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Located in the heart of Pulaski County, we are dedicated to helping you achieve your wellness objectives -- combining skill and expertise that spans the entire chiropractic wellness spectrum. Dr. Henderson and Dr. Wilson are committed to bringing you better health and a better way of life by teaching and practicing the true principles of chiropractic wellness care.
Dr. Henderson and Dr. Wilson are committed to relieving your pain using the true principles of chiropractic care. Our caring helpful team strives for excellence through extraordinary service and patient education. We are here to help you get in, get better and get on with your life.
Our practice is equipped with modern chiropractic equipment and the most advanced technology. Dr. Henderson and Dr. Wilson has had extensive training in all aspects of chiropractic care. We provide Chiropractic Care for injuries that occur during sports, auto accidents, work-related activities or just everyday "wear and tear."
We specialize in family care, musculoskeletal injuries, disc problems and offer customized wellness care for people who want to maintain their current health and prevent future injuries. We have had stunning success with these conditions and many others.
If you are new to our website, please feel free to discover and learn about chiropractic wellness. If you are interested in starting your journey towards wellness please subscribe to our newsletter. If you are already a newsletter subscriber, please explore the member wellness section of our website for wellness articles, resources, and health facts that are specifically targeted to your wellness needs and interests.


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|There are no prerequisites for this course
financial consultancy with Better Numbers Ltd.
Do you have an entrepreneurial spirit, but lack confidence in your business and financial knowledge? This course will help you bring these attributes together, and provide the financial coaching that you need to run your own business successfully.
Written with business coaches and consultants in mind. People who want to take their career to to the next level, but need to gain a better financial understanding first.
The course will help identify the costs that are susceptible to overspending. Learn the financial tools and techniques to manage and control finances.
Your Finance Expert brings years of experience with large corporations and small businesses. She will share industry financial metrics and measures to help you make informed expenditure.
With just 60 minutes of video lectures to absorb, it won't be huge time investment. But it will be time well spent.
Increase your knowledge, and gain the confidence to help small businesses to grow.

subset: commoncrawl


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Funky Joy Division – The Editors live at Terminal 5
Photos by G.
The good thing about being open-minded is when you have a new experience, you can let yourself be free to witness the unknown and form your opinions later. When I saw The Editors on February 19, 2010 at New York's Terminal 5, I didn't really know what to expect. They've been around since 2002, and while I knew their name, I didn't really know much of their music. What little I had heard made me decide to take a chance and see them live. I walked into the show as a blank slate and from the second The Editors came on stage (at 9:40 pm) until they exited (around 11:00 pm), they colored my slate with love. They were so awesome live, as I write these words, I wish the show was still going on. They needed no backdrops and fancy lights to show the crowd that they rock. Instead, lead singer Tom Smith played guitar, piano and keyboards (sometimes multiple instruments during a song). His voice sounds scarily like Ian Curtis from Joy Division and musically, if you take the best and funkiest moments The Killers have and meld it all together, you have Funky Joy Division. I'm keeping this review short because I need to switch over to Amazon.com and buy all of their albums immediately.
View some more pix and the set list for The Editors after the jump.


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Parliament must get on and implement the will of the British people as soon as possible, and there is no question of voiding the result of Britain's Brexit vote, outgoing prime minister David Cameron said in his first appearance in the House of Commons since resigning.
There is now one government with one view, which that we have to find the right path for the future, and I think the sooner we can do that, the better," Cameron told the chamber.
While he urged haste Cameron said that there are no plans to trigger Article 50 — the clause that will begin the process of the UK leaving the EU — until he has left office, and a new prime minister is in place. That is expected to occur by September.
"The British government will not be triggering Article 50 at this stage ... this is our sovereign decision and it will be for Britain, and Britain alone, to take."
The government is also setting up a special unit to lead the UK's negotiations to leave the European Union, Cameron told the House of Commons, saying that he and his cabinet agreed on Monday morning to create a unit within Whitehall designed specifically to lead and advise the government on European Union exit talks once they commence.
The unit will be created with collaboration between the cabinet office, treasury, foreign office, and several other arms of the civil service.
Cameron added that there is no question of voiding the result of the referendum, saying: "There can be no doubt about the result ... I am clear, and the cabinet agreed this morning, that the decision must be accepted."
He continued: "Britain is leaving the European Union but we must not turn our back on Europe or the rest of the world. We have to determine the kind of relationship we want with the EU."
Britain must "hold fast to a vision that wants to be respected abroad, tolerant at home, engaged in the world and working with our international partners to advance security and prosperity of the nation for generations to come," Cameron added.
Before beginning his statement, Cameron joked that new MP, Rosena Allin-Khan, who was sworn in as the member for Tooting, should be prepared to take a role in Labour's shadow cabinet, following the massive turmoil in the party over the past two days. "I'd advise her to keep her phone on. She might be in the shadow cabinet by the end of the day," Cameron said.
Notably, prominent Leave campaigner, and the favourite to be the next Conservative party leader, Boris Johnson was not present in the Commons chamber during the speech.


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England has a collected data on daily temperature from 1772 in the Hadley Centre Central England Temperature (HadCET) dataset.
I downloaded this Hadley Centre dataset. And I followed this tutorial. Based on an original graphic by Tufte.
Here the black line is the average temerature for each day last year. The dark line in the middle is the average average temperature (95% confidence). the staw coloured bigger lines represent the highest and lowest average daily temperature ever recorded on that day since 1772. the red dots are the days in 2015 that were hotter than any other day at that time of year since 1772.
Looking at the black line that represents last years temperatures it was the Winter and Autumn that were far above average. Instead of a scorching hot summer most of the record hot days were in November and December. 2014 had the same pattern of a hot Winter. No day in 2015 was the coldest for that date in the recorded time.


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Podcast: Play in new window | Download
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So you want to move to Hawaii, but you don't know where to live…Today we discuss a few of the best locations to live on each of the main islands. There are reasons you may want to move to these towns as they are the best for certain things like surf or art…other towns are the best fishing or best to retire, others are great for families, some have marina's and some are the sunniest…
BUT of all the Towns we talk about the one we DON'T recommend you moving or going to is KAILUA/LAIKAI on Oahu…it's soooooooo OVERRATED today. Unfortunately so many Tourist books and Japanese have been heading over to Kailua it has truly LOST it's small town feel…20 years ago this would have not only be a place WE would live, but a place WE would recommend you live as well. We can no longer recommend you go here. The community has had a love/hate relationship with people moving here and Tourists Tour Buses flocking to this beautiful small family town…because of these reasons Kailua is no more. Hopefully this will be a lesson for other towns in Hawaii like Haleiwa…hopefully they and others don't follow in the footsteps of what happened to Kailua Town and we hope the community of Kailua steps up and takes their town back from the politicians and Bus Tour companies who have allowed this to happen to their town. One of the reasons our tours do not enter Kailua…We don't wish to be a part of the problem no matter how bad our visitors want to see Kailua…we explain to them why we won't go and they fully understand.
We discuss…
OAHU: Haleiwa, Mililani, Hawaii Kai, Kaneohe & Honolulu
MAUI: Lahina & Kihei (we forget to mention Kihei, but it's a great affordable town and great for Families as well.)
KAUAI: Hanalei & Poipu as well as Princeville if you don't mind some tourism here and there.
HAWAII ISLAND: Kailua-Kona, Hilo, Puna & Keauhou


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JavaScript – Quick Validation
I will be the first to admit that I am not a Javascript king so this may be so elementary to most. This is a very easy way to verify that fields are filled in and the email address is a proper format. Make sure that your form has a proper name and that all […]Read more
Stop SPAM with CAPTCHA!
Every web site today pretty much accepts input from users. Unfortunately this almost always means that the site will accept input from bots, and malicious attackers. Why must people make the internet such a hostile place? Well luckily there are neat, and FREE tools to help developers stop this type of stuff. Let's focus on […]Read more


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The human factor
Social scientists say that IQ minus EQ makes for stunted relationships. Indian politicians need to internalise this and become less aloof and more accessible to the people, writes Barkha Dutt.india Updated: Mar 06, 2011 17:36 IST
For an emotional people who seek tactile validation from all other parts of our lives, have you ever wondered how we seem to end up electing politicians who are — for the most part — aloof and distant, irrespective of party affiliations? This quintessentially Indian gap between the voter and the voted is poignantly captured in the classic photo-image of every political rally. A sea of outstretched hands desperately trying to reach across a neck-high barricade, using the tiny open spaces to thrust their way in and somehow talk to — or maybe just even touch the leader-in-a-hurry on the other side. And this is when it is election season. Or maybe, in the aftermath of a natural disaster. For the rest of the year most politicians appear to be desk-bound administrators who inhabit a world that remains opaque and inaccessible to those who placed them there.
Indeed, they may work 16-hour days, firefight against a daily crisis and have jobs that are tougher than most of us appreciate. But the fact is that even the best-intentioned of them, appear essentially non-existent to their constituents. And decency cannot be a substitute for invisibility. In a world where online technology is forcing egalitarianism and empowering people into direct conversations with the world's most powerful, it is ironic that in India we are still to evolve a politics of mass contact and visible empathy. If anything — because Independent India was built on a Gandhian people's movement — this country's first generation netas were much more at ease among their own people.
Since then — and here's the irony — while politics has become much more representative in terms of caste, religion and gender, it has simultaneously become much more elitist, if measured in terms of how many of us are ever able to meet and directly connect with those we elect.
The haze of inaccessibility is even more deeply reinforced by the fact that at the top echelons of power, there appears to be a deep suspicion of or — at the very least — discomfort with the media and the platforms it could offer to serve as a bridge of communication. In informal interactions, I have never known Manmohan Singh to shy away from answering a question, no matter how awkward it may be. To the dismay of his minders, his answers are usually defined by a refreshing, no-frills bluntness. Yet, after six years in office, he is yet to give an interview to an Indian journalist. His interventions in Parliament are rare, and usually in response to an adamant demand for a prime ministerial clarification. And his press conferences in the capital attract headlines just for the fact that they are being held.
His predecessor, A.B. Vajpayee was not that much more forthcoming either and had converted his ambiguous pauses into a virtual political strategy. And while the BJP may legitimately raise questions today over what it calls the "silence" of Manmohan Singh, even its own leaders would not be willing to be part of an American-style presidential debate during elections.
By contrast, when you see Barack Obama sitting down to guffaw with five women on The View or David Cameron rolling up his sleeves and letting
his hair down at a university campus, our own political culture seems so stodgy and yesteryear. Sure, I don't think when we say openness; we mean the vaguely orchestrated chummy energy of the
Obamas on vacation, or an abiding interest in whether Sasha gets a pet dog. But between the Hallmark version of the politician-as-showman and the Indian extreme of the politician-as-introvert, surely there is space for a real, communicative, accessible form of connecting with people?
While this may read as the frustrated lament of a journalist, this is a debate that actually has precious little to do with the media. Politicians may even be correct in their contempt for the minuscule reach of the English language media in a country as vast as India. But can they afford to be as indifferent to the perceptions of the people? And doesn't silence and the absence of a tangible political narrative only exacerbate and worsen things for any government?
Every area of friction and flashpoint today has suffered precisely from this missing expression of empathy and articulation. In Kashmir, for example, with 61 civilian deaths, many of them teenagers, even children — the youngest victim is an 8-year-old — how can Indian politicians justify their silence and their emotional disconnect? Whether it's the chief minister — who made a trip to the hospital only after the deaths and injuries started mounting, or the prime minister himself who did eventually break his silence, but two months into the crisis — there is a sense of deep disappointment at the absence of immediate intervention.
Worse still, sometimes when politicians do speak, they speak in multiple voices and mostly to snipe at each other. So there is a lot of noise, but very little cogency. Nothing illustrates this better than the cacophonous disagreement within the UPA over the government's anti-Naxal strategy. As Mani Shankar Aiyar and Digvijay Singh express open dissent and key ally, Mamata Banerjee directly contradicts the home ministry's formulations, you can't help but feel that it is the absence of clear articulation at the very top that has amplified the confusion within.
Our choice as voters cannot be between the extremes of noise and silence, or aloofness and rehearsed friendliness. In the end, politics is about people and it should have no space for misanthropic inwardness. Effective politics belongs to those who have the common touch.
Social scientists who study human behaviour have long observed that IQ without EQ (emotional quotient) makes for stunted relationships. That may be a lesson that our political class needs to internalise. Or else, to borrow a line from the cult Paul Simon song, Sounds of Silence, in "restless dreams they will walk alone".
Barkha Dutt is Group Editor, English News, NDTV
The views expressed by the author are personal
First Published: Aug 20, 2010 23:47 IST


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Sleeping is something necessary, something important because it helps our brain to rest, and we can recharge our body to do any activity scheduled for the next day. However, there are people who find it difficult to sleep, but don't worry. There is a perfect remedy, and it's the use of some special oils that will help you rest completely. Here we leave some of them:
Rose Oil
Yes! As you can read, roses can also be used for other things like oil, and you will not regret doing it. This type of oil works as a remedy for any type of insomnia you're suffering from.
Chamomile Oil
This type of oil is actually the best for insomnia, and many studies have proven it. It helps you to fall asleep and relax not only your brain but also your body, eliminating any type of stress you may have.
Lavender Oil
This oil brings many health and skin benefits. Its smell is incredible, but t also helps you fall asleep quickly. You can sleep deeply without any kind of interruption and be able to get up the next day with a lot of energy.
Lemon Oil
Besides being an excellent remedy for our health, lemon oil is also incredible for this problem. It's an excellent remedy for people with insomnia because of the number of stimulants it has. You may even feel like you're sitting on a cloud, and insomnia won't be one of your worries anymore.
These oils also bring many nutrients and benefits for our health and beauty. Most of all, they're excellent to help you sleep and rest like a baby, without any kind of interruption. That's why we highly recommend trying any of these essential oils and play with different fragrances to relax and have a nice sound sleep tonight.…


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Time and place: Wednesday, June 5th, from 1:30 to 2:15 pm, Booth #509 on the DAC exhibit floor.
Author Archives: insights-from-leading-edge
Join The ConFab discussion
The overall theme of this year's conference is "Filling the fabs of the future," with a focus on the types of products that will drive demand for semiconductors in the next decade, the technologies and processes that will be required to meet this demand, and the manufacturing and operational challenges that will arise as a result of this demand and how to meet them.
We'll kick things off on Tuesday morning with a keynote talk by Yoonwoo Lee, executive advisor (and former CEO) of Samsung Electronics. He will speak on "Technologies and Business Strategies of the Future IT Industry." Mr. Lee is well known for his accomplishments in pioneering the development of the memory chip and LCD industries in Korea, and has been widely credited for turning Samsung Electronics into a global leader in the semiconductor business.
Session 1 will focus on major economic trends, with talks from Jim Feldhan of Semico, Bill McClean of IC Insights, Mark Thirsk of Linx Consulting and Dan Hutcheson of VLSI Research.
Next, we'll look at the design/manufacturing/packaging/testing supply chain, including collaboration between fabless/product design companies and foundries. Mike Campbell of Qualcomm and Jae Cho of Xilinx will present in this session.
In the afternoon on Monday, we'll hear from a panel of experts on 3D integration, including Mike Ma of SiliconWare, Subu Iyer of IBM (who will also be keynoting on Tuesday morning), HoMing Tong of ASE, and Bob Patti of Terazzon. A special thanks to Phil Garrou and IEEE CPMT, the technical sponsor of this session and another session on Advanced Packaging.
Tuesday will begin with a keynote from Subu Iyer, followed by a panel session moderated by Scott Jones of Alix Partners. The session will focus on R&D Portfolio Management and Improving R&D Efficiency. Jones will share the results of a AlixPartners' study of the 72 largest semiconductor companies globally over the past six years that found that companies with a higher degree of R&D efficiency show greater profitability.
We'll then get into a status report on advanced packaging, with an excellent line-up of speakers, including: Devan Iyer from Texas Instruments, Bob Lanzone from Amkor, Steve Anderson from STATS ChipPAC, and Ted Tessier from FlipChip International.
In the afternoon on Tuesday, we'll hear from Sanjay Rajguru of ISMI and a panel if speakers assembled by ISMI, focusing on accelerating manufacturing productivity.
We're posting information on the site about the speakers and their talks as we get them. Check it out!
Questions and answers on FD-SOI
In mid-December, we posted an article titled "STMicro: 28nm FD-SOI is ready for manufacturing" which elicited an interesting comment and response. The story noted that ST's "feature-complete and silicon-verified" 28nm planar FD-SOI Technology Platform, which is now open for preproduction from the Crolles 300mm manufacturing facility, encompasses a full set of foundation libraries (std-cells, memory generators, I/Os, AMS IPs, and high speed interfaces), and a design flow ideally suited for developing high-speed and energy-efficient devices. Measurements on a multi-core subsystem in an ST-Ericsson NovaThor ModAp platform revealed a maximum frequency exceeding 2.5Ghz and delivering 800 MHz at 0.6V, according to Jean-Marc Chery, EVP/GM, digital sector, and CTO/chief manufacturing officer of STMicroelectronics.
Sang Kim first commented, noting that "IBM had developed FD-SOI technology for the first time, but was not successful in manufacturing up to now because of the following four main reasons: Floating body effect, self-heating, ultra-thin SOI approximately 7nm required for 28nm node, and high SOI wafer costs." Kim noted that STMicro didn't mention how it has resolved these four problems.
In response, STMicro's Giorgio Cesana, director of technology marketing, posted a follow-on comment that I thought was quite interesting. Here's what he said:
"Thank you for those comprehensive questions. Responding gives us a chance to provide details of the advances of UTBB FD-SOI technology and remove any doubts you may still have about it.
1. Ultra-Thin Body and Buried Oxide (UTBB) FD-SOI technology is very different from Partially-Depleted technologies manufactured before. Those partially-depleted technologies were affected by floating-body effects where the body was subject to an uncontrolled charging/discharging that led transistor behavior to depend on the previous transitions –i.e. making them suffer from a kind of memory effect. In UTBB FD-SOI technology, hybridation lets us contact the body, so it is not left floating, overcoming the problems with PD-SOI technologies.
2. Self-heating is also a problem that exists with partially-depleted SOI technologies, where the buried oxide thickness (~150nm) was thermally isolating transistors from the substrate, leading to self-heating effects. UTBB FD-SOI technology offers two advantages to overcome this self-heating: The Buried Oxide (BOX) is extremely thin (only 25nm thick in 28nm technology), offering significantly less thermal resistance; The big diodes, the drift MOS, the vertical bipolar, some resistorsâ??¦ are all implemented on the "hybrid" bulk part, eliminating even the thin BOX below them.
3. Wafer thickness: The ST process specification is for wafers with 12nm thick silicon (+/- 5A). Process manufacturing then "uses" part of the silicon film for the manufacturing of the transistors, leading to a final 7nm film below the transistors.
4. Wafer costs: UTBB FD-SOI technology manufacturing uses up to 15% fewer steps vs. our bulk planar 28LP HKMG gate-first technology. This process simplification, by itself, is capable of totally compensating for the current substrate cost difference. Then, we expect in high volume production, UTBB FD-SOI die costs should be even better than bulk planar, with substrate-cost erosion and with UTBB FD-SOI improving electrical yield over bulk planar.
We hope these answers convince you, as they've convinced us, of the suitability of FD-SOI technology for sub30nm semiconductor manufacturing."
Thanks for the comments, and stay tuned for more of FD-SOI.
Present your ideas at The ConFab in 2013
We're presently recruiting speakers for the following topics:
• Economic outlook of the semiconductor and related industries
• The economics of semiconductor manufacturing
• Technology trends in the semiconductor industry
• Trends in 3D Integration, TSVs, advanced packaging
• Tips on managing 150mm and 200mm legacy fabs
• Collaboration between fabless companies and foundries, particularly
success stories
• Trends in logic, memory, analog and mixed signal devices and how they
drive manufacturing requirements
• New applications for semiconductors and related devices
Please submit your abstract before December 14, 2012.
Click here to submit your abstract on-line.
Speaker/Presenter Benefits:
• Attend a high-level conference including meals, networking events and
roundtable discussions
• Opportunity to collaborate with materials suppliers as well as OEM, fab,
fabless and foundry manufacturers
• Platform to present a unique perspective on a topic of interest to
high-level executives
Please note: By submitting your abstract, you are indicating your willingness to attend and present a paper at The ConFab 2013, if selected. Please ensure that the speaker and author details you provide when submitting your abstract are correct, as these will be used for pre-event marketing purposes.
I look forward to reviewing your abstracts.
Pete Singer
The ConFab 2013 countdown begins
We're already gearing up for next year's event, and would like to welcome to our newest member of the advisory board, Liam Madden of Xilinx, Inc. Liam is corporate vice president of FPGA Development and Silicon Technology at Xilinx. He has responsibility for FPGA design, Advanced Packaging (including Stacked Silicon Interconnect) and Foundry Technology.
For sponsorship opportunities, please contact Sabrina Straub: firstname.lastname@example.com.
We'll be working on content shortly, so stay tuned!
Pete Singer (email@example.com).
The ConFab: Big data is here
I ran into some colleagues almost as soon as I arrived, and we had a nice lunch at the Society Café (crab salad for me). After we all compared our smart phones (one iphone, two Androids and one Windows phone), we talked about how the semiconductor industry has changed over the years. One interesting tidbit was that a member of our group had heard that over 90% of the world's data has been created in the last two years (I found out later that this factoid comes from IBM in a report on so-called "big data").
What is big data? According to IBM, every day, we create 2.5 quintillion bytes of data — so much that 90% of the data in the world today has been created in the last two years alone. This data comes from everywhere: sensors used to gather climate information, posts to social media sites, digital pictures and videos, purchase transaction records, and cell phone GPS signals to name a few. Big data is any type of data – structured and unstructured data such as text, sensor data, audio, video, click streams, log files and more. New insights are found when analyzing these data types together.
The concept of big data isn't that new – in fact it's one of the trendy buzz works in business-to-business media today, and was a focal point of this year's American Business Media's annual conference. In a presentation titled "Building the Big Data-Driven Media Company of the Future," Frank Cutitta, CEO, The Center for Global Branding discussed how an "integrated database can help companies streamline their customers' experience, uncover new product opportunities and execute a successful lead generation program. But most importantly, it can give b-to-b media companies a chance to target customers based on their preferences." Yes, people are working on that at PennWell, but I digress.
Just imagine what this will mean for the semiconductor industry. Massive amounts of data are already being generated, and the future of many businesses will hinge on how quickly that data is collected and analyzed. Cha-ching! IBM says volume, velocity and variety will be key: Enterprises are awash with ever-growing data of all types, easily amassing terabytes—even petabytes—of information. "How do you turn 12 terabytes of Tweets created each day into improved product sentiment analysis?" they ask.
That's just one of the thoughts from The ConFab this year. More than 90% of the world's data has been generated in the last two years. Mind-boggling!!
Another thought – if you're not here, you're really missing out!
Oh, snap!: Pics from The ConFab
Funding the future: How best to spend limited R&D dollars?
These issues are top of mind since I've been asked to moderate a panel on this topic at the upcoming Advanced Semiconductor Manufacturing Conference (ASMC), to be held May 15-18 in Saratoga Springs, NY. The panel, "Competing for R&D Dollars: Funding the Future," will be held on May 16, 2012 from 4:30 to 5:45. The panelists will be:
— David Bennett, VP Alliances, GLOBALFOUNDRIES;
— Noreen Harned, VP Marketing, ASML;
— Subramanian (Subu) Iyer, IBM Fellow, IBM Systems & Technology Group;
— Nag Patibandla, Sr. Director (Office of CTO), Applied Materials; and
— Risto Puhakka, President, VLSI Research.
I think it's fairly clear that, with the industry's present model, it's going to be difficult to fully finance everything on the wish list. In fact, that's been one of the main arguments against going to 450mm: Wouldn't precious R&D dollars (or euros/yens/RMBs) be better spent on some other endeavor, such as 3D integration?
This isn't a new dilemma, of course. In a SEMI-funded reported published in 2005, Ron Leckie analyzed all the things that were noted in the International Technology Roadmap for Semiconductors (ITRS) and concluded that the funding gap could reach upwards of $9.3 billion by 2010. It's now 2012 and, two years later, Moore's Law is holding firm. On the other hand, there has been a fair amount of consolidation, and a shift to fabless and asset-lite (or capital-lite) business models.
In this blog, over two years ago, I reported that some believed that a massive restructuring is underway that will leave only a handful of companies producing devices at the leading edge. Bob Johnson, VP of research at Gartner, predicts that by 2014 there will be only 10 companies operating at the leading edge: 1-2 non-memory IDMs, 4-5 memory companies, and 3 foundries (speaking at SEMI's 2010 ISS). I haven't seen much to contradict that thinking. The percentage of revenue that chip makers are spending on R&D is fairly low, around 14%. It was at a historical low in 2010, only 12%
The way the industry has been able to get around the funding challenge is through collaboration. Consortia such as SEMATECH and imec are great models of collaboration, enabling companies to work on "pre-competitive" research to share costs and reduce risks. The Common Platform model employed by IBM/Samsung/GLOBALFOUNDRIES is another great example of collaboration. The entire CNSE/Albany Nanotech/G450C effort is perhaps the best example of university, industry, consortia and government working together (as I'm sure will be discussed at ASMC).
What's intriguing to me, though, is if the semiconductor industry will go the way of the automotive and aerospace industries, which have very different models when it comes to cost-sharing and risk-sharing. Mike Splinter of Applied Materials, Steve Newberry of Lam and Paolo Gargini of Intel all made references to those models at this year's ISS.
I don't have the answers, but if you have questions you'd like to pose to the ASMC panel, and aren't going to make it in person, let me know: firstname.lastname@example.com.
Thirty years ago today
Two weeks later, I was attending my first Semicon West writing stories for our show daily. I have attended every Semicon West since, plus many other Semicons in Europe, Japan, Korea, Taiwan and China, plus Austin and Boston when there was a Semicon Southwest and Semicon East. I tried to count how many days I got up, put on a suit and badge (a show badge) and reported to work on a trade show floor. Easily a year's worth. But it was that first trip to California, dining at Ondine's in Sausalito, looking out over San Francisco bay, when I thought, "hey, I really like this job!" And, of course, covering the most dynamic industry in the world, during the information age, has been a lot of fun too.
My first feature article was about photomask inspection and repair. Several companies, such as Florod, offered laser-based tools that could trip off a bit of chrome or add a bit of chrome to repair a pinhole defect. Today, eliminating defects on masks continues to be a challenge.
What I remember most from the early days was trying to piece together the overall process flow of an integrated circuit. Today, the 300 or so process steps — cleaning, etching, deposition, doping, etc. – are pretty well known, but that was not the case in the '80s when companies such as Texas Instruments and IBM jealously guarded their information. One Eureka! moment was when I saw the process flow of a 16K DRAM. Another was when I read my first set of papers from the International Electron Devices Meeting (IEDM). The conference organizers were kind enough to send abstracts of all the articles well in advance of the actual conference – it was always one happy day when that foot-high stack of paper arrived (now they send a link but it's still a thrill). One of those papers was by Lou Parillo of Motorola (he's now with Unity Semiconductor). I asked Lou to write a paper for SI on CMOS Trends, which he did in 1988. I think it was a bit of a challenge for him, probably due to time constraints – I clearly recall him saying I had him "screwed to the wall" on it – but he came through with an excellent piece. I also remember when the first International Technology Roadmap for Semiconductors (ITRS) came out, although I don't remember the exact year (1994?). That pretty much filled in any missing blanks when it came to process flow.
I did have the opportunity to interview Bob Noyce before his untimely passing in 1990. He always took time to talk to the press, which was nice. He likened semiconductor manufacturing to a swamp full of alligators. "You have to drain the swamp, and when you see an alligator, you shoot it," he said (or something like that). That's hilarious.. and I say that with 4 syllables like my 6 year old nephew does, hill-air-e-us.
Another article I wrote was on intrinsic gettering. Oxygen in silicon causes dislocations, and those dislocations trap or "getter" defects and impurities that tend to move around in the silicon (the oxygen is introduced into the silicon by the melting of the interior of the quartz crucible in which the silicon ingot is grown or pulled). At the time, I had no idea that there was so much action going on in solid materials. Or that they were so porous. In the case of ultra-high vacuum, small atoms such as hydrogen will move right through stainless steel, making 10-11 Torr, "ultra-high" vacuum difficult to achieve.
Some of the biggest trends and advances I covered over the years: the move from aluminum to copper, the switch from silicon dioxide to low-k dielectrics, the introduction of chemical-mechanical planarization (CMP), high-k dielectrics, strained silicon and, of course, continued scaling (we did a special supplement, Breaking the One Micron Barrier, in the late '80s). And the transitions to larger wafer sizes. I don't remember the transition to 200mm being a big deal, probably because IBM financed most of it (Paul Castrucci specifically) but I know the 300mm transition was pretty rough on many suppliers. Some are no longer around today as a result, I believe. It was really CMP, though, that was shocking. To take a wafer that had been handled so delicately, when it had acquired so much value, to turn it upside down and grind it down with a slurry… that was unthinkable, at least to me. But IBM proved it worked and the rest is history.
Other cool moments: walking the halls of IBM's Almaden research center, where I met with Grant Willson. My degree is in EE, so organic chemistry hurts my brain a bit, but Willson made it hurt less. I wrote an 11 page article on photoresist around that time, and had to figure out what diazonaphthoquinone novolac resist was all about, and Grant was very helpful. I'll never forget my first visit to Bell Labs in Murray Hill, where the transistor was invented. I stood in the parking lot for a bit, staring at that awesome building, totally awestruck! I later, just a few years ago actually, had dinner with Steve Hillenius (now with the SRC), who worked at Bell Labs, and he said his office was the same room where Shockley, Brattain and Bardeen worked their magic. The reverence in his voice was clear. A good read on the invention of the transistor is Shockley's "The Path to the Conception of the Junction Transistor". Shockley turned into a nut later in life, but it's still a good read (jeers to IEEE; this used to be free but now they want $10).
Another Eureka! moment came when I was reporting on some kind of technology award. I believe it was AT&T. I called someone up and my questioning was along the lines of what research led to this, what did you discover? His answer, which I'll never forget, was simple: It was really the people. It wasn't the company, it wasn't the technology, it was just a bunch of smart and dedicated people. Everything this industry has accomplished is truly amazing, but it's really the people behind it that deserve the credit.
If you've made it this far into this snoozefest, you may be wondering what happened to Semiconductor International. Well, Cahners was acquired at some point by Reed, which at some point merged with Elsevier to form Reed Elsevier (RE). If you think the combination of British managers and Dutch accountants is a good idea, then you'll like RE. Anyway, RE decided to get out of the business-to-business (B2B) publishing market and, in early 2008, before the biggest downturn since the Great Depression, announced that it was selling the Reed Business Information (RBI) division, which was largely based in the U.S. 30 different magazines or "brands" were on the block. It was the worst timing ever, and by early 2009, the decision to divest was cancelled. But, the damage was done. After selling a few and closing a few magazines in 2009, in April 2010, RE closed 23 magazines, including SI. Seven of those were eventually sold, but the majority simply ceased to exist. I had moved to PennWell (a fantastic company) and Solid State Technology in April 2008, so thought it almost comical, except for the fact that many good friends lost their jobs on that day.
Looking back over the last 30 years, what has clearly changed the most is media. With the evolution of the internet, ironically made possible by semiconductor technology, people are "consuming content" in every way imaginable, including blogs, tweets, podcasts, videos, e-newsletters, e-mail. An editor today also has to be tuned into all the social media: Facebook, LinkedIn, Twitter, YouTube, GooglePlus, Pinterest, etc. Search engine optimization know-how is also a must (I'm not complainin' I'm just sayin'). Most people use social media and Google to stay up on the news and trends, but sometimes very technical information is best absorbed by hearing someone explain it. That's probably the best part of being an editor for 30 years: Some wonderful and very smart people have taken the time to patiently explain things to me, and I have done my best to collect that and pass it on.
I can't imagine what the next 30 years will bring — the Internet of Things and some major advances in personal medicine enabled by semiconductors, no doubt, which I will hopefully need later rather than sooner, but, as always, send me your ideas: email@example.com.
The packaging side of The ConFab
This year, for The ConFab 2012, an entire session is devoted to Advanced Packaging and Progress in 3D Integration. The session chair, Abe Yee, is Director of Advanced Technology and Package Development, Nvidia Corp. The speakers will be:
• David McCann, Senior Director for Packaging R+D, GLOBALFOUNDRIES
• Sandeep Bharathi, Vice President of Engineering, Xilinx
• Ron Huemoeller, Senior Vice President, 3DAmkor
• Bill Chen, ASE Fellow and Sr. Technical Adviser, ASE
The focus of the session will be, in part, on 3D integration which continues to offer the promise of packing ever-higher amounts of functionality into a smaller area. We'll also be focusing on the significant progress that continues to be made in traditional packaging (such as package-on-package and wafer level packaging).
The abstracts are still coming in, but Ron Huemoeller, for example, plans to discuss some of the challenges and opportunities for high density 3DIC Through Silicon Via (TSV) product technologies in the semiconductor industry. He says that TSV product technology offers significant opportunity in the advanced product sector of the semiconductor industry as compared to traditional System on Chip (SOC) methods for packaging die. The first part of this presentation will focus on the opportunities provided by TSV product technology in the following key areas: performance and power improvement, form factor reduction and in cost reduction at the system level. The second part of this presentation will focus on the challenges remaining in bringing this new product technology to high volume production as well as anticipated product launch dates. Particular focus will be given to the issues surrounding supply chain constraint as well as the issues associated with current state of the art approaches to completing the die stacking of these complex package structures.
A strong focus on packaging was also in evidence in 2011, with a session featuring John Waite (GLOBALFOUNDRIES), Raj Pendse (STATS ChipPAC), Robert Darveaux (Amkor), and Nick Yu (Qualcomm).
• John Waite presented "Supply Chain Reaction: A Collaborative Approach to Packaging Innovation"
• Raj Pendse presented "3D Packaging Evolution from an Outsourced Semiconductor Assembly and Test (OSAT) Perspective"
• Nice Yu presented "3D Through Si Stacking Technology," and
• Robert Darveaux presented "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
A recurring theme among the presentations was that 3D integration shows tremendous promise, particularly with many fabless companies, yet many barriers remain. "We firmly believe 3D will provide a better form factor and better system level performance," said Nick Yu, VP of technology development at Qualcomm. He believes that smart phones and the demand they create for wide I/O memory stacked on logic could be the key enabler for through-silicon via (TSV) technology. "We really think it can bring the best of all worlds into your mobile handset," he said. "We think the smart phone space is really the right application for 3D TSV stacking." Growth in this market drives a lot of volume, which will drive down the cost and drive adoption, thus justifying the industry's investment.
At the time, Yu said Qualcomm is pushing for implementation by 2013, and that over the last four years they have already completed a lot of engineering work with the supply chain and demonstrated the concept. It's a little bit of a "chicken-and-egg" situation, he noted, because a driver product is needed to acquire process learning and drive the product ramp, but there are "no real show-stopper or intrinsic technical issues," he said.
Supply chain needs a 3D ecosystem, as 3D is disruptive to how we do things today. SOURCE: Nick Yu, Qualcomm.
Wide I/O memory on logic provides significantly more bandwidth. The memory industry's view is that as smart phones blur the lines between tablets and hand laptops, demand for memory bandwidth will be nearly insatiable. To enable that, standards are needed and JEDEC is going to finish the wide memory standardization by the end of 2011. Memory vendors will have parts sampling in 2012, all targeting end-product going to market by 2013, according to Yu (again, speaking in 2011).
What's not quite there yet, though, according to Yu and other presenters at The ConFab, is the 3D supply chain. "3D really ties a lot of other players together and it has this really complicated cobweb type of relationship," he said. "It is, in a sense, quite disruptive to the supply chain. That's certainly one of the major challenges for a fabless company like Qualcomm. We've been spending a lot of time and resources to work with the supply chain for the last four years on this."
Qualcomm has a clear vision of what the product looks like, and that the architecture has already been optimized, Yu explained. The next step is to implement that in the manufacturing process — and therein lies the rub. "I think there are some integration challenges out there that we haven't quite fully resolved," he said. "We need some sort of standards and conventions between the supply chain hand-offs." One example is the quality of a stack of known good die (KGD). "If we have a stack of memory, what is meant by a known good stack of memory? Who's going to be responsible for the test, and what's the quality of it?" All these discussions need to happen between the supply chain partners, with "huge implications" for their balance sheets, he noted.
Other business model questions: Who ultimately owns the dies? Who owns the inventory? And does the "pass-through" business model work? How is it going to be funded? Who owns the integration process in the end, and who owns yield? There are no easy answers and that's part of what The ConFab is all about – giving people a forum to ask those questions and get answers.
The good news is that companies such as Qualcomm appear to be committed to making it work. "We really thought about all those challenges and we've set out to work with the industry, leveraging some of the standards bodies and really pulling together different players in the supply chain to work through that," Yu said. "There's a lot of good will and intent in the industry, but I don't think there's enough leadership."
John Waite, VP, packaging development and central engineering at GLOBALFOUNDRIES, presented noted that, since packaging costs are the dominant contributor to the value chain, designers need to select the right combination of silicon and packaging technologies to achieve performance and cost goals.
What enables success in the More Moore realm? Waite listed diverse options for wafer bumping (lead-free, copper pillar, lead and high-lead solders used in bond on pad, repassivation or redistribution [RDL] designs) and package form factor (QFP/QFN, BGA and flip chip, wafer-level chipscale packages [WLCSP]), as well as vertical options that take advantage of Z space (stacked chips, system in package [SiP]). These each have tradeoffs of cost, time, and density/performance, and customers must make packaging choices with these goals in mind.
Packaging influences the front end. SOURCE: John Waite, GLOBALFOUNDRIES.
Packaging increasingly requires attention on the frontend because of the packaging demand on the wafer. The frontend, backend, and system suppliers must collaborate in chip development. Early engagement, EDA tool flow optimization, turnkey wafer-to-package assembly, and other risk reduction strategies take a design from R&D into high-volume manufacturing.
While integrated fabless companies are ramping up leading-edge 3D IC designs, the lack of standards is holding back the 3D ecosystem. Traditional business models also don't support the boundary-breaking 3D design and process steps. Yu supports integration via standards bodies and research consortia to bring design and manufacturing standards to the 3D arena. Consider Yu's questions: Who owns the die? Who holds the inventory? How are pass-through costs funded? Who owns the integration process? Who owns the yield? Is the additional risk of TSV worth the benefits over wire-bonded stacks? Is a fabless design company or an IDM the way to go? The key question here is who acts as the "3D aggregator"? Foundry, memory company, OEM, fabless, OSAT?
Raj Pendse, VP of product and technology marketing at STATS ChipPAC and Robert Darveaux, CTO of Amkor, covered this supply chain integration from the dedicated packaging house perspective. Pendse presented "3D Packaging Evolution from an OSAT Perspective." Darveaux spoke on "Supply Chain Challenges for 3D Integration of Memory and Logic Devices using TSVs."
Material flow and infrastructure evolution. SOURCE: Dr. Raj Pendse, STATSChipPAC Inc.
Pendse sees synergies and intersections among parallel developments in the three areas of packaging technology (i.e. traditional die and package stacking on substrates, fan-in and fan-out wafer level packaging and 3D Si integration). With these new process technologies, the OSAT industry's role is transformed. Pendse channels wafer bumping, thinning, and other tasks into an in-between space for the Si foundry and OSAT to determine logical hand off points. Many of these processes can be done in both — the question to ask is who can do it better in each scenario? Is TSV fabrication best handled in the fab, with the OSAT taking over via fill and silicon interconnect? Pendse also spoke on "bridge" technologies — interposers, super-thin package-on-package, TSV hybridized with fan-out wafer-level packages (FOWLP) — that play an interim role in the commercialization of 3D. Pendse shared a typical OSAT TSV roadmap through 2013 with the attendees.
Darveaux compared the relative ease of sourcing, assembly, and test of package-on-package (POP) with the challenges of TSV: difficult to test high-density area array contact pads or bumps; bare or partially assembled memory and logic die that are difficult to burn in adequately; a newer joining technology not widely available to OEMs and contract assemblers; a poorly characterized joining process yield; and, due to the immaturity of the test, burn-in, and assembly; unclear ownership of defect liability. This applies to the "2.5D" interposer strategy as well as pure 3D TSV stacks. Interconnect processes are too new and done in too small sample sizes to lead to industry agreement on the right method: die-to-die first or die-to-laminate first? Interposer in singulated format or wafer format?
Consortium collaboration model.
Supply chain collaboration model.
SOURCE: Robert Darveaux, Amkor Technology.
These problems cannot be resolved by technologies or business models alone, he said. TSV processes can be standardized and characterized, with the resource-sharing model of consortia or the faster but potentially messy supply chain collaboration on specific projects. Both offer pros and cons, and fit different needs of the industry.
Also in 2011, Raj Jammy, VP of materials and emerging technologies at SEMATECH, covered a broad swath of CMOS scaling drivers, system and device trends, and infrastructure requirements, many of which have a direct impact on packaging. System-level trends, such as smart phones, mobile computing (e.g., iPads), and cloud computing are driving requirements for low- and ultralow-power logic with multi-core/multi-modules, dense 3D nonvolatile memory RAM for SSDs, and dense DRAMs. There is also a move to SoCs, along with high levels of functional integration and faster data transfer between modules and chips.
At the system level, the implications for devices include an even greater need for leakage reduction, and wide-band intra-chip and inter-chip interconnects. At the device level, architectural transitions to 3D FinFETs, III-V FETs, 3D flash memories, RRAM, STTRAM, SoCs, and 3D TSVs, and even photonic interconnects are being evaluated. Each of these alternatives poses specific challenges — but common to all are strong infrastructural needs to be successful. Among the transitions' challenges will be new materials and/or using non-silicon materials, new models/test methods/designs, integration challenges, as well as processes, materials, tools, and packaging.
The biggest challenges for high-volume manufacturing of through silicon vias (TSV), Jammy said, are all through the process flow. Bonding and de-bonding is one major example, with poor throughput. Materials stresses, especially on thinned dies, are another.
SoC technologies are on the verge of some significant changes, Jammy predicts. For example, an entire smartphone could be fit onto one SoC. With system in package (SiP), additional functionality will be integrated, even MEMS devices.
Packaging has a rich history in previous ConFabs going back even further. In 2010, for example, Matt Nowak, director of engineering in Qualcomm's VLSI technology group, said high-density through-silicon stacking (TSS) shows promise for very high-volume applications, but work still needs to be done to "tame" key issues in manufacturing, improve costs, and smooth out the supply-chain. He also urged standards for supply-chain handoff points, with specs and test methods to reliably manufacture TSS from multiple sources and processes, validated by experimental results (reliability, cost, yield, etc.). Target areas for initial standards include:
• Nomenclature/definitions
• TSV size, tier thickness, via fill material
• Tier-to-tier pin locations and assignments
• Key physical design rules
• Microbump and passivation materials properties and geometries
• Reliability test methods
• Metrology
• Thin wafer shipping
Also in 2010, Jim Clifford, SVP/GM of operations at Qualcomm CDMA Technologies, talked at length about the convergence of wireless connectivity and increasing performance requirements, the resulting technical (and economic) challenges brought upon supporting technologies, and the importance of "early engagement" to cost-effectively research and develop products. He, too, stuck to a common theme across many ConFabs over the years: Collaboration across the entire eco-system. Speaking to Qualcomm's bread-and-butter, Clifford highlighted the "integrated fabless model" in which fabless companies engage with foundries very early on. In the IFM model, development starts toward the end of module development; then investing in IP/design/product development (including integration/qualification), and then production. An aligned ecosystem across the entire value chain (foundry, customers, research, EDA, IP, packaging, and testing) is required to optimize product innovation and execution. Clifford highlighted the need for early engagement with research organizations for a "co-design start," a phase dubbed "early pathfinding," which starts before and extends beyond module development and into integration/product development.
Prior to that, system-level considerations of 3D ICs were presented by Tom Gregorich, VP of Qualcomm, in a session discussing the "Economic implications of 3D" at the ConFab in Las Vegas in 2008. He reminded the audience that end-users of portable electronics products — such as cellphones and PDA — expect reliable functionality regardless of dropping, kicking, or washing the device. Delivering ever greater functionality in essentially the same robust package is a mandate for innovative concepts such as 3D.
Subramanian Iyer, distinguished engineer and chief technologist of IBM's Systems and Technology Group, explained the economic considerations behind 3D microprocessors. He noted that the economics of any new technology need to be assessed with respect to the advantages of other competing approaches that provide the same or similar benefits. Both embedded DRAM in a system-on-chip (SoC) and stand-alone DRAM as part of a system-in-package (SiP) have been well established as 2D solutions, so any 3D approach must be compared to these proven techniques. Iyer made his case by examining the relatively straightforward but very important challenge of balancing memory with 64 processor cores in a system.
Beyond today's stacked chips in a package may come higher performance 3D stacked ICs using through-silicon vias (TSV) to interconnect layers, according to Sitaram Arkalgud, who spoke on the economic implications of 3D.
In short, during the 8 years of The ConFab's history, packaging topics have always been at the forefront, and will continue to be this year and in the future.


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'Mirror Mirror' trailer: Are the Snow White wars overblown?
Those of us who make our living following the entertainment business tend to look for rivalries because, well, it's fun, and because Hollywood is enough of a copycat place that it's impossible to avoid the competition even if we wanted to.
But we didn't have to look very hard to find a battle between Universal Pictures and Relativity Media over the last year as they each raced to mount Snow White movies. The fight had more story lines than the Grimm Brothers could come up with: Two movies, each putting a new spin on the virginal beauty and the mirror-gazing villain, were pushing forward at the same time.
Each had buzzy young actresses in the title role (Kristen Stewart for Universal's "Snow White and the Huntsman" and Lily Collins for Relativity's film, which would eventually be titled "Mirror Mirror") and an established Oscar winner as the Evil Queen (Charlize Theron in "Huntsman" and Julia Roberts in "Mirror").
Each hired Hollywood outsiders to get behind the camera (Rupert Sanders for "Huntsman" and Tarsem Singh for "Mirror").
To top it off, you had two companies with history: Relativity for years had financed a large section of Universal's slate before breaking out to produce and release movies on its own.
Throughout the summer, it seemed like the companies played chicken with release dates, before settling on March 16 ("Mirror") and June 1 ("Huntsman").
But there's been a nagging feeling for a while now that the movies may not turn out that similar to one another, if only because that's not really in anyone's interest. As much as each side in one of these battles says it wants to win, what it really wants is to avoid cannibalization. Sure, these standoffs sometimes amount to riches for everyone -- "Armageddon" and "Deep Impact," from 1998, is the oft-cited example -- but chances are if two studios make their movies too similar to each other, they'll both lose at least a little bit.
If there was any doubt that the similarities were overstated, the newly released trailers underlined the point. The spot for "Snow White and the Huntsman" came out last week, and it immediately made clear it owed a creative debt to a host of genre movies, from "Twilight" to "The Dark Knight." The villains were genuinely scary and the mood was ultra-serious; even the heroine's not doing much smiling.
Right on its heels came Relativity Media on Wednesday -- it seemed like a response, but who could say for sure -- with its own trailer for "Mirror Mirror." The company appeared to have blinked when it took the "Snow White" name off its movie. But it may also have been hinting at something else: Its film really doesn't go to the dark roots of the Grimm Brothers or to the hunter/hunted angle of its counterpart.
As the trailer suggests, it's a light, bouncy story, somewhere between "The Princess Diaries" and a live-action "Shrek." Roberts' Evil Queen isn't fearsome as much as goofy, and Collins looks like, well, a princess, not sprinting, breathless prey. (For our sister blog Hero Complex's take on the two trailers, please check out its story here.)
It's possible that some filmgoers will still conflate the films. But at this point it's becoming clear that each movie can succeed on its own.
Not that that will be easy. "Mirror Mirror" has to battle it out with the proliferating number of family films, which has already claimed some victims. And "Huntsman" has plenty to worry about with the other dark mythology-laden stories, such as "The Dark Knight Rises," which comes out this summer, and fairy-tale television dramas like "Grimm" and "Once Upon a Time." There will be rivalries, in other words. Just not necessarily the ones we expect.
Snow White and the Huntsman vs. Mirror Mirror: Which is fairest of them all?
Mirror Mirror trailer shows another side of Snow White
Kristen Stewart's Snow White looks to be the fairest of them all
Kristen Stewart vs Lily Collins: Who's the fairest of them all?
-- Steven Zeitchik
Photo: Julia Roberts in "Mirror Mirror." Credit: Relativity Media


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Summer scorchers – How to recognize and avoid heatstroke in pets
With the dog days of summer before us, pet owners should beware of the dangers of heatstroke in pets.
Heatstroke is a life-threatening condition that results when pets cannot adequately rid themselves of excess body heat. Pets rely on panting to cool down. Although panting is a very efficient way to control body heat, it is severely limited in areas with high humidity or low ventilation. The intake of cool, fresh water improves the cooling effects of panting.
Keep reading ...
Horse and burro management must be balanced with wildlife and other natural resource needs
DENVER - Arizona Game and Fish Department Director Larry Voyles this week told the National Wild Horse and Burro Advisory Board that federal proposals to change how wild horses and burros are managed must have a goal of ensuring a thriving ecological balance between horses and burros and wildlife, and include the involvement of state wildlife agencies.
Keep reading ...


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recipe for rhubarb meringue pie
May 4, 2007 at 7:49 pm 3 comments
You won't find any strawberries in this rhubarb pie to make it mushy and sweet. All you'll find here is rhubarb in all its tart glory. This is a wonderful recipe from The New England Yankee Cookbook, 1939, by Imogene Wolcott.
I Tablespoon butter
1 1/4 cups sugar
2 cups rhubarb cut into 1/2 inch pieces
2 eggs, separated
1 tablespoon flour
4 tablespoons sugar
baked pie shell
Melt the butter, add 1 cup of the sugar and rhubarb. Cook until the rhubarb is slightly softened and the sugar is melted. Add the egg yolks, slightly beaten. Mix the remaining 1/4 sugar with the flour and add to the rhubarb mixture. Cook until rhubarb is of a jelly-like consistency. Pour into baked pie shell and top with meringue made by gradually beating sugar into the egg whites until stiff peaks form. For a higher meringue, use more egg whites and sugar and add a little cream of tartar.
Pour into a baked pie crust and brown in a 300 degree oven for about 15 minutes–longer if you use more meringue. Allow to cool at room temperature and then store in refrigerator.
Read what can happen if you don't follow the directions.
Entry filed under: baking, recipes, rhubarb pie.
3 Comments Add your own
I haven't ever tried rhubarb meringue pie… my Mom always made rhubarb custard pie at our house. No strawberries in her recipe, either… I have always preferred it that way. I haven't made the pie in a long while, even though I have one of the biggest happiest rhubarb plants out in my backyard. What annoys me is that every year, almost before I notice that the rhubarb is up and growing again, it shoots up those big flowers that I never used to see on grandma's rhubarb growing up… but my aunt told me that rhubarb does bloom sometimes, and when it does the stalks aren't supposed to be at their best flavor anymore. I don't know. Also, I'm pretty much the only one in my family that will eat the stuff. Too bad because I have these giant thick rhubarb stalks that would probably fetch a pretty penny at a farmer's market. Oh well.
Maybe I'll go out and pick some today, in spite of the blooms, and see if I can get one good pie out of it this year.
At this moment I am going away to do my breakfast, after having my breakfast coming again to read additional


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Mac Miller's Watching Movie With the Sound Off was an refreshing deviation from some of the Pittsburgh rapper. Though the album was chock-full of great collaborations with a wide range of producers and artists, Watching Movies was generally overshadowed by the public's conception of the rapper and not by the beats and rhymes that were associated with the album. Today, Mac gives us the visuals for "Gees," the track he did with Los Angeles rapper ScHoolboy Q. The video features both rappers consuming some 40's and riding around on bikes, all with some trippy, multi-colour, saturated visuals. Check it out down below.
Directed by:Mike Waxx and Mike Carson of illRoots


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Jungle Spirit - Call of the Wild Slot Review
A brand new slot has just been announced by Net Entertainment. The game is called Jungle Spirit: Call of the Wild and is scheduled for release on 20.02.2017. This new title comes weeks after NetEnt launched the successful Scruffy Duck slot as well as Wild Wild West. It is obvious that the gaming giant wants to assure its dominance as the biggest slot provider on the market. Upon release players will be able to access the game on LeoVegas, Rizk as well as most other major online casinos.
Slot Description
Jungle Spirit - Call of the Wild is a 5 reels and 3 rows slot game which will be available on desktop, tablet and most other mobile devices. The number of paylines goes from an initial 243 up to 1024. The min and max bets players can lay - range from €0.20 to €100, depending on the currency played. As the name suggests the game's theme is all about the jungle. Tropical flowers and trees are featured on the background. The reel set resembles stone ruins of an ancient extinct civilization and vines sticks hang on all sides.
The high value symbols on the reels are all theme related and feature cobras, crocodiles, bears, elephants and tigers. 10, J, Q, K and A make up the lower value symbols. The scatter symbol is a pink flower. There is no wild symbol on this game.
Symbol Expansion
This a random feature which can be triggered both in the base game and during the free spins. Each symbol in the game, except the scatter, can be marked by butterflies. If any of the marked symbols contribute to a winning combination, they will expand to cover that reel.
Butterfly Boost
This is another random feature which can be only triggered during the base game. Butterflies will fly around the screen and land on 1 or 5 symbols, which are part of a winning combo. The symbols with butterflies will expand to cover the entire reel.
Free Spins
The free spins feature is triggered by landing 3 or more scatters anywhere in view. Landing 4 or 5 scatters will also award a prize of respectively 15 and 50 times the bet. The free spins will be played on 1024 paylines. When the free spins are triggered the player will have to pick between 5 options, each represented by an animal.
- Tiger – 4 free spins
- Elephant – 8 free spins
- Bear – 12 free spins
- Crocodile – 16 free spins
- Cobra – 20 free spins
The game states that the options with the fewer spins have a higher volatility. This means that the chances of huge wins are bigger on the options with the least spins.
Jungle Spirit - Call of the Wild is a high volatility slot with an RTP of 97%. The max win on a base game spin is 1825 times the stake. However in the free spins, due to the 1024 paylines the max win goes up to a staggering 7678 times the stake. The game has an excellent design and amazing graphics. Another unique and exciting title by NetEnt that promises to become a fan favorite.
For a Better look on Jungle Spirit - Call of the Wild check out the official Trailer on the video below:
Let us know what you think about the game in the comments. Or join our forum for discussions.


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I know the last few posts have been closely related to my return to America and adjusting, so I apologize for that. Today, I want to talk about the many things that affect adjusting back to American living and what culture shock really does to your body. I have several friends who have never experienced what I have, or at least not to the same extent, and that's mostly what this is for.
I would have to say that the biggest and most challenging thing about all of this is you can't prepare completely for it and you have no control over it. You can't speed up the adjusting process. You can prepare your heart and mind all you want, but there are so many things you cannot prepare for or expect.
My third week back was extremely difficult. I was exhausted all the time and every day felt as if I could fall apart at any moment, and I did a couple times. I grew frustrated with myself and my circumstances, then I got frustrated that I was even frustrated in the first place. God has blessed me so incredibly much since being back, in ways I not only don't deserve, but never expected. Because of these blessings, I was feeling that I had no right to be frustrated.
The second most challenging thing is that on the outside, you look perfectly fine, but on the inside everything is a mess.
I have barely been able to have full thoughts over the past couple weeks. I have had to write literally every single thing down that I need to remember, and even then I still may forget. In a previous post, I wrote about staring at orange juice for ten minutes because I was used to two size options not fifty size, brand and pulp options. On the outside, I may have looked like I just was taking my time deciding, but on the inside I was beyond overwhelmed and felt that I could fall apart on the spot (and surprised I didn't).
The third for me has been the ability to be emotionally present.
I thought that since my heart for Honduras and God has opened some amazing opportunities for me here, that this aspect of adjusting would be simple. I couldn't be more wrong. I could be in a deep conversation with a friend or having game night and laughing with a few friends, but I don't feel present. I feel like I'm simply observing, watching my life pass by without having the ability to be there and enjoy it. This is one of those things that has grown increasingly frustrating for me, because I so badly want to be here. It almost makes you so focused inward, that you feel extremely self-centered. I was told that I've been pretty quiet since being back, and this is why. It is better some days than others and it something that will slowly wear off, but being patient with that is difficult.
Lastly, it's all the little things that get you, the ones you don't even think about!
It's hearing a father speaking Spanish to his children in Target and completely tuning your friend out and being sucked out of your own world for a couple minutes without realizing it. It's seeing kids that look like your students and seconds before waving, realizing that it's an impossibility. It's paying $60 for food that would only cost you $20 a month ago. And most importantly (haha), it's paying $5 for a coffee that isn't as good as the $1 coffee you used to enjoy every day.
I feel like I'm coming into a more stable place. I'm beginning to have a schedule again and real-life is starting to settle in. Maybe I will never be able to truly live as I did before Honduras. Maybe the cost of living will always surprise me. Maybe hearing Spanish will always pull me out of reality. Maybe $5 coffee will always sadden me.
I'm learning, extremely slowly, to be patient with myself. In order to be patient with myself, I have to surround myself with people who are patient with me. I have had such a great support system in returning, of people who encourage me to take my time in adjusting.
I'm learning to rest and to be content in where God has me. Learning all I can while I'm there, and taking the next steps in being more adjusted. It's exhausting, frustrating and sad at times, but it's a process that I have to walk through.
Have a blessed day!


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Dr. Simon Ramo, a legendary American engineer wrote a book in 1970 about, of all things, tennis, titled Extraordinary Tennis for the Ordinary Player.
The engineer in him noticed that the game of tennis involves two games – one is played at the professional level and the other is played at the weekend warrior level.
Now, that's not particularly brilliant, but the conclusion he reached from his observation is.
After extensive analysis, Ramo concluded that professional tennis players win points while amateur players lose points.
In other words, for professionals, most points are won by the pro hitting a spectacular winning shot that is just out of reach of their opponent (a "winner's game"), while amateurs typically lose points by making an unforced error (a "loser's game").
Writing in a famous 1975 Financial Analysts Journal article, noted investment analyst Charles Ellis extended Ramo's tennis concept to the investment business.
Ellis said investing had flipped from being a winner's game to a loser's game.
I think what he meant was that to succeed at investing you need to focus on making fewer avoidable errors as opposed to making spectacular winning investments.
Now making fewer avoidable errors is a worthy goal at any time, but it is critical in today's more mature property markets.
So what has all this got to do with property?
The best way to explain this is that during property booms it's easy to look smart. Rising values cover up many mistakes.
But the property markets around Australia are very fragmented and even those that performed strongly over the last year or two are unlikely to exhibit the same levels of growth in the future.
That reminds me of 2 of Warren Buffet's famous sayings:
- "A rising tide lifts all ships" and…
- "When the tide is out you can see who is swimming naked."
Yet some investors are doing very well.
While some investors are floundering, at the same time other, more strategic investors, those who understand the importance of correct timing, proper asset selection and smart financing using financial buffers, are heading towards financial independence through smart property investing.
These successful investors are not trying to get rich quick. Instead they focus on making fewer avoidable errors by using proven trusted property investment systems.
The 4 types of knowledge you need to seize control of your financial future:
To make the most of our current schizophrenic economic and property markets strategic property investors will need:
- Unbiased economic insights
- Education based on proven property investing principles and strategies
- Guidance from expert investors who have been there, done that
- Insider information so you can spot market trends that are "hidden" from the average investor
That is why it is critical to learn from experienced and successful property investors, from someone who has already achieved what you want to achieve and has retained their wealth in the long term.
I also see it as a great time to not just wait for the market to do its thing, but to actively "manufacture growth" by getting involved in property investment in South Africa and then holding on to your properties in the long term and enjoying the capital growth. And that's precisely the topics we'll be teaching at my monthly Property Investment Seminar – http://propertyseminars.co.za/ – book your seat now.
We give our investors the tools, knowledge and peace of mind to start a buy to let business and to make property investment the cornerstone of their pension fund for early and carefree retirement."


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13 Dec 18
Breathing Buildings' NVHR® Wins Prestigious Energy Award
Breathing Buildings is delighted to announce that it has won a prestigious Energy Award.
Air quality and thermal comfort are crucial for any building. On warm days, the benefits of natural ventilation are obvious – bountiful amounts of fresh air and a connection with nature help create a healthy, happy environment. In cooler weather, a purely natural system can struggle to provide sufficient fresh air without causing unwelcome cold draughts. Breathing Buildings pioneered the concept of 'mixing ventilation' and is the world leader in controlled hybrid ventilation systems.
13 Dec 18
Breathing Buildings is delighted to announce that it has won a prestigious Energy Award.
26 Nov 18
27th & 28th November 2018, Olympia, London
20 Nov 18
Recognising the vital importance of good indoor air quality (IAQ) and thermal comfort in schools, the Energy Awards have shortlisted Breathing Buildings in their 2018 awards.
1 Nov 18
Breathing Buildings is delighted to have won the 'Commercial/Industrial Ventilation Product of the Year' category at the HVR Awards 2018


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"Only 30 seconds gone and all of us are captivated, spellbound and lapping it up." - Alan Scott-Theatreview
15,000+ children saw this extraordinary show in 2017/18.
700 schools will hear about it in 2019.
20,000+ children will see it in 2019.
What Is the Matariki Glow Show?
It's literally legendary! A giant scale puppet show for 2-10 year olds with magical glow-in-the-dark characters from Māori myth and legend. This innovative, cutting edge new concept features over 45 glow-in-the-dark puppets under ultraviolet light in a black box theatre environment.
Rich in Te Reo Māori and Māori culture it's an upbeat show that has the audience buzzing from the onset. This masterful 40-minute show is underpinned by catchy music that engages the audience immediately, followed by a Q&A session afterwards for our tamariki. There's an abundance of educational content to take back to the classroom.
Phone: 09 3075058
Wednesday 5 June, 10:00am to 11:00am
Wednesday 5 June, 11:30am to 12:30pm
Restrictions: All AgesBuy Tickets »
Phone: 09 3075058
Napier Municipal Theatre, Napier, Hawke's Bay / Gisborne
119 Tennyson St, Napier, Hawke's Bay / Gisborne
Disclaimers and Copyright
While every endeavour has been taken by the to ensure that the information on this website is accurate and up to date, shall not be liable for any loss suffered through the use, directly or indirectly, of information on this website. Information contained has been assembled in good faith. Some of the information available in this site is from the New Zealand Public domain and supplied by relevant government agencies. cannot accept any liability for its accuracy or content. Portions of the information and material on this site, including data, pages, documents, online graphics and images are protected by copyright, unless specifically notified to the contrary. Externally sourced information or material is copyright to the respective provider.
© - https://www.napiernz.com/ / +64 0800 847 488 / email@example.com


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Summary of Recommendations
This section includes the 7 high-level recommendations provided by TkMC in their final report. The paragraph in italics following each recommendation provides the City Manager's and Chief of Police's initial plan to address the recommendation.
- City Council and the RPS Board of Police Commissioners receive the Report titled, "Choices for Redefining Excellence" (December 2004). The report will be officially received from TkMC by Mayor Pat Fiacco on Monday, January 24, 2005. It will be tabled with City Council that evening.
- Council establish a Committee of Council to act as sponsor of the Implementation Plan, oversee the implementation and provide necessary recommendations to Council. (December 2004) The Executive Committee of Council will be responsible for monitoring progress of implementation for the City of Regina. The Board of Police Commissioners will be responsible for progress monitoring for the Regina Police Service. Corporate issues or those strategic initiatives that affect all of City Council (e.g. strategic planning) will be addressed through Executive Committee. Department specific issues will be reported on through the respective standing committee (e.g. Transit issues will be addressed through Parks and Community Services Committee).
- The RPS refers the Report to the Chief of Police to review and provide a recommended course of action. The referral will be officially undertaken at a meeting of the Board of Police Commissioners in early 2005. The implementation will be managed through the Chief's Office.
The City establishes a Program Management Office (PMO) reporting to the City Manager to:
- Review opportunities and categorize as to relative degree of change, implementation effort and implications. These implications should include but not be limited to impact to service, requirement for policy change, Council and Administrative roles.
- Assess the public engagement requirements for the various categories of opportunities based on the implications determined above, and in conjunction with Public Affairs recommend an engagement plan as part of the implementation.
- Develop a detailed program plan for implementation of strategic and tactical initiatives.
- Opportunities having potential of implementation in 2005 should be identified for action.
- Manage the process and ensure integration between the City and Police Service where interdependencies exist. (January to June 2005).
- Opportunities from the Core Services Review contained in Section 5 (Service Area Improvements, Corporate Process Improvements and Corporate Improvements) and the Strategic Initiatives contained in Section 6 of the Core Services Review be referred to the PMO for further review, recommendations and implementation details. (January to June 2005). The City Manager will provide Executive Committee with a Plan for Change in the Spring of 2005.
- City Manager to report to Committee on progress monthly and receive direction as required pertaining to the implementation of the program. (Ongoing). Progress reports will be provided to Executive Committee. Specific issues will be addressed with the appropriate standing committee.
- City Manager to initiate short and long term human resources transition plan to support CSR decisions of Council. (As required). Any change management initiatives that affect current human resource requirements and structures will be addressed as part of the implementation plan for that initiative. For any complex initiatives, human resource transition planning will be a major consideration as part of the overall plan for change. Human Resource Transition planning will address contemporary Human Resource management practices and adhere to the collective agreements in place.
- That City Council conduct the necessary work to establish more defined governance, accountabilities, role definition and decision–making policy framework, as identified in this report. (March and ongoing 2005). The City Manager will provide suggested approaches to addressing these issues to City Council through Executive Committee (in the spring of 2005). Based on that information, Executive Committee will make decisions on how to move forward with specific strategic initiatives related to these issues.


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We deliver to all of Hamilton, Warren, Butler & Clermont Counties. We may be able to deliver to other areas—please inquire if your event is not in one of these counties. Events in Hamilton, Warren & Butler Counties receive free delivery. Events in Clermont County and all other counties include a minimum delivery fee of $20, which may be more depending upon the travel time involved. Some of the communities in Cincinnati, Ohio that we serve are:
Want to know if we'll deliver to you? Contact us today and find out!


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- Telephone:
- 0116 2606300 | 07807 012898
Vauxhall Astra 1.6 CDTi ecoFLEX Tech Line Sport Tourer 5dr Diesel Manual (s/s) (99 g/km, 134 bhp) 1 onwer sat Nav
Key factsPrint summary
10 months mot 1 owner from new full service history just been serviced sat nav zero road tax fully hpi clear and mileage checked , Blue, WE HAVE THREE SITES SO VIEWINGS ARE STRICTLY BY APPOINTMENT ONLY PLEASE CALL 01162606300, £6,495
This car comes with
Air Conditioning with Air Recirculation, Cruise Control with Speed Limiter, Digital Radio, Start/Stop System, Alloy Wheels - 17in 10-Spoke (225/50 R17), Bluetooth Mobile Phone System, CD 400 - CD/MP3 CD Player and Aux-In Socket, Electrically Operated Front Windows with Safety Autoreverse and One-Touch Facility, Tinted Glass, Tyre Pressure Monitoring System
- 201902195083751
- 2015
- 65
- £6,495
- 650
- 53,000
- Cars
- pu9ogRggfvI=
Vehicle summary
|Body style
|Engine size
|1598 cc
|Fuel type
|Number of doors
|Number of seats
|Gearbox type
|CO2 emissions
|99 g/km
|Insurance group
|Standard manufacturer's warranty (miles)
|No details available
|Standard manufacturer's warranty (years)
|No details available
|Standard paintwork guarantee
|No details available
Performance & economy
|Fuel consumption (urban)
|64.2 mpg
|Fuel consumption (extra urban)
|83.1 mpg
|Fuel consumption (combined)
|76.3 mpg
|0 - 60 mph
|9.7 seconds
|Top speed
|125 mph
|Engine power
|134 bhp
|Engine torque
|236.03 lbs/ft
|1535 mm
|Height inclusive of roof rails
|No details available
|4698 mm
|2685 mm
|2013 mm
|Width including mirrors
|No details available
|Fuel tank capacity
|56 litres
|Minimum kerb weight
|No details available
|Interior features
|Exterior features
|Load Restraint Lashing Eyes
|Alloy Wheels - 17in 10-Spoke (225/50 R17)
|Multi-Function Display Showing Outside Air Temperature
|Twin Electrically Adjustable/Heated Door Mirrors
|12-Volt Auxiliary Power Socket within Front Centre Console and 12-Volt Auxiliary Socket in Luggage Compartment
|Black Roof Rails
|Heated Rear Window with Automatic Timed Cut-Off
|Body Coloured Bumpers
|Three-Spoke Chrome-Bezelled Leather-Covered Steering Wheel
|Start/Stop System
|Cruise Control with Speed Limiter
|Intermittent Rear Window Wash/Wipe
|Multi-Function Trip Computer
|60/40 Split-Folding Rear Seat Back
|USB Connection with iPod Control
|Illuminated Glovebox and Storage Box on Drivers Side Lower Facia
|Drivers Seat Height Adjuster
|Air Conditioning with Air Recirculation
|Dolomite Pearl-Effect Centre Console
|CD 400 - CD/MP3 CD Player and Aux-In Socket
|Sports Steering Wheel
|Tinted Glass
|Upholstery Cloth - Silvanus Cloth Seat Trim
|Steering Column Adjustable for Reach and Rake
|6 Speakers
|Steering Wheel Mounted Audio Controls
|Electrically Operated Front Windows with Safety Autoreverse and One-Touch Facility
|Digital Clock with Automatic RDS Time Adjustment
|Digital Radio
|Bluetooth Mobile Phone System
|Drivers Airbag
|Electronic Brakeforce Distribution
|Anti-Lock Braking System (ABS) with Emergency Brake Assist (EBA) and Cornering Brake Control (CBC)
|LED Centre Brake Light
|Front Seat Side-Impact Airbags and Full-Size Curtain Airbags
|Power - Assisted Steering
|Remote Control Central Deadlocking
|Front Passengers Airbag with Deactivation Switch
|Tyre Pressure Monitoring System
|Electronic Stability Programme - Plus (ESP - Plus)
|Emergency Tyre Inflation Kit
|Front Body-Lock Diagonal Seatbelt Pretensioner System with Drivers and Front Passengers Lap Belt Pretensioner System
|Daytime Running Lights
|Centre Rear Seat Belt
|Electronic Engine Deadlock Immobiliser
|ISOFIX Child Seat Restraint System for Outer Rear Seats Incorporating Top Tether
|Traction Control
|Active-Safety Front Seat Head Restraints and Height-Adjustable Front and Outer Rear Head Restraints
|Straight Line Stability Control, Adaptive Brake Lights and Hydraulic Brake Fade Assist
Please note
This includes MPG figures which are calculated under European Standards, in test conditions, and will vary under normal driving conditions. The information displayed above describes the typical specification of the most recent model of this vehicle. It is not the exact specification for the actual vehicle being offered for sale which may vary. Specifications for older models may also vary. Please contact us prior to purchase to confirm the exact specification of this vehicle.
Thank you for contacting us!
We will aim to get back to you as soon as possible.
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Please try again later.


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The NCAA Texas A&M Aggies Luggage Carry-On 21in Spinner Softside NylonTo all our sports Fans, enjoy the benefit of showcasing your favorite team while dragging this 8 multi-directional spinner wheels bag that offers incredible 360 degree upright maneuverability. It has a fully lined interior with elastic garment straps and interior zipper pocket for delicate items and small accessories. Other features include two exterior zipper pockets, high embroidered logo. This product is officially licensed by the league and team.
Share this Product
Shipping is $4.99 for the continental US. Orders are mailed via first-class or priority mail.
Most products arrive 3-5 business days after purchase. Shirts and Pre-Sale items are Made to Order and may take up to 7-10 Business days to arrive after ordering.
100% Designed, Printed, and Shipped from the USA
Return Policy
If you're not 100% satisfied, return it for a no hassle exchange or refund.


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About the Minnesota Modeling & Simulation CenterPage address: http://www.mnsu.edu/modsim/about/
Providing Research Opportunities and Solutions to Problems Facing
Business, Industry, Education, Health Care, and Environment
Big ideas, real-world solutions at work
How can a business know when and were to construct a new facility? How can a hospital prepare to deal with a pandemic virus? How can a dairy farmer investigate the environmental impact of building in a new area? How can a community know if proposed transportation changes will be safe? How can a region attract more business, create more jobs, and stimulate the regional economy?
Real-world solutions to many of the questions facing government, industry and education are available right here, at the Minnesota Modeling and Simulation Center at Minnesota State University, Mankato. The Center, the only one of its kind in the Upper Midwest, brings together experts from different fields who use their predictive expertise to solve problems from an interdisciplinary approach. That allows for more accurate predictions and more robust solutions than can be offered from any one field alone.
The Minnesota Modeling and Simulation Center is a great place to experiment with new ideas and to try out grand plans. The Center can identify growth opportunities and point out potential missteps before they happen. It can also help its clients become more efficient, more nimble, and more profitable as well.


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Historic Houses in Ile-de-France
Browse 1,259 attractions, meet 105 travelers, 37 tour guides and discover 2,892 photos
Travelers are voting Château de la Muette, Château de Bagatelle and Petit Trianon as the best of 7 historic houses in Ile-de-France. Also popular are Maison de Verre in Paris and Château de Rosny-sur-Seine and Château de Guermantes in Ile-de-France. Want more? Check out our map of historic houses in Ile-de-France or these 4 historic houses in Paris.
Château de la MuettePlaces To Visit Historic HousesFrance
The Chateau de la Muette is a chateau located on the edge of the Bois de Boulogne in Paris, France, near the Porte de la Muette.2
Château de BagatellePlaces To Visit Historic HousesTrocadéro - District 16, Paris, Ile-de-France, France
The Château de Bagatelle is a small neoclassical château with a French landscape garden in the Bois de Boulogne in the 16th arrondissement of Paris.…2
Petit TrianonPlaces To Visit Historic HousesVersailles, Yvelines, France
The Petit Trianon is a small château located on the grounds of the Palace of Versailles in Versailles, France.2
Maison de VerrePlaces To Visit Historic HousesParis, France
The Maison de Verre (French for House of Glass) was built from 1928 to 1932 in Paris, France. Constructed in the early modern style…2
Château de Rosny-sur-SeinePlaces To Visit Historic HousesRosny-sur-Seine, Yvelines, France
The Chateau de Rosny-sur-Seine is a chateau in the Louis XIII style, situated in Rosny-sur-Seine in Yvelines, on the left bank of the Seine, at a…1
Château de GuermantesPlaces To Visit Historic HousesFrance
Construction of the Chateau de Guermantes in Lagny-sur-Marne, Seine et Marne, France, was undertaken by Claude Viole (died 1638), whose family…
Académie Nationale de MédecinePlaces To Visit Historic HousesParis, France
Situated at 16 rue Bonaparte in the 6th arrondissement of Paris, the Académie Nationale de Médecine, or National Academy of Medicine was created in…0


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Steve Andrews goal is to share his music with the public.
He wants to continue to grow and experiment with recording techniques and instruments. Also he's determined not to be locked into a specific style or type of music. Andrews feels part of the joy of music is to be creative and free.
Steve Andrews:
Producer, engineer, songwriter and musician.
Lead Guitar, Rhythm Guitar, Bass Guitar, Steele Guitar,
Mandolin, Hammond Organ, Synthesizers, Drums , percussion
and Vocals
Estela Andrews: Back vocals
We hope you enjoy the MUSIC


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Defamation Laws
Defamation Laws
Defamation laws pertain to any act of defamatory action, which can be defined as words, sentiments, or statement spoken with regard to an individual or entity that may paint them
In order to accuse someone of slander, the victim must prove slanderous acts. Slanderous acts may be committed anonymously or directly. Those acts may include gossip which hurts the reputation
What is Libel? Libel is a common law tort, governed by state law, in which an individual makes a written "publication" of a defamatory statement of and concerning the plaintiff


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Compact & Green: Flow2 Kitchen by Studio Gorm
Check out the design for the Flow2 efficiency kitchen (key word: efficient) — Oregon-based Studio Grom has integrated all the functions of a kitchen so that drying dishes help water plants, condensation from refrigeration helps cool butter (but keeps it soft enough to spread) and composting food waste helps fertilize kitchen plants.
From John Arndt and Wonhee Jeong of Studio Gorm:
"Flow is a living kitchen where nature and technology are integrated in a symbiotic relationship, processes flow into one another in a natural cycle, efficiently utilizing energy, waste, water and other natural resources. It provides a space not only for preparing food but an environment that gives a better understanding of how natural processes work. A kitchen where food is grown, stored, cooked and composted to grow more food."
Flow2 is on display at Oregon's Museum of Contemporary Craft as part of the Exhibition Call and Response through 10/31/09.
Via: Dezeen | Flow2 kitchen by Studio Gorm
(Images: Wonhee Jeong and John Arndt)


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Can you believe the first official day of summer is just a few short days away? Wow, looking back I'm not too sure where the spring went! Luckily, our dear cute friend Anya is all suited up (literally) and ready to show us the way to summer fun! How will YOU embrace the sun or stay cool inside?
Our friends at the Greeting Farm our not leaving us short of inspiration...in fact they are giving it in spades...take a look at these GORGEOUS examples!
Many people spend their summer's vacationing at some point or maybe going to a wedding. The Sunshine Kit is PERFECT to really make your pictures and pages pop as seen in the lovely examples from The Greeting Farm designers:
Special thanks to Jessica, Angela, Jaci, JoAnn, and Lynda for the awesome inspiration!
***Blog Candy Alert! Join our following and tell me your favorite stamp from TGF and you could win this super sweet and LIMITED EDITION stamp below. Isn't Savannah darling?
I will draw the winner on Thursday, June 24th! Good luck!! Happy Summer!
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TAKE THE CHALLENGE: Simon Says Stamp Challenge! | Vintage Simon Says Stamp & Show Challenge


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The Topo Designs Pack Bag is versatile and functional. It can be used on its own or packed with within a larger bag. It has durable 1000d Cordura oute...r construction. mesh inner sleeve, top carry handle, and a YKK zipper.
14"(H) x 10"(W) x 3"(D)
Designed & built in the USA. Read More
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Get the sneakers & goods you want, shipped to your part of the globe. Int'l Shipping details.


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I was so incredibly lucky with the image that I got sent to play with. Her name is Punkette Prue and she is such an adorable image....I just love her and was so glad that I lucked out and got her. My dd needed a card for her best friend for her birthday and Punkette Prue is perfect for her.
We hope you'll join us in checking out all of our wonderful new images on our challenge blog. While you're at the challenge blog check out all of the fabulous creations that my team mates have come up with and our current challenge....there's still a couple of days to get in on it.
Thanks for looking....hugs ~ Charlene
Challenges Entered:


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Apple cop raid upsets many
I'm not the only one. (NSFW.)
I'm not the only one. (NSFW.)
Speaking of TOTALLY NSFW responses to official abuse of power, here's a little ditty about The Church (TM) that ought to be up for at least 30 seconds more, if you hurry.
More f-bombs per minute than any other performance piece in history.
This is very not safe for work. Do not click on the link if you do not like obscene language or "low-brow" humor. The repetitiveness is actually part of what made me LOL.
Also, spineless, soulless Google (first don't be evil - my ass) may very soon take this down when someone complains. See it sooner or maybe never.
I absolutely love the iPhone. In 100 years, historians are going to look back on the iPhone as the defining product/invention of our generation. Yes. I'm serious. :)
But umm yeah, Apple's recent attack on Gizmodo just proves what everyone assumes. Steve Jobs is a huge d**k.
The AP and other news orgs asked a judge today to unseal the search warrant:
Sorry, it was the search warrant affidavit that was requested to be unsealed:
"Court documents spelling out the legal reasons for a search are usually made public within 10 days, but the affidavit supporting the April 23 raid remains sealed."
"[Gizmodo editor Jason] Chen's lawyer, Thomas Burke of Davis Wright Tremaine in San Francisco, said in a recent interview with the AP that a search warrant should never have been issued because Chen is a journalist and his home is his newsroom. California law protects journalists from such searches."