text: We're sorry, Cow Parsley Crystal Hair Pin is no longer available Why not try one of these instead? Set Of Pearl Blossom Wedding Hair Pins by Chez Bec £36$64.45€43.42$48.31 free UK delivery Bette Crystal And Pearl Hair Comb by Anusha £49$87.72€59.10$65.76 free UK delivery Keishi Pin by Gillian Million £45$80.56€54.28$60.39 Set Of Downton Wedding Hair Pins by Chez Bec £36$64.45€43.42$48.31 free UK delivery Cow Parsley Crystal Hair Pin by Cherished £42$75.19€50.66$56.37 This item is no longer available £6.95$12.44€8.38$9.32 delivery to United States Receive this item 5-10 working days from dispatch International delivery available colourcolour (required)cp002gs Light grey/white opal with silver wiringcp002wg White alabaster with gold wiringcolour (required)cp002gs Light grey/white opal with silver wiringcp002wg White alabaster with gold wiringcolour (required)cp002gs Light grey/white opal with silver wiringcp002wg White alabaster with gold wiringcolour (required)cp002gs Light grey/white opal with silver wiringcp002wg White alabaster with gold wiring we're sorry we're sorry, This item is no longer available buy a gift voucher related categories weddings > more > fashion > women's accessories > hair accessories weddings > styling your day > wedding fashion > bridesmaid accessories weddings > styling your day > wedding fashion > hats, hairpieces & hair clips by Cherished Location: West Sussex, GB read seller's profile see seller's complete range more items from this seller Cow Parsley Crystal Hair Vine by Cherished £230$411.76€277.44$308.70 Petworth Pearl Acorn Wedding Tiara by Cherished £240$429.67€289.51$322.12 Silver Rose Leaf And Pearl Hair Pin by Cherished £28$50.12€33.77$37.58 Golden Laurel Leaf Wreath Bridal Hair Vine by Cherished £220$393.86€265.38$295.28 Rose Gold Laurel Leaf Wreath Bridal Hair Vine by Cherished £220$393.86€265.38$295.28 Pansy Bloom Hair Comb by Cherished £140$250.64€168.88$187.90 view all you may also like PRODUCT DETAILS DELIVERY RETURNS ask seller a question save for later Beautiful handmade crystal hair pin in a beautiful floral 'seed head' design. This pretty hair pin is reminiscent of a wild Cow Parsley seed head and is the perfect accessory for brides seeking a relaxed and bohemian look. Fresh and modern, it would also suit a destination wedding. Created from the finest swarovski crystals in either light grey/white opal, or white alabaster, each pin features over twenty crystals handwired into a flexible floral spray, set on a silver- or gold-plated hair pin. Suitable for bride, bridesmaid or flowergirls, these charming crystal hair pins look beautiful dotted through tied-back or braided hair. Also available as a set of three. These pins are available in two beautiful colourways; Light Grey and White Opal with silver-plated wiring or White Alabaster with gold-plated wiring. Additional colourways are available on request and customers should get in touch via the 'ask the seller a question' button to discuss any bespoke requirements before purchasing. made from: Swarovski crystals, silver-plated or gold-plated wire, silver-plated or gold-plated hair pin. dimensions: Height of detail from top of hair pin H3 x W5cm approx. Hair pin is approx 7 cm in length. product code: 246163 This product is dispatched to you by Cherished. MAINLAND UK order now and receive this item by price Free Delivery Wednesday 3 August FREEFREEFREEFREE Tracked Two Day Delivery Monday 1 August £3.95$7.07€4.76$5.30 NON-MAINLAND UK estimated delivery price Highlands & Islands of Scotland 2-5 working daysfrom dispatch FREEFREEFREEFREE Northern Ireland 2-5 working daysfrom dispatch FREEFREEFREEFREE Other UK Islands 2-5 working daysfrom dispatch FREEFREEFREEFREE INTERNATIONAL DELIVERY estimated delivery price Western Europe 2-5 working daysfrom dispatch £5.00$8.95€6.03$6.71 Rest of Europe 5-10 working daysfrom dispatch £5.00$8.95€6.03$6.71 USA & Canada 5-10 working daysfrom dispatch £6.95$12.44€8.38$9.32 Asia & Australasia 5-10 working daysfrom dispatch £7.25$12.97€8.74$9.73 Rest of the world 5-14 working daysfrom dispatch £7.25$12.97€8.74$9.73 You have 28 days, from receipt of cancellable goods, to notify the seller if you wish to cancel your order or exchange an item. Please note: goods that are personalised, bespoke or made-to-order to your specific requirements, perishable products and personal items sold with a hygiene seal (cosmetics, underwear) in instances where the seal is broken are non-refundable, unless faulty. Read more about our returns policy.Should you choose to return or exchange your order you will need to deliver the item(s) to the UK, where this seller is based. Cherished's return policy Please see notonthehighstreet.com's returns policy.


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Finishing league play with a win on Senior Night, the Borgia volleyball Lady Knights secured second place in the Archdiocesan Athletic Association Large Division.
Borgia swept Bishop DuBourg Wednesday, 26-24, 25-14, to finish league action.
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HOPE NOW is currently in the process of developing a property donation program with the goal of increasing capacity for organizations providing housing and supportive ...HOPE VI is a plan by the United States Department of Housing and Urban Development. It is meant to revitalize the worst public housing projects in the United States ...Money Smarts. As part of the Federal Reserve's Money Smart Week, Focus: HOPE will host a number of financial workshops on April 25, 2015 from 10:00 a.m. to 3:00 p.m ...During the period of January 29-30 2014, Southern Nevada Regional Planning Coalition Committee on Homelessness conducted the 2014 Southern Nevada Homeless Census.9/7/2012 · "Effective Evil" or Progressives' Best Hope? Glen Ford vs. Michael Eric Dyson on Obama PresidencyTennessee Education Lottery Scholarship Program (TELS) (Promulgated Rules) The TELS rules were revised to facilitate administration of the TELS program, which ...ENERGY STAR is a government-backed program helping businesses and individuals protect the environment through superior energy efficiency.1/23/2015 · Tax Topic Index Topic 123. These Tax Topics contain general individual and business tax information. If you don't find the answer to your question below ...Giving Hope. Children's Hope Alliance is the combination of Barium Springs and Grandfather Home for Children joining forces to serve children and families ...Get to Know Your Species Interactive Website . View our new interactive map to learn about endangered species success in your state or territory.
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This week is a bit of potpourri in the column category. I just had to get each of these little nuggets off my chest.
BEIRUT, Lebanon - At the ''Buns and Guns,'' the chefs wear military helmets, the food is wrapped in camouflage paper and the advertising slogan is ''a sandwich can kill you.''
Summer Sports Show for Thursday, June 26 - Presented by Farmers and Merchants Bank.
This is another deal in which the optimist fails after assuming everything will be for the best in the best of all possible worlds. But the pessimist - or would you prefer "realist"? - works out how to overcome adversity.
Generally speaking, all Cancers could be extremely fortunate in the year ahead with endeavors they initiate and take a strong interest in. Once you set your mind to something, it'll be a fait accompli.
HARARE, Zimbabwe - President Robert Mugabe on Thursday said he is open to talks with the opposition, which is boycotting Friday's runoff because its leader says state-sponsored violence has made it impossible to take part.
PHNOM PENH, Cambodia - High on a Cambodian cliff, the Preah Vihear temple has weathered war and territorial disputes. Now it's at the center of a political tug-of-war in neighboring Thailand.
BAGHDAD - A suicide bomber attacked a meeting of pro-government Sunni sheiks west of Baghdad on Thursday, killing at least 20 people. The U.S. military acknowledged coalition casualties but did not say how many.
DEAR ABBY: I am a woman in my late 40s. My father and siblings all live in the same town. We have always been close and spend holidays, birthdays, etc. together, even as our families have grown.
Studio Statesboro Vodcast - Thursday, June 26, 2008
NEW YORK - Stocks tumbled Thursday as Wall Street contended with a barrage of bad news: another surge in oil prices and warnings of trouble in the key financial, automotive and high-tech industries. The major indexes showed losses of more than 2 percent, including the Dow Jones industrial average, which shed about 250 points and dropped to its lowest level in more than a year.
ST. LOUIS - Strong Midwestern downpours may force residents to wait even longer to return to homes they evacuated due to fears of flooding, emergency management officials said Thursday.
HENDERSON, Ky. - It was swift and chaotic, witnesses said, as the plastics plant worker with a determined look opened fire, killing five co-workers then himself in rural western Kentucky.
DRY TORTUGAS NATIONAL PARK, Fla. - Reeling in a 45-pound grouper used to be just an average day on the water in the Florida Keys.
WOBURN, Mass. - A British man convicted of shooting to death his 9-month-old baby and wife as they cuddled together in bed showed no reaction Thursday as he was sentenced to two life prison terms without the opportunity for parole.
OMAHA, Neb. - Michael Phelps surged to the wall, and then whipped around to spot his time.
LONDON - How much money might you be willing to pay for the once-in-a-lifetime chance to play tennis against Roger Federer on Centre Court at Wimbledon?
CLEVELAND - LeBron James is about to hit the free-agency market and stay right at home.
AKRON, Ohio - The U.S. Open trophy was on the kitchen table in Dustin Johnson's home in South Florida. That was by design.
New laws targeting abortion are set to take effect Friday in about one-fifth of the states, initiating another wave of restrictions just days after the ...
Who is the SACK Company? Do they make sacks? What does SACK even stand for?
Healthcare is more complicated now more than ever.
When local businessman Bubba Hunt saw an opportunity to shake up the local real estate market, like most great entrepreneurs, he seized it.
How will your grandchildren's children remember you?
On Thursday, March 17, nine students from Statesboro High School went to the Georgia International Convention Center in Atlanta to showcase their skills and compete ...
The welcoming of warmer weather and flowers blooming signals the beginning of spring and the upcoming Easter holiday. Easter brings families together to celebrate the ...
Since entering the Statesboro healthcare market in 2009, Dr. Daniel Okungbowa has embraced the community with a passion of ensuring that every citizen has access ...
Nestled among the oak trees of what was once the Gesmon Neville Family Farm, The Lodge at Bethany, an extension of the long-standing history of ...
Man of the Decade
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- Swimmer Ryan Lochte reveals one of his worst dates - US Weekly
- Get the latest on Dr. Dre's arrest - TMZ
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"Few seize the brass ring in business or in life without topnotch negotiation skills. Martin Latz's Gain the Edge! will empower you to achieve that kind of success. Read it. Make it your own. You'll close more deals and get more favorable terms in all your negotiations." Harvey Mackay, author of the #1 New York Times bestseller Swim With The Sharks Without Being Eaten Alive
"Martin Latz's Gain the Edge! is the best book I've ever read on negotiation strategy. If you negotiate for a living or only occasionally, Latz gives you the tools and tactics to succeed before you sit down at the table. Whether it's negotiating Randy Johnson's contract or the purchase of your next car, Gain the Edge! is clear, concise, and unfailingly useful." Jerry Colangelo, Chairman and CEO, Arizona Diamondbacks and Phoenix Suns
"Anyone who's tried to push a bill through Congress knows the importance of negotiation. In Gain the Edge! Martin Latz has condensed his enormous font of negotiating wisdom into a book that's accessible, readable, and eminently usable in politics, business, and everyday life." U.S. Senator Russ Feingold
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text:
|Publication number
|Publication type
|Application number
|Publication date
|Feb 8, 2011
|Priority date
|Feb 12, 2009
|Fee status
|Also published as
|Publication number
|Hessel Sprey, Akinori Nakano
|Original Assignee
|Asm International, N.V.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (57), Non-Patent Citations (10), Referenced by (10), Classifications (14), Legal Events (2)
|External Links: USPTO, USPTO Assignment, Espacenet
1. Field of the Invention
This application relates generally to integration circuit fabrication. More particularly, this application relates to the deposition of liners for through-silicon vias used in the 3-D integration of integrated circuits.
2. Description of the Related Art
Integrated circuits (ICs) typically include many devices and circuit features formed on a single semiconductor wafer. Current trends in IC technology are toward faster and more powerful circuits. However, as more complex ICs such as microprocessors having high operating frequency ranges are manufactured, various speed related problems are becoming increasingly challenging. This is especially true when ICs having different functions are used to create electronic systems, for example, computing systems including processor and memory ICs, where different ICs are electrically connected by a global interconnect network. As the global interconnects become longer and more numerous in the electronic system, RC delay and power consumption as well as low system performance are becoming limiting factors.
One proposed solution to these problems is three dimensional (3-D) integration or packaging technology, where 3-D integration refers to the vertical stacking of multiple dies or wafers including ICs within a package. In 3-D integration technology, multiple wafers are electrically connected using vertical connectors or 3-D conductive structures which can have depths or widths as large as one hundred micrometers or greater. Holes or vias (known as "through-silicon vias") extending through one or more wafers can be filled with conductive material such as copper and can be aligned when the wafers are stacked to provide electrical communication among the ICs in the stacked wafers. Such 3-D integration can result in size and weight reduction of the IC package, reduction in power consumption, and an increase in performance and reliability.
A conventional method of forming an IC device using a 3-D integration technique will now be described. First, a wafer including substrate-level IC elements (e.g., transistors, capacitors, resistors, etc.) is provided. The front surface of the wafer is then coated with an insulating layer, such as a SiO2 film. One or more vias are then formed by etching, drilling (e.g., laser drilling) or a like process. For 3-D integrated devices, vias can be large, with the depths ranging from twenty microns to several hundred microns. The vias are typically in the fifty micron range. For some rounded vias, the diameters can range from one micron to over one hundred microns. After via formation, a dielectric film liner is coated on the wafer surface and also inside the vias for the purpose of insulating the wafer material from subsequently deposited conductive material. The dielectric film is then lined with a barrier layer such as a Ta/TaN layer and a seed layer. The via is then filled with conductive material using an electrochemical deposition or electroplating process to form one or more conductive plugs, followed by an optional chemical mechanical polishing (CMP) process or electrochemical mechanical polishing (EMCP) process to remove any unwanted conductive material from the surface of the wafer. A metallization layer is then formed and patterned to interconnect the substrate-level IC elements to the conductive plug. To expose the conductive plug embedded in the wafer, the wafer is thinned down to reveal the conductive plug from its back surface. The wafer may then be sliced into individual dies that are aligned and capable of being stacked on top of a base wafer. Eventually more levels of dies can be stacked on top of each other.
The development of 3-D integration continues and there is a continuing need for improved methods and systems for 3-D integration.
The present application provides methods and devices related to the deposition of a liner material, preferably a low-k film liner material such as a polymerizable organo-silicon compound such as a benzocyclobutene compound, using a chemical vapor deposition (CVD) process, on sidewalls of a through-silicon via. In some embodiments, a method of forming an integrated circuit device comprises providing a first semiconductor workpiece and forming one or more vias in the first semiconductor workpiece. The vias are lined with a benzocyclobutene film. Conductive material is deposited in the vias of the first semiconductor workpiece after lining the vias with the benzocyclobutene film. The conductive material in the bottom of the via can be exposed and a through-silicon via is formed. A second semiconductor workpiece having a wiring layer can be provided. The first semiconductor workpiece is stacked over the second semiconductor workpiece to form a 3-D IC device, wherein the wiring layer of the second semiconductor workpiece is electrically connected with the exposed conductive material of the through-silicon vias of the first semiconductor workpiece.
In some embodiments, a method of integrated circuit fabrication comprises providing a semiconductor workpiece with one or more vias formed therein, lining the vias with a dielectric film having a dielectric constant less than 3, and depositing conductive material in the vias after lining the vias with the dielectric film. The semiconductor workpiece is back-thinned so that the conductive material in the bottom end of the one or more vias is exposed. In some embodiments, the low-k dielectric film comprises benzocyclobutene.
In some embodiments, an integrated circuit device is provided comprising a through-silicon via in a silicon substrate, a benzocyclobutene film lining the via and a conductive fill filling the via over the benzocyclobutene film.
In forming an IC device using 3-D integration technology, the use of a dielectric film to line through-silicon vias prevents excessive capacitive coupling between vias and also prevents current from going to the wafer during some conductive material filling processes. Through-silicon vias are generally larger and possess much greater depths than conventional vias formed in integrated circuits, such as inter-level vias, which can have depths that are in the sub-micron range (e.g., about 0.15 to about 0.6 microns). Through-silicon vias, in contrast, can have depths of up to several hundred microns, although the depth is more typically in the range of about 10 to about 50 microns. The through-silicon vias can also have large widths or diameters (for circular through-silicon vias) of over one hundred microns, although the width is more typically in the range of about 1 to about 5 microns. Because of their large sizes, including being significantly wider and deeper and having larger surface areas than the vias typically formed in integrated circuits, the considerations for deposition processes for these through-silicon vias can differ from conventional processes; processes applicable to lining and filling small, conventional vias do not necessarily apply to filling the through-silicon vias of 3-D IC devices. For example, typical deposition processes may not provide adequate coverage in the deep and large through-silicon vias.
A typical dielectric film liner material is silicon oxide (SiO2). Silicon oxide is a well-known dielectric material and processes for effectively and economically depositing it into vias to form through-silicon vias are well-known.
In addition to the dielectric film liner, various other liner materials can line the through-silicon vias to perform various functions. For example, barrier and stress buffer layers may also line through-silicon vias in some circumstances. Barrier layers prevent the diffusion of conductive material into the wafer. Stress buffer layers help to absorb stress caused by a mismatch in the coefficients of thermal expansion of nearby materials, such as between the conductive material (e.g., copper) and substrate material (e.g., silicon). Generally, the conductive material has a higher coefficient of thermal expansion, resulting in material stress during thermal cycling. Because through-silicon vias are very large integrated circuit structures, there can be considerable space to accommodate these various layers.
Advantageously, it has been found that polymerizable organo-silicon compounds can be used to line through-silicon vias. Such compounds include benzocyclobutenes, such as divinylalkylsiloxanebisbenzocyclobutene. These materials offer exceptional benefits as liners for through-silicon vias. The benzocyclobutene film can be deposited thinly and conformally, is "flexible" (thereby buffering the semiconductor substrate against stress caused by differential thermal expansion of the substrate and conductive material in the via), and possesses low electrical leakage characteristics. The benzocyclobutene film can also serve as a diffusion barrier. And, as benzocyclobutene is a low-k dielectric, it also results in lower capacitive coupling between nearby through-silicon vias. Utilizing a benzocyclobutene film as a dielectric film liner reduces the need for other layers that may be used in the 3-D integration of integrated circuits, such as diffusion barrier layers and thermal stress absorbing layers, and therefore, can reduce the number of processing steps used to form a 3-D integrated circuit. In addition, because of their thinness, ability to perform the function of multiple layers, and ability to be deposited in narrow, high aspect ratio vias, these polymerizable organo-silicon compounds can facilitate the use of through-silicon vias that are narrower and have a higher aspect ratio than those through-silicon vias used with conventional dielectric liners.
According to some embodiments of the invention, 3-D integrated circuit devices and methods of forming 3-D integrated circuit devices by depositing highly conformal low-k dielectric film liners for through-silicon vias are provided. In some embodiments, the low-k dielectric material will have a k value less than or equal to 4, or even less than or equal to 3. While the methods described herein can be used to deposit lining material on vias of any size involved in integrated circuit fabrication, the methods are particularly advantageous for depositing low-k dielectric film liners on the sidewalls of through-silicon vias (TSV) used in 3-D integration of integrated circuits, in which multiple die or chips including ICs are stacked vertically in a package.
In some embodiments, a low-k dielectric film liner having a k less than 4, more preferably less than 3, lines a through-silicon via. The preferred precursor material for the low-k liner is a polymerizable organo-silicon compound such as a benzocyclobutene compound. A preferred compound is divinylalkylsiloxanebisbenzocyclobutene, most preferable divinyltetramethylsiloxanebisbenzocyclobutene, the structure of which is shown in
In some embodiments, the low-k dielectric liner, preferably formed of benzocyclobutene, has a high degree of uniformity and conformality when deposited. Film thickness uniformity is preferably determined by making multiple-point thickness measurements, e.g., by ellipsometry or cross-sectioning, determining the mean thickness by averaging the various thickness measurements, and determining the root mean square (rms) variability. To enable comparisons over a given surface area, the results can be expressed as percent non-uniformity, calculated by dividing the rms thickness variability by the average thickness and multiplying by 100 to express the result as a percentage. To determine conformality for films that overlie a stepped surface, one can measure "step coverage." Step coverage refers to the thickness uniformity of a conformal film that overlies a stepped substrate. A stepped surface is a surface that has two or more parallel components that are not disposed in the same horizontal plane. Step coverage is preferably determined by measuring the average thickness of the film at the bottom of the step, dividing it by the average thickness at the top of the step, and multiplying by 100 to express the result in percentage terms. The methods provided herein result in a dielectric film liner in a through-silicon via of a 3-D integrated circuit device having low thickness non-uniformity (e.g., 20% or less) and high step coverage (e.g., 80% or greater).
Thus, according to some embodiments, this application provides integrated circuit devices comprising a silicon substrate having a through-silicon via lined with a low-k dielectric material, preferably benzocyclobutene. The integrated circuit devices further comprise a conductive fill filling the via after lining with the benzocyclobutene film. Using benzocyclobutene as a dielectric film liner over the silicon substrate can provide a device with overall better mechanical and electrical properties than similar devices utilizing conventional film liners.
With continued reference to
After the semiconductor workpiece having a via is provided 10, the via is lined 20 with a low-k dielectric material, preferably a benzocyclobutene (BCB) film, as illustrated. The benzocyclobutene film can be deposited by chemical vapor deposition (CVD). The CVD process can comprise a plasma-enhanced chemical vapor deposition (PECVD), using a remotely generated plasma or a plasma generated in situ. The benzocyclobutene film is coated on the semiconductor workpiece surface and on the sidewalls of the via. After filling the via with conductive material, the conductive material in the bottom portion of the via is exposed, e.g., the semiconductor workpiece can be back-thinned, thereby forming a through-silicon via. In some embodiments, the benzocyclobutene film can help to minimize the smear of metal during the back-thinning process. In some embodiments, the through-silicon via that is formed has a width of between about 1 nm and about 5 nm and an aspect ratio greater than 3. In other embodiments, the through-silicon via that is formed has a width of between about 5 nm and about 20 nm and an aspect ratio greater than 3.
The preferred benzocyclobutene compound is divinyltetramethylsiloxanebisbenzocyclobutene. However, other organosilicon compounds or siloxanes comprising benzocyclobutene can be used. For example, one or more of the methyl groups of benzocyclobutene can be substituted with hydrogen, an ethyl or propyl group.
Using a dielectric film comprised of a low-k material such as benzocyclobutene allows for conformal liners that are thinner and have greater diffusion barrier capabilities than conventional liners such as silicon oxide liners. In some embodiments, a low-k dielectric film such as benzocyclobutene is deposited on sidewalls of the vias in addition to other layers, such as diffusion barrier layers and/or thermal stress absorption layers. In some embodiments, a low-k dielectric film such as benzocyclobutene will be the only deposited film layer between the conductive fill and the semiconductor wafer, as the benzocyclobutene film serves as an effective diffusion barrier and thermal stress absorption layer on its own.
After lining 20 the via with a benzocyclobutene film liner, conductive material is then deposited 30 into the via. The conductive material can be deposited using an electrochemical deposition process, including an electroplating or electrodeposition process. Other processes are also available for depositing conductive material, such as the ink drying method utilizing copper particles described in U.S. patent application Ser. No. 11/394,064 to Basol, filed on Mar. 29, 2006. In the ink drying method, an ink comprising conductive particles (e.g., copper) can be deposited into a via and then dried, thereby allowing conductive particles to remain in the via. One skilled in the art will appreciate that this method as well as other deposition methods may be used for depositing conductive material into the via. In some embodiments, these methods will result in the deposition of conductive material in a bottom-up fashion. Preferably, the conductive material filling the via will have little or no voids.
Examples of conductive material used for filling the via include ruthenium (Ru), copper (Cu), aluminum (Al), platinum (Pt), gold (Au) and silver (Ag). In certain embodiments, mixtures, alloys, or oxides of the foregoing materials, such as ruthenium oxide (RuO2), may be used as a conductive filler. Conductive material such as Cu are prone to diffuse through liners such as silicon oxide liners and into nearby materials, such as oxide and silicon layers. A low-k dielectric liner, preferably a benzocyclobutene liner, can effectively serve as a diffusion barrier to such conductive materials.
Even though via 113 has a large depth and/or aspect ratio, the benzocyclobutene film 121 is capable of being deposited uniformly and conformally over via 113. Therefore, using the benzocyclobutene film 121 makes it much easier to achieve a certain minimum required thickness in the bottom of the via than with conventional SiO2 lining films. The required film thickness can be in the range of between about 50 nm to about 500 nm, more typically about 100 nm to about 200 nm. As a low-k dielectric, the benzocyclobutene film 121 can also result in low levels of capacitive coupling between nearby vias.
The copper material 135 can fill the via 113 to its top, as shown in
Unlike conventional dielectric film liners, such as SiO2 liners, the benzocyclobutene film 121 provides superior copper barrier capabilities, to block diffusion of the copper material 135 into the substrate 101. In addition, it has been found that the benzocyclobutene film 121 has low leakage characteristics, which is important when copper is plated, so as to prevent current from flowing into the substrate 101. The benzocyclobutene film 121 is also flexible, which is beneficial for counteracting the thermal stress caused when the silicon in the silicon substrate 101 and the copper material 135 expand differently, due to different thermal coefficients of expansion, during processing and thermal cycling during operation of the integrated circuit.
With reference to
After back thinning the first substrate, a second substrate 201 is formed having a wiring layer 250 as shown in
Once the first substrate is stacked over the second substrate, additional substrates having through-silicon vias and other IC substrate level devices can be stacked thereover, and electrically interconnected using through-silicon vias, resulting in an 3-D IC device having three, four, five, six, seven or more substrates. In some embodiments, the IC substrate level devices can be electrically interconnected by contacting the conductive filling material of one device with the conductive filling material of a second device.
A first semiconductor workpiece is provided in an Eagle� 10 chemical vapor deposition chamber, commercially available from ASM Japan K.K. of Tokyo. A via or opening is provided in the workpiece. The via, which is subsequently formed into a through-silicon via, has a width of between 1 and 5 microns and a depth much greater, between 10 and 50 microns.
A first benzocyclobutene film is deposited on the via using a plasma enhanced chemical vapor deposition process. The deposition of the first benzocyclobutene film takes place at a temperature between about 200� C. and about 450� C. and a pressure between about 150 and about 600 Pa. The benzocyclobutene film is introduced at a mass flow rate of between about 0.1 g/min and about 0.2 g/min. The benzocyclobutene is introduced with a carrier gas comprising He, which has a flow rate between about 300 and about 800 sccm. To generate plasma, a high RF power of between about 50 and about 300 W and a high RF frequency between about 13.56 MHz and about 27.12 MHz are provided.
A benzocyclobutene film is deposited that is uniform and conformal. The benzocyclotuene film has a thickness non-uniformity of about 5% or less and a step coverage of about 80% or greater. The benzocyclobutene film has a thickness of between 50 nm and 1 micron, more preferable between 100 nm and 500 nm. The benzocyclobutene film serves as an adequate diffusion barrier and thermal stress buffer, and therefore, no other film need be deposited on the benzocyclobutene film. The benzocyclobutene film also displays beneficial leakage current properties. As shown in the graph of
Following the deposition of the benzocyclobutene film, conductive material is deposited into the via using an electrodeposition process. The back of the first semiconductor workpiece may be thinned so as to expose the conductive material in the bottom of the via and form a through-silicon via. After forming the through-silicon via with conductive material, a second semiconductor workpiece is provided. The second workpiece comprises a wiring layer, including contact pads for contacting the exposed conductive material 135 in the bottom part of vias 113 in the first semiconductor workpiece. The second semiconductor workpiece and the first semiconductor workpiece are then stacked to form a 3-D integrated circuit device. The first and second semiconductor workpieces are electrically connected by contact between the conductive material deposited in the first semiconductor workpiece and the conductive wiring layer of the second semiconductor workpiece.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope or spirit of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided that they come within the scope of the appended claims or their equivalents.
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|Citing Patent
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|Samsung Electronics Co., Ltd.
|Method of forming through silicon via of semiconductor device using low-k dielectric material
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|U.S. Classification
|International Classification
|Cooperative Classification
|European Classification
|Mar 11, 2009
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I just checked the MLS and it is not listed there yet. Are you talking about it going for sale as a Trustee's Sale or foreclosure? If that is the case, I can order a property profile to see if it has been foreclosed on. Let me know if that is what you are asking. I can have that information fairly quickly today for you. That document of the Trustee's Sale will tell where the sale will be held. It is usually on the steps of a courthouse. And, there are typically other buyers ready to purchase the property.
If you are looking for a great deal on a house, let me know. I know I can find it for you!
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text: First of all, I am spanish, so my English may not be very good. I just want opinions and other possible options for my Rb team. Gengar - Confuse Ray - Hypnosis - Mega Drain - Thunderbolt The lead. I used to go with Explosion over CR in other teams, but i recently go with this. I put whatever to sleep if i can, the confuse ray as they will more than likely switch. TBolt is the main attack, while MD is very fun to use against Rhydon / Golem, when they think they come into Explosion. I also try to use it as the sleep absorber, as i have another sleeper to go with, for example. Gengar vs Gengar in the battle start. If the other sleeps me, I go with Eggy to put something to sleep. Exeggutor - Explosion - Psychic - Sleep Powder - Stun Spore If gengar cant sleep, i sleep with this, and then Stun Spore. Explosion for Chansey and such. Starmie - Ice Beam - Recover - Thunder Wave - Thunderbolt I use ice beam because my idea was to try to freeze predicted Chansey switches. A freeze Chansey alows Starmie to paralyze anithing else. Sometimes i paralize it, to then outspeed with Rhydon, but if i want to TWave other things I then want to Explode on Chansey with Exeggutor. Chansey - Ice Beam - Softboiled - Thunder Wave - Thunderbolt Not much to explain lol. I try to come into other non paralyzed chanseys TWave, and if she stays in, try to a freeze. I want to spread a lot of paralysis with it, to allow Lax and Rhydon to sweep better. Rhydon - Body Slam - Earthquake - Rock Slide - Substitute Comes into normal attacks like Hyper Beams. I usually attack more with it, in the mid-late game, when a lot of stuff is paralyzed Snorlax - Body Slam - Earthquake - Hyper Beam - Rest My late game sweeper, when everything is paralyzed. In my team paralisis is even more important than in others, as you can see, so i want to paralyze a lot (the reason I explain IB Starmie for Chansey) Thanks^^


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Roasted Cauliflower With Onions and Fennel
Total Time
Prep 40 mins
Cook 15 mins
From the March 2007 Gourmet magazine, to which I have subscribed for more than 35 years. This combination is outstanding and the prebrowning of each vegetable is key. (Yes, it's more work, but it is worth it!) It is delicous hot and even better at room temperature.
Ingredients Nutrition
- 1 (1 1/4 lb) cauliflower, cored, cut into 1-inch florets
- 6 tablespoons olive oil, divided
- 2 (1/2 lb) onion, halved lengthwise, cut into 3/4-inch-wide wedges with some core still attached, peeled
- 2 fresh fennel bulbs, halved lengthwise, cut lengthwise into 1/2-inch-wide wedges with some core still attached (about 1 pound total)
- 8 small garlic cloves, unpeeled
- 15 sprigs fresh marjoram
- Preheat the oven to 425°F Toss cauliflower and 2 T olive oil in a large bowl. Heat a heavy large skillet over medium-high heat. Add cauliflower and sauté until beginning to brown, about 5 minutes. Transfer cauliflower to rimmed baking sheet.
- Add 2 T oil to the same skillet. Add onion wedges and cook until browned on 1 side, about 3 minutes. Using spatula, carefully transfer onions to baking sheet with cauliflower, arranging wedges browned side up.
- Add last 2 T oil to same skillet. Add fennel; sauté until fennel softens slightly and starts to brown, about 5 minutes. Transfer to same baking sheet.
- Scatter garlic and marjoram over vegetables. Sprinkle with salt and pepper. Roast until vegetables are caramelized, about 25 minutes. Serve hot or at room temperature.
Most Helpful
This is a great recipe. Very simple, and the vegetables come out crunchy with a nice roasted flavor. I served it with lemon, and the acid helped bring out all the flavors. It does need a little more color, though, so next time I think I will try it with purple onion or garnish with parsley or something. Thanks for posting!
I didn't have any marjoram so I substituted rosemary, which was really good. I would absolutely make this again, since our summer farm share usually includes fennel. Next time I'll try the lemon juice too. Yum!
I made a half recipe (one onion, one fennel bulb and enough cauli for two) for us tonight. I was able to cook all in the same skillet at basically the same time (just added the fennel wedges in a couple of minutes after the other stuff). I served this at room temp and it was amazingly deliciously yummy. I took note of reviewer Slick 18 and served it with a lemon wedge which I think is essential to bring out the flavours even more.


text:
Dairy Farmers of America ends price suit for $50MThe Associated Press | July 14,2014MONTPELIER - The cooperative Dairy Farmers of America has agreed to pay a total of $50 million to thousands of Northeast dairy farmers to settle antitrust allegations.
A class-action lawsuit filed in 2009 charged Dallas-based Dean Foods, DFA, and the cooperative's marketing arm, Dairy Marketing Services, with working together to monopolize the market for raw milk in the Northeast, driving down prices paid to dairy farmers.
DFA does not admit any wrongdoing under the terms of the settlement. It says the legal costs have become too great.
The settlement agreement is preliminary and must be approved by a judge.
Dairy processor Dean Foods Co. agreed to a settlement of $30 million in 2011.MORE IN This Just In
Police say a too-quick reaction to a GPS system's directions sent a Toyota Corolla... Full Story To our readers: This morning we had an issue that has prevented timely delivery of... Full Story
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Christopher Matthew Kanton
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Dec. 1, 1981
Pierce County
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Aug. 6, 2005
Riverside County
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Chris was born in Puyallup, Wash., and moved with his family to Paso Robles, California when he was nine years old. While in high school Chris started as a paid call firefighter at Station 33 at Heritage Ranch in Paso Robles. After graduating from high school in 2000, Chris attended and graduated from Allan Hancock Fire Academy in Santa Maria and subsequently completed three years as a seasonal firefighter in Riverside County, Calif. He completed HAZMAT training and served on the HAZMAT team at Station 81 in Palm Springs and other locations as a full time firefighter. Recently, Chris was transferred to Station 88 in Moreno Valley where he served as a firefighter II. Chris' love and passion for firefighting is exemplified by the numerous certifications he achieved throughout his career.
Chris had an interest in photography and served as the yearbook photographer and editor in high school. His greatest love however, was extreme sports. Chris was an avid waterboard, snowboard, and motorcycle enthusiast. When he was not on duty with CDF he worked for the ski patrol at Big Bear and rode his dirt bikes in the summer. Chris learned to play hockey (he was a goalie) before arriving in California and played in several leagues including the high school league in Paso Robles. For the past four years he played hockey in the Firefighter Olympics for both L.A. and Riverside Counties.
Firefighter Canton is survived by his wife, Kathryn. They were newlyweds who were married on February 6, 2005 in Las Vegas, Nevada.
Chris is also survived his parents, Paul and Mary Kanton of Paso Robles; sister, Heather Alspach and husband, Michael, and their son Blake of Paso Robles; Grandmother Betty Sharber of Paso Robles; Uncle Pete Kanton, and wife Carol and their daughter Ashley of Scottsdale, Ariz; Uncle Robert Sharber and wife Linda, and their son Jason and daughter Jana of Eugene, Ore; Great Aunt Bessie Georgouses of Santa Cruz, Calif. From Mission Viejo: Linda Motts mother-in-law; Tim Motts, Father-in-law; Janelle Thompson, sister-in-law and husband Casey; Michael, Jeff and Tim Motts, brothers-in-laws.
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Skip to comments.Pit bulls fatally maul jogger, remain on the loose; warning issued
Posted on 05/09/2013 8:30:01 PM PDT by Arthurio
An Antelope Valley woman jogging in Littlerock was mauled to death Thursday by a pack of pit bulls, officials said.
The dogs remained on the loose Thursday afternoon. L.A. County Sheriff's Department deputies were warning people to stay away from the area, department spokesman Steve Whitmore said.
(Excerpt) Read more at latimes.com ...
Dreadful. RIP.
absolutely horrible. I hope the dogs are found and destroyed.
Los Angeles is on lock down. Marines are taking to the streets, The Torrance police department just shot 78 bullets at a couple innocent Pekingese. Culver City PD just rammed their patrol cruiser into an ASPCA van. KABC-7 news has just learned of the wanted pit bulls' manifesto on Facebark, taunting the Los Angeles humane society. Investigators in San Bernardino have reportedly found a dog collar matching the description of the wanted dogs in Big Bear.
Stay tuned to the KABC-7 Action News Channel for more details as they develop.
But to carry for protection in L.A. County, OH HELL NO!!
is there a point where jogging becomes RUNNING just wonderin
Law abiding citizens don't need guns. They might end up shooting someone who intends to do them harm. We can't have that.
The name of the woman was not immediately released, but ABC7 reported she was 63 years old.
Sheriff's Lt. John Corina told the station that a witness saw four or five dogs attacking the woman this morning and honked to try and scare them away. Instead they tried to attack the witness car—specifically trying to puncture the car's tires.
The first deputy on scene fired a shot at the dog from about 30 feet away, and the dog ran off into the desert.
Los Angeles County Supervisor Michael Antonovich ordered county personnel to continue air and ground searches for the pit bulls and offered a $25,000 reward for information leading to their capture. The money will not come from public funds, Antonovich spokesman Tony Bell said.
There's always some who jump all over the cops when they shoot a dog, and not to excuse bad behavior, but if I were confronted by a viscous dog I would have no qualms whatsoever about putting a bullet through it's brain. I like dogs, but dogs aren't people and as we see here again, they can kill.
...and missed. I'm shocked, shocked I tell you!
Well, at least you only tried to redirect the attention of this thread from the death of a human being into how stupid a person has to be to actually believe that a pit bull could attack a person (e.g., the pit bulls could NOT be pit bulls, they must be chihuahuas or parrots). Usually, pictures of children being licked by a pit bull are the distortion of the day - those pictures always make me think of family photos taken days right before the dog attacks and kills a family member.
" Each year from a third to 45% of the total U.S. pit bull population enters an animal shelter, a phenomenon never seen with any other dog breed. " http://www.animalpeoplenews.org/anp/2011/11/19/editorial-the-shelter-killing-of-pit-bulls/
Yeah it's probably just animal shelters misidentifying bears, parrots, cats etc. as pit bulls. Just a big conspiracy where humans frame pit bulls. Yup.
That was a vicious dog. If someone knocked on the front door, the dog charged the closed door crashing against the door. They would put the dog in a big cage in their bedroom if a visitor was there.
My friends were very upset the dog bit me but my knee wasn't bad. I think the dog, after hearing the yell, didn't do the damage he could have done on my leg. I don't have big legs and he could have encircled my whole knee and ripped it off. I felt very lucky.
The next day, a florist was at my house with flowers and a note that said, "I am very sorry I bit you." Later, when the wife called to find out how I was, I told her I had been to the doctor and it was really bad and the doctor said the only thing that would cure it would be to go to Acapulco with a handsome man. She started laughing and so did I. I never went to their house again until I called first for them to put up the dog.
But they are such nice dogs........./s/
Yup, and don't worry, the police will be there in no time to help ya out too!!
Chet 99 ping...
you can hate jerkwad cops who unnecessarily shoot a dog, just as much as you can hate a dog attacking you or a loved one. there is room to hate both. personally i loathe the cop more because people are generally responsible for bad dogs, it isn't all their fault.
Nice story. I have dated lots of women who own (some) pretty nasty dogs. Ever heard of the saying "must love dogs"? It applies to guys who want to get to 1st base even and I've had my bite stories. After one that got me to the hospital (she paid for the costs), I broke up with her.
Sorry but any resemblance between a Pit bull and my pointers is lost in hundreds of years of canine breeding programs.
Pit bulls are bred to bite and can exert thousands of pounds if pressure in their jaws......My pointers are bred to bring a bird to hand without ruffling a feather.....My pointers were bred to be a trusted member of the family even near the smallest of the clan.... but bulls around tots???? Might as well hand them a loaded and cocked pistol as leave them with a pit.......
"I have dated lots of women who own (some) pretty nasty dogs."
My little 5 lb. Yorkie loves everyone. I would not have a mean dog or one who wouldn't be sweet.
You cannot out run a dog. Period. Head to the nearest tree and climb. Dog can't do this.
Had a rather small mixed breed and when I drove out from the farm it could pace me at about 40MPH before it got tired and stopped. About 1/8 of a mile. It was just having doggy fun.
On foot no way I could win. Find something and get up off the ground as fast as possible. If it's a pack do your best to run faster. Even getting on the top of a car gives you the advantage because they have no traction and slip off. Get off the ground.
When I said mixed breed no pit bull. Just a nice mutt.
"Pit bulls are bred to bite and can exert thousands of pounds if pressure in their jaws....."
"Domestic dogs: 320 LBS of pressure on avg. A German Shepherd Dog, American Pit Bull Terrier (APBT), and Rottweiler were tested using a bite sleeve equipped with a specialized computer instrument. The APBT had the least amount of pressure of the 3 dogs tested."
You must have been thinking of Nanzi Pelousy.
My American bulldog was trained to fight bulls in England, as well as serve as a guard dog, and some were used to herd livestock. The two different varieties—`Scott' and `Johnson' have different characteristics: my Scott is lean and agile, probably close to what he was in Albion, about the times the Romans required that if they were restrained by a `stout rope or chain.'
But the damned bull lobby ... So they started breeding them with pugs and turned them into the docile sluggards we see today.
In the meantime Americans continued to use them for herding livestock and for protection from varmints—animal and human.
Dogs are territorial. Feral dogs have reverted to wolves, have broken their ancient compact with us and should, as a general rule, be shot on sight.
One reason there are so many `pitbull' bites (the American pitbull terrier?) is that—there are so many of them, just as Rottweilers, Dobermans, etc. have ebbed and waned in popularity over the years. Another big reason, the owners who have no business owning a dog of any breed. The breed with the largest, overwhelming population in animal shelters? Bulldogs.
A `bullydog' requires a strong—and kind—owner. I could never own a `yapster' hairball after coming to know this breed. All my neighbors understand my tall picket fence, reinforced with 18 gauge wire, and why my three gates are marked "Dogs on Premises" and are locked.
My wife is disabled and home alone a lot when I'm working. Anyone asking another to "Hold muh beer so I kin climb this fence ... " is a trespasser and will be re-climbing the fence a lot faster.
But all that's neither here nor there, those stupid facts, since we all know about 'evil pitbulls', the conventional wisdom, that their jaw strength is actually measured in gigabites, et cetera and so on. Bed time.
I sometimes watch "Pitbulls and Parolees" - the original Villalobos center - I remember them saying Antelope Valley was a disaster area as far as maltreated pits and dogfights went. Just a very bad place to be a dog.
the Romans required that if they were restrained by a `stout rope or chain.
the Romans required that if they were walked on the street or in public that they were restrained ...
>> The APBT had the least amount of pressure of the 3 dogs tested.
So does that make the GSD more dangerous? No. Intelligence, obedience, and loyalty make the difference.
One reason there are so many `pitbull bites (the American pitbull terrier?) is thatthere are so many of them
No. The stats show that pit bulls are disproportionately represented by mauling/maiming/killing etc. compared with their presence in the population.
In the 8-year period from 2005 to 2012, pit bulls killed 151 Americans and accounted for 60% of the total recorded deaths (251).
A viscous dog. Is that anything like a jellyfish?
Poor Chet..
he was right
Amen brother.
I wouldn't restrict that to pit bulls.
About the only large dogs I'd trust around a child, and NOT unsupervised, are Labs, Border Collies, some Hounds.
Indeed he was.
Carry a 25-lb bag of Milk-Bones, throw 'em at the dogs and run for a scalable tree. The LEOs will be there within the hour, so don't worry about it.
If she didn't live in the worker's paradise of Kalifornia she could have employed the Perry Defense.
Its not the dogs, its irresponsible owners. No one should ever let their dogs roam outside without being supervised.
Pit Bulls can be sweet and loving dogs but they do need supervision. Some people simply can't be trusted to be responsible dog owners.
Domestic dogs: 320 LBS of pressure on avg. A German Shepherd Dog, American Pit Bull Terrier (APBT), and Rottweiler were tested using a bite sleeve equipped with a specialized computer instrument. The APBT had the least amount of pressure of the 3 dogs tested.
Too much is made of "experts" measuring animal bites. First, they can't even get the fundamental facts of physics right. Pounds is a measure of force. Pressure is a measure of force over an area such as pounds per square inch. So your 320 pounds of pressure is gibberish. The Doctor who ran the experiments in the referenced website couldn't keep to consistent units and frequently mixed force with pressure. It pains me to frequently hear this confusion by the experts on the so called science shows.
The measure of pressure in his experiments is really a measure of the force per area on the bite sleeve. An example of how misleading this can be imagine a pit bull (which have very wide jaws) measures at 100 psi while a Doberman with a narrow jaw measures at 300 psi. Well the pit's jaw may be clamping down on three times the area of that of the Doberman. So they both have the same bite force! The other misleading thing about measuring bite sleeve forces is the pressure the meter reads against the resisting arm is distributed over entire bite area. Whereas, the actual pressure a victim feels is the force applied over the small area of the tips of the teeth which is a far greater pressure.
Sorry tumblindice...
My general reference wasn't meant to include APBT which are few and far between in this neck of the woods.....the single one I've known lived across the street and his owner used him for Boar hunting with the appropriate body armor against tusk slashes.....A nice puppy but once the dog reached full size it was no longer allowed anywhere but the back yard or it's dog run...."you just never know..." was my neighbor's comment.....
Stafford Pit Bull Terriers are predominate in this neck of the woods.....just go to any SPCA or city Animal shelter and you'll see that they predominate the breeds there by a large %......never saw one that wasn't vicious if left to it's own devices.....
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