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Please note as of Wednesday, August 15th, 2018 this wiki has been set to read only. If you are a TI Employee and require Edit ability please contact x0211426 from the company directory.
General hardware design/BGA PCB design/BGA decoupling
(Updated 10/12/2011 with suggestions on inter-plane capacitance)
(Updated 10/21/2011 with suggestions on decoupling capacitor values)
(Updated 11/8/2011 to include frequency range of each PDN section)
- 1 Decoupling (Bypass) Capacitor Selection and Placement for BGAs
- 1.1 "Decoupling is not the process of placing a capacitor adjacent to the IC to supply the transient switching current, rather it is the process of placing an L-C network adjacent to the IC to supply the transient switching current. The inductance comes from the capacitor itself (typically 1-2 nH for a SMT capacitor), the interconnecting traces (typically 5 to 20 nH according to the layout), and the lead frame of the IC (typically 4 to 15 nH according to the type of IC package)." Henry Ott, EMC expert, 2001
- 1.2 General Info
- 1.3 Summary (for more info, read below)
- 1.4 Overall PDN (Power Distribution Network) design
- 1.5 General number and value of pin (bypass) capacitors required
- 1.6 Methods of placement for bypass capacitors
- 1.7 Inter-plane capacitance
- 1.8 Ferrite Bead Recommendations
Decoupling (Bypass) Capacitor Selection and Placement for BGAs
"Decoupling is not the process of placing a capacitor adjacent to the IC to supply the transient switching current, rather it is the process of placing an L-C network adjacent to the IC to supply the transient switching current. The inductance comes from the capacitor itself (typically 1-2 nH for a SMT capacitor), the interconnecting traces (typically 5 to 20 nH according to the layout), and the lead frame of the IC (typically 4 to 15 nH according to the type of IC package)." Henry Ott, EMC expert, 2001
General Info
Much research has been done on decoupling capacitor selection and placement for BGAs. Presented here is the current proven best practices, and what TI recommends in general for placement and selection of values.
In the past, TI (and many other semiconductor companies) recommended 1 capacitor (cap) per power pin. For DIP packages, this worked great, but other packages like BGAs were developed, this became harder and harder. With any pitch less than 1.0mm this is nearly impossible, so now TI is trying to take a more realistic approach.
Summary (for more info, read below)
- Place a 0.1uF or higher value capacitor (in the smallest physical package practical for your company, 0402 or 0201) for every two power balls on a BGA embedded processor.
- Be absolutely sure that the traces for decoupling caps are as short as humanly possible. Where you place them in relation to the BGA is a secondary concern to this because planes have very low inductance. Shortening the cap traces to/from the ground/power plane is THE MOST IMPORTANT concern for making a low inductance connection.
- Make sure reset is held low until all powers are at their proper level and are stable (with power up and power down sequence correct).
- Use one 15uF or larger bulk cap for every 10 or so power balls, placed as closely as practical to the chip.
- For tantalum and electrolytic caps, be sure to select a high enough voltage to take into account the derating over time. In other words you generally want to pick a voltage that is substantially higher (2x) than the voltage being applied to the cap. The derating curve can be found in the data sheet of the capacitor and should be used to validate that a sufficiently high voltage was selected. This can significantly improve MTBF.
- Be careful not to place so much bulk capacitance that the power rail will get out of the correct power-up or power-down sequence (this is the order of power supplies starting up and powering down).
- Limited via sharing (using a single via with ~2 power or ground balls) is helpful to allow decoupling caps to be placed under the footprint of a BGA, increasing the overall decoupling network effectiveness.
- For the best decoupling, especially for very fast switching interfaces like PCIe, SATA, and USB 2.0, consider pairing power and ground planes close to each other (within 10 mils). This creates interplane capacitance, and GREATLY reduces noise and increases power supply stability at the pins because of the extremely low inductance of this kind of capacitance. The number of discrete capacitance can then be reduced because the effective capacitance is greatly increased and the impedance of the power distribution network is reduced across a very broad frequency range.
- Ferrite beads (especially forming Pi filters) are recommended for analog and PLL power connections.
- Ferrite beads are not recommended for digital power connections.
Overall PDN (Power Distribution Network) design
The Power Distribution Network, or PDN, is the network for getting the power from the power input (AC cord, battery, etc.) to the circuits it supplies. The components are:
- Power supply/supplies
- Bulk bypassing of the power supply
- Secondary bulk bypassing to recharge the bypass capacitors
- Pin (bypass or decoupling) capacitors
- Planar capacitance (if present)
- Chip, or on die capacitance
- PCB traces/planes to/from all of the above
All of these elements play a part in the effectiveness of the PDN. They all have different frequencies of response (ranges are approximate):
- 0 to ~ 30 KHz -Power supply response (varies considerably)
- 70 Hz - ~40 KHz Bulk power supply capacitors (works with above)
- 15 KHz - 1 MHz Secondary bulk capacitors (near the chip)
- 1 MHz - 250 MHz bypass or decoupling capacitors
- 250 MHz + Planar and on-die capacitance
Noise caused by load comes at all different frequencies dependant on the switching frequencies of the buffers and transistors inside the chip, which is dependant on the clock frequencies, software routines, etc., so it's important to be able to sustain loads at a wide range of frequencies to avoid having voltage droop at the chip pins.
General number and value of pin (bypass) capacitors required
TI recommends placing one 0.1uF cap (in the smallest possible package size, to reduce lead inductance) as close to the chip as possible for every two power pins. Power/ground routes to the BGA should go as directly as possible to the power/ground planes and power/ground traces to/from the caps should also be as short as possible to the power/ground planes. Do not wire the BGA balls to the capacitor before going to the ground/power plane! This increases trace length and reduces the effectiveness of the power distribution network, especially if any planar capacitance is used.
Pay special attention not to put so much bulk capacitance on a supply that it slows the start up voltage ramp enough to change the power sequencing order. Also be sure to verify that the main chip reset is low until after all supplies are at their correct voltage and stable.
The use of inter-plane capacitance is recommended whenever possible (see below section). When using inter-plane capacitance, the requirement for discrete capacitors is drastically reduced. In some situations (after careful analysis) only bulk capacitance is required and the smaller discretes are completely removed. Consider this before deciding on the number of discrete capacitors required for your product.
Note about power sequencing: Power sequencing refers to the order the power supplies come up. This is important because internally the electronics expect a certain order and if it isn't followed, reliability and logic errors may result. Sometimes this causes problems that are difficult to diagnose since they may be sporadic and even temperature depdendant. Care should be taken to follow the order recommended on the data sheet for power up and power down.
TI also recommends that at least one bulk (~15uF or larger) cap be present for every 10 or so power pins. This bulk capacitance recharges the smaller capacitors, but are not low enough inductance to replace them, so both bulk and closer pin decoupling capacitors are necessary. The larger bulk capacitors can be a little farther away, but still should be as close to the part as practical.
As mentioned in the summary above, for tantalum and electrolytic caps, be sure to select a high enough voltage to take into account the derating over time (which is substantial in most capacitors). In other words you generally want to pick a voltage that is substantially higher (2x) than the voltage being applied to the cap. The derating curve can be found in the data sheet of the capacitor and should be used to validate that a sufficiently high voltage was selected. This can significantly improve MTBF as these kinds of capacitors tend to be a weak link (system wide) over time.
Value For Pin Capacitors
One school of thought suggests that since in the old days capacitor inductance was partially based on capacitor value, capacitors of varying values (usually chosen in logarithmic fashion) should provide the best decoupling (low impedance over a wide frequency range). The larger capacitors would provide the lowest impedance for the PDN (Power Distribution Network) at lower frequencies, the middle values at the middle frequencies, and the smaller values at higher frequencies. This made sense when graphing their impedances separately, however, studies have shown that these varying capacitor values do not usually add in a complementary fashion, providing the combined benefits of both, but can resonate considerably at unpredictable frequencies which are hard to control, causing unpredictable rises in impedance at frequencies between the capacitor resonances. Simulations and real life studies have shown this is no longer a good practice.
With the newer ceramic capacitor dielectrics, inductance is related only to the physical size of the capacitor body rather than the value of the capacitor. To verify this, check your capacitor's manufacturer's websites. TDK lists graphs that show this data well for both X7R and other small capacitor dielectrics. When looking at 0.1uF and 0.01uF in the same body size (0402 or other small size), both capacitors exhibit the same high frequency slope because the inductance is exactly the same. This fact is also confirmed by high speed experts such as Howard Johnson (www.sigcon.com).
Based on the fact that often differing values of capacitors cause more harm than good (because of the resonance possibility listed above), and the fact that with newer capacitor dielectrics, larger value capacitors have the nearly identical high frequency impedance as their smaller value counterparts in the same body size, we recommend using just one value, 0.1uF-0.2uF, in the smallest package manufacturable by your company (this should be 0402 size or smaller). This will provide the best overall PDN impedance and effectiveness unless the data sheet shows otherwise for that situation. Values larger than 0.1uF are also useful if they can be ordered in a suitable body size to be placed close to the pin, and don't forget the fact that more capacitors reduces inductance because of their parallel connection.
Simulations on our systems have shown that values lower than 0.1uF are not very useful in most systems, and instead just take up space that could be more useful otherwise.
Methods of placement for bypass capacitors
With the smaller pitches that are common on BGAs today, placing caps in between ball vias is usually impossible. That's why via sharing (using just one via for more than one power or ground ball) can be very helpful.
In days past, via sharing was looked down on because theoretically it raises inductance of the system. When 1.0mm or larger pitches were used, that was true. Now that finer pitches make it impossible to put caps in between multiple rows of vias, we are left with two choices:
1. Keep our "one via per power/ground ball" rule and put the caps the only place they will fit, outside the footprint area.
2. Abandon this rule and realize that the distance to the caps, if placed outside the footprint area, introduces a lot more inductance than what it would be if two balls shared a single via and the caps were placed inside the footprint area.
Instead of placing one via per ball inside the power/ground center section of a BGA, skip every other row and share every via with two power or ground balls. This will allow caps to fit directly underneath the part and inductance will be minimized greatly Vs. placing the caps outside the footprint area..
Now it's easy to place 0402 caps inside 0.8mm pitch BGAs, and 0201 caps can even be placed 90 degrees rotated if desired! This results in more caps underneath the BGA area, much closer to the balls than they would be otherwise, and power distribution network (PDN ) integrity is much improved. TI has used this shared via method many times in our own systems, and some of our BGAs are actually designed specifically for this. It is still a good idea to limit the number of power balls shared with one via. As with most engineering problems, the benefits vs. cost (in added inductance) must be weighed.
Sharing more than two power/gnd balls to one via is discouraged because of the extra inductance it causes.
Short capacitor trace length is the most important measure of inductance in most PCB systems. Placement in relation to the BGA is also important, but not as important as trace length.
Inter-plane capacitance
Above ~250 MHz, PCB mounted capacitors are not very effective, however since TI uses some amount of on-die capacitance, they are adequate for our embedded processing chips, but for any high speed system especially systems with more than one processor, inter-plane capacitance is very helpful. Inter-plane capacitance is the capacitance that happens when two PCB layers are brought in very close proximity to each other. Often this requires two extra PCB planes, one power and one ground, that are separated by an extremely thin (<10 mils) layer of dielectric. Since the only "lead" to this giant "capacitor" is the tiny length from the chip's die to the plane and back, inductance is extremely small. This is why planar capacitance can be effective to 10+ GHz, and is invaluable for systems with very high speed PHY chips or other chips that require very high speed decoupling.
The smaller amount of capacitance provided by the planes (Vs. discretes) is made up for by the reduced inductance of this solution, so the effective capacitance is often increased at the frequences that are most useful.
Inter-plane capacitance is not required for any current catalog processor, but if your PCB has the possibility of having a ground and power plane in very close proximity to each other, take advantage of it. It will decrease noise substantially and help ensure a good, stable power supply to the processor pins. The benefits are:
- Greatly reduced inductance, which means:
- Lowered power supply impedance across a very broad range of frequencies.
- Decreased need for discrete capacitors (in some cases the smaller discrete capacitors are completely eliminated)
- Increased cost of adding two planes can be offset by the reduced cost of discrete capacitors and their assembly as well as the reduced size of the PCB, in some situations resulting in even lower cost (Vs. using discrete capacitors).
For even more benefit, consider using a special dielectric from 3M, Faradflex, or others that increases the inter-plane capacitance because of the reduced thickness and dielectric constant of the material.
For this to work on boards that have fewer layers, consider pouring copper islands on the signal layers to add capacitance. If the second layer is ground, pouring copper on the top layer (with many vias to the power layer) make more planar capacitance possible, as well as reducing EMI, increasing heat transfer, and reducing power fluctuations. If the second to bottom layer is power consider pouring ground on the bottom layer and realize the same benefits there. Keep isolation between the copper pours and the signals to 15-20 mils minimum to minimize impedance effects on nearby traces.
Ferrite Bead Recommendations
Ferrite beads are very handy tools to have in your circuit design arsenal. They are, however, not a good idea for all circuit power rails.
Ferrite beads effectively absorb high frequency transients by raising their resistance at higher frequencies. This makes them very good at preventing power supply noise from getitng to sensitive circuit sections, however, it also makes them a very bad idea for main digital power.
When to use them:
Use them on power traces in series with analog circuit sections like composite video or PLLs. These beads effectively shut down power flow in times of high noise transients, allowing the power to be drawn only from the decoupling capacitors that are downstream. This cuts noise to sensitive circuit sections considerably.
How to use them:
Ferrite beads should be used in between two capacitors to ground. This forms a Pi filter and reduces the amount of noise to the supply considerably. In practice, the capacitor on the chip side should be placed as close to the chip supply ball as possible. The ferrite bead placement and input capacitor placement is not as crucial.
If there is not room for two capacitors to form a Pi filter, the next best thing is to delete the input capacitor. The chip side capacitor should always be there. This is very important. Otherwise the ferrite beads increased high frequency resistance may make things worse instead of better since there will be local power storage on the chip side, and therefore no way to get the high peak power pulses to the chip that it so desparately needs.
When not to use them:
The above ferrite traits are very handy for those circuit sections that draw power evenly and consistently, but the same traits make them unsuitable for digital power sections. Digital processors need high peak current, because most internal transistors that switch are switching on each clock edge, all the demand occurs at once. Ferrite beads (by definition) will not allow power to flow through them with the high ramp rates required by digital processor logic. This is what makes them perfect for noise filtering on analog (like PLL) supplies.
Since all the power demand in digital system is instant (high frequency), instead of being a slow and steady demand, ferrite beads will block the digital supply during the peaks. Theoretically, the bypass capacitors on the processor side of the bead would supply the peak current, filling in the gaps caused by the ferrites until they were charged after the peak was over, but in reality, the impedance of even the best capacitors is too high above about 200 MHz to supply enough peak power for the processor. In systems without ferrites, the planar capacitance can help to fill in this gap, but if a ferrite is used, it's inserted between the planes and the power pin, so the benefits of planar capacitance are lost. This will cause a big instantaneous voltage drop during the period the processor needs it most, causing logic errors and strange behavior if not immediate crashing. This can be avoided by proper design if required for your system (for EMI reduction, for example), however this is beyond the scope of this note.
Is it O.K. to use a ferrite on supplies that have no planar capacitance? We still don't encourage the use of ferrite beads on digital power supplies since after the bead, the power must flow on traces which greatly increases the inductance of the connection. This means that the decoupling capacitor connection becomes that much more critical to supply power. If all the decoupling capacitor traces are the very shortest humanly possible, it might still work adequately, but in general, it's not a recommended design practice.
Another disadvantage: segmenting the power planes. Here is an article written by signal integrity expert Howard Johnson, explaining how having a non-segmented power plane reduces noise. Segmenting the Vcc Plane


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|P is for Practical
Re^9: Plea for upvotes. (nonsense)by Anonymous Monk
|on Sep 10, 2013 at 21:38 UTC ( #1053370=note: print w/replies, xml )
|Need Help??
A private email (hearsay) from a third party, that I am not at liberty to divulge either author or content, but take to be convincing for several reasons, not least of which is that the author has historically no particular love for me.So... you are now taking techinical advice from sundialsvc4 ?? Holy crap. Surely that's a red light in anyone's book? You are without doubt the single most important contributor to this website. Don't get involved in personal politics of this type.
In Section Seekers of Perl Wisdom

subset: commoncrawl


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|14 - 90 nights
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|Rental Period
|Minimum Price
|Additional Nights
|Weekend Night
|Event Price
1 Apr 2018 - 31 Dec 2018
14 night minimum stay
for 14 nights
High - 3 month minimm
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90 night minimum stay
for 90 nights
See Summer Special Note
1 Apr 2019 - 31 Dec 2019
14 night minimum stay
for 14 nights
My Standard Rate
14 night minimum stay
for 14 nights
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A one-off family membership transfer fee ($200 US) to the Golf and Country Club entitles you to all of the amenities. Only a modest cart fee applies. DURING PEAK MONTHS OF JAN TO MARCH 3 MONTH MINIMUM, PLEASE ENQUIRE FOR RATES AT THIS TIME. 2 week minimum rentals at all other times. SPECIAL RATES DURING SUMMER MONTHS ( JUNE TO SEPT ) GIVING 3RD AND 4TH WEEKS AT HALF PRICE.


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Pocono ProFoods is a family-owned distributor based in Stroudsburg, PA, supplying quality food and equipment to independent and multi-location restaurants and large-scale organizations with the ease, responsiveness and personal attention of a true partner. At Pocono ProFoods we've been innovating the business of broadline foodservice distribution for over 70 years, with a true commitment to building personal one to one relationships with all of our customers. Our passion is the seamless delivery of the quality goods you count on to bring your best to the table, and we've been delivering on that promise for three generations.
About Us
About Us Tabs
The Beginning 1903
It all began when Kahlil Driebe, the father of Edward Driebe, and his brother, Tom, started a wholesale banana business in Scranton, PA. In 1905, Kahlil branched out to distribute fresh fruit and produce from a railroad car in East Stroudsburg to local area resorts, delivering via a team of mules pulling a wagon. At that time, the Pocono Mountain area of Northeastern PA was home to many fine resorts. Due to the region's proximity to NYC and its accessibility by rail, the resorts in the Poconos were enjoyed by many well–to-do travelers from the city, who primarily visited during the warm summer months. Many of those people eventually built homes to enjoy year round.
The Foundation 1930
During this time, Scranton was prospering as a booming coal city and as a result a convenient rail system existed from New York City and Philadelphia, both within 110 miles of Scranton. It was this ease of access that enabled Scranton to unexpectedly develop into a thriving hub for produce. The Driebe family recognized this opportunity and opened a fresh fruit and produce market, The Park Market, in downtown Scranton, which kept the seven siblings very busy. Edward Driebe' s sister, Mary, and her husband opened another Park Market in 1927 at the corner of 6thand Main Streets 45 miles away in Stroudsburg, Pennsylvania. In 1933 the market moved to larger building across the street.
The Birth 1940
In 1940, Edward Driebe and his wife, Mary, moved to Stroudsburg from Scranton and operated the Park Market. At this time, Ed's brother, Jim, started Pocono Produce Company, a fresh wholesale fruit and produce house, in the rear of the old ice building on Second Street. Five years later, Ed purchased Pocono Produce from his brother, recognizing that the area's resorts were quickly growing into a year round industry. Eight years later, he needed to relocate to a larger facility with more space, different unloading and loading requirements, and most importantly the need for multi-temperature storage.
Breaking Ground 1954
Construction of the new facility at North Fifth Street began in 1954. On June 3, 1955, Ed Driebe founded the "new" Pocono Produce Company, adding frozen foods to the already established high quality fresh-line. The move in June proved to be very fortunate. In August 1955 Hurricane Diane struck the area dumping more than 12" of rain in less than 6 hours. Without warning, widespread flooding destroyed most of the bridges in eastern Pennsylvania. The towns of Stroudsburg and East Stroudsburg were half-under water. Pocono's original facility lay under more than 15 feet of water but the new facility, home for just two months, was spared as it was located just high and far enough away from the affected areas. With the addition of frozen foods came new opportunities in other areas. By 1956 another freezer was added and Pocono expanded its delivery area into the nearby cities of Allentown, Bethlehem, Easton and eastward into northern New Jersey. New segments of opportunity appeared as well, as schools and healthcare began to offer frozen foods to students and patients.
Expanding 1964
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Fresh Seafood 1983
Product offering expansion continued as Pocono introduced a fresh seafood department in 1983. In 1984 a 330,000 cubic-foot freezer was constructed to meet the increased demand for frozen products throughout all segments of the foodservice industry. A modern sales training center was added, complete with a fully-equipped test and demonstration kitchen. The sales team was introduced to more technology as remote order entry became a reality. This technology feature was the link that paved the way for Pocono's seamless communication with its customers.
Forging Ahead 1997
Fresh Meat and Protein were added to the product mix during this period. Edward K. Driebe remains chairman of the board as family members from the second generation, Terrence B. Snyder and Rosemary Driebe Olofsson were named president and executive vice president. In 1996, Pocono joined the Pro*Act family of produce distribution companies and became a part of the leading foodservice produce purchasing and marketing organization in the country. In 1997, Pocono began operating out of a new distribution center which added more than 2 million cubic feet of refrigerated and frozen space. The new facility, situated on 54 acres, affords the opportunity for almost unlimited possibilities to expand services to meet the needs of our market.
The Next Century 2000's
Sadly, on January 1, 2005, our father and founder Edward K. Driebe passed away. His presence and vision are greatly missed, but his legacy continues to live on. The change in the millennium brought about the addition of the third generation of family members to fill key positions within the company. In 2013, Pocono Produce Company was rebranded as Pocono ProFoods to reinforce its position as a premier full-line food distribution company. Today, our business continues to grow with service currently available to portions of 13 states in New England and the Mid-Atlantic. As Pocono ProFoods looks forward to the future, the essence of the past guides its leadership to operate in noticeable ways that the corporate focus of the national distributors lacks. We bring our best to your delivery, so you can bring your best to the table. Pocono Profoods is truly Always Serving You.
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The Design of THE CHEAT SHEET
I'm biased, of course, but I seriously think "The Cheat Sheet" is one of the best designed short story collections I've ever seen. I gave my designer Nicole Pagliaro carte blanche and she chose a different design for each of the eleven stories, something I'd never heard being done before. I wanted to know her thinking behind the design, so I shot her a quick email and here's what she replied:
After I read The Cheat Sheet, I was pretty surprised by the storytelling of romance in New York. It's personal, it's eclectic, it's far from perfect, but it's all pretty dark.
So what did I get from my experience? Some semi-dark storytelling of a bunch of different definitions of romance.
In my brain this translated to a dark cover and eclectic use of type treatment. Made sense to me at least.
I was really inspired by Michael Beirut's 79 Short Essays on Design, as he designed his book this way. I thought this way of "telling a story by telling stories" seemed pretty appropriate.
Hah, it's way too hard for me to bullshit this any more: there's no real reason each font was chosen for each story specifically (definitely not any interesting reasons) but more for the aesthetic distinction between them as they flow in the book is what determined which font would be used for each story.
And here are the fonts I picked for each story:
I used "Archer Light" in the title header of The Boyfriend Trials. How fucking girly does that header feel? It's so full of sugar it makes me want to throw up.
Thanks, Nicole!
I certainly want you to check out the book because of my writing, but you'll also get the great gift of Nicole's great design along with it!
What are some of your other favorite book designs?
Genesis of HOW TO FAIL's Cover Design
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text: This is my first submission to Sherry Massey's "History of Art Challenge" blog. The challenge was to portray, in any medium, a chosen image from Ancient Greece. I chose a very famous statue currently housed in the Louvre, Paris: "Nike of Samothrace", a marble statue from c. 220 - 190 BC, which depicts the winged goddess of victory in full flight. I am woefully untutored in the art history of this time even though I studied it at university. It was an interesting exercise for me as I was enchanted by the pose; the huge triumphant gesture and those delicious folds of drapery. However, to capture those in detail would require a larger sized paper and possible rendering in graphite pencil. Big congratulations to Sherry Massey for starting a challenge blog with an academic angle. I look forward to watching it grow from strength to strength.


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In honour of this year's RHS Chelsea Flower Show (19-23 May 2015), Tom's Kitchen Chelsea will be offering a floral inspired menu for all guests.
The menu will be available from Monday 18th until Sunday 24th May and includes beautiful dishes that draw inspiration from the vibrant horticultural displays at the famed exhibition.
The menu showcases the very best seasonal ingredients and is available throughout the week for lunch and dinner, in addition to our a la carte menus.
To make a reservation please call us on 0207 349 0202 or email firstname.lastname@example.com


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Know more about this business than we do? Cool! Please submit any corrections or missing details you may have.Help us make it right
Be the first MLive.com user to add photos or videos of Perry Angelo P Tax Service
Perry Angelo P Tax Service is located at 6735 Park Ave, Allen Park, MI. This business specializes in Taxes.
Perry Angelo P Tax Service can be found at Park Ave 6735. The following is offered: Phonebook. The entry is present with us since Sep 9, 2010 and was last updated on Nov 14, 2013. In Allen Park there are 38 other Phonebook. An overview can be found here.


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|Page (1) of 1 - 05/19/08
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Cleaning Up Those After Effects Projects
As I'm sure everyone knows by now, I am big on cleanliness and organization. For me, that is one of the keys to being efficient with not only your work, but the work of the editors you work with. I thought that for this article, I would look at two ways to tidy up your After Effects projects. The first method can be done at any point in your workflow, and the second can be done when the project is finished, and you are ready to archive.
This method is quick and easy, and is something that most people overlook, and that is "Reduce Project". "Reduce Project" is located under FILE>REDUCE PROJECT, and it does exactly what it says it does. It looks at the composition(s) you have selected, and removes everything from the project that is not associated with that particular composition(s).
Most people might be quick to say that you could use "Remove Unused Footage" (FILE>REMOVE UNUSED FOOTAGE), but all it really does is look at all your compositions (all of them, and even pre-comps as well), and removes footage that is not present in any of them. Not really a good way to clean up or organize your project. In most cases, you are working on a single, or multiple compositions at one time, and for me, it's better just to use "Reduce Project". One thing to keep in mind about cleaning up this way is that it does not change your media hierarchy outside of After Effects. It only cleans up the project from within After Effects.
My second method for cleaning up your After Effects projects is meant to be done when your project is finished, and it is by using "Collect Files" located under FILE>COLLECT FILES. "Collect Files" would be used to back up a project, or move it to another system for you, or a colleague to work on. This method works very similar to the above method. If you only want to "collect" one sequence, select it in your project window, and then navigate to FILE>COLLECT FILES.
You will notice immediately that After Effects wants to "Collect Source Files: All", which is fine if you want to collect the files for the entire project, but we just want to clean up the files for a selected composition. No problem, simply change from "All" to "For Selected Comps", and once you do, you will notice the project size change at the bottom of the "Collect Files" window, giving you an updated, smaller (new) project size. What I am also going to do is add the "Reduce Project" step in here by simply clicking the checkbox, so now I will have my project streamlined into a new folder with only the media I am using.
Once you click "Collect", After Effects will prompt you to create a folder to collect the selected composition into. The best part about cleaning up this way is that when After Effects is done collecting your composition, you will have a folder with your streamlined project, and only the files used within the composition(s) you collected. You also get a text file telling you exactly what was moved, and the effects used in your comps, so if you are sending it to another system, whoever is working on it will know exactly what clips and effects you have used. This is an excellent way to not only clean up your project, but to get it ready for archive as well.
Like I said at the beginning of this article, keeping a clean and organized project in any program you are using will not only help you find things quicker, but it will speed up your overall workflow as well.
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|Kevin P McAuliffe is currently a Senior Video Editor working in HD post production in Toronto, Canada. He has been in the television industry for 12 years, and spends his days onlining on a Final Cut Pro HD. Kevin's high definition onlining credit list includes concerts for Coldplay, Sarah McLachlan, Barenaked Ladies, Snow Patrol, Sum41, Paul Anka, Il Divo and Pussycat Dolls, to name a few. Also, Kevin is an instructor of Advanced Final Cut Studio 2 at the Toronto Film College. If you have any questions or comments, you can drop him a line at [email protected]
Related Keywords:after effects, motion graphics, workflow


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Evaluable predicates: The most general definition of external predicates (built-ins), I know of (in an attempt to write down the definition of Eiter et al. [1] in a RIF suitable way): An evaluable predicate &pred(X_1,....,X_n) is assigned with one or more binding patterns, where a binding pattern is a vector {in,out}^n. Intuitively, an evaluable atom provides a way for deciding the truth value of an output tuple depending on the extension of a set of input predicates and terms. Note that this means that evaluable predicates, unlike usual definitions of built-ins in logic programming, can not only take constant parameters but also (extensions of) predicates as input. inputs can not only be terms, but also predicate names (in which case the *extension* of the respective predicate is the input.) External predicates have a fixed interpretation assigned. The distinction between input and output terms is made in order to guarantee that whenever all input values of one of the given binding patterns are bound to concrete values, the fixed interpretation only allows a finite number of bindings for the output values, which can be computed by an external evaluation oracle. 1. T. Eiter, G. Ianni, R. Schindlauer, H. Tompits. A Uniform Integration of Higher-Order Rea- soning and External Evaluations in Answer Set Programming. In International Joint Con- ference on Artificial Intelligence (IJCAI) 2005, pp. 90–96, Edinburgh, UK, Aug. 2005. -- Dr. Axel Polleres email: firstname.lastname@example.com url: http://www.polleres.net/Received on Tuesday, 6 November 2007 23:16:14 UTC
This archive was generated by hypermail 2.3.1 : Tuesday, 6 January 2015 21:47:48 UTC


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This is a Scots pine, Pinus sylvestris, which was collected in Norway in 2009. It is very healthy and ready for the next step. Walter worked on the deadwood and corrected the position in the pot. This tree could be finally styled by the end of this summer. But I cannot keep all trees. So it is for trade or sale.
Walter Pall's main blog about bonsai and his work with trees from day to day. Lots of good pictures of good trees and lots of valuable information about bonsai.
Wednesday, May 11, 2011
Walter works on Scots pine
Posted by Walter Pall at 6:54 PM
4 comments:
- Al Polito said...
What kind of electric gadget is that?
- May 11, 2011 at 9:28 PM
- Philipp Reinfurt said...
die flex is sein lieblingsspielzeug, oder? :-)
- May 11, 2011 at 9:47 PM
- Walter Pall said...
That's meant for cutting tiles, cutting metal, stone and so. It is most useful for the rough work on trees. But it is highly dangerous. One wrong move and a branch is gone. Another wrong move and a finger is gone. Walter is so keen to work with this and is quite skillful by now.
- May 11, 2011 at 9:49 PM
- xtolord said...
Its got a really nice trunk flow !
- May 12, 2011 at 3:28 PM
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Friday, January 8, 2010
Day 8
9 comments:
they're beautiful and I can see you collect words as well as objects, because I had no idea what a missal was (a liturgical book containing all instructions and texts necessary for the celebration of Mass throughout the year) - who knew?ReplyDelete
wow hoe cool I've never seen old ones before. I love this blog already I'm gonna fav rite away!ReplyDelete
A collection a day, what a cool idea!ReplyDelete
this is a wonderfully creative idea, and i'm looking forward to the year ahead.ReplyDelete
this is lovely. and im so jealous of all your collections! Can not wait to see what is yet to come!ReplyDelete
Hi Lisa, just wanted to say how much I love this blog already! It encompasses everything I love - collections and multiples, packaging and pattern. I have featured you on my blog - hope that's ok!ReplyDelete
- AnonymousJanuary 9, 2010 at 4:14 PM
very nice..my vintage bibles look similar..love the smell of leatherbound books..ReplyDelete
dusty yet importantReplyDelete


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All A Savage Hunger cast + crew photos
Movies.com, the ultimate source for everything movies, is your destination for new movie trailers, reviews, photos, times, tickets + more! Stay in the know with the latest movie news and cast interviews at Movies.com.
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I have devised an uncrackable code which I put into coder's corner. If any of you don't go down there, do go, because I have just put the original message on and challenged them to say which code letters represent the message.
It is decoded by pencil and paper BUT would take all the computers in the world millions of years to try all the permutations, because, cunningly, I have included dummy letters within the code that are not distributed as to UK letter frequency, and there are differing numbers of dummy letters between the message letters. The block of letters is 900 long, increasing this by 100 would make the problem trillions of times harder.
I formally claim to have devised an uncrackable substitution cypher code.
Oh, and hello all, a really nice site.
Yes very nice site, Maybe bobbym can help you.
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Grand Theft Automobile V (commonly abridged to GTA V) is an upcoming unstoppered experience action-adventure video business existence formed by games developer Rockstar Northern in the Incorporate Realm and publicized by Rockstar Games. The business module be the premier starring appellative in the Lordly Felony Motorcar periodical since Impressive Felony Auto IV (2008), which started the quaternary "era" in the programme.[a] The fifteenth courageous in the playoff boilersuit, GTA V is to be set in fictional Los Metropolis in the propose of San Andreas and its close areas, based on modern-day Los Angeles and Rebel California. A performance of Los Santos was previously featured as one of figure cities in 2004's Pianoforte Thieving Auto: San Andreas, from the broadcast's tierce era.
Download GTA 5 Setup Installer
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Teen Conference
Kerri Viets - Ext. 302
The Tazewell County Teens Unlimited Teen Conference is held annually in the spring. The Conference is hosted in two sessions – one for high school students and one for junior high students. The Tazewell County Youth Board plans the Conference and facilitates many of the workshops. Both Conferences have a keynote speaker, workshop sessions, and a meal included. All Tazewell County schools are invited.


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Eastern European (EE) countries have a large number of low quality housing
built with prefabricated concrete elements. These concrete residential
buildings present the largest retrofitting challenge in Eastern European
countries; and one of the best opportunities to substantially improve energy
efficiency of residential buildings on the large scale in the EU. In the light
of the ambitious energy-efficiency improvement targets in the building sector,
we look at possibilities of retrofitting these buildings, focusing on
sustainability and to reduce negative environmental impact.
We attempt to adapt some of renovation experience of prefabricated concrete
residential buildings in Finland to Eastern Europe, with special focus on
technological (e.g. architecture, building physics & structural safety),
economical, institutional and policy settings.
RESPIRE is part of the ERACOBUILD
project INSPIRE (Integrated strategies and policy instruments for retrofitting
buildings to reduce primary energy use and GHG emissions), the Finnish-EE part
of it being developed in partnership between VTT and the Polytechnic
University of Timisoara, in Romania. The financing in Finland is from TEKES,
RUUKKI and VTT, and in Romania from UEFISCDI. Arkkitehtitoimisto Käppi is
working on architectural solutions.
Identification of building typologies and past design practices in Romania
(PUT) merged with a review of renovation experience in Finland (VTT) into a
technology overview.
Retrofit market in Romania and Eastern Europe analyzed to understand important
market drivers (PUT) and propose business models to activate and access the
market (VTT).
Analyze the retrofit technologies to a number of examples and analyze in
detail the impacts (financial, added value, energy, CO2, service life etc
Please also visit the alternative
project site for more details.