Ethiopian slave whose head looked like a raisin (Bukhari).
from the Quran, explanation, no 11
Malcolm X was no racist. He responded to racism. However, he was predjudiced towards whites due to the ideology of racist white supremacy, which still exists and is just as pervasive today in 2015. Understand, "racism exists only when one group holds a disproportionate share of wealth and power over another group then uses those resources to marginalize, exploit, exclude and subordinate the weaker group" (Dr Claud Anderson). No black person in America has ever possessed such.
Overall some very thoughtful
Overall some very thoughtful points and Hadiths and verses which we should not forget...however there are many misconceptions in regrads to Arabs and the so-called Africans...what many people don't know is that the ORIGINAL Arabs were the same complexion as the the so-called Africans...infact the ORIGINAL Arabs were very racist towards people with a fair complexion and they were ver proud of their very dark complexion
Al-Mubarrad said: "The Arabs used to take pride in their asmar and black complexion and they used to hate a red (white) color and very fair color and they said that it was the color of the Persians."قال المبرد"العرب كانت تفتخر بالسمرة و السواد و كانت تكره الحمرة و الشقرة و تقول انها من ألوان العجم"
Ibn Berry said: The Arabs describe their color as black and they describe the color of the Persians as red (white).و قال ابن بري: "العرب تصف ألوانها بالسواد و تصف ألوان العجم بالحمرة"
Ibn Sayyida said: "...They are Arabs and their colors are adam, asmar, and black."قال ابن سيده ... فهم عرب، وألوانهم الأدمة والسمرة والسواد
Abu Taalib Al-Nahwi said: "... It is said that he meant that he was a pure Arab because most Arabs are adam complexioned.قال أبو طالب النحوي: ... و قيل أراد أنه من خالص العرب و صميمهم لأن الغالب على ألوان العرب الأدمة
i interpret 6. also as that the creation of our differences is a gift from God, so beautiful. That it is a clear sign to all of his existence.
Great it's so educating.
beautiful, mashah allahsharing it on fb
Salam. I've lifted the article and posted as notes on Facebook. Many can share. Thanks.
This is realy very nice and informative Article,May Allah guide us and show us the straight path to whole Ummah..Jazako Mullah E Khair
very well explained.
This is a message for Hasib from Ontario: in Islam, you are correct, God is One with no partners, sons or associates. The use of "we" refers to what in English is called the "royal we". It is another way of referring to oneself (e.g. "we are not amused" used by a queen or king). It is not referring to the commonly used plural "we" in the English language.This is not just in English but in other languages as well. For instance, in Urdu, the language spoken by millions of Muslims in South Asia, there is the use of "hum", another form of "we" but it is considered a higher level usage of the language instead of just saying "I" like "I think".
Hello, can you tell me why it says "WE" at the beginning of the line? God is one and only, then why say "We created you..." ?thanks :)


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I'm 36 weeks and had my first cervix exam today (along with strep b) and I'm halfway effaced and 1 cm dilated! woo hoo!! I expected nothing, so it made me really happy! When the doctor checked me he said, "Oh! She's really low! Do you feel like you're walking around with a bowling ball between your legs?" ...how'd ya know, doc?! lol
I know I can be sitting at 1 cm for a while, but it's progress!! Can't wait for next week's appointment!


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