text:
|Publication number
|Publication type
|Application number
|Publication date
|Apr 22, 1986
|Filing date
|Mar 5, 1985
|Priority date
|Oct 19, 1982
|Fee status
|Publication number
|John R. Lamattina, Paul F. Petric
|Original Assignee
|Varian Associates, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (10), Non-Patent Citations (4), Referenced by (71), Classifications (16), Legal Events (4)
|External Links: USPTO, USPTO Assignment, Espacenet
The Government has rights in this invention pursuant to Contract No. F19628-80-C-0173 awarded by the Department of the Air Force.
This application is a continuation of application Ser. No. 435,179, filed Oct. 19, 1982.
This invention relates to apparatus for carrying out a process in a vacuum and, more particularly, relates to an envelope apparatus for carrying out a process in a vacuum at a localized region on the surface of an article.
The processing of articles in a vacuum has generally occurred within a sealed chamber, given that processing in the evacuated region outside the earth's atmosphere is not feasible except for specialized space experiments. For vacuum processing on terra firma, articles are loaded into a chamber, and the chamber is then sealed and evacuated. The process of choice is then carried out within the chamber; such processes would include sputtering, vacuum deposition, welding or treatment by a charged particle beam. For example, see H. Kita, et al., "Method of Treating a Workpiece with Electron Beams and Apparatus Therefor," U.S. Pat. No. 4,327,273; A. I. Plyshevsky, et al., "Apparatus for Vacuum Coating of a Substrate," U.S. Pat. No. 3,990,390.
In the semiconductor processing industry the batch approach has been widely employed. The batch approach requires that the chamber be opened to the external environment when the wafers comprising the batch are loaded and when they are unloaded. This requires a complete pumpdown of the chamber for each successive batch. The breaking of the vacuum of the chamber allows potential contaminants into the system and permits all exposed surfaces within the chamber to adsorb gases. During the ensuing pumpdown these adsorbed gases must be removed in addition to removing the gas filling the volume of the chamber. In addition, such equipment must possess a high level of complexity particularly if automatic loading and transport are features of the equipment. As examples of conventional batch processing by vacuum, see E. H. Voight, et al., "Apparatus for Processing Semiconductor Devices", U.S. Pat. No. 3,749,838; C. D. Dobson, "Enclosures for Vacuum Coating," U.S. Pat. No. 3,892,198; and D. Maydon, "High Capacity Etching Apparatus," U.S. Pat. No. 4,298,443.
In the evolution of vacuum processing techniques, particularly as practiced in the semiconductor processing industry, the tendency has been to more efficiently utilize vacuum. To accomplish efficient vacuum utilization, processing equipment has been developed which minimizes the time required for loading and unloading, which utilizes loadlock chambers to prevent the main processing chamber from returning to ambient each time an article is unloaded from or loaded into the chamber and which reduces the size of the main chamber to minimize the surface area which will adsorb gases and to reduce pumping requirements. Also, the main chamber and processing equipment within the chamber have been fabricated from non-volatile materials so as to reduce outgassing into the chamber.
Serial processing of individual semiconductor wafers has been carried out for many reasons including reducing the size and most often the complexity of the vacuum chamber. In theory, the chamber may be reduced in size to nearly the size of the wafer, as exemplified in the situation where the processing station may form one wall of the chamber. Serial processing is exemplified by the apparatus of J. D. Helms, "Low Volume Deposition Reactor", U.S. Pat. No. 3,721,210. In Helms '210 a semiconductor wafer is loaded on a support disk and moved successively to low volume reaction chambers. As disclosed in F. T. Turner, et. al., "Individual Wafer Metalizing System-A Case History," Industrial Research & Development, March, 1982, p. 150, April, 1982, p. 148, individual wafers are introduced from a cassette through a loadlock onto a transfer plate. The wafers are held in place by clips on the transfer plate. The transfer plate is rotated so as to present the wafer for treatment at successive processing stations. The volume of the chamber at each successive station is exceptionally small since the wafer is presented in close coupled opposition to each processing apparatus. Also, each chamber is not opened up to ambient, but is only exposed briefly to the adjacent chamber as the wafer is transferred. Thus, the inefficient use of vacuum associated with batch processing of wafers is thereby eliminated. However, throughput is still affected by the need to load the wafer into a loadlock or into the chamber with the associated requirement of pumping out the volume before commencing processing. And since the semiconductor wafer is loaded into a volume in which a high quality vacuum is ultimately generated, an enclosure at least as large as the wafer is required. Also, the mechanical complexity of the system for wafer transport is still high due to the need for vacuum air interfaces. Since the whole wafer is maintained within the vacuum only radiative thermal transfer is readily available to heat or cool the wafer. Excessive temperature levels may therefore result during such processes as ion implantation or sputter etching. Or, the wafer may not be satisfactorily heated within a vacuum chamber when the process requires heating the wafer.
For focused charged particle beam processing the vacuum region in prior art equipment is usually significantly greater than the localized region at which processing occurs. This localized region may be a spot-sized region or a well-defined scanned field much smaller than the total surface area of the wafer. Typically, the semiconductor wafer is moved relative to the beam while the beam is making small movements in order to obtain full processing of the surface of the wafers. The wafer translation apparatus is also typically included within the vacuum volume thereby increasing the required size and complexity of the vacuum chamber and associated mechanical systems.
It is therefore an object of the present invention to provide an envelope apparatus which permits localized vacuum processing on the surface of an article.
It is a further object of the present invention to provide an envelope apparatus which forms a graded vacuum seal on the surface of an article being treated between an internal vacuum processing zone and the external ambient.
It is another object of the present invention to provide an envelope apparatus which provides a vacuum only at the localized region on the surface of an article where vacuum is required to support the process being employed.
It is another object of the present invention to provide an envelope apparatus which provides a vacuum at the localized region on the surface of an article without physically contacting the article.
For a more complete understanding of the vacuum envelope apparatus of the present invention, reference may be had to the accompanying figures which are incorporated herein by reference and in which:
FIG. 1 is a side schematic view of a batch type vacuum processing system;
FIG. 2 is a pictorial side view of localized vacuum processing equipment which incorporates the envelope apparatus of the present invention;
FIG. 3 is a side cross sectional view of an electron beam lithography system which incorporates the envelope apparatus of the present invention;
FIG. 4 is a detailed cross sectional side view of the envelope apparatus for vacuum processing of the present invention;
FIG. 5 is a bottom view of the tip of the vacuum envelope of the present invention;
FIG. 6 is a bottom view of an alternate embodiment of the tip of the vacuum envelope of the present invention;
FIG. 7 is a cross sectional view of the vacuum envelope apparatus of FIG. 6 taken through line 7--7 of FIG. 6;
FIG. 8 is a plan view of a conveyor mechanism holding semiconductor wafers which are to be processed by equipment incorporating the envelope apparatus of the present invention;
FIG. 9 is an expanded cross sectional view of the conveyor mechanism of FIG. 8; and
FIG. 10 is a detailed side view of the apparatus of FIGS. 6 and 7.
An envelope apparatus is provided for facilitating the production of a vacuum in a localized region on the surface of an article such as a semiconductor wafer. The presence of the vacuum permits specialized processing to be carried out. The envelope structure defines an internal processing zone in which the processing level vacuum is maintained. Intermediate vacuum zones surrounding the internal processing zone are also defined. The internal processing zone and surrounding vacuum zones are exposed at a surface of the envelope apparatus so that when the surface is placed in close coupled opposition to the article being processed, a graded vacuum seal is formed extending from the internal processing zone outwardly. The vacuum envelope is held either in a fixed position or actively tracks the topography of the surface of the article so that the gap between the end of the tip and the surface of the article lies within an acceptable range. This forms a noncontacting graded vacuum seal to an ambient environment outside the vacuum envelope. For semiconductor processing applications, it has been found that a graded seal formed by two-stage differential pumping and having a gap in the range of 20 micrometers to 40 micrometers will permit vacuums on the order of 10-5 Torr or lower to be maintained within the interior processing zone of the envelope apparatus.
State of the art vacuum processing is accomplished in sealed vacuum chambers. As shown in FIG. 1 a vacuum chamber 10 is evacuated and maintained at high vacuum by high vacuum pump 14 such as a diffusion, ion or cryogenic pump. The high vacuum pump 14 is backed up by roughing pump 19 via cold trap 17 and valves 16. A booster pump 15 or other auxilliary pump, e.g., a Roots blower pump, may be employed for a further intermediate pumping stage. High vacuum valve 13 seals the vacuum pumps from chamber 10 during loading and unloading of the chamber. High vacuum manometer 11 monitors the vacuum in chamber 10 while manometer 18 indicates the roughing vacuum in the foreline. In operation, the article being processed in a vacuum is placed in its entirety into chamber 10. For each batch of articles the system must be fully pumped down to a sufficiently high vacuum level to support the process and the vacuum must be maintained while the process is underway even if outgassing of the chamber walls occurs due to the elevated temperature experienced during the processing. In addition, objects larger than the size of available vacuum chambers may not be subjected to batch vacuum processing.
Localized vacuum processing produces efficient utilization of vacuum and reduces the size and complexity of vacuum processing apparatus. For certain applications it may be permissible to contact the article being processed in order to form the seal. For example, in S. Susei, et al., "Vacuum Shield Device of an Electron Beam Welding Apparatus," U.S. Pat. No. 4,342,900, a shield member fabricated from heat-resistant, flexible material is pressed against the article. The open interior of the shield member forms a processing zone where vacuum is maintained to support an electron beam welding process. For certain other applications the processing apparatus may not be allowed to make contact with the wafer. For example, in the processing of semiconductor wafers the upper surface of the wafer must not be contacted so as to avoid damage to regions already processed, to avoid breaking the wafer and to prevent the generation of microparticulates which could interfere with subsequent processing or contaminate the wafer. Thus, when processing semiconductor wafers it is desirable to accomplish localized vacuum processing without physically contacting the wafer.
The envelope apparatus of the present invention does not make physical contact with the wafer. A pictorial illustration of a system incorporating the envelope apparatus is shown in FIG. 2. Envelope apparatus 29 is attached to the bottom of processing apparatus 27. Envelope apparatus 29 is shown to be conically shaped with truncated end 31 being positioned in opposition to surface 24 of article 30 which is to undergo processing by apparatus 27. For processing flexible articles the envelope apparatus will necessarily be small so as to not produce bowing of the article due to the differential pressure between ambient and the various vacuum regions described below. The high vacuum to support the process is generated by high vacuum pump 28 and is communicated through high vacuum valve 33 to the chamber of processing apparatus 27. The working process is applied to surfaces 24 through the opening of width d. A graded vacuum seal is formed between truncated end 31 and the surface 24 of the article being processed with high vacuum being present at opening 32 and ambient existing outside cone 29. Inbetween, an intermediate vacuum is present as communicated from roughing pump 26 through annular conical sleeve 34. Additional intermediate vacuum stages may be utilized depending upon the vacuum requirements of the process. A gap is continuously maintained between the end 31 of the envelope apparatus 29 and the surface 24 of the article 30. This gap is either fixed or is dynamically maintained by means 25 within an acceptable range, e.g., 20 micrometers to 40 micrometers. The upper end of the range is limited by the gas inflow that can be tolerated while yet maintaining an acceptable vacuum in the internal processing zone. The lower end of the range is determined by the margin required to ensure that no contact is made with the wafer; for the reasons given above contact with the wafer must be avoided at all times.
Gap maintenance techniques include the use of a planar air bearing, the establishment of fixed positions for the article and the envelope apparatus, and the use of air micrometers of the type set out in M. Knobel, "Work Dimension and Position Detecting, Indicating and Controlling Method and Apparatus," U.S. Pat. No. 3,194,055. Other gap maintenance systems for use with an envelope apparatus of the type of the present invention are described in copending application "Gap Control System for Localized Vacuum Processing," U.S. Pat. No. 4,528,451 and assigned to the assignee of this application. Briefly, such a gap maintenance system comprises sensing means operative to provide a gap sense signal corresponding to the gap measured between the tip of the vacuum envelope and the article being processed. A control means is operative in response to changes in the gap to provide a control signal corresponding to the difference between the measured gap and a desired gap dimension or range of allowed dimensions. An actuating means is operative to vary the gap between the vacuum envelope and the article in response to the control signal. In a preferred embodiment, the actuating means includes three spaced apart, independently controlled actuators coupled through a workpiece holder to the workpiece, and the control means provides independent actuator signals to each of the actuators. The actuating means is thereby operative to vary the angle between the surface of the article being treated and the vacuum envelope when the independent actuators are actuated by unequal amounts.
When vacuum is lost or appreciably reduced, the vacuum envelope may have to lock-in to the newly-supplied substrate. Lock-in of the vacuum envelope may occur in several ways. In one embodiment a two-step vacuum lock-in process is employed. Here, before the high quality vacuum of the internal processing zone is established a sensor such as a capacitive sensor is employed to detect the relative proximity of the vacuum envelope to the surface of the article. The vacuum envelope is moved towards the article from above and/or from a laterally displaced position. The capacitive sensor provides information to the positioning means so that the vacuum envelope and the article come together close enough to establish the low level threshold vacuum. Once the low level threshold vacuum level is exceeded the high vacuum source for the internal processing zone is turned on. Then, the gap maintenance system described above is activated and equilibrium vacuum levels for the graded vacuum seal are quickly achieved. For semiconductor wafers of known and uniform thickness, as shown in FIG. 3, the wafers may be placed on a vacuum chuck 46 adjacent an alignment pad 63. The chuck lies below the pad a distance equal to the thickness of the wafer. Thus the stage 47 may be moved laterally with respect to vacuum envelope 39 and vacuum may be retained either over the pad 63 or over the wafer 45. Or, for ion implantation or metallization a link conveyor 83 having wells 84 as shown in FIGS. 8 and 9 may be used.
The present invention provides a contactless seal between the vacuum envelope and the surface of an article. Once the seal is formed, a vacuum may be generated and maintained within the interior zone of the envelope. This zone corresponds to a local regional area on the surface of the article being processed. Within the zone the particular vacuum process, e.g., electron beam welding, ion beam milling, a lithographic process, etc., is carried out. Typically, the vacuum envelope and the substrate are moved relative to each other so that the zone rests above different local regions at different times. The relative movement follows a pattern such that all relevant areas of the article are treated by the vacuum process before the article is removed and a new article is inserted for processing.
The contactless requirement of the present invention is readily met when articles which have generally planar surfaces or surfaces which have smoothly varying contours are treated. As a result of the smoothly varying contours few sudden Z-axis movements which might bring the tip of the envelope close to the wafer will be required. The acceptable values for the range of the gap between the tip of the vacuum apparatus and the article also depends upon the quality of the vacuum which is required for processing. If a low quality vacuum can be tolerated, e.g., greater than about 10-4 Torr as in a welding system, then a larger gap or a workpiece with an irregular surface may be tolerated. If a high quality vacuum is required, e.g., lower than about 10-4 Torr, as in semiconductor processing, then it is necessary that the gap be closely maintained and that the wafer be flat to within close tolerances. In the semiconductor industry wafers are routinely supplied by vendors with such a high degree of surface flatness. SEMI Standard M1.1 for Polished Monocrystalline Slices dated January 1981 specifies maximum allowable variations in wafer thickness and indicates that future revisions will specify flatness quality as well. In processing in the semiconductor industry, great care is taken to prevent warping of the wafers during processing so that the wafers are amenable to being handled in automated wafer handling equipment. See D. C. Guidici, "Wafer Flatness: An Overview of Measurement Considerations and Equipment Correlation", SPIE, v. 174, Developments in Semiconductor Microlithography IV, p. 132 (1979). High temperature processing, one of the primary sources of warpage, is almost eliminated by employing the apparatus of the present invention. Such warping is one of the most serious problems with semiconductor device processing. See D. Thebault, et al., "Review of Factors Affecting Warpage of Silicon Wafers", RCA Review, v. 41, p. 592, December 1980. The elimination of this warpage with the envelope apparatus of the present invention results from exposure of most of the wafer at any point in time to the ambient environment, thereby producing high overall heat transfer between the ambient and the wafer. Heat losses are especially great over that portion of the wafer in the vicinity of the localized region being treated since here the temperature differentials and thus the heat transfer rate is highest. Thus, any wafer warpage is made much less likely so that the gap is more readily maintained within the acceptable range.
As seen in the pictorial representation of FIG. 2, processing apparatus 27 employs the vacuum envelope apparatus 29 of the present invention. The article 30 which is undergoing processing of its surface 24 is presented in spaced apart, close coupled opposition to the tip 31 of envelope apparatus 29. Vacuum sufficient to support the process is supplied by vacuum pump 28 through valve 33 to apparatus 27 and thus to the interior processing zone 32 of envelope apparatus 27. When envelope apparatus 29 is moved with respect to article 30, typically by movement of article 30 but in some cases by movement of processing apparatus 27, portions of the surface area to be treated are successively exposed to the internal processing zone 32 having an orifice of dimension "d" within vacuum envelope apparatus 29. It is evident that the whole surface 24 of article 30 is never subjected in its entirety to the vacuum and that only a small localized region is subjected to vacuum and the associated processing at any one time. An intermediate vacuum level is produced by roughing pump 26 and communicated to tip 31 through channel 34 which surrounds internal processing zone 32. A graded vacuum seal is thus produced between the tip 31 of envelope apparatus 29 and the surface 24 of article 30. The graded vacuum seal extends from internal processing zone 32, under the opening of channel 34 and out to ambient. The gap between tip 31 and the surface 24 of article 30 may be fixed, if processing vacuum requirements are not severe, or may be dynamically controlled by means 25 as described in detail in U.S. Pat. No. 4,528,451. The location of the region undergoing processing will change as vacuum envelope apparatus 29 is moved with respect to article 30 by mechanical means (not shown). For beam applications the beam may be steered or scanned to fully or selectively cover that portion of the surface 24 of article 30 which is instantaneously exposed underneath the aperture of vacuum envelope means 29. This combined movement may be of the type disclosed in R. J. Collier, "Electron Beam Exposure System," U.S. Pat. No. 3,900,737.
A particular application of the envelope apparatus of the present invention is shown in FIG. 3, in the context of an electron beam lithography machine. An envelope apparatus 39 is attached to the bottom of electron beam column 35. The tip 40 of envelope 39 rests slightly above the surface of semiconductor wafer 45 mounted on vacuum chuck 46. A gap is maintained between the tip 40 of cone 39 and the surface of wafer 45. Within this gap a graded vacuum seal is formed when the machine is in operation. Since vacuum envelope 39 has a truncated conical shape, a radial seal is formed. Since the vacuum envelope 39 has interiorly positioned, spaced apart conical members, a series of discrete zones 43, 42 and 41 are formed, each zone being in communication with a vacuum pump. Intermediate zones 41 and 42 are in communication, respectively, with first stage pump 53 and with second stage pump 54. Zone 43 is in communication with high vacuum pump 36 which produces a vacuum sufficient to support the lithographic process. The quality of the vacuum at the tip necessarily reflects the low conductance between pump 36 and tip 40. The vacuum is graded from the level of the ambient environment to a low vacuum level produced by the first stage vacuum pump 53, to a higher vacuum level formed by second stage vacuum pump 54, to the high vacuum level formed by high vacuum pump 36 as communicated to tip 40. Due to low conductance produced by the filling of column 35 with electron optical elements such as lens 60 only a portion of the high vacuum is communicated to tip 40 of vacuum envelope 39. Sufficient high vacuum is, however, delivered through internal zone 43, and sufficient intermediate vacuum is delivered through zones 41 and 42 so that a graded vacuum seal is maintained as relative movement of stage assembly 47 is accomplished with respect to column 35. As a consequence, the point of processing of the working beam on the semiconductor wafer is always maintained under high vacuum even though that point moves over the surface of the semiconductor wafer.
Movement of the stage may be accomplished by any means which is capable of providing prompt, accurate movement in response to control signals such as feedback from an x-y laser interferometer. Short settling time is also a requirement. For example, orthogonal cylindrical air bearings may be employed. See D. R. Herriott, et al., "EBES: A Practical Electron Lithography System," IEEE Transactions on Electron Devices, ED-22, p. 385 (1975). Planar air bearings have also been proposed. See, W. L. Fox, "Vacuum-Sealed Gas-Bearing Assembly", U.S. Pat. No. 4,191,385; or a double sided planar air bearing may be utilized. B. G. Lewis, et al., "A Laser Interferometer Controlled X, Y Air Bearing for Direct Wafer Exposure Electron Beam Lithography," Proceedings, 10th International Conference on Electron and Ion Beam Science and Technology, p. 477 (1982). Such air bearing translation means have, however, been bulky, costly and often difficult to maintain in good running order. Preferably, linear motors may be used in a closed loop system as disclosed in copending application, Ser. No. 435,178 "Charged Particle Beam Lithography Incorporating Localized Vacuum Envelope," filed on even date herewith and assigned to the assignee of this application. Briefly, linear and smooth operating characteristics for the stage as well as simplicity of design are achieved by using linear motors, for example, linear motors of the Sawyer-principle type. With Sawyer-principle type motors, a moveable stage possesses a network of magnet poles which are wire-wound and function as electromagnets. A baseplate has a matching or complementary network of poles. By appropriate switching of the polarity of the magnets on the moving stage, the poles are intermittently and selectively attracted by counterpart poles on the baseplate. The timing of the switching determines the speed of the motor. Extremely smooth movement is experienced. See, e.g., B. A. Sawyer, "Magnetic Positioning Device", No. Re 27, 289; J. Dunfield, et.al., "Sawyer-Principle Linear Motor Positions Without Feedback", Power Transmission Design, p. 72, June 1974.
A serial loading capability is desirable in automated wafer processing equipment. Such a capability allows wafers to be moved from processing station to processing station and introduced to the next successive process without queing to form a batch. See F. T. Turner, et.al., "Individual Wafer Metallizing System-A Case History"; Industrial Research and Development, March 1981, p. 150 and April 1981, p. 148. With such an approach large batches of wafer are never placed at risk in a given process at any time. Such a serial loading capability is inherent with the vacuum envelope apparatus of the present invention since only a single wafer at a time is transported to the vacuum envelope apparatus and subjected to processing. This can be seen by reference to FIGS. 3 and 4 in which the lithography system is shown as having an alignment pad 63 positioned adjacent to wafer 45 on vacuum chuck 46. When a wafer 45 is being unloaded from or loaded onto vacuum chuck 46 on stage 47, stage 46 may be moved so that alignment pad 63 is placed in opposition to vacuum envelope 39, thereby allowing unloading and loading of wafers to occur unobstructed. When the tip of the vacuum envelope is positioned over the newly loaded wafer it is not necessary to reestablish processing vacuum as it has been retained.
The tip of the vacuum envelope is shown in bottom view in FIGS. 5 and 6 and in cross section in FIG. 7. The tip in FIG. 5 corresponds to the three-stage vacuum envelope shown in side view schematic view in FIGS. 3 and 4; the tip in FIGS. 6 and 7 corresponds to the three-stage envelope plus air bearing embodiment shown in FIG. 10. For the three-stage vacuum envelope, high vacuum zone 65 is surrounded by conical member 68 and is connected to high vacuum pump 36; intermediate vacuum zone 66 is surrounded by annular conical member 69; and is connected to second stage vacuum pump 54; and intermediate vacuum zone 67 is surrounded by external conical member 70 and is connected to first stage vacuum pump 53. For the three-stage envelope plus air bearing, the same structure exists with the addition of air supply holes 72, annular groove 73 and radial air grooves 71. Air supply holes 72 are connected via zone 106 to a positive air supply 113. In operation, air is supplied at an appropriate pressure to produce an air bearing between surface 70 of the tip of the vacuum envelope and the surface of semiconductor wafer 99. In order to minimize the flow of air into vacuum groove 67, annular groove 73 is disposed to receive inwardly flowing air and conduct it through radial air grooves 71 outwardly to ambient. Relatively little air enters vacuum zone 67. Some air reaches ambient across the circumference of region 70, but most air flows through annular groove 73 and radial air grooves 71 to ambient.
The air flow from the positive air supply 113 prevents air from the surrounding room environment from entering the vacuum zone 67.
As shown in FIG. 7, the conical member 68 has a truncated conical shape tapering inwardly toward the high vacuum zone 65 and is concentric with the beam axis. Thus, the passage leading to high vacuum zone 65 increases in cross-sectional area as the distance from the tip increases. Likewise, the annular member 69 has an inner wall with a truncated conical shape tapering inwardly toward the intermediate vacuum zone 66. Thus, the passage formed between members 68 and 69 leading to intermediate vacuum zone 66 increases in cross-sectional area as the distance from the tip increases. In the embodiment of FIG. 7, the inner wall of member 69 has a taper greater than the taper of member 68.
For the air bearing embodiment of FIGS. 6, 7 and 10, it is not necessary to provide active z-axis tracking between stage 101, vacuum chuck 102 and vacuum envelope apparatus 103. Instead, envelope apparatus 103 is attached by bellows 107 to processing chamber 109, e.g., to the electron optical column which produces working beam 108. As stage 101 is moved by X,Y drive system 116 with respect to the tip 105 of envelope apparatus 103, relative z-axis movement is provided by a dynamic equilibrium between the spring forces of bellows 107 and the forces exerted by the air bearing.
For purposes of illustration throughout this specification the vacuum envelope apparatus has been shown with vertical orientation with the processing apparatus being positioned above the article being treated. In practice, any orientation may be selected. For the processing of semiconductor wafers, for example, a horizontal orientation of the vacuum envelope may be preferred so that the wafer is oriented vertically thereby avoiding the settling of particulates onto the surface of the wafer. And for vacuum processing on the surface of irregularly shaped articles the orientation of the vacuum envelope will necessarily change as the mobile apparatus traverses the surface of the article. Or, the orientation of the apparatus may be chosen to match the configuration and nature of the processing system and the article may be presented in an orientation appropriate for the formation of a graded seal with the the apparatus.
Also, for purposes of illustration the vacuum envelope apparatus has been shown to be conically shaped. This permits a focused beam process to be supported over a small local region. Generally, however, the shape of the tip is selected to accommodate the particular process. For example, a rectangular shape would support a line scan. And for electron beam welding the shape of the vacuum envelope may be tailored to accommodate the topography of the surface of the article being welded. In each case the vacuum seal is maintained between the tip of the envelope apparatus and the surface of the article and spans the distance from the internal processing zone to ambient. The size of the envelope should not be so large that the article being processed will experience appreciable bending due to the differential pressures between the various vacuum levels present on one surface of the article and the ambient present on the other surface. Generally, the more rigid the article or the lower the vacuum levels, the larger the area of the internal processing zone that may be exposed to vacuum. The number of vacuum stages surrounding the internal high vacuum region and separating it from ambient may be one where low vacuum requirements are present, or may be two or more where higher vacuum levels are required. The vacuum envelope, as shown in FIGS. 6, 7 and 10, may also ride on a planar air bearing in order to maintain the gap within an acceptable range. The applications for which the envelope apparatus of the present invention may be utilized are of two principal types: large surface area treatment and lithographic. For the latter application the internal high vacuum zone is small since the working beam is scanned only over distances of the order of a few millimeters with substrate translation accomplishing relative movement of larger size. Due to the depth of focus specifications, e.g., of an electron beam, it is often necessary to obtain accurate z-axis control as described in detail in Applicant's copending applications, Ser. Nos. 435,177 and 435,178, filed on even date herewith. In order to utilize as much of the mask or silicon real estate as possible the envelope apparatus must function as close to the edges as possible, thereby creating a preference for small sized apparatus. For focused beam processing a conical shape is preferred since the shape provides good vacuum conductance to the tip and since the small tip is associated with small differential forces being applied to the article being processed. For gross applications, larger envelope structures of varied shapes may be employed since there typically will be less concern about the edges. As shown in FIGS. 8 and 9 moving conveyor 83 has a surface 82 having wells 84. The wells 84 are configured to receive semiconductor wafers 80 having flats 81. Preferably, the exposed surfaces of the semiconductor wafers are coplanar with the surface 82 of conveyor 83. Also, preferably, wafers are held in wells 84 by conventional vacuum chuck means (not shown). The conveyor may be moved underneath vacuum envelope 77 (shown in partial cross sectional view) positioned at the end, for example, of an ion implanter, plasma etching or sputter deposition machine. Processing is supported in internal vacuum zone 79 while an intermediate vacuum is established in zone 78. A graded vacuum seal is established from internal vacuum zone 79, underneath wall 76, across intermediate vacuum zone 78, underneath wall 77 and out to ambient. The overlap of internal vacuum zone 79 may cause processing to occur on the surface 82 adjacent wells 84; the impact of this processing may be minimized by using specific scan patterns in the case of ion implantation or by refinishing or replacing conveyor 83 periodically. Such a continuous approach to processing would be suitable for ribbon semiconductor materials fabricated for solar cell applications. For example, ion implantation of a silicon ribbon grown by edge defined film fed growth could be accomplished by running the ribbon under an envelope apparatus attached to an ion implanter.
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|The Perkin-Elmer Corporation
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|Advanced Energy Systems, Inc.
|Method and apparatus for producing extreme ultra-violet light for use in photolithography
|Apr 3, 1998
|Jan 30, 2001
|Advanced Energy Systems, Inc.
|Holder assembly system and method in an emitted energy system for photolithography
|Apr 3, 1998
|Feb 27, 2001
|Advanced Energy Systems, Inc.
|Method and apparatus for adjustably supporting a light source for use in photolithography
|Jun 2, 1998
|Apr 3, 2001
|Lsi Logic Corporation
|Electron beam fault detection of semiconductor devices
|Dec 9, 1999
|Oct 9, 2001
|Etec Systems, Inc.
|Annular differential seal for electron beam apparatus using isolation valve and additional differential pumping
|Dec 23, 1998
|Oct 16, 2001
|Matsushita Electric Industrial Co., Ltd.
|Apparatus and method for processing
|Jun 20, 2000
|Aug 20, 2002
|Advanced Energy Systems, Inc.
|Fluid nozzle system and method in an emitted energy system for photolithography
|May 16, 2000
|Nov 19, 2002
|General Scanning Inc.
|Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
|Nov 2, 2001
|Jun 3, 2003
|General Scanning Inc.
|Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
|Jan 17, 2002
|Mar 23, 2004
|Kla-Tencor Corporation
|Scanning electron microscope architecture and related material handling system
|Dec 5, 2001
|Jun 1, 2004
|Hitachi, Ltd.
|Evacuation use sample chamber and circuit pattern forming apparatus using the same
|Jun 2, 2003
|May 24, 2005
|Harald Gross
|Portable scanning electron microscope
|Mar 27, 2002
|Apr 11, 2006
|Gsi Lumonics Corporation
|Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
|Feb 28, 2001
|Apr 25, 2006
|Sony Corporation
|Electron beam irradiation apparatus, electron beam irradiation method, original disk, stamper, and recording medium
|Nov 17, 2004
|Sep 19, 2006
|Ebara Corporation
|Sheet beam-type inspection apparatus
|Apr 26, 2005
|Feb 13, 2007
|Gsi Group Corporation
|Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
|Mar 26, 2004
|Oct 30, 2007
|Kla-Tencor Technologies Corporation
|Transverse magnetic field voltage isolator
|May 13, 2004
|Jan 22, 2008
|Kla-Tencor Technologies Corporation
|Transverse magnetic field voltage isolator
|Jun 30, 2004
|Jul 1, 2008
|Kla-Tencor Technologies Corporation
|Transverse magnetic field voltage isolator
|Feb 24, 2006
|Aug 26, 2008
|Ebara Corporation
|Sheet beam-type testing apparatus
|Jun 28, 2005
|Nov 25, 2008
|Fei Company
|Apparatus for evacuating a sample
|Mar 23, 2007
|Jun 23, 2009
|Kla-Tencor Corporation
|Chamberless substrate handling
|Nov 3, 2009
|Kla-Technologies Corporation
|Transverse magnetic field voltage isolator
|Nov 9, 2010
|Ebara Corporation
|Sheet beam-type testing apparatus
|Sep 26, 2008
|Jan 11, 2011
|Carl Zeiss Nts Gmbh
|Material processing system and method
|Jun 7, 2007
|Mar 15, 2011
|Fei Company
|Compact scanning electron microscope
|Jun 5, 2012
|Gsi Group Corporation
|Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
|Feb 1, 2011
|Nov 13, 2012
|Fei Company
|Compact scanning electron microscope
|Sep 23, 2011
|Feb 5, 2013
|Ebara Corporation
|Inspection system by charged particle beam and method of manufacturing devices using the system
|Apr 26, 2007
|Dec 3, 2013
|Fei Company
|Slider bearing for use with an apparatus comprising a vacuum chamber
|Jan 2, 2013
|Aug 12, 2014
|Ebara Corporation
|Inspection system by charged particle beam and method of manufacturing devices using the system
|Jun 7, 2007
|May 5, 2015
|Fei Company
|User interface for an electron microscope
|May 23, 2013
|Sep 22, 2015
|Sharp Kabushiki Kaisha
|Charged particle emission device and air-blowing device
|Jan 31, 2007
|Oct 6, 2015
|Fei Company
|Particle optical apparatus with a predetermined final vacuum pressure
|Jun 30, 2014
|Jun 14, 2016
|Ebara Corporation
|Inspection system by charged particle beam and method of manufacturing devices using the system
|Jun 27, 2001
|Mar 28, 2002
|Mamoru Nakasuji
|Sheet beam-type inspection apparatus
|Mar 27, 2002
|Nov 14, 2002
|Cordingley James J.
|Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
|Dec 26, 2002
|Aug 21, 2003
|Hitachi, Ltd.
|Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method
|May 30, 2003
|Nov 6, 2003
|General Scanning Inc.
|Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
|Jun 2, 2003
|Dec 2, 2004
|Harald Gross
|Portable scanning electron microscope
|Nov 17, 2004
|May 5, 2005
|Ebara Corporation
|Sheet beam-type inspection apparatus
|Apr 26, 2005
|Aug 25, 2005
|Gsi Lumonics Corporation
|Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
|May 10, 2005
|Sep 15, 2005
|Gsi Lumonics Corporation
|Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
|Feb 24, 2006
|Jun 29, 2006
|Ebara Corporation
|Sheet beam-type testing apparatus
|Jan 18, 2006
|Aug 31, 2006
|Johnson Shepard D
|High-speed, precise, laser-based material processing method and system
|Aug 7, 2006
|Dec 21, 2006
|Carl Zeiss Nts Gmbh
|Material processing system and method
|Jun 28, 2005
|Dec 21, 2006
|Fei Company
|Apparatus for evacuating a sample
|Jan 31, 2007
|Aug 2, 2007
|Fei Company
|Particle optical apparatus with a predetermined final vacuum pressure
|Jul 22, 2008
|Dec 11, 2008
|Ebara Corporation
|Sheet beam-type testing apparatus
|Sep 26, 2008
|May 14, 2009
|Carl Zeiss Nts Gmbh
|Material processing system and method
|Jun 7, 2007
|Jul 8, 2010
|Fei Company
|Compact scanning electron microscope
|Jun 7, 2007
|Aug 5, 2010
|Fei Company
|User Interface for an Electron Microscope
|Apr 26, 2007
|Nov 4, 2010
|Fei Company
|Compact Scanning Electron Microscope
|Jun 9, 2011
|Fei Company
|Compact scanning electron microscope
|May 23, 2013
|Apr 23, 2015
|Sharp Kabushiki Kaisha
|Charged particle emission device and air-blowing device
|Jul 1, 2005
|Dec 22, 2010
|Apparatus for evacuating a sample
|Mar 14, 1994
|Nov 28, 2002
|Agency Ind Science Techn
|Vorrichtung mit geladenem Teilchenstrahl
|Mar 1, 2001
|Nov 7, 2001
|Sony Corporation
|Electron beam irradiation apparatus, electron beam irradiation method, original disk, stamper, and recording medium
|Jun 27, 2001
|Jan 4, 2012
|Ebara Corporation
|Inspection system by charged particle beam
|Dec 16, 2002
|Jul 3, 2003
|Fei Company
|Scanning electron microscope assembly and method for using same
|Feb 21, 2008
|Sep 4, 2008
|Thermo Fisher Scientific (Bremen) Gmbh
|Vacuum pump or vacuum apparatus having a vacuum pump
|U.S. Classification
|250/441.11, 219/121.24, 219/121.22, 250/492.2
|International Classification
|Cooperative Classification
|European Classification
|Aug 21, 1989
|Fee payment
Year of fee payment: 4
|Oct 1, 1993
|Fee payment
Year of fee payment: 8
|Sep 30, 1997
|Fee payment
Year of fee payment: 12
|May 10, 1999
Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC., M
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:VARIAN ASSOCIATES, INC.;REEL/FRAME:010024/0960
Effective date: 19990406


text:
Home Concert Tickets Hard Rock/Metal Slipknot
Slipknot Tickets
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text: deongeletterdewanhoop Play via YouTube OPEN IN APP NSFW Safe Is this playlist safe for work? Women in the mix November 11, 2010 | 20 tracks | 116 13 | Stats The PipettesJoni MitchellBettye LaVette indie rockpopvocal Liked Collect Share Edit Liked! Share this mix with friends: Women in the mix Wrong video Collect Share Liked! Share this mix with friends:


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Reviews and ratings of local lawyers.
Post a review of your attorney.
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4.5 stars 6 reviews
Avvo Rating: 10.0
Licensed since 1981
NINA M. PARKER has been practicing since 1981 and has been certified by the American Board of Certification in Consumer Bankruptcy since 2002. She has been continuously selected for inclusion as a Massachusetts Super Lawyers and New England Super ...
Practice areas & skills: Bankruptcy & Debt, Chapter 11 Bankruptcy, Chapter 13 Bankruptcy
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Licensed since 2006
Practice areas & skills: International Law, Corporate & Incorporation
5.0 stars 1 review
Avvo Rating: 6.7
Licensed since 1994
Review: "Attorney Lett has helped me on a few different cases He is very professional, extremely knowledgeable and if he doesnt know something he will let you know, but you better believe he will find out the answer. He is one ph...
Practice areas & skills: Criminal Defense
Licensed since 1961
Review: "Attorney Kenneth Joyce worked with me for three years on a trust matter. He helped me through a difficult trust accounting.. He kept me going and gave me sound advice. His field is trust, wills, estates, and tax. He k...
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Practice areas & skills: Elder Law, Estate Planning
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Licensed since 1977
Review: "Attorney Largay has been my corporate attorney for many years. I believe he takes a personal interest in his clients. I have recommended him to my clients as well."
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Practice areas & skills: Securities & Investment Fraud, Corporate & Incorporation, Financial Markets and Services, Project Finance, Mergers & Acquisitions
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To explain that the puppet of a ventriloquist in a coma is telling jokes to the hospital patients, you need a lot of free minutes, like the ones CTY PK OLA offers you.
For each minute you talk, CTY PK gives you the next one free.
Advertising Agency: Lowe/SSP3, Bogotá, Colombia
Creative Directors: José Miguel Sokoloff, Alejandro Aponte
Art Director: Rodrigo Tarquino
Copywriters: Jairo Lezaca, Ricrado Beltrán
Photographer: Laurie Castelli
Published:March 2007
6 comments
brandsurgeonMar 14, 2007 - 7:50
Okay, why's the puppet always positioned at the coma patient's mid-section?
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philippertlMar 14, 2007 - 12:32
Please vote for us! http://www.thefwa.com/submissions/ertl-design


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Email this article from PlasticsNews.com
iPhone case maker hits jackpot
SAN FRANCISCO (Sept. 13, 5:15 p.m. ET) — Last year, iPhone case maker Hard Candy Holdings LLC took a gamble on what it expected would be the next-generation shape of the smart phone. It was wrong. But this year, when the San Francisco-based company had access to leaked designs for the iPhone 5, it decided to double down.
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MULTIMEDIA01 Monday, July 25
Campbell Soup pushes further into pouches
NEWS Friday, July 22


text:
zoo animals
Credit: Thomas Northcut
Creative #: 83585146
Licence type: Royalty-freeRoyalty-free pricing is based solely on the size of the product you need, not the specific use. You don't have to pay any additional royalties on a use-by-use basis. Once you license a royalty-free product, you may use it multiple times for multiple projects without paying additional fees. (Pornographic, defamatory, libellous or otherwise unlawful use of any image is, of course, prohibited.)
Collection: Photodisc
Release info: No release required
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Zoo Animals Stock PhotoAnimal Body Part,Animal Head,Animal Themes,Animals In The Wild,Captive Animals,Close-Up,Day,Elevated View,Endangered Species,Horizontal,Looking Away,Mammal,No People,One Animal,Outdoors,Photography,Safari Animals,Seattle,Undomesticated Cat,WildlifePhotographer Thomas NorthcutCollection: Photodisc Thomas Northcut


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Columbiana Ridge
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text:
Engine Performance problem
2002 Ford Escape 6 cyl Four Wheel Drive Automatic 140K miles
Not all of the time but when the engine is cold it is difficult to start or it has a very low idle. The idle will kick in when it wants to. Sometimes when driving the idle speed surges up for a very brief period. Any ideas?
Sunday, October 18th, 2009 AT 11:23 AM


text:
About the School
The School of Information Technology provides premier undergraduate and distinguished graduate programs for the education of computing and telecommunications professionals.
We offer three undergraduate bachelor's degree programs, two undergraduate minor programs, a master's program in Information Systems, and a graduate certificate program offering five graduate certificates.
Both the Information Systems program and Computer Science program are accredited by the Computing Accreditation Commission of ABET, www.abet.org.
Why choose an accredited program?
View the School of Information Technology IT Strategic Plan
Information Technology News
Video, photo gallery from Illinois Summer Research Academy
The Center for Mathematics, Science, and Technology (CeMaST) is hosting 65 high school students July 11 to 15 for the 2016 Illinois Summer Research Academy (ISRA) at Illinois State University.
Summer Research Academy draws students from across Illinois
Sixty-five high school students from across the state (and a few from out-of-state) will take part in the 2016 Illinois Summer Research Academy (ISRA), July 10-15, at Illinois State University.
Tin man: Alum masters the art of seasonal sales
Brian Hanc lives in a business world few can imagine.
Illinois State meets growing need for cybersecurity professionals
Illinois State's School of Information Technology is a nationally recognized leader in cybersecurity education with 125 students in its rapidly growing information assurance and security sequence.
IT professional mentors, student mentees to be recognized
The School of Information Technology (IT) will recognize participants in the IT Professional Mentorship Program April 22 at the annual Celebrate IT reception.
Redbird Hacks takes over Milner Library for 36-hour competition
Illinois State's 2nd annual Redbird Hacks challenged around 100 students on 20 teams to build or program a new website or application, all in just 36 hours.
View all Information Technology News.
Information Technology News Feed
School of Information Technology Fall Picnic
Tue, August 30, 2016 5:30 PM - 7:00 PM Old Union Building (OU), On the Quad
IT Professional Mentorship Kick-off - session 1
Wed, September 7, 2016 6:30 PM - 9:00 PM Stevenson Hall (STV), STV 401
IT Professional Mentorship Kick-off - session 2
Fri, September 9, 2016 6:30 PM - 9:00 PM Stevenson Hall (STV), STV 401
IT Employer Panel Discussion
Tue, September 13, 2016 4:00 PM - 5:00 PM Bone Student Center (BON)
IT Internship Fair
Tue, September 13, 2016 5:30 PM - 8:30 PM Bone Student Center (BON), Brown Ballroom
ITA Tech Challenge
Fri, September 23, 2016 2:30 PM - 5:30 PM Old Union Building (OU), OU129
Come Home to IT Open House
Fri, October 7, 2016 5:00 PM - 9:00 PM Old Union Building (OU), Old Union
CAST Homecoming Tailgate
Sat, October 8, 2016 11:00 AM - 2:00 PM Redbird Tent Zone - Free
View all Information Technology Events.
Information Technology Events Feed


text:
A 3-D carbon nanotube mesh enables rat spinal tissue sections to reconnect in culture.
Hope for Universal Flu Vax?
August 26, 2015|
Two studies point to the possibility that a single vaccine could protect against every strain of flu virus.
August 26, 2015|
Two studies point to the possibility that a single vaccine could protect against every strain of flu virus.
August 24, 2015|
The multiple sclerosis treatment has yet to be tested in Phase 3 clinical trials.
August 19, 2015|
The US Food and Drug Administration OKs the first drug for female sexual dysfunction.
August 18, 2015|
Despite dramatic increases in publications, the last 50 years have seen relatively little return on investment for US public health, a study suggests.
August 11, 2015|
Frances Oldham Kelsey, a physician who halted use of a drug that caused birth defects in babies, has passed away at age 101.
August 10, 2015|
A compound that degrades nicotine before it reaches the brain could serve as a successful smoking cessation therapy, according to an in vitro study.
August 4, 2015|
The US Food and Drug Administration green lights the first medicine produced by a 3-D printer for use in the human body.
August 1, 2015|
Four studies identify alternative origins for cells of the developing lymphatic system, challenging the long-standing view that they all come from veins.
August 1, 2015|
Can mice with humanlike tissues better model drug effects in people?
August 1, 2015|
Donated organs are helping researchers map out the immune system in humans.


text:
MILAN, June 20 Italian luxury goods group Tod's has hired Italian designer Andrea Incontri as creative director for menswear, the company said on Friday, as it seeks to strengthen its reputation for making clothes and accessories as well as shoes.
Group sales for the maker of bobble-bottomed loafers priced as high as 400 euros ($540) have lagged behind those of rivals in recent quarters, which analysts have attributed partly to its heavy reliance on footwear.
That core business accounts for three quarters of the company's revenue, but luxury shoes tend to offer lower margins than handbags and other accessories because they have to be made in many sizes and take up valuable storage space.
The appointment of 43-year-old Incontri, described by fashion magazine Vogue this year as being "on the path to success", follows a catwalk debut for the brand's womenswear last year under the creative direction of ex-Gucci designer Alessandra Facchinetti.
"His arrival will enrich our men's collections, giving our clients ever more choice, especially in ready-to-wear," Tod's Chairman and Chief Executive Diego Della Valle said in a statement announcing Incontri's appointment.
Tod's, which also owns the Hogan, Fay and Roger Vivier brands, has said that the staging of fashion shows should help it to generate publicity and boost credibility for the brand.
Tod's reported flat first-quarter revenue last month, with a decline in like-for-like sales offset by income from new stores. Close peer Salvatore Ferragamo, meanwhile, reported a 3 percent bounce in first-quarter sales. ($1 = 0.7366 Euros)
(Reporting by Isla Binnie; Editing by David Goodman)
Trending On Reuters
Patents & Entrepreneurial Universities
Measuring and evaluating academic innovation


text:
Volunteer opportunities
Coordinator for volunteer recruitment
Are you interested in people? We need a volunteer to help us to recruit volunteers. We meet with prospective volunteers once a month and we need someone to arrange the meetings and follow up with interested volunteers.
Brighton & Hove Open Door co-ordinator
We need people to help us to co-ordinate the opening of dozens of buildings in the Brighton & Hove area during the annual Heritage Open Weekend each September.
There are two sides to this task: one is to find interesting buildings and encourage their keepers to open them; the other is to list the details of these buildings on national and local websites. Creative thinking, a persuasive manner and an attention to detail are useful talents in this role.
Restoring a Regency building takes time and money, so we need help with fundraising initiatives and writing project proposals. A way with words or being able to find your way around a spreadsheet will come in handy here.
Friends Group
Your job will be to encourage more people to join our Friends Group and contribute to fundraising appeals and acquisitions, in return for a regular newsletter and invitations to exclusive events and private views.
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Other opportunities
There is a wide range of jobs that need doing at the Town House and we are always interested to hear from people who want to help. Please email firstname.lastname@example.com if you would like to join in.


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That said, assuming you did sign escrow docs allowing for advance of your funds, when that property is sold again to a different Buyer, you should receive your $650 from escrow when they deduct it from the new Buyer. I would send a letter to escrow notifying them that you expect your funds as son as possible. Just a last word.... if that property never sells, or becomes a foreclosure, your money is GONE!
A lesson to everyone - remove any language from the escrow instructions that allows Buyer's funds to be used / advanced for Seller costs.
Best of luck,
Thom Colby
Broker / Owner
Your agent SHOULD have told you of the possibility for such fees to be dinged against your deposit. Or, he or she could have instructed escrow to not make such expenditures until you were ready to remove all the contingencies. Did you pay for a home inspection? Same principle applies.
Perhaps your agent will reimburse you if you end up buying a different property from them.
No, our agent never informed us of anything and he kept saying we would get the full amount back.
We never signed any of the escrow paperwork nor had the home appraised.
Any thoughts/suggestions?
I've done this before. You need to put into the cancellation to get your full deposit back and have the seller pay that amoubt to escrow so you get the full deposit back . Or. When there is a new buyer to get them to sign an addendum that escrow can reimburse you for the HOA fees
The first one is better
The buyer MAY recoup the fees IF the seller deposits funds into escrow to reimburse the buyer. If the seller realizes they are responsible for payment and they are able to use the documents for the subsequent escrow you may get it back.
Hope this helps!
A few questions before I can give a good answer without speculating
What city are you buying in?
Next is this a standard sale or short sale? If it is then you can stay on top of the property with your agent to see when it sells and goes into escrow and have the new buyer sign a document and seller that they agree to release the $650. To give back to Kelly ----- from previous escrow for items of escrow fee and HOA fee.
I have done this and it works since they have mont in escrow to work with
The seller could agree to put money In Escrow.
The only money escrow would ever have is the buyers deposit
The agents below hit on some of the things you can do as well
Talk to you Soon
Ingrid Ski Realtor
Sorry and good luck,
No, our agent never informed us of anything and he kept saying we would get the full amount back.
We never signed any of the escrow paperwork nor had the home appraised.
Any thoughts/suggestions?


text:
I have multiple 2D arrays of Strings that are layed out a little like this
Array 1
[0] = ["01/01/01","Bill","17","0.86"]
[1] = ["02/01/01","Bill","12","0.84"]
[2] = ["03/01/01","Bill","15","0.85"]
Array 2
[0] = ["01/01/01","Joe","14","0.81"]
[1] = ["02/01/01","Joe","15","0.83"]
[2] = ["04/01/01","Joe","19","0.85"]
I'm trying to compare only data from the same days, so what I need to do is search both arrays for dates that are in one but not the other and then remove them. So in the above example I would remove [2] from both of the arrays. Is there a way of doing this using List/Collection retainAll or will I have to write a loop? Oh I'm using Java.


text:
Originally posted on Puck Daddy | Last updated 1/1/12
PHILADELPHIA — When asked if he was starting for the Philadelphia Flyers in the 2012 Winter Classic, goalie Sergei Bobrovsky said "it's very confidential for now." His coach, Peter Laviolette, said no decision had been made after the Flyers' practice at Citizens Bank Park. Meanwhile, Ilya Bryzgalov stood before the assembled media and did what Ilya Bryzgalov does best: Speaking without the benefit of a filter. "I have great news and even better news," said Bryzgalov when asked if he was starting for the Flyers. "Great news: I'm not playing tomorrow night. Good news: We have a chance to win the game." Bryzgalov said he hadn't spoke to Laviolette but that his goalie coach Jeff Reese had informed him he wasn't starting. "Is that big deal?" he said, dry as toast. Here's Bryzgalov announcing his status and speaking about HBO 24/7, auctioning his pads on eBay and other bits of Bryz gold. Barring this being a smokescreen or a late change of heart by the coach, what does Bryzgalov's benc...
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text:
Full name Mihlali May
Born May 6, 1997
Current age 19 years 83 days
Major teams Border Under-17s, Eastern Province Under-15s
Batting style Right-hand bat
Bowling style Right-arm fast
Education Pearson High
|Bat & Bowl
|Match Date
|Border U19
|v Eastns U19s
|Port Elizabeth
|20 Dec 2015
|Other OD
|Border U19
|v Mpu U-19s
|Port Elizabeth
|18 Dec 2015
|Other T20
|Border U19
|v KZN In U19s
|Port Elizabeth
|18 Dec 2015
|Other T20
|4*, 0/17
|Border U19
|v Limpopo U19s
|17 Dec 2015
|11, 0/30
|Border U17s
|v Boland U17s
|15 Dec 2014
|Other OD
|2/50, 8
|Border U17s
|v SWD U-17s
|14 Dec 2014
|Other OD
|6*, 1/48
|Border U17s
|v FS Under-17s
|13 Dec 2014
|Other OD
|2/39, 1
|Border U17s
|v GW Under-17s
|11 Dec 2014
|E.Prov U15s
|v GTG U-15s
|10 Dec 2012
|Other T20
|E.Prov U15s
|v Mpu U-15s
|10 Dec 2012
|Other T20
Loose West Indies succumb to Ashwin's wiles
One after another, the hosts' batsmen attempted questionable flicks and drives in their second innings, disregarding the drift and dip the offspinner was generating
Ashwin emulates Botham with ton and seven-for
Stats highlights from the fourth day's play in Antigua where Ashwin's maiden five-wicket haul outside Asia bowled India to an innings victory
Stats highlights from the first day of the Antigua Test, where Virat Kohli and Shikhar Dhawan stole the show from the hosts
Remembering West Indies' last major series win
Against India in 2002, Hooper, Dillon, Chanderpaul and Co. gave their fans something to cheer about
Manjrekar: 'Kohli reminds me of Tendulkar'
Former India batsman Sanjay Manjrekar analyses the various aspects of the first day's play in Antigua
Standout performers continue to carry England (65)
A crushing victory over Pakistan gave England plenty to be pleased about but familiar concerns remain over the make-up of the side
The case for four-day Tests (63)
Shorter matches spell good news for spectators and broadcasters. Cricket has a little to lose and a whole lot to gain by truncating its premier format
Loose West Indies succumb to Ashwin's wiles (53)
One after another, the hosts' batsmen attempted questionable flicks and drives in their second innings, disregarding the drift and dip the offspinner was generating
Herath versus the mighty Australians? (45)
Sri Lanka's lead spinner must feel like a bus driver in charge of a spluttering vehicle as the hosts strive to challenge a strong Australian side
Cook braves criticism as England play it safe (39)
There was enough logic in Alastair Cook's decision not to enforce the follow-on to make it understandable at worst and reasonable at best


text:
In a warning that's sure to disappoint many who enjoy sneaking a taste of cookie dough, the federal Food and Drug Administration says people shouldn't eat raw dough or batter of any kind due to an ongoing outbreak of illnesses related to a strain of E. coli bacteria found in some batches of flour.
Your daily look at late-breaking news, upcoming events and the stories that will be talked about today:
With just 131 days until Election Day, Mitt Romney's family is still urging him to run for president.
Donald Trump is struggling to connect with female voters, and his latest comments suggest that he doesn't have any intention of changing course.
Kurt Busch has accomplished much in his racing career except a restrictor-plate race victory.
It was all a dream... er, a hallucination, that is. For its penultimate episode Wednesday, Royal...
Outgoing Ashland Schools Superintendent Jay Hummel had good things to say about Ashland and about the district he led for the past three years. By all accounts, he did a good job himself — although it would have been nice to see him stick...
Nick Salvatore, the biographer of Eugene V. Debs, wrote that the popularity of the great American Socialist leader in the early decades of the 20th century "rested upon his ability to articulate and symbolize something of the severe dislocation...
WEEK IN RELIGION Nearly 1,000 people, all with different spiritual backgrounds, recently came together in New York to help Syrian refugees. At the historic 69th Regiment Armory in lower Manhattan, Muslim, Sikhs, Jews, Buddhists, Christians...
Southern Oregon Directory
Business Name
Location, ST | website.com


text:
- the most reliable RC Calculator on the Web
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text:
Very quiet location (had a room in the front). The staff was very helpful. Breakfast offered the normal choices for a Comfort Suite. Room had plenty of room to spread out. Only minor issue was not recognized as member of Choice Hotel group.
- Official Description (provided by the hotel):
- Welcome to the Holiday Inn Express Rocklin hotel. The Holiday Inn Express Rocklin hotel offers a superb location close to casino excitement, championship golf, award winning wineries and world class dining. From arts and culture to blissful spas, the area offers memorable experiences and activities for all interests. There is no shortage of things to do in Rocklin. Just a few blocks from the Holiday Inn Express Rocklin hotel find tantalizing menus at Cheesecake Factory, P.F. Changs, Il Fornaio, Ruths Chris, and Buca Di Beppo just to name a few. And for your shopping needs you will find everything you need and want at the Westfield Galleria Mall! When in Rocklin, CA, do not miss out on the undiscovered Placer County Wine Trail. Visit the Joss House Museum Sunsplash and Golfland and, if you are feeling lucky Thundervalley Casino is a must! ... more less
- Reservation Options:
- TripAdvisor is proud to partner with Booking.com, Expedia, IHG, Hotels.com, Travelocity, Hotwire, Orbitz, Odigeo and Priceline so you can book your Holiday Inn Express Rocklin - Galleria Area reservations with confidence. We help millions of travelers each month to find the perfect hotel for both vacation and business trips, always with the best discounts and special offers.
- Also Known As:
- Comfort Suites Rocklin
- Rocklin Comfort Suites


text:
Endurance exercise and metabolism are linked to transcriptional activation of human telomeres, researchers propose.
Minimal Genome Created
March 24, 2016|
Scientists build a living cellular organism with a genome smaller than any known in nature.
March 24, 2016|
Scientists build a living cellular organism with a genome smaller than any known in nature.
March 22, 2016|
At first blush, do-it-yourself clinical trials seem pointless and reckless. But a deeper truth pervades the research and the patients who drive it forward.
March 18, 2016|
Answer some brief questions and help us determine the most current salary outlook for life scientists and earn a chance to win a $100 Amazon gift card.
March 17, 2016|
Aimed at primary care providers, the recommendations encourage non-narcotic alternatives or short-term opioid prescriptions and patient monitoring.
March 16, 2016|
A newly described horse-size relative of Tyrannosaurus rex may help settle the question of how massive carnivorous dinosaurs took shape throughout the eons.
March 11, 2016|
Food processing in early hominid populations might have played a key role in human evolution by increasing net energy uptake, researchers show.
March 10, 2016|
Every time Emily Temple-Wood receives an inappropriate email, she writes a Wikipedia entry about a woman scientist.
March 9, 2016|
Scientists discover compounds that restore antibiotic efficacy against drug-resistant superbugs.
March 4, 2016|
Scientists provide a potential biological link between Zika virus infection and microcephaly.
March 3, 2016|
Endogenous retroviruses in the human genome can regulate genes involved in innate immune responses.


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Samsung Galaxy Camera now available
Ilse Jurriën : November 14th 2012 - 11:40 CET
Samsung Galaxy Camera now available in the UK :
The Galaxy Camera is a revolutionary camera and the perfect combination between photography and Android. The Samsung Galaxy Camera offers high performance photography features with Android 4.1 Jelly Bean and the freedom of 3G / 4G + Wi-Fi connectivity. Users can shoot and edit their photos in the camera and with internet connectivity it is easier than ever to share and enjoy memorable pictures and videos with friends and family - anywhere and at any time. The new Galaxy Camera comes in the colors White and Cobalt Black, the Samsung Camera is now available in the UK and will soon be available in other parts of the world.
16 MP Samsung Galaxy Camera
Boosting a super-bright 16 megapixel BSI CMOS sensor, the Galaxy Camera takes brilliant pictures and offers a 21x super zoom lens to bring the subject closer. The Samsung Galaxy Camera integrates a quad-core processor for quick image processing. Smart Auto technology helps the photographer to create even better pictures by offering a series of 15 details modes and settings. Photos and videos can be reviewed on the 4.8-inch HD Super Clear Touch display.
Samsung Galaxy WiFi Camera
Besides offering WiFi support, the Galaxy Camera also features 3G and 4G connectivity. Users will enter a world of limitless sharing and smartphone like activities. Posting high quality images to your favorite social networking sites such as Facebook, Twitter, Pinterest, and the pre-installed Instagram app has never been easier. The Samsung Galaxy Camera functions on Wi-Fi with Dual Band and Channel Bonding for extra speed. Simply shoot, enjoy, edit and share with the touch of a button.
Samsung Galaxy Camera price & availability
The Galaxy Camera ships with Android 4.1 (Jelly Bean), giving users access to thousands of apps available on the Google Play Store. The Samsung Galaxy Camera is now available in the UK for a suggested retail price of £399.00 GBP. The camera will soon be available in other parts of the world as well, in Europe the price is set at €600 Euro, in the USA you have to pay about $500 USD. The Galaxy Camera comes in two colors; Cobalt Black and White. As soon as we receive a test sample, we will publish a sample photo gallery with high resolution pictures, followed by an in-depth Samsung Galaxy Camera review.
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text:
As i understand it a request for files.get only returns my own permissions on a file. How can i read all of them or at lest get a handle for all of the permissions to copy them to another file.
The use case would be an app which creates a related file alongside the original and wants to set the same permissions and sharing settings as the original file on the app created copy.


text:
Chasing stardust
20 July 2015 Feature
Molecules in deep space are very small and very far away, as Matthew Gunther discovers
Artificial star dust may help inform scientists how planets form © NASA/Ames/Farid Salama
Interstellar dust is normally produced by dying stars that eject this material into the space between stars. Eventually, after millions of years, this dust can coalesce to form planets. The cosmic simulation chamber (COSmIC) at Nasa's Ames Research Center in the US can reproduce the harsh conditions found at the boundary of a star where temperatures fall to –173°C, particles are bathed in high intensity radiation and the vacuum of space prevails. Into this inhospitable environment the scientists fed a stream of argon seeded with the basic hydrocarbon ethyne. The COSmIC experiments produced particles just 10nm wide and grains ranging from 100 to 500nm in size, as well as aggregates 1.5µm in diameter. The researchers say that the work will help them to understand the kind of dust around stars and, in turn, how planets form from them.
20 July 2015 Feature
Molecules in deep space are very small and very far away, as Matthew Gunther discovers
31 July 2015 Feature
Comets are thought to represent leftover building blocks of the solar system; Jennifer Newton finds more questions than answe...
13 January 2016 Research
Borrowed hydrogen chemistry drives reaction to obtain useful fuel from biomass
22 December 2015 Research
Scientists say biomaterial could treat bone defects and diseases


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Mimi's Maryland Crab Cakes
Total Time
Prep 10 mins
Cook 20 mins
This is my mom's (Mimi's) crab cake recipe, and I think it's the best! She originally came to Florida from Baltimore, and they know their crab cakes there! This might even be an Old Bay recipe, I don't know. I like to make these and my potato salad and Mimi's baked beans for "special" occasions. Mimi used to serve her crab cakes with her coleslaw as a side dish. This recipe makes 8-10 cakes depending on the size.
Ingredients Nutrition
- 1 lb fancy white crab meat (and claw)
- 1 teaspoon Old Bay Seasoning
- 1⁄4 teaspoon sea salt
- 1 tablespoon mayonnaise
- 1 tablespoon Dijon mustard or 1 tablespoon Worcestershire sauce or 1 tablespoon yellow mustard
- 1 tablespoon chopped fresh parsley or 1 teaspoon dried parsley
- 1 tablespoon baking powder
- 1 large egg, beaten
- 1⁄2 cup prepared Italian seasoned breadcrumbs
- canola oil, for quick frying
- Mix all ingredients (except canola oil) together and shape into cakes (about 8-10).
- In large skillet, heat canola oil over medium heat.
- Add cakes and cook, turning once, until brown (~3 to 5 minutes per side).
- Drain well on absorbent paper.
- Serve with tartar sauce or Dijon mustard, or make crab cake sandwiches with lettuce & tomato.
Most Helpful
After looking at all the recipes for crabcakes on 'Zaar, I decided to try this one with a few changes. After mixing as directed I didn't think the mixture was wet enough to stay together for broiling so I added about 1/4 cup more mayo and another teaspoon of Old Bay. Broiled them for 15-20 minutes on high and drizzled them with melted butter just before serving. They were very good and I would certainly make them again. I did not have Italian style breadcrumbs so I used homemade soft breadcrumbs. My dinner company said they were 'crabcakes to die for'! Thanks!
We really enjoyed these crab cakes. All the ingredients went together very nicely. Will make again soon. Thanks for posting.
Yummy! I really enjoyed this as a sandwich (recommended by the posting chef). This is very easy to put together. I scaled it down to 2 servings using one 4.25 oz can of premium lump crabmeat and yellow mustard, making one large patty. I served it on a toasted bun with a splash of lemon juice. Although a messy sandwich, it was so delicious! Buddha wants me to make one for him using canned salmon (as he is allergic to shellfish). Thanks for sharing your mom's recipe. :)


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The Medford Mail Tribune reports that two of the fires were lit in piles of trash in one alley.
Medford police are encouraging the public to come forward with any information on the person or persons starting the fires or be on the lookout for suspicious activity. Department officers are also on the lookout.
Medford Fire-Rescue battalion chief Rick Rohrbough says whoever is starting the fire is "getting everybody ramped up."
On Saturday, as fire fighters were dousing the blazes in the trash piles, the third fire began smoking near them. That fire burned the outside wall of a building.
While Saturday's fire was minor, one of three fires set July 15 was set outside of an occupied home. The woman inside was uninjured. Police also believe that arsons may have started a massive fire that leveled a former fruit-packing plant.