text:
|Publication number
|Publication type
|Application number
|Publication date
|Aug 12, 1997
|Filing date
|Jun 23, 1995
|Priority date
|May 6, 1994
|Fee status
|Also published as
|Publication number
|Cuong Van Pham, Brian J. Hayden, Bethany J. Walles
|Original Assignee
|Ford Motor Company
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (12), Referenced by (37), Classifications (33), Legal Events (6)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a continuation-in-part of application No. 08/239,106, filed May 6, 1994, now U.S. Pat. No. 5,427,301.
This invention relates to an improved apparatus and method for bonding flip chip devices onto a substrate, such as a circuit board. More specifically, the invention is a semi-automatic system which enables high alignment and bonding accuracy of flipped chips to a substrate.
Flip chip bonding has emerged as one of the fastest growing technologies in packaging electronic components. Such technologies have developed in response to the demand for circuits which may operate at high speeds in high packing densities. Acceptable performance criteria may only be realized by appropriate selection of the substrate, interconnect mechanisms, flip chip design, and the bonding media (manufacturing reliable multi-chip modules).
Several methods may be used to attach a flip chip or die to a substrate. Solder is often used for silicon, aluminum nitride, alumina, or flexible substrates. Gold-to-gold thermocompression or ultrasonic bonding are mainly used for high power small devices. Standard conductive epoxy may also be used for flip chip bonding.
Among the issues which need to be considered when designing automated flip chip bonding mechanisms are placement accuracy, the types of flip chips and substrates, flip chip pickup and placement, substrate pickup and placement, throughput, and price.
Illustrative of previous approaches is U.S. Pat. No. 3,938,722 which discloses an apparatus for bonding flip chip devices onto mating conductive surfaces on a substrate utilizing ultrasonic energy. The bonding tool has a spherically shaped bonding surface which is caused by a pivoting mechanism to bond in a complex wobbling motion. Such approaches, however, may lead to relative lateral motion between the flip chip and the substrate which may jeopardize alignment.
U.S. Pat. No. 4,842,662 discloses a bonding approach wherein no gold globules or bumps are used in advance of the flip chip connection process. Such gold bumps are typically placed on the terminal pad of the flip chip and on the underside of the wire to be connected to the flip chip. The '662 disclosure, however, relates to single point bonding processes adapted for use with tape-automated-bonding (TAB) tape.
U.S. Pat. No. 5,341,979 discloses a thermosonic process for securing a semiconductor die to bonding pads on a substrate using multiple gold bumps. In such a process, heat is applied while ultrasonic energy is coupled to move the die in the horizontal, rather than vertical, plane. In contrast to this prior art, the process utilized in the present invention operates at room temperature, and the ultrasonic energy is delivered substantially isothermally in the form of vertical oscillations.
The present invention discloses a process and apparatus for bonding a flip chip to a substrate. The process includes the following steps:
1. positioning the flip chip, coupled to an ultrasonic horn, above the substrate, the flip chip having an active face provided with conductive bumps, so that the active face is oriented toward the substrate;
2. lowering the ultrasonic horn for placing the flip chip on the substrate so that the bumps align with a bonding pattern on the substrate;
3. applying through the ultrasonic horn a force to the back side of the flip chip, the force being normal to the substrate so that minimal lateral displacement of the flip chip and the substrate results; and
4. applying a vibration dampening force to areas of the substrate adjacent to the flip chip for reducing the transmission of ultrasonic energy through the substrate;
5. activating the ultrasonic horn while the force is applied so that the ultrasonic energy in the form of oscillations is isothermally transferred across the flip chip to the substrate and a diffusion bond is created therebetween.
The invention also includes the manufacturing apparatus by which to practice the above-noted process.
FIGS. 1 is a flow chart of the main process steps of the present invention;
FIGS. 2-14 are side elevational views and depict various process steps and apparatus configurations used in bonding a flip chip to a substrate according to the teachings of the present invention;
FIGS. 12a and b are side sectional views showing the positioning of the ultrasonic horn, the vibration damper arm and the substrate. FIG. 12c is a top view of the die and the corresponding aperture within the vibration damper arm.
FIGS. 15 and 16 are graphs showing the time sequencing of the bias force and ultrasonic energy as they are applied to the flip chip.
The process and method of the present invention represent a system for multi-chip bonding to substrates. The apparatus disclosed can be operated as an accurate pickup and placement mechanism for registering the flip chips in relation to the bonding pattern defined on a substrate.
By way of overall orientation, the apparatus and process of the present invention is used to produce high density packaging applications which require high alignment and bonding accuracy of flipped chips or dies to substrates. The apparatus includes one pickup head and one bonding head. The first head picks up the flip chip from a waffle pack, or sawn wafer on frame, or tape and reel, and places it on an orientor. The second head picks up the die from the orientor and brings it over the substrate. Machine vision is used for final alignment when the die is over the substrate. A vibration damper arm isolates the ultrasonic energy from passing through the substrate and into adjacent dies or components.
As used herein, the term "ultrasonic bonding" includes a solid-state process in which the flip chip is bonded to the substrate by locally applying high-frequency vibratory energy thereto while the surfaces to be joined are held together under bias pressure. It is thought that the diffusion layer may be on the order of 2-3 kilo angstroms in thickness. The disclosed process can be used to bond flip chips to gold, silver, platinum, nickel, or copper metalized patterns on a substrate.
FIG. 1 of the drawings is a flow chart of the main process steps used for practicing the process of the present invention.
The flip chip is coupled through a vacuum force to the end of an ultrasonic horn and then positioned (10) above the substrate. Conventionally, the flip chip has an active face which is provided with gold globules or bumps. The active face is oriented toward the substrate. Next, the ultrasonic horn is lowered to place the flip chip on the substrate (12) so that the bumps align with a bonding pattern which is formed on the substrate. A bias force is then applied (14) through the ultrasonic horn to the back side of the flip chip so that the force is normal to the substrate. In this way, minimum lateral displacement of the flip chip in relation to the substrate results. A vibration damping medium is then placed onto the substrate adjacent the flip chip for inhibiting the transfer of vibrations and ultrasonic energy (16) from the flip chip, through the substrate and outwardly to adjacent electronic devices and other components previously mounted on the substrate. Finally, the ultrasonic horn is activated (18) while the bias force is applied so that ultrasonic energy is isothermally transferred across the flip chip to the substrate for carrying a diffusion bond therebetween.
FIGS. 2-14 depict the apparatus and process steps in more detail. FIG. 2 depicts the main components of the apparatus used to practice the process disclosed and claimed herein. In FIG. 2, a flip chip 20 is loaded onto a flip chip pickup table 24. While a flip chip is described with respect to the best mode of the invention, the process may be used with a die comprising a variety of materials, such as silicon, gallum arsenede, ceramic, metal, and glass. A substrate 22 (such as an FR4 printed wiring board, the base of a multi-chip module, glass, ceramic, or flexible PWB) is positioned upon a work holder 26. In FIG. 3, a vacuum flip chip pickup mechanism 28 is extended to pick up the flip chip 20 by use of vacuum.
FIG. 4 shows the vacuum flip chip pickup arm retracted in combination, thus elevating the flip chip 20 above the flip chip pickup table 24. In FIG. 5, a stage 38 which includes the vacuum flip chip pickup mechanism 28 and an ultrasonic horn 30 is translated so that the vacuum flip chip pickup arm 28 with the flip chip 20 is aligned with a squaring device 36.
Next, the vacuum flip chip pickup arm 28 (FIG. 6) is extended to place the flip chip 20 onto the squaring device 36. The vacuum flip chip pickup arm 28 is then retracted (FIG. 7) and the squaring device 36 is activated to orient the flip chip 20 so that it is square in relation to the substrate 22.
In FIG. 8, an appropriate distended section 30b is selected from a nest 60 and attached through a snap connector 31 to the actuator section 30a to form the ultrasonic horn 30. This coupling is more clearly shown in FIG. 12b. The snap connector 31 includes an O-ring section for sealing the internal vacuum channel 30a. The snap connector 31 must be located at a position that will not adversely interfere with the resonance and desired vertical motion of the ultrasonic bonding tool 30. Next, the stage 38 is translated so that the ultrasonic horn 30 is aligned with the squaring device 36. The distended end 32 of the ultrasonic horn 30 is then extended (FIG. 9) to pick up the flip chip 20 from the squaring device 36 using a vacuum. The distended end 32 of the stainless steel ultrasonic horn 30 does not require any special finishing (other than normal buffing and polishing), hence there is no requirement to "hold" the die 20 against horizontal displacement forces. The vacuum is delivered through a channel 30c which extends axially through the ultrasonic horn 30 to a supply of negative pressure 70. While the disclosed horn may be used for various flip chip sizes, it is advisable to have the distended end 32 of the ultrasonic horn 30 slightly smaller in size and similar in shape with respect to the die 20.
In FIG. 10, the ultrasonic horn 30 is shown as being retracted while carrying the flip chip 20 along with it. In FIG. 11, the stage 38 is translated so that the ultrasonic horn 30, together with the flip chip 20, is aligned opposite a known bonding location 48 defined upon the substrate 22.
In FIG. 12, a means for alignment, such as an optical device 34, is translated to a location between the flip chip 20 and the substrate 22. Precise alignment of the flip chip 20 in relation to the substrate 22 then commences by manual or automatic means. Although an optical means for aligning has been disclosed, other alignment means may be used, such as split prisms and infrared techniques. After proper alignment of the flip chip 20 is achieved with the fine line conductor traces on the substrate 22, the optical alignment device 34 is moved into a storage location away from the bonding location 48 on the substrate as illustrated in FIG. 12a.
As illustrated in FIG. 12A, a vibration damper arm 40 is moved into position directly above the known bonding location 48. As illustrated more clearly in FIG. 12B, the vibration damper arm 40 has attached to the underside thereof a rubber pad 42 that is deformable when vertically compressed onto the substrate 22. As illustrated in FIG. 12C, both the vibration damper arm 40 and the rubber pad 42 have defined therein an aperture 44 which is sized and shaped to be just slightly larger than the die 20 and the distended end 32 of the ultrasonic horn 30. In this manner the die 20 may be inserted through the aperture 44 without disturbing the location or alignment of the die 20 with respect to the circuit traces at the known bonding location Note that in FIG. 12B the damper arm 40 and the rubber pad 42 remain spaced above the substrate 22. The damper arm 40 is formed with a horizontally disposed aluminum plate approximately four inches square and 0.25 inches thick. The rubber pad is approximately 0.10 inches thick and is laminated to the underside of the plate. A pneumatic mechanism employing an air piston is coupled to a slide bearing which allows the damper arm 40 to be extended vertically to engage with the substrate 22. While the damper arm 40 is illustrated separately from the carrier 38 for the ultrasonic horn 30 for sake of clarity, in the preferred embodiment the damper arm is actually fixed to and moves with the carrier 38 for the ultrasonic horn 30.
FIG. 13 depicts extension of the ultrasonic horn 30 to bring the flip chip 20 into contact with the substrate 22. A predetermined initial bias force of approximately 10 pounds per square inch is then applied by the ultrasonic horn 30 to press the die 20 against the substrate 22 in known registration. In the preferred embodiment it will be assumed that the die 20 comprises a 300 mill by a 300 mill silicon die having a total of 144 gold bumps on the lower side thereof for being attached to corresponding traces in the substrate 22 which are approximately 5 mils in width and having a gap of 1 mill therebetween. The bump sizes are approximately 5 mils square.
After this initial bias force, which may be fixed or varied as a function of time, is impressed upon the die 20 to secure it in know registration against the substrate 22, the vibration damper arm 40 is lowered such that the rubber pad 42 deforms around adjacent electrical components and die, as shown more clearly in FIG. 13B, so as to press firmly against the substrate 22. Since the size of the aperture 44 within the vibration damper arm 40 and the rubber pad 42 is larger than the die 20, the proper registration between the bumps on the underneath side of the die 20 should not be disturbed with respect to the circuit conductors on the substrate 22. The rubber pad 42 is sufficiently soft such that a force of only approximately 25 pounds per square inch will deform the rubber pad 42 around adjacent die and electrical components that have been previously placed on the substrate 22. However, the rubber pad 42 is sufficiently stiff and resilient so that it will absorb or dampen a major portion of the ultrasonic energy that is conducted from the ultrasonic horn 30 and through the die 20 and into the substrate 22. In this manner, the ultrasonic energy will not be transferred to the adjacent die and electrical components which could cause delamination of the various bonds, as will be discussed in more detail subsequently.
After the damper arm 40 is secured against the substrate 22, ultrasonic energy, within a range of 30,000 to 100,000 oscillations per second (with the preferred embodiment utilizing a 60,000 Hz frequency), is applied to the backside of the flip chip 20 for a predetermined time period of up to about 10-20 seconds as illustrated in FIG. 13A. To complete the cycle (FIG. 14), the damper arm 40 and then the ultrasonic horn 30 retract, leaving the gold bumps 20b on the flip chip 20 joined to the substrate 22 by a secure diffusion bond.
X-ray photographs (not shown) of a flip chip 20 poised above a substrate 22 reveal a rectangular gray area is the backside of the substrate 22. In the aligned configuration, each dot represents a gold globule bump located on the active face of the flip chip 20. Extending away from the gold bumps is a bonding pattern which is defined by gold plated circuit traces or leads defined on the top surface of the substrate 22. Alignment or registration is enabled by the alignment device. Using the disclosed process and apparatus, all of the bumps disposed upon the flip chip are diffusion bonded simultaneously to the bonding sites defined upon the substrate.
As illustrated in FIG. 13C, the plurality of gold bumps 20b are bonded to the conductive paths 20p, typically manufactured of aluminum or copper, on the lower side of the die 20. Since the gold bumps 20b are grown on the aluminum pads 20p of the semiconductor die 20, the ultrasonic energy used to bond the flip chip also affects the gold to aluminum interface and creates gold-aluminum intermetallic formations. These intermetallic formations range from the gold rich to the aluminum rich, among them the well known purple plague (AuAl2) and the white plague (Au5 Al2) intermetallic formations. Also, Kirkendahl voids, which are delaminations of the gold to aluminum interface, may be formed at this bonding interface. During the ultrasonic bonding process, the profile of the application of the bias force and the ultrasonic energy can be controlled so that the optimum bonding can be obtained and these undesirable affects can be avoided.
However, in the case where multiple flip chips are bonded sequentially onto the same substrate, the ultrasonic energy which is undesirably coupled into adjacent flip chips bonded previously onto the substrate can alter the intermetallic formations and cause the Kirkendahl voids to occur on these previously attached components. These failure modes are of special concern when the ultrasonic energy is applied normal, rather than horizontal to, the plane of the substrate. The damper forces used in the present invention substantially eliminate these undesirable side-effects.
Since the ultrasonic energy transfers through the vertical displacement of the ultrasonic element 30, it will be absorbed in large part by the formation of the intermetallic bonds between the die 20 and the substrate 22, rather than being lost due to the planar displacement of the die and the slippage between the die and the ultrasonic element that would take place if the ultrasonic motion would be in the horizontal plane. As a result, a relatively smaller amount of ultrasonic energy is required to complete the bonding when the motion is normal to the substrate 22. As used herein, the term normal to the substrate 22 should also imply that the ultrasonic motion will be normal to the horizontal plane of the die 20, since in typical operations the plane of the die 20 is parallel to the plane of the substrate 22.
The vertical ultrasonic bonding motion greatly reduces chip displacement found when the ultrasonic motion displaces the chip in the horizontal plane. Therefore, more accurate placement of the die 20 will allow the use of smaller fine-line geometries between the die 20 and the substrate 22 than is possible for processes using horizontal displacement.
Furthermore, since the ultrasonic motion is in a plane normal to the substrate 22, the distended end 32 of the ultrasonic tool 30 does not have to be custom designed to engage and hold the die 20 as is necessary for horizontal displacement processes. Therefore, the entire range of die sizes, that is from approximately 100 to 500 mils, can be covered using only approximately three ultrasonic elements that are pre-tuned and quickly interchangeable. This compares with the expense and time required to tune the natural frequency of the ultrasonic tools used in horizontal displacement systems which must take into account the mass of the horn and the attached die.
In practice, when the ultrasonic horn 30 is activated, microscopic surface contaminants and oxides are dispelled from the flip chip and the substrate, thereby producing an atomically clean surface for bonding.
As illustrated in FIG. 15, when the bias force 80 is applied to the flip chip 20, it is applied in stages. First, an initial bias force 80a of, for example, 5-10 pounds is applied (shown as the first plateau in the dashed line), followed by a second force 80b of up to 15-25 pounds. These forces are generated by electromagnetic transducers that can be transitioned (slewing) between the two pressures with a preferred ramping wave-form. As illustrated in FIG. 15, the initial period of ultrasonic energy 90a is applied for only approximately 3 seconds, which is about the first one-third of the approximately 10 second bonding period. This initial period of lower energy bonding 90a produces a "tacking bond" or "mechanical bond" that is sufficient to assist in holding the die 20 firmly in place with proper registration to the substrate 22 during the final or higher power bonding process 90b. After the higher pressure static force 80b is exerted upon the die 20 by the ultrasonic horn 30, the increased ultrasonic energy 90b is transferred to complete the full diffusion bonding process (also known as a "cold weld"). This higher energy bonding is required in order to permanently bond the die 20 onto the substrate 22. Of course, these bonding profiles will change depending on the die size, the number of bumps, and the materials used in the bumps.
This unique sequential profile of multiple force and energy levels, beginning at low values and moving to higher values, creates a significantly more reliable bond, as well as reducing misalignment between the die and the substrate. If the full ultrasonic energy 90b were to be applied at the beginning of the process, the die would vibrate and thereby cause potential misalignment and damage to the bumps on the die or the substrate circuit traces. This failure mode is entirely eliminated by the profile illustrated in FIG. 15 which sequentially increases the clamping force and ultrasonic energy. Furthermore, this pressure and energy profile avoids many of the over-bonded and under-bonded failure modes observed in horizontal displacement bonding processes.
An alternative multi-level force and energy profile is illustrated in FIG. 16. According to this profile, the static compression force from the ultrasonic horn 30 ramps up sharply 80c until the initial lower level ultrasonic energy 90c is applied, and then the rate of increase of the static force is reduced 80d, although it still is increasing. After an initial "tacking period", the level of ultrasonic energy is increased rapidly 90d to a higher final bonding level 90e. The bias pressure of the ultrasonic horn 30 against the die 20 need not be increased further after it reaches plateau 80c, during which the higher level of ultrasonic bonding energy is transferred. It should be apparent to one skilled in the art that various multi-level bonding profiles may be utilized depending upon the size and shape of the die, the number of bumps, etc.
As illustrated in FIG. 13D, the ultrasonic forces induced by the ultrasonic horn plastically deform the gold bumps adjacent a region of contact between the flip chip and the substrate so that an intimate contact therebetween results and an intermetallic atomic bond is formed by isothermal ultrasonic energy. In practice, if there are three bumps per flip chip, a 1-2 pound force should suffice. If there are 250 bumps, for example, a force of 25-30 pounds should suffice if applied for a period of up to about 10-20 seconds, with 10 seconds being used in the best mode of the present invention.
With continuing reference to FIG. 13D and to FIG. 13C, the precise control of the pressure and ultrasonic energy profiles are helpful in controlling and eliminating any delamination that can occur in the intermetallic bonds that are used to construct the pads 22p on the substrate 22. The typical gold pad 22p includes a base layer of copper (approximately 1-2 mils), onto which an intermediate layer of nickel is plated (approximately 100-200 micrometers), followed by the final layer of soft gold (approximately 30-50 micrometers). It has been found that excessive absorption of the ultrasonic energy by this complex metallic structure, as located on die that had been bonded adjacent to the energized work area, may delaminate and fail due to the additional energy conducted by the substrate 22 and absorbed by the intermetallic interfaces. The same general failure modes are also observed in the complex intermetallic formations (Alx Auy) that hold the gold bump to the aluminum trace that traces on the die 20.
The vertical displacement process of the present invention is superior to those prior art processes requiring horizontal displacement because these prior art processes typically require the application of heat to either the die, the substrate or both. The addition of this supplemental heat energy further increases the probability of the intermetallic failures between the substrate, the gold bump and the die.
Thus, it will be apparent that the disclosed process and apparatus requires no heat, no solder, and is quick. Since no heat is required, the apparatus and process can be used for heat sensitive substrate flip chip bonding media and produces less damage to the flip chip compared to thermocompression bonding or solder reflow. Throughput is enhanced because an entire flip chip can be bonded to a substrate regardless of the number of connections. Finally, since all forces are in the vertical (Z) direction, there is no relative horizontal movement between the flip chip and the substrate.
In practice, substrates up to about 14 inches square may be accommodated within the disclosed apparatus. Flip chips as small as 0.05 inches square may be handled. Flip chips 1 inch square may also be effectively used by the disclosed process.
The disclosed invention not only improves bonding accuracy but also facilitates throughput because the pickup tool is also the bonding tool. This eliminates the need to place, retract, and engage the flip chip with the horn. The disclosed apparatus is a semi-automatic system for producing high density packaging applications which require high alignment and bonding accuracy of flipped chips to the substrate.
While the present preferred embodiment has been described with reference to gold bumps 20b that are bonded to the die 20, it should be apparent that the bumps may be formed from any deformable and fusible material that will create long-lasting intermetallic with the adjacent materials. Gold is preferred because it will not oxidize and is especially workable in the diffusion bonding process as described herein. However, appropriate adjustments in the bonding profile and metal substrates can be employed to bond flexible cables to the substrate and the die or to form a cable to cable bond using essentially the same process as disclosed herein.
The ultrasonic transducer and horn of the disclosed apparatus may be manufactured in various forms. One suitable vendor is Uthe Technology of Milpitas, Calif. The disclosed ultrasonic transducer and horn is a model 506 FO, which may be driven at the 6 watt and then the 20 watt power levels in the profile shown in FIG. 15.
One type of flip chip attachment apparatus is manufactured by R D Automation of Piscataway, N.J. (Model AFC-101-AP). The machine produces alignment accuracy of better than �5 microns. Throughput levels up to 350-500 flip chips per hour are possible depending upon the process parameters. In one system (M-8 flip chip bonder), a thin optical probe is inserted between the flip chip and the substrate, imaging both bonding surfaces simultaneously. Two video cameras and reflection illuminators are used to view the flip chip and the substrate individually. Outputs of the video systems are superimposed on one screen and the alignment is achieved by moving the substrate in reference to the stationary flip chip. Final alignment is performed when the flip chip is in close proximity to its final position, after which there is no motion in the X, Y, or theta directions. The only axes upon which motion may remain is in the vertical (Z) direction.
Although the present invention has been described in conjunction with the best mode of its process and the preferred embodiment of the apparatus, one skilled in this art will understand that other equivalent implementations are intended to be covered, and not limited by, the following claims.
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|U.S. Classification
|International Classification
|Cooperative Classification
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|Oct 30, 1995
Owner name: FORD MOTOR COMPANY, MICHIGAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:VAN PHAM, CUONG;HAYDEN, BRIAN JOHN;WALLES, BETHANY JOY;REEL/FRAME:007707/0657
Effective date: 19950623
|Jun 20, 2000
Owner name: VISTEON GLOBAL TECHNOLOGIES, INC., MICHIGAN
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FORD MOTOR COMPANY;REEL/FRAME:010968/0220
Effective date: 20000615
|Jan 3, 2001
|Fee payment
Year of fee payment: 4
|Mar 2, 2005
|Maintenance fee reminder mailed
|Aug 12, 2005
|Lapse for failure to pay maintenance fees
|Oct 11, 2005
|Expired due to failure to pay maintenance fee
Effective date: 20050812


text:
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There's very much a strength of conviction in remaining what you were, but arguably more so in becoming what you want to be.
The BBC drama starring Aidan Turner returns to BBC One on September 4th.
Guns N' Roses were detained at the Canadian border last week for gun possession but they're adamant the weapon didn't belong to them.

subset: commoncrawl


text:
Per poter visualizzare i contenuti del sito è neccessario installare il Flash cliccando qui e attivare il Javascript.
Le Terrazze Residence in Trieste
A prestigious residence in the heart of splendid Trieste, composed of apartments and suites in a refined context of quality and discretion.
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text:
User talk:Circumspect
Hello, Circumspect, and welcome to Wikipedia! Thank you for your contributions. I hope you like the place and decide to stay. Here are a few good links for newcomers:
- The five pillars of Wikipedia
- How to edit a page
- Help pages
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I hope you enjoy editing here and being a Wikipedian! By the way, please be sure to sign your name on talk pages using four tildes (~~~~) to produce your name and the current date, or three tildes (~~~) for just your name. If you have any questions, you can post to the help desk or ask me on my talk page. Again, welcome!--Pharos 02:42, 8 September 2005 (UTC)
Alben Truitt[edit]
Do you have a source for the statement (which you added to List of Cuba-US aircraft hijackings)that Alben Truitt was/is Alben Barkley's grandson? That's potentially defamatory, so if Wikipedia says it, it is important that there be a source cited in the article.--orlady 14:44, 8 February 2007 (UTC)
Yep, the source is http://openweb.tvnews.vanderbilt.edu/1969-2/1969-02-10-CBS-7.html. Circumspect 22:59, 8 February 2007 (UTC)
I was living in the 1960's, and I recall contemporary news accounts, stating that Barkley's grandson had hijacked an airplane to Cuba. It was well reported at the time. John Paul Parks (talk) 12:11, 9 March 2008 (UTC)
Next German Federal Election[edit]
Here you've got some more German polls:
http://wikiumfragen.wikia.com/wiki/Wikiumfragen_Wiki — Preceding unsigned comment added by 188.8.131.52 (talk) 15:15, 29 November 2011 (UTC)
ArbCom elections are now open![edit]
You appear to be eligible to vote in the current Arbitration Committee election. The Arbitration Committee is the panel of editors responsible for conducting the Wikipedia arbitration process. It has the authority to enact binding solutions for disputes between editors, primarily related to serious behavioural issues that the community has been unable to resolve. This includes the ability to impose site bans, topic bans, editing restrictions, and other measures needed to maintain our editing environment. The arbitration policy describes the Committee's roles and responsibilities in greater detail. If you wish to participate, you are welcome to review the candidates' statements and submit your choices on the voting page. For the Election committee, MediaWiki message delivery (talk) 13:03, 23 November 2015 (UTC)


text:
EPUB is a free and open e-book standard designed for reflowable content. Popular e-Reader devices such as the Nook and Sony Reader support the EPUB format.
Beginning in September 2011, Linux Journal began offering an EPUB edition. All paid Linux Journal subscribers receive access to download their monthly issue in .epub format as a part of their regular subscription.
EPUB Edition FAQ
Q. How do I sideload Linux Journal for reading on my NOOK?
A. You can sideload the Linux Journal EPUB files on to the NOOK and read them using the following steps:
- Connect your NOOK to your computer using a USB cable
- Copy the EPUB file from its location on your computer to the My Documents folder in the NOOK window
- On your NOOK, tap My Library, Go to My Documents, and then Check for New Content to refresh your NOOK's My Documents folder.
- Tap My Library on the touchscreen
- Tap Go to My Documents
- Browse to your book and then tap Read
Another easy way to manage EPUBs on your NOOK is to use the open source free eReader management software for your PC called Calibre which will allow you to transfer EPUBs to and from your NOOK.
Q. How do I sideload Linux Journal for reading on the NOOK app for Android?
A. You can sideload the Linux Journal EPUB files into the NOOK app and read them using the following steps:
- Connect (Mount) your phone to your PC or Mac to access the folder structure
- Open the NOOK Folder
- Open the My Documents Folder
- Drag any ePub files into the folder
- Disconnect your phone from PC or Mac
- Open NOOK for Android app
- In the library, filter by "My Files"
- You should be then able to open and read any of your files. If you cannot see your files, perform a sync.
Q. How do I read Linux Journal epubs on my iPad?
A. Browse to www.linuxjournal/digital and login to your account from the web browser on the iPad, then click on the epub you'd like to download. Once it downloads, there is a screen that says "Open in..." (for opening in Stanza or any other reader software) and "Open in "iBooks"" (for opening it in iBooks).
To open Linux Journal epubs purchased in the online store, we recommend using DropBox to sync up your eBooks books across devices, and download them to the iPad that way. Once you download each epub file in Dropbox, you will see an arrow in the top right corner to open it in another app, and you can choose iBooks, Stanza, or whatever you prefer.
You may also download your epubs directly from your subscription or Linux Journal store notification emails. Just click the download link while on your iPad, and open the file in the reading app of your choice.
Q. How do I sideload Linux Journal for reading on the Sony Reader?
A. You can sideload the Linux Journal EPUB files on to the Sony Reader and read them using the following steps:
- Open the Reader Library software and connect your Reader to your PC or Mac with a USB cable
- Sign in to your Reader Store account
- Within the Reader Library, locate the purchased EPUB file on your hard drive
- Drag your eBook from your Library to the Reader icon located in the left navigation area of the Reader Library software
- Click on the Reader icon to verify that your new book has successfully transferred to your device
- Once confirmed, you can now disconnect the USB cable and read your book on your Reader
Another easy way to manage EPUBs on your Sony Reader is to use the open source free eReader management software for your PC called Calibre which will allow you to transfer EPUBs to and from your Sony Reader.
Q. Can I read EPUB files on my desktop computer?
A. Yes. For Linux, Mac OS X, and Windows systems, we like to use the free and open source Calibre to read EPUBs. For other platforms please visit Wikipedia's list of EPUB software reading systems. However if you're reading Linux Journal on your desktop and not a mobile device, we recommend downloading our PDF or Enhanced Online Digital edition instead (paid subscribers have access to both).
Q. Do I need to be subscribed to the Enhanced Online Digital edition to get access to the EPUB?
A. No. All paid subscribers receive access to all digital formats.
Q. Is the Linux Journal EPUB file "protected" by DRM?
A. No.
Q. Are back issues of Linux Journal available as EPUBs?
A. The EPUB file format of the magazine is only available for the September 2011 issue on forward.
Q. I'm a subscriber. Where do I download the .epub files?
A. You can download all available .epub files on our Digital Download page (you'll need to login).
Q. Can I buy single issues of Linux Journal in the EPUB format?
A. Linux Journal is available in Barnes & Noble's Nook Bookstore online.
Q. Can I see a sample of the EPUB edition of the magazine before buying?
A. Yes. We invite you to sample our September 2011 issue free of charge.
Q. I have an EPUB-related question not answered here. Can you help me?
A. Yes! Please e-mail us your question and we'll do our best to get you an answer. If it's a commonly asked question, we'll also post it here.
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Practical Task Scheduling Deployment
July 20, 2016 12:00 pm CDT
One of the best things about the UNIX environment (aside from being stable and efficient) is the vast array of software tools available to help you do your job. Traditionally, a UNIX tool does only one thing, but does that one thing very well. For example, grep is very easy to use and can search vast amounts of data quickly. The find tool can find a particular file or files based on all kinds of criteria. It's pretty easy to string these tools together to build even more powerful tools, such as a tool that finds all of the .log files in the /home directory and searches each one for a particular entry. This erector-set mentality allows UNIX system administrators to seem to always have the right tool for the job.
Cron traditionally has been considered another such a tool for job scheduling, but is it enough? This webinar considers that very question. The first part builds on a previous Geek Guide, Beyond Cron, and briefly describes how to know when it might be time to consider upgrading your job scheduling infrastructure. The second part presents an actual planning and implementation framework.
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Geek Guides
With all the industry talk about the benefits of Linux on Power and all the performance advantages offered by its open architecture, you may be considering a move in that direction. If you are thinking about analytics, big data and cloud computing, you would be right to evaluate Power. The idea of using commodity x86 hardware and replacing it every three years is an outdated cost model. It doesn't consider the total cost of ownership, and it doesn't consider the advantage of real processing power, high-availability and multithreading like a demon.
This ebook takes a look at some of the practical applications of the Linux on Power platform and ways you might bring all the performance power of this open architecture to bear for your organization. There are no smoke and mirrors here—just hard, cold, empirical evidence provided by independent sources. I also consider some innovative ways Linux on Power will be used in the future.Get the Guide


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text:
(July 24, 2013) -- The U.S. Small Business Administration has awarded the South-West Texas Border Small Business Development Center (SBDC) Network, headquartered at The University of Texas at San Antonio (UTSA), a five-year, $1.5 million contract to host the Small Business Development Center National Information Clearinghouse (SBDCNet), which services the United States and its territories.
It is the first time in the history of SBDCNet that an institution has hosted the program for four consecutive terms.
"The SBDCNet is a service that our clients say 'places big business tools into the hands of small businesses,'" said SBDCNet Director Deborah Schueneman. "The information that we provide to SBDC clients nationwide is information and data not normally available to them without a tremendous investment of time and money. Each request for information is customized to a client's particular industry, geography, financial and market trends."
SBDCNet is dedicated to meeting the needs of the 1,100 small business development centers (SBDC) across the United States by providing timely, relevant, Web-based information and training services to SBDC advisors and their clients. Using Web-based subscription services and other databases available through the UTSA Libraries, SBDCNet researchers can collect data on industry trends, geography and demography, customer profiles, competitive company details, regulations, intellectual property, location suitability and more. From any address, a ring study analysis can plot suppliers, competitors and consumer trends up to a 90-mile radius.
The current financial crisis has created complicated economic conditions for small business. Lenders often view small businesses and start-ups as risky investments and may be reluctant to provide business loans. With business plans supported by solid research, entrepreneurs are better prepared to approach lenders for startup or venture capital. While demographic and consumer research can be cost prohibitive, SBDCNet can provide these helpful tools at little or no charge.
"UTSA's vision for Tier One continues to focus on research, academic excellence and an international reach," said Albert Salgado, director of the South-West Texas Border SBDC. "UTSA's Institute for Economic Development and its programs such as the SBDC National Information Clearinghouse will further help fulfill its vision to become a viable player in the global market, strengthening the economy of San Antonio, the state of Texas and this great nation. Together we will drive growth, jobs and futures for small businesses."
Since its inception in 1998, the SBDCNet has responded to more than 65,000 requests and serves as the research arm for the SBDC network. During fiscal year 2012, SBDCNet completed 5,940 research requests, each consisting of five reports totaling nearly 30,000 individual research requests.
For more information about the SBDCNet, contact Deborah Schueneman at 210-458-2465.
About the IED
The UTSA Institute for Economic Development is dedicated to creating jobs, growing businesses and fostering economic development. Its 12 centers and programs provide professional business advising, technical training, research and strategic planning for entrepreneurs, business owners and community leaders. Programs serve San Antonio and the Texas-Mexico border area as well as regional, national and international stakeholders. Together with federal, state and local governments, and private businesses, the UTSA Institute for Economic Development fosters economic and community development in support of UTSA's community engagement mission.
About UTSA
The University of Texas at San Antonio is an emerging Tier One research institution specializing in health, energy, security, sustainability, and human and social development. With nearly 31,000 students, it is the largest university in the San Antonio metropolitan region. UTSA advances knowledge through research and discovery, teaching and learning, community engagement and public service. The university embraces multicultural traditions and serves as a center for intellectual and creative resources as well as a catalyst for socioeconomic development and the commercialization of intellectual property -- for Texas, the nation and the world.
The UTSA Interactive Technology Experience Center camps are for curious youth who are interested in STEM and related topics. This week, campers will study environmental science, robotics and computer science.
UTSA Main Campus
In four sessions of this weeklong day camp for 9 to 13-year-olds, campers will participate in indoor and outdoor activities while exploring ancient technologies from around the world and the new technologies archaeologists are using to discover them.
UTSA Center for Archaeological Research, Main Campus
Campers will investigate how museums use artifacts, oral histories, and research to unravel stories about our past.
UTSA Institute of Texan Cultures
UTSA Math faculty prepare participants for success in their future math courses.
UTSA Main Campus
An opening reception is being held for the exhibit "Girl's Eye View" which was produced by students who documented life on San Antonio's East Side with photography, poetry and film.
UTSA Institute of Texan Cultures
Experience a very different summer camp! The UTSA East Asia Institute is teaching kids Japanese through language, culture, art, crafts, music, cooking and more. For kids age 6-12. For more details, email email@example.com.
Main Building (MB 1.126), Main Campus
7 to 12 year-olds will explore Mayan Culture in a three-day sessions, concluding at the Witte museum, where campers will have the chance to see the new "Maya: Hidden Worlds Revealed" exhibit.
UTSA Center for Archaeological Research, Main Campus
Other Calendars
» UTSA Events | » Academic | » Institute of Texan Cultures
The University of Texas at San Antonio is dedicated to the advancement of knowledge through research and discovery, teaching and learning, community engagement and public service. As an institution of access and excellence, UTSA embraces multicultural traditions and serves as a center for intellectual and creative resources as well as a catalyst for socioeconomic development and the commercialization of intellectual property - for Texas, the nation and the world.
To be a premier public research university, providing access to educational excellence and preparing citizen leaders for the global environment.
We encourage an environment of dialogue and discovery, where integrity, excellence, inclusiveness, respect, collaboration and innovation are fostered.


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Release Date:
June 21, 2011
In a future where the War on Terror is being fought in cyberspace, and elite counter-terrorism task force charged with keeping the internet safe must catch a hacker whose remarkable skills are unlike anything they have ever encountered. In the year 2034, terrorists have taken on a decidedly hi-tech persona. The job of Public Security Section 9 is to ensure that the integrity of the internet is not compromised by terrorists who would effectively bring the information superhighway to a crippling standstill. Previously, it was Major Motoko Kusanagi who was charged with overseeing the investigations of Public Security Section 9. But Major Kusanagi retired from her post two years ago, and now a skilled hacker known only as The Puppeteer is determined to bring the entire technological infrastructure crumbling to the ground. Now, as the members of Section 9 track The Puppeteer, they uncover a vast conspiracy that leads to the highest levels of government. When Major Kusanagi mysteriously reappears, some even begin to suspect that she is in league with the computer savvy terrorist. As the Ghost in the Shell: Stand Alone Complex continues in this techno-thriller from director Kenji Kamiyama, absolutely no one is above suspicion ~ Jason Buchanan, Rovi
- Genre: Sci-Fi & Fantasy
- Category Anime, Psychological Sci-Fi, Action Thriller
- Theme: Future Dystopias, Cyberspace [Anime], Terrorism, Switching Sides, Task Forces
- Run Time: 01 hr 53 min
- Language: Japanese , English
- Subtitle Language: English
- Picture Format: widescreen
- Format: Blu-ray
- Release Date: June 21, 2011
other Info.
- Online Item #: 13489101
- Store Item Number (DPCI): 246-06-7694
- Made in the USA or Imported


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Simply Mauvelous!
- 224 views
- 51 clicks
- 9 admirers
Jun 3, 2012
beautiful colors! lovely compilation of treasures!
Thank-you for including my beaded fringe earrings (:
Beautiful collection!
great finds, amazing collection !
Thanks for including my necklace in this lovely collection :)
You said it! Good variety here. Thank you!
Very pretty collection!
Thanks for including our earrings!
Beautiful treasury! Love the arrangement! Miigwech (thanks in Ojibwe) for featuring my art quilt on canvas of Turtle Island, Sky Woman.
Very nice collection!
Mauvelous, indeed!
Perfectly mauvelous! I love it!
Great treasury! Thanks for including me!
Oh Yes !!!!!
Beautiful picks and beautiful soft color. Love it.
Beautiful treasury! All wonderful selections!
Lovely! Thank you for including my rosary :)


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The first dedicated A380 concourse at Dubai International Airport includes 20 gates for the jets. The project, a joint effort between Emirates Airline and the airport, will increase passenger capacity from 60 million to 75 million fliers a year. The Terminal 3 Concourse A was built exclusively for Emirates jets.
Full Story:Frequent Business Traveler


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Great earnings report and this is how we get treated .. whats the point of owning stock when it takes 4 months to go up and 1 minute to go all the way back down .. this is acting like they reported losses instead . someone has a license to steal and they did .
sell it


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|Message view
|« Date » · « Thread »
|« Date » · « Thread »
|Eduardo Pelegri-Llopart <Eduardo.Pelegrillop...@eng.sun.com>
|Re: request for comments about Multilinguage JSP
|Thu, 17 Feb 2000 05:46:56 GMT
In many cases the data starts from some single source (say the database) and ends up being differentiated based on a number of reasons; let's say based on client characteristics for this - that could be supported language, or it could be a WAP device vs an HTML browser. I don't know where the practical boundary lies between transforming some common representation and starting afresh. I doubt any of us really knows given how little experience there is with the differnt mechanisms. If the transformation is very deep it seems to me it may be easier to start afresh. Anyhow, we will find out as we try things out, that is why we like our jobs, right? A response to the original question in a separate mail. - eduard/o Assaf Arkin wrote: > > I totally agree. And also produce text from within Java code (Java 1.2 > supports that nicely). > > But if you need database or progamattic messages, you still end up > having one JSP page supporting multiple languages. > > The point that was raised is whether multiple JSP pages, one for each > language, makes sense. XSLT solves that. Java code (and JSP beans) solve > the remaining issues. > > arkin > > Benson Margulies wrote: > > > > I don't think that it is realistic to assume that all the text in a > > multilingual application will surface via XLT. A JSP/servlet may need to > > pull strings from a database based on language. > > > > --------------------------------------------------------------------- > > To unsubscribe, e-mail: email@example.com > > For additional commands, e-mail: firstname.lastname@example.com > > -- > ---------------------------------------------------------------------- > Assaf Arkin www.exoffice.com > CTO, Exoffice Technologies, Inc. www.exolab.org > > --------------------------------------------------------------------- > To unsubscribe, e-mail: firstname.lastname@example.com > For additional commands, e-mail: firstname.lastname@example.com
|View raw message


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Student Life
"When students exercise campus leadership, they become more deeply involved in and committed to shaping the educational experience – for themselves and for others – and are more likely to exercise leadership in their lives beyond college."- Astin & Astin 2000
As you enter College of DuPage, you are becoming a participant in our campus community. Student Activities provides a supportive, values-based environment that helps students get the most out of their College of DuPage experience as well as prepares them to be active leaders in a complex and ever-changing society. Our staff coordinates the college's Living Leadership Program and helps students involved with clubs and organizations.
So take a look at what we have to offer. And get ready for an experience you won't
Find us on Facebook
Office of Student Life
Student Services Center (SSC), Room 1217, (630) 942-2243
Twitter FeedMore Student Life Tweets
News at COD
College of DuPage Celebrates 50 Years of Changing Lives
Continuing its year-long celebration of its 50th anniversary, College of DuPage officials recently held a reunion at Plymouth Place retirement community in La Grange with former COD staff, faculty and key community members in the College's formation.
The MAC Hosts Encores of National Theatre Live's International Series Broadcasts for 2016-2017 Season
Part of the U.K.'s National Theatre's groundbreaking project, the broadcasts bring a selection of world class, award-winning British theater productions to local venues around the world.Read More
MAC Hosts 30th Anniversary Open House, On-Sale Party Aug. 6
Ticket buyers will enjoy personalized customer care from the MAC's ticket services staff, no handling fees and the chance to pick their seats. The first 50 ticket buyers that day will also receive a complimentary gift. Everyone attending the event will have the opportunity to tour the three MAC theater spaces, and enjoy free food, ticket giveaways, and live music.Read More
COD New Student Orientation Aug. 9 to 11
Attendees receive valuable information on where to find assistance, how to use technology and other resources.Read More
COD Student Selected to Compete in Sampaguita Scholarship Competition
College of DuPage graphic design student Alpha Sadcopen has been selected to compete in the Sampaguita Scholarship Competition.Read More
College of DuPage
425 Fawell Blvd., Glen Ellyn IL
60137 (630) 942-2800
2016 College of DuPage


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After the Bell
Before the Bell
Jim Cramer's Daily Booyah
Midday Bell
Top 10
Winners & Losers
Here's why Anthony Zackery, portfolio manager for Zevenbergen Capital Investments, is bullish on these three stocks.
Twitter and Apple both faced low earnings expectations. Doug Kass looks at how they fared.
We believe the company is well on its way to spiraling out of control.
The social media giant reports earnings today after the market closes. We sort through the hype to tell you what to expect.
©1996-2016 TheStreet, Inc. All rights reserved.
Action Alerts PLUS is a registered trademark of TheStreet, Inc.


text:
Click here to print the obituary below
Gladys M. Kizer
Gladys M. Kizer, 53, of Scranton, died Tuesday at Geisinger Community Medical Center. She was the wife of Francis Kizer. The couple would have celebrated 24 years of marriage on Dec. 31.
Born in Syracuse, N.Y., daughter of the late Charles Monta and Gladys Graves, she was a former member of St. John the Evangelist Church and educated in Syracuse public schools. She had been employed by the Scranton State General Hospital and Scranton State Office Building. She had been a very active volunteer over the years. Her great joy was spending time with family.
Also surviving are a daughter, Tomika Doolittle, Avoca; a grandson, Mark Lee Dutter, Scranton; four granddaughters, Destiny, Jessie and Brittany Moore and Trinity Veaudry; six sisters, Mary Morten, Lorraine, N.Y.; Betty Schmidt, Syracuse; Charlotte Sobles, Syracuse; Fran Angerson, Dunmore; Dorothy Monta, Scranton; and Pearl Dyer, Hastings, N.Y.; two brothers, Charles Monta Jr., Syracuse; and William Graves, Rome, N.Y.; nieces, nephews and cousins.
She was also preceded in death by a daughter, Kathleena Monta; and two grandsons, Richard and Brandon Moore.
The funeral will be Friday at 8 p.m. in the Thomas J. Hughes Funeral Home Inc., 1240 St. Ann's St., Scranton, with services by the Rev. Joseph Jones, C.P. Interment, Cathedral Cemetery.
Friends may call Friday, 4 to 8 p.m.
Published in Scranton Times on Nov. 8, 2012


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Skip to comments.John Kerry Flies to Tel Aviv Despite FAA Ban
Posted on 07/23/2014 1:29:04 AM PDT by bd476
AP and ABC News
TEL AVIV, Israel Jul 23, 2014, 4:12 AM ET
The top U.S. diplomat defied a Federal Aviation Administration ban and flew into Israel's main airport Wednesday in a sign of sheer will to achieve a cease-fire agreement in the warring Gaza Strip despite little evidence of progress in ongoing negotiations.
U.S. Secretary of State John Kerry planned to meet with Israeli Prime Minister Benjamin Netanyahu, Palestinian President Mahmoud Abbas and United Nations Secretary-General Ban Ki-moon during what appeared to be a crucial day in the flailing talks. U.S. officials have downplayed expectations for an immediate, lasting truce between Israel and the Hamas militant group that controls Gaza. At the least, Kerry's mission Wednesday sought to define the limits of what each side would accept in a potential cease-fire.
Kerry flew into Tel Aviv on an Air Force jet one day after the FAA banned commercial flights into Ben-Gurion Airport. The FAA imposed the 24-hour restriction after a Hamas rocket landed within a mile of the airport on Tuesday.
State Department spokeswoman Jen Psaki said Wednesday's meetings would continue Kerry's efforts to get Hamas and Israel to declare a truce after more than two weeks of fighting in the Gaza Strip. More than 630 Palestinians and about 30 Israelis have been killed in the violence.
(Excerpt) Read more at abcnews.go.com ...
Yeah right. Maybe he is there to help his buddies in Hamas, before they are wiped out. Do you think he will say, if you like your rockets, you can keep your rockets?
"The top U.S. diplomat defied a Federal Aviation Administration ban and flew into Israel's main airport Wednesday in a sign of sheer
willhubris ... "
There, fixed it.
And AP also made the error in their title:
"John Kerry Files (sic) to Tel Aviv Despite FAA Ban"
... probably because they were thinking about the
missingIRS email filesscratched hard drive.
LOL! You're right! That's his m.o.
He undoubtedly flew on a US Air Force aircraft that in no way would be subject to FAA policies as it is not a commercial carrier. Are the journalists in this country really this stupid?
Egypt is pissed at Washington for supporting the MB. Israel is pissed at Washington for supporting the MB/HAMAS. Talk about EPIC Foreign Policy fail... comedy of errors!
Obama/Kerry will make the decision which most advantages the terrorists and hurts US and other stable governments.
Kerry sure knows how to prove the FAA has it's head firmly implanted. For once, he may have actually been useful.
Taking a chance like that,!!
He deserves a Silver Star w/ Oak Leaf Clusters for valor to go with his Purple Hearts he got in Vietnam Nam.
Did you know he was in Vietnam Nam?
Predictive spelling is your friend. :) Vietnam
Initially as I read this generated from the captain of the Delta flt which turned around over the med after learning the reports of the missile strike. The FAA which is always slow to ring the bell responded later. Once the Delta pilot returned to Europe it was game on for restrictions. Airlines start worrying about liability IF something happened. As far as Lurch is concerned, I would make a solid bet (other than US Gov aircraft are excluded), that his aircraft has some missile warning and countermeasures. Lurch has not had any failed diplomacy for a couple hours, so he needed to achieve more failures..
So did the statue of Ozymandias have to dodge sniper fire and come in in a corkscrew fashion?
Tellin' ya, he's bad... meaner than a junk yard dog... /you know the rest2ndDivisionVet wrote: "Are the journalists in this country really this stupid?"
Well yes. :)
This reads like it is from parody site like The Onion rather than a news site. Maybe that is what has become of American journalism; it has become a parody.
I don't mind that he went. What bothers me is that he plans to come back.
Maybe flew on "EL AL" .
...that's the way things are stacking up, pathetic, really...
Please see post number 17, thank-you!
Excellent insight, Truth29. Kind of gives me the willies thinking about it, though. Purposeful parody, propaganda puff-pieces... where does it end?! /end alliteration ;)
Hahahaha ding, ding, ding, high five! That's a winner, South40!
One stray Hamas rocket, and he's Lord Moynh II. Let's hope they're out of them, and that Iron Dome works. Not that I enjoy his presence, but because I wouldn't be able to bear the media feeding frenzy that would result from his demise.
Useful? It hasn't happened yet. Did you hear his oops, hot mike moment the other day?
Kerry recorded on a hot mike and his long-winded explanation
Transcription of Kerry trying to dig himself out:
Pre-Show Hot Mike Catches Kerry Mocking Israel-Avoids Repeating When Asked During Show
I'm stealing that!
He's such a fool as is his boss. No wonder the the world is laughing at us.
Netanyahu is considering restricting flights from the United States.
LOL! Marvelous mix of mental images, PghBaldy! :)
Oooh, joke or possibly true? It's easy to understand how Netanyahu would lose his patience with any one of the three stooges.
Please tell me they're not that stupid. But then again, it's ABC.
The ban is the manifestation of corruption of another government agency to serve the political ends of the Obama administration.
Obama and Kerry must have been salivating for another opportunity to stick it to the Jews and hand Hamas a victory by isolating Israel.
ROFLOL! Excellent! High five, Vinnie!
Israel should have run this guy out on a rail. How can you trust a guy whose assistant tweeted solidarity with Hamas?
Despicable administration
Good point, Eleutheira5.
never let a crisis go to waste....... have the FAA impose a flight ban to force ceasefire negotiations
Then although not invited nor wanted, force yourself on Israel and Palestine to smirk about disregarding the ban and use the leverage to force your will
The end of the rule of the treacherous tyrant can't come too soon
I could, with pleasure
And right there is your answer.
Very well said, Bert.
They're more determined to make him into a heroic diplomat who's more Audie Murphy than John Kerry.
He is not important to the peace. His ego is obsessed with making a mark. He didn't "defy" any ban.
Agree, DForest. Just so bizarre and difficult to accept that Kerry is in the position he is in now, and that Obama is in the WH.
Do you have a correction for that 2nd link?
Its propaganda
Really stupid and ineffective propaganda
Slow news day? I don't care for Kerry, but he should be doing his job. This is nit-picky.
That, or he's attempting to change what History books will finally say about him.
Yep, that's it. Thanks.
"Sheer will", eh?
Is he seeking a "Triumph of the Will"?
Is that a trick question?
So if Kerry breaks a Federal ban, it's an "act of sheer will"?
What is it if one of the serfs does it? Just plain "illegal"?
It's sheer will for him to continue talking, despite the constant whickering and whinnying going on behind him, and the flies that must be swatted with the long, hairy appendage attached to his nose, not to mention the flagellant noises that emanate from his mouth.
Disclaimer: Opinions posted on Free Republic are those of the individual posters and do not necessarily represent the opinion of Free Republic or its management. All materials posted herein are protected by copyright law and the exemption for fair use of copyrighted works.


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ARCA/Williams Summer Hamfest
ARCA/Williams Hamfest
July 22 - 24, 2016
Click Above for Forecast
Advanced Reservations are now closed.
You may still print a reservation packet and bring it with you to the event.
Click on the Reservations link at left to access the packet and visit the Registration booth when you arrive.
NOTE: If you do not see links at the left of this page, click HERE.
As part of the ARRL's National Parks on the Air (NPOTA), the Northern Arizona DX Association & Amateur Radio Council of Arizona will "activate" the Grand Canyon on July 24th in conjunction with the train ride to the canyon. Enjoy the ride to the canyon, then take part in the NPOTA activation of the Canyon and get your name in the log! Join the fun!
Please Note: Noise restrictions will be strictly enforced this year. Quiet time is 10:00 p.m. until 7:00 a.m. NO loud or annoying sound will be permitted. That includes - music, radios, generators etc. Generators may not be run over night. If you need power for medical or other reasons, please contact the reservations committee for possible accommodations.
|Map of Williams
|Rodeo Grounds Map
|(PDF Format Only)
|(PDF Format Only)
|NOTE: Space layout has changed.
To View Available Spaces, Go to Reservations Page
|Event Schedule
|Click on the link at left.
|Click on the link at left.
|(Updated 7/09/2016)
|(Updated 7/09/2016)
2016 Flyer
(PDF Format Only)
To Contact the Hamfest Committee or Make a
Click on Request/Comment at top of page.
Please remember, ARCA is an entirely volunteer organization and returning phone calls, responding to inquiries, and so forth, sometimes takes a little time. Rest assured that if you call the ARCA Voice Line, your call WILL be returned. If you send an email, either through this site or otherwise, we WILL respond.


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The Rome, Ga.-based freight broker's purchase of Apex Freight Services will allow Scott Logistics to expand its market presence and contribute $20 million in additional annual revenues, according to a statement from the company.
Although activity increased from the first quarter, total deal volume and value in the transportation and logistics sector were still down 18 percent and 22 percent year-over-year, respectively, according to a new report from PricewaterhouseCoopers.
Echo posts strong second quarter Chicago-based Echo Global Logistics reported strong year-over-year increases in net income, revenues and truckload volumes during the second quarter of 2016.
Registration takes less than 1 minute.
The third-party logistics company is closing a distribution center in southeast Memphis, which will result in the largest lay off announced by any company in the Memphis metro area so far this year.


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Blue Springs regulations
Getting good land use and zoning regulations in place near the new Toyota plant in Blue Springs is an important community issue.
Mike Slaughter, urban planning consultant for Oxford-based Slaughter and Associates, recently met with the Blue Springs Board of Aldermen to discuss land use, subdivision regulations and zoning. It's part of a comprehensive plan developed by the consulting firm for Blue Springs.
Blue Springs is preparing to grow, both in size and population, because of an annexation that is nearly complete. It only needs clearance from the U.S. Department of Justice.
It is important to prevent willy-nilly unplanned and unregulated development near the plant that would result in the area becoming an eyesore. Problems created by such development are expensive to fix after they occur.
Blue Springs will need to conduct a public hearing about zoning in the annexed area before new regulations can be adopted. The village, which will soon become a town, needs to move as quickly as possible to get regulations in place.
Blue Springs is only part of the problem that will develop around the plant. Our county Board of Supervisors also needs to put strong zoning and land use regulations in place to head off a wealth of problems.
Waiting until the county is overwhelmed by problems caused by lack of strong standards is not the answer.
About Chris Elkins
- New Legion Auxiliary officers July 27, 2016
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- Martintown bridge complete, road open again July 28, 2016
- There is much we didn't know about millionaire Paul Rainey July 28, 2016
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problem started like a month ago. had to toll the vehicle on both occasions
Gas leak into engine,caused damage to ecu.changed ecu and value, problem persist on 2000 Nissan Quest
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1 answer
Only thing i can figure is the fuel pressure regulator is defective if gas is getting into the crankcase.


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I have had a leak at the lid of the oil filter housing for some time. It has gotten progessivly worse, to the point were it is now leaving a puddle on the driveway. I replace my filter and rubber o-ring at the same time. I use aftermarket filters and o-rings from Napa and such. I believe the lid is on tight enough, do you think the aftermarket o-ring is inferior to OEM and allowing the leak?
Is this a common problem with these units?