text:
|Publication number
|Publication type
|Application number
|Publication date
|Nov 9, 2004
|Filing date
|Aug 5, 2002
|Priority date
|Sep 13, 1996
|Fee status
|Also published as
|Publication number
|Warren M. Farnworth, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud
|Original Assignee
|Micron Technology, Inc.
|Export Citation
|BiBTeX, EndNote, RefMan
|Patent Citations (39), Classifications (32), Legal Events (6)
|External Links: USPTO, USPTO Assignment, Espacenet
This application is a continuation of application Ser. No. 09/638,276, filed Aug. 14, 2000, now U.S. Pat. No. 6,543,785, issued Mar. 18, 2003, which is a continuation of application Ser. No. 08/994,843, filed Dec. 19, 1997, now U.S. Pat. No. 6,118,138, issued Sep. 12, 2000, which is a divisional of application Ser. No. 08/713,606, filed Sep. 13, 1996, now U.S. Pat. No. 5,898,186, issued Apr. 27, 1999.
Field of the Invention: The invention relates to a semiconductor wafer mode controlling assembly and, more particularly, to such an assembly in which modes of circuitry of dice (ICs) on the wafer are controlled through alternating signals applied to the dice through probe pads on the wafers. The invention also includes methods for constructing and operating such wafers and the assembly.
State of the Art: Typically, finished integrated circuit chip assemblies include a die or dice attached to a lead frame and encapsulated with an encapsulant. Numerous expensive and time consuming steps are involved in producing such chip assemblies. These steps may include the following: (1) forming dice on a wafer substrate, (2) testing the dice, (3) cutting dice from the wafer, (4) connecting a die or dice to a lead frame, (5) encapsulating the die or dice, lead frame, connecting wires, and any auxiliary circuitry, (6) performing burn-in and providing other stresses to the dice, and (7) testing the assembly.
Defects in a finished chip assembly can prevent it from operating as intended. In spite of painstaking attention to detail, defects may be introduced at various levels of production. For example, manufacturing defects in the die may cause a failure. It has been found, however, that some defects are manifest immediately, while other defects are manifest only after the die has been operated for some period of time.
Reliability curves are used to express a hazard rate or instantaneous failure rate h(t) over time t, and often have a "bath tub" shape. The reliability curves for many, if not all, ICs are generally like that shown in FIG. 1. The reliability curve in FIG. 1 may be divided into three regions: (1) an infant mortality region, (2) a random failures region, and (3) a wearout region.
The infant mortality region begins at time to, which occurs upon completion of the manufacturing process and initial electrical test. Some ICs, of course, fail the initial electrical test. Inherent manufacturing defects are generally expected in a small percentage of ICs, even though the ICs are functional at time to. Because of these inherent manufacturing defects (that may be caused by contamination and/or process variability), these ICs have shorter lifetimes than the remaining population. Typically known as ICs suffering "infant mortalities," while the ICs may constitute a small fraction of the total population, they are the largest contributor to early-life failure rates.
Once ICs subject to infant mortality failure rates have been removed from the IC population, the remaining ICs have a very low and stable field failure rate. The relatively flat, bottom portion of the bathtub curve, referred to as the random failure region, represents stable field-failure rates which occur after the IC failures due to infant mortalities have been removed and before IC wearout occurs.
Eventually, as wearout occurs, the failure rate of the ICs begins to increase rapidly. However, the average lifetime of an IC is not clearly understood, because most lab tests simulate only a few years of normal IC operation.
"Burn-in" refers to the process of accelerating failures that occur during the infant mortality phase of component life in order to remove the inherently weaker ICs. The process has been regarded as critical for product reliability since the semiconductor industry began. There have been two basic types of burn-in. During the process known as "static" burn-in, temperatures are increased (or sometimes decreased) while only some of the pins on a test IC are biased. No data is written to the IC, nor is the IC exercised under stress during static burn-in. During "unmonitored dynamic" burn-in, temperatures are increased while the pins on the test IC are biased. The IC is cycled under stress, and data patterns are written to the IC but not read. Hence, there is no way of knowing whether the data written is retained by the cell.
In recent years, as memory systems have grown in complexity, the need for more and more reliable components has escalated. This need has been met in two ways. First, manufacturing process technology has reached a level of maturity and stability where inherent manufacturing defects, caused by contamination and process variation, have been reduced. As a result, latent failures have been significantly reduced, resulting in lower field failure rates. Secondly, more sophisticated methods of screening infant mortalities have been developed. As IC manufacturing practices have become more consistent, it has become clear that burn-in systems that simply provide stress stimuli in the form of high temperature and VCC (power) to the IC under test may be inadequate in two areas: (1) such burn-in systems cannot detect and screen infant mortality failure rates measured in small fractions of a percent; (2) such burn-in systems are unable to confirm random failure rates that are claimed to be significantly lower than 100 FITs (i.e., fewer than 100 failures per billion IC hours) at normal system operating conditions.
To address these issues, an "intelligent burn-in" approach can be utilized. The term "intelligent burn-in," as used in this discussion, refers to the ability to combine functional, programmable testing with the traditional burn-in cycling of the IC under test in the same chamber. Advantages to this approach include:
(1) The ability to identify when a failure occurs and, thereby, compute infant mortality rates as a function of burn-in time. As a result, an optimal burn-in time for each product family can be established.
(2) The ability to correlate burn-in failure rates with life test data typically obtained by IC manufacturers to determine the field failure rates of their products.
(3) The ability to incorporate into the burn-in process certain tests traditionally performed using automatic test equipment (ATE) systems, thereby reducing costs.
Some ICs have internal test modes not accessible during normal operation. These test modes may be invoked on ATE by applying a high voltage to a single pin. The IC is then addressed in a manner so as to specify the operating mode of interest. Operating modes such as data compression, grounded substrate, and cell plate biasing can be enabled, thus allowing evaluation of IC sensitivities and help in isolating possible failure mechanisms.
The electrical characterization data gathered from these tests is used to identify which part of the circuit appears to be malfunctioning, the possible location(s) on the IC, and the probable type or nature of the defect. To facilitate discussion and reporting, failures are often classified according to their electrical characteristics, referred to as the failure mode. Typical classification of these modes includes the following: single cell defect, adjacent cell defect, row failure, column failure, address failure, open pin, supply leakage, pin leakage, standby current leakage, and entire array failure (all dead cells).
In anticipation that some ICs will have defects, many ICs are designed with redundancies. In such ICs, a defective section of the IC may be shut off and a redundant but properly operating section activated and used in place of the defective section. For example, typical integrated memory circuits include arrays of memory cells arranged in rows and columns. In many such integrated memory arrays, several redundant rows and columns are provided to be used as substitutes for defective rows or columns of memory. When a defective row or column is identified, rather than treating the entire array as defective, a redundant row or column is substituted for the defective row or column. This substitution is performed by assigning the address of the defective row or column to the redundant row or column such that, when an address signal corresponding to the defective row or column is received, the redundant row or column is addressed instead.
To make substitution of the redundant row or column substantially transparent to a system employing the memory circuit, the memory circuit may include an address detection circuit. The address detection circuit monitors the row and column addresses and, when the address of a defective row or column is received, enables the redundant row or column instead.
One type of address detection circuit is a fuse-bank address detection circuit. Fuse-bank address detection circuits employ a bank of sense lines where each sense line corresponds to a bit of an address. The sense lines are programmed by blowing fuses in the sense lines in a pattern corresponding to the address of the defective row or column. Addresses are then detected by first applying a test voltage across the bank of sense lines. Then, bits of the address are applied to the sense lines. If the pattern of blown fuses corresponds exactly to the pattern of address bits, the sense lines all block current and the voltage across the bank remains high. Otherwise, at least one sense line conducts and the voltage falls. A high voltage thus indicates the programmed address has been detected. A low voltage indicates a different address has been applied.
Antifuses have been used in place of conventional fuses. Antifuses are capacitive-type structures that, in their unblown states, form open circuits. Antifuses may be "blown" by applying a high voltage across the antifuse. The high voltage causes the capacitive-type structure to break down, forming a conductive path through the antifuse. Various flash devices may be used.
Typically, ICs have numerous contacts that provide interfaces between the circuits within the die and the outside world. The contacts are used for bond pads to which bond wires are connected. The bond wires are also connected to the lead frame. The contacts (bond pads) may be used for various signals including those for addressing, data (DQ), VCC (power), VSS (ground), and control. However, physically, the contacts are extremely small or tiny. As such, it is impractical and expensive to provide direct connections between each of the contacts and probes used in, for example, testing, stressing, or repairing the IC. Probe pads that are much larger than die contacts have been placed on, for example, the edge of the wafer. However, the sheer volume of contacts limits the number of contacts to which probe pads may be practically connected.
If there is a defect in an IC, it is desirable to discover the defect as early as possible in the manufacturing process for a finished chip assembly. In that case, if it is determined that the defect cannot be repaired, the time and expense of completing a chip assembly will not be expended. Further, some repairs may be less expensive to repair at an earlier stage of production of the chip assembly.
Accordingly, it would be desirable to test, stress, and, if necessary, attempt to repair ICs while they are still on a wafer, rather than in a packaged chip assembly.
U.S. Pat. No. 5,504,369 to Dasse et al. describes an apparatus for performing wafer level testing of integrated circuit dice. Burn-in is described as being performed while the dice are still connected to the wafer. Conductors are connected between wafer contact pads and contacts (bonding pads) on dice. In a preferred embodiment, the conductors supply six voltage signals: power supply high voltage level signal, data signal, reset signal, clock signal, power supply memory programming voltage level signal, and ground voltage level signal. For the following reasons, connecting six conductors to each die has a considerable effect in terms of wafer real estate and/or processing steps. There are a large number of dice on the wafer. Current requirements dictate using numerous wafer contact pads and conductors to supply signals to the dice. Included extra conductors for redundancies increase the number by at least a factor of two. Further, the conductors are positioned on top of the dice and/or in the dicing lanes (streets or street area of the wafer). Placing all six conductors in the dicing lanes requires either stacking the conductors one on top of the other in a dicing lane, and/or widening the dicing lane (which may reduce the number of dice of the wafer). Placing several conductors over the dice requires additional processing steps. The processing steps may be further increased where conductors run both vertically and horizontally.
Accordingly, there is a need for an assembly in which a variety of signals may be supplied to dice in wafer form through a small number of contacts and conductive paths.
The present invention relates to a semiconductor wafer having dice that include circuitry that is placed into a mode when the circuitry receives an alternating signal having certain characteristics. The alternating signal may be supplied from a system controller through a probe, probe pad, and conductive path on the wafer. In a preferred embodiment, the conductive path simultaneously carries a VCC power signal and the alternating signal to the circuitry. However, the alternating signal may be carried on a conductive path different from the one carrying the VCC signal.
A great deal of information may be conveyed through the alternating signal, making other signals unnecessary in controlling, testing, stressing, and repairing dice on the wafer. For example, clocking information may be conveyed through the alternating signal. The circuitry may be placed in different modes in response to different characteristics of the alternating signal.
The alternating signal and a VCC power signal are received through a single contact on each die. There may be redundant contacts, conductive paths, and probe pads.
The dice may include additional circuitry that produces a signal indicating a particular event (e.g., a test is completed) has occurred. A fuse may be blown at the occurrence of the event.
A semiconductor wafer mode controlling system includes a system controller to control application of the alternating signals and other signals to the dice on the wafer. The semiconductor wafer mode controlling system may also control a probe positioning controller including an array of probes that selectively brings the probes into contact with the probe pads, whereby the alternating signal having the certain characteristics is transmitted from the probe to the circuitry through the probe pad and conductive path and the circuitry of each of the dice is placed into the mode. Each die on the wafer may be identical or there may be differences in the dice. Where there are differences, the system controller may supply alternating signals having different characteristics as needed.
The circuitry in the dice includes a local oscillator. A local oscillator may be off the die and on the wafer or in the system controller.
When the dice are cut from the wafers and packaged or otherwise used in commercial applications, the circuitry may continue to be enabled or may be disabled before a chip assembly containing one or more such dice is completed.
A wafer according to the present invention may be used in connection with a wide variety of semiconductor devices including memories (e.g., DRAM or SRAM), microprocessors, control circuits, and ASICs. The wafer may be used in computer systems and in a wide variety of other electronic devices.
The invention includes a method of constructing wafers and wafer mode controlling systems that have the above described characteristics.
While the specification concludes with claims particularly pointing out and distinctly claiming that which is regarded as the present invention, the advantages of this invention can be more readily ascertained from the following description of the invention when read in conjunction with the accompanying drawings in which:
FIG. 1 shows a graphical representation of a reliability curve that expresses a hazard rate h(t) as function of time t.
FIG. 2A shows a schematic top view of a semiconductor wafer under one embodiment of the present invention.
FIG. 2B shows a schematic top view of a semiconductor wafer under another embodiment of the present invention.
FIG. 3 shows a more detailed representation of an example of circuitry in a die on a wafer of FIG. 2A.
FIG. 4A shows an exemplary graphical representation of alternating signals superimposed on a VCC signal as a function of time.
FIG. 4B shows an alternative exemplary graphical representation of alternating signals as a function of time.
FIG. 5A shows a schematic representation of a system used in connection with blocking instructions in the alternating signal that instruct the dice to send an output signal from the dice to a probe pad.
FIG. 5B shows a schematic representation of buffers used in connection with blocking an output signal from the dice to a probe pad.
FIG. 6A shows an embodiment of a wafer mode controlling system.
FIG. 6B shows a schematic top view of an embodiment of a wafer mode controlling system in which a chamber contains multiple wafers.
FIG. 7 shows a first alternative input circuit that may be used in a die as part of the present invention.
FIG. 8A shows a signal received at the input contact of the circuit of FIG. 7.
FIG. 8B shows a signal supplied at an output of a regulator in FIG. 7.
FIG. 8C shows a signal supplied at an output clock extractor in FIG. 7.
FIG. 9 shows a second alternative input circuit that may be used in a die as part of the present invention.
FIG. 10A shows a graphical representation of certain signals included in the alternating signal received by the circuit of FIG. 9.
FIG. 10B shows signal levels above and below a VIH and VIL range.
FIG. 11 shows a third alternative input circuit in which a second contact carries a reference signal.
FIG. 12 is a graphical representation of the input and reference signal received by the circuit of FIG. 11.
FIG. 13 shows a fourth alternative input circuit including a differential circuit.
FIG. 14 shows an example of ranges of input signals that may be supplied to the circuit of FIG. 13.
FIG. 15 shows a fifth alternative input circuit including a detector.
FIG. 16 shows a sixth alternative input circuit that may receive a local oscillator reference signal.
FIG. 17 shows a schematic representation of a chip assembly under the present invention as part of a computer system.
FIG. 18 shows a schematic representation of a chip assembly under the present invention as part of an electronic device.
A. Wafer Overview
Referring to FIG. 2A, a semiconductor wafer 10 includes a substrate 14 onto which numerous dice are formed through etching, deposition, or other well known techniques. Since there are many dice on a wafer, for clarity of illustration, only dice 18A, 18B, 18C, 20A, 20B, 20C, 22A, 22B, and 22C (collectively "dice 18-22") are shown.
Probe pads 26, 28, 30, 32, 34, and 36 (collectively "probe pads 26-36") are formed on substrate 14. Because the size of dice 18-22 is exaggerated with respect to the size of wafer 10 and probe pads 26-36, the optimal placement of probe pads 26-36 is not shown. However, probe pads 26-36 should be positioned such that the total number of dice on wafer 10 is either not reduced at all or reduced only by a minimum due to the presence of probe pads 26-36. Such placement may be along the edge of wafer 10 where there is unused space caused by the round shape of wafer 10 and the non-round shape of the dice.
Conductive paths, which may be conductive traces, are connected between probe pads 26-36 and contacts on dice 18-22. For example, a conductive path 42, which includes branches 42A and 42B, is positioned between probe pad 26 and a first contact on dice 18A-18C and 20A-20C. A conductive path 46, which includes branches 46A and 46B, is positioned between probe pad 28 and a second contact on dice 18A-18C and 20A-20C. A conductive path 48, which includes conductive path branches 48A and 48B, is positioned between probe pad 30 and a third contact on dice 18A-18C and 20A-20C.
Further, a conductive path 52 is connected between probe pad 32 and particular contacts on a first contact of dice 22A-22C. A conductive path 54 is connected between probe pad 34 and a second contact of dice 22A-22C. A conductive path 56 is connected between probe pad 36 and a third contact on dice 22A-22C.
The conductive paths may run between dice in dicing lanes or "streets", or run over dice. (A conductive path may also run in a street and over a dice.) For example, conductive paths 46B, 48B, and 52 run along a street 60 between dice 20A-20C and dice 22A-22C. As an example of different possibilities, conductive path 54 runs over dice 22A-22C. An insulating coating, such as a borophosphosilicate glass (BPSG) coating, may separate a die from a conductive path. Further, to keep the streets narrow, conductive paths may be stacked on top of each other. A via or other connection may be made from a conductive path through the coating to a contact on die 22A. Coatings may also be useful to the extent conductive paths overlap. An advantage of the present invention over the prior art is that the number of conductive paths is reduced, thereby reducing processing steps in insulating conductive paths from each other and other components on the wafer and, if necessary, in removing insulation.
As illustrated, probe pads 26, 28, and 30 are connected to two sets of dice (i.e., 18A-18C and 20A-20C). Probe pads 32, 34, and 36, however, are connected to only one set of dice (i.e., 22A-22C). This difference illustrates that the invention is not limited to a particular number of dice being connected to a probe. In practice, the controlling software may be simpler if each probe pad is connected to the same number of dice, but that is not required. Further, the controlling software will be simpler if each die on a wafer is identical. However, the invention is not limited to the dice on a wafer being identical.
In FIG. 2A, conductive paths are shown running in only horizontal directions. However, the conductive paths may run in both horizontal and vertical directions, although doing so may add additional processing steps. The conductive paths may run in only the vertical direction.
FIG. 2B is an alternative embodiment, which is the same as FIG. 2A except that all the dice on the wafer are connected to a single probe pad 30 through conductive path 48, which in turn is connected to conductive path branches 48A, 48B, and 48C, etc. Probe pad 30 may be connected to VSS. As still another alternative embodiment, substrate 14 may be connected to VSS, eliminating another probe pad.
B. Die Circuitry and Alternating Signal Examples
FIG. 3 provides an example of circuitry in die 22A of wafer 10 of FIG. 2A. FIG. 3 is schematic in that the components are not necessarily to scale or in the only relative position. Various other circuitry may also be employed in addition to or in place of the circuitry illustrated in FIG. 3.
Referring to FIG. 3, conductive path 52 connects probe pad 32 (near an edge 64 of wafer 10) to a contact or bond pad 70A on die 22A. In ordinary operation of die 22A, conductive path 52 and contact 70A carry a VCC signal to internal circuitry of die 22A. To control modes of the circuitry of die 22A, an alternating signal may be applied simultaneously with the VCC signal to conductive path 52 and contact 70A. The alternating signal may be a continuous or discontinuous digital signal, a continuous or discontinuous analog signal, or some combination of them. The alternating signal may employ a modulation scheme, such as frequency modulation (FM), amplitude modulation (AM), phase shift keying modulation (PSK), pulse width modulation (PWM), quadrature phase shift keying modulation (QPSK), and others. The alternating signal may be applied to a contact other than the VCC contact. It is not necessary that the alternating signal be applied to a conductive path that also carries another signal; however, doing so may reduce the number of conductive paths, probe pads, and probes required. A contact 94A may provide a VSS signal between die 22A and probe pad 36.
Various examples of alternating signals are illustrated in FIGS. 4A and 4B. Referring to FIG. 4A, an alternating signal 74 is superimposed on a VCC signal 76. As used herein, "superimposed" means there is a voltage overlap between alternating signal 74 and VCC signal 76. Digital circuitry often includes input buffers (such as input buffer 86 in FIG. 3) that, for example, block signals between voltages VIL and VIH. In such a case, it is desirable for the alternating signal to be above or below the range of VIL to VIH so that the alternating signal will be invisible to the buffers. Digital circuitry may also include isolation circuitry (such as low electrostatic discharge (ESD) latching circuit 88 in FIG. 3) that blocks very high voltages, e.g., 13 volts.
To illustrate some possibilities, from time t0 to time t1, alternating signal 74 is a square wave signal having a frequency f1. From time t1 to time t2, alternating signal 74 has a frequency f2, which is greater than f1. In practice, the number of cycles at a particular frequency may be more or less than is shown in FIG. 4A. From time t2 to time t3, alternating signal 74 employs a frequency modulation scheme.
FIG. 4B shows an alternating signal 80 at voltages greater than VIH and a sinusoidal alternating signal 82 at voltages less than VIL. Of course, the present invention is not limited to dice that include circuitry that blocks signals between VIH and VIL.
Types of alternating signals include control alternating signals and data alternating signals. A control alternating signal conveys control information to circuitry. A clock signal may be an example of a control alternating signal. A data alternating signal conveys data to be written into storage or operated upon. For example, a microprocessor may operate on a data that is written into a register by adding it to data written in another register. Some alternating signals include both a control alternating signal and a data alternating signal, because they contain both control and data information.
Referring to FIG. 3, signals passing through input buffer 86 are applied to a VCC power bus 92. VCC power bus 92 carries both the VCC signal and the alternating signal(s). Except for those circuits designed to pass the alternating signals, circuits connected to VCC power bus 92 block the alternating signals.
In operation, demodulator 100 determines one or more characteristics of the alternating signal. Information is conveyed through the alternating signal to die 22A by the characteristics. The alternating signals may have various characteristics including, but not limited to, peak-to-peak amplitudes, average amplitudes, frequency, change in frequency, duration or number of cycles at a particular frequency or voltage, and relationship between average or peak-to-peak voltage and VCC or zero volts or ground. Data may be transmitted through high and low voltages within the peaks of a square wave. It is noted that the alternating signal does not have to be periodic, or if it is periodic, it does not have to be over a large number of cycles. The characteristics of the alternating signal may change with time (e.g., FIG. 4A) to add further information to control die 22A.
A great deal of information may be provided into an alternating signal. For example, upon demodulation, an alternating signal may provide circuitry with control information and clocking information, as well as pass data to be written into memory or operated on.
Clock signals used in die 22A may be generated through at least the following means: (1) the clock signals are generated completely inside die 22A with no control from signals outside die 22A; (2) the clock signals are generated inside die 22A, but under at least some control from the alternating signal supplied from outside die 22A; (3) clock information is encoded in the alternating signal and then extracted from the alternating signal by demodulator 100; or (4) the clock signal is generated completely outside die 22A and supplied to die 22A through the alternating signal or some other signal. Depending on how it is implemented, means (2) may be an example of means (3). Use of the alternating signal in originating or controlling a clock signal(s) can help synchronize dice to each other and external circuitry. Clock signals may be used for timing tests and/or to provide general timing control and information.
As an example of means (2), a clocking device 106 (which may be a local oscillator) may be controlled by a lock signal from demodulator 100 based on clocking information from the alternating signal on conductive path 52 and VCC power bus 92.
By providing an oscillation signal through conductive path 52 and contact 70A, it is not necessary to use a dedicated contact and probe pad for the clock signal. Accordingly, one less probe pad is needed. Of course, another conductive path may be used to provide clock signals or information.
Under some embodiments of the invention, a contact is used to provide data between a die and a probe pad. For example, referring to FIG. 3, a signal may pass from contact 130A of die 22A to probe pad 34, and/or from probe pad 34 through contact 130A to die 22A. Contact 130A may be, but is not required to be, a DQ contact. Contact 130A may be a contact that is used only while die 22A is on wafer 10, or it may continue to be used in ordinary operation of die 22A after it is packaged. Examples of uses for contact 130A include the following. First, a signal from contact 130A may indicate information about the results of tests or other occurrences in die 22A to off-wafer circuitry through probe pad 34. As an example, a fuse or antifuse may be activated upon completion of a test allowing a particular signal to pass through contact 130A to probe pad 34. The fuse may be blown in response to completion of a test or other event, the occurrence of which may be read then or later. The signal to activate the fuse or antifuse may come from contact 70A or 130A, or some other contact. A signal through contact 130A may be as simple as a single bit (e.g., indicating a test was positive), or more extensive or complicated to provide diagnostic information. The signal from contact 130A may be a stream of data providing, for example, data read from array 114 or some other component in die 22A. There may be more than one contact, such as contact 130A, used to transmit or receive data.
A potential problem in providing output signals to a probe pad from multiple dice is contention on the conductive path to the probe pad. One possible solution is to have a different conductive path for each die output signal.
A second solution is to have only one output conductive path shared by several dice, and to design the dice to not provide output signals to the probe pad until being instructed to do so by the alternating signal on conductive path 52. The system controller (which may be off-wafer as described below in connection with FIG. 6) may instruct each die in order (e.g., first die 22A, then die 22B, then die 22C, etc.) to respond to a particular test. If a die had not responded after a certain period of time, the system controller may assume the die was defective in some regard and instruct the next die to respond through its contact 130A. Referring to FIG. 5A, one way in which dice may be instructed in order by the alternating signal is to place buffers 138A, 138B, 138C, etc. on conductive path 52. Just prior to the time at which the dice are to respond, the alternating signal may instruct each die to place its respective buffer in high impedance mode. For example, die 22A may place buffer 138A in high impedance mode by sending a signal through conductor 140A. Die 22B may place buffer 138B in high impedance mode by sending a signal through conductor 140B, etc. Then, upon sending a signal through contact 130A to conductive path 54, die 22A may take buffer 138A out of high impedance mode by sending a signal through conductor 140A. The alternating signal may then instruct die 22B to send a signal through contact 130B to conductive path 54. Buffers 138A-138C may have circuitry to respond to an override by the alternating signal. Such an override may be used if the system controller has not received a signal on conductor 54 after a certain amount of time.
Another way in which the dice may respond in order would be for each die to have its own identification code. A particular die would respond when a code on the alternating signal matched the identification code on the die. The codes may be placed on the dice through a photo process or through the alternating signal.
A third solution is to place buffers along conductive path 54 which are enabled by, for example, a signal on conductive path 54. For example, referring to FIG. 5B, a buffer 144B may be enabled by a signal from contact 130A or some other contact on die 22A, allowing the signal from contact 130B to pass through buffer 144B to probe pad 34. Then the signal from contact 130B (or from some other contact on die 22B) may enable buffer 144C. Depending on the design, a buffer 144A (not shown) between contact 130A and probe pad 34 would not be necessary.
In FIGS. 2 and 3, there are three probe pads connected to each die. There may be a greater or lesser number of probes connected to each die. There are numerous combinations of contacts on the dice to which the probe pads may be connected through conductive paths. The following are some of the possibilities:
No. of
Contacts on die
One contact
VCC (ground may be made through the back of the
Two contacts
Two contacts
VCC (ground may be made through the back of the
Signal or test contact
Three contacts
Signal or test contact
Four contacts
First signal or test contact
Second signal or test contact
Contacts may be any input or output pin including power, address, data, control, n/c (no connects), and ground contacts.
C. System Level Examples
FIG. 6A shows one embodiment of a wafer mode controlling system 160. Wafer 10 is supported by a support 162, which may be part of a vacuum handler. A probe positioning controller 166 includes an array of probes 170 (including probes 170A, 170B, . . . 170N) held by a probe support 174. Probe positioning controller 166 may lower or raise probes 170 as a group. Alternatively, individual ones of probes 170 may be lowered or raised by, for example, solenoids.
A system controller 180 controls probe positioning controller 166 through a conductor(s) 182. System controller 180 also sends signals to and perhaps receives signals from one or more of probes 170 through conductors 184. Logic 192 (which may include one or more microprocessors and dedicated hardware) provides signals to and may receive signals from conductors 182 and 184 through drivers/buffers 188. A signal generator 194 may be used to create signals. Alternatively, logic 192 may generate all signals needed. In a preferred embodiment, the alternating signals that are conducted over conductive path 52 originate in system controller 180. Signals may also be generated from circuitry on wafer 10. Memory 196 may be used to store data used by logic 192 and perhaps signal generator 194. System controller 180 may include both digital and analog circuitry and drivers/buffers 188.
Wafer 10 may be housed in a heating chamber 200 (such as a burn-in oven), which may be an autoclave. Heat may be generated by heat strips placed on, for example, support 162.
Referring to FIG. 6B, an embodiment of the invention includes heating chamber 202, which accommodates more than one wafer (e.g., wafers 10A, 10B, and 10C, 10D) at a time, which may be simultaneously tested, or otherwise controlled, by system controller 180. (The wafers may be stacked, one above the other.) One or more probe positioning controllers (which may be like controller 166) may be used in heating chamber 202. Whether or not a heating chamber is used, more than one wafer may be simultaneously controlled by system controller 180.
The relatively small number of probes needed to control the wafer reduces the space required in heating chambers.
D. Modes
Die 22A may enter, modify, operate within, or exit certain modes based on the characteristics of the alternating signal obtained through demodulator 100 and associated circuitry. Data may be transmitted through the alternating signal in a mode. The following are examples of the various modes within which die 22A may enter, modify, operate within, or exit in response to reception of information from the alternating signal:
1. Testing Modes
Referring back to FIG. 3, in various testing modes, die 22A may perform self-tests to determine whether certain portions of die 22A perform according to specification. These tests may include functional and/or parametric tests. Merely as an example, test circuit 110 may write data to locations in an array 114 and then read from the locations in array 114 to determine if the data was properly stored. Errors may be identified through error block 118 and logic block 122. Other components of die 22A (such as periphery 128) may be tested.
Test patterns and addressing information may be provided on the alternating signal on, for example, conductive path 52. For example, a first portion of the alternating signal may specify a particular test to be performed. A second portion of the alternating signal may provide the data to be written and the addressing information. A third portion of the alternating signal may indicate the conclusion of the test mode, or initiate another event such as a self-repair mode. Alternatively, test patterns and other information can be stored in memory on die 22A, or in a chip on wafer 10.
As discussed above, data may be passed from contact 130A through conductive path 54 to probe pad 32. Such data may indicate that a test was successful or a test was not successful, or other diagnostic information.
2. Stressing Modes
As noted above, certain defects in a die will only appear after the die has been operated over a period of time under various conditions. These conditions may be accelerated in a self-stressing mode. An alternating signal with certain characteristics may initiate and control self-stressing.
3. Repair Modes
In various self-repair modes, die 22A may repair various components through, for example, activating redundant circuits. The self-repair modes, including back-end repair, may be activated by different alternating signals. An alternating signal on conductive path 52 may indicate which fuse or antifuse should be activated. Because complicated tests may be done while the die is on the wafer, repairs may be done before stressing including burn-in, prior to the completion of stressing, or after stressing.
Time and resources are saved if a repair is made before burn-in or other stressing. Time and resources are also saved if it is determined before burn-in or other stressing that a repair is not available.
E. Additional Examples, Explanations, and Variations
Various input circuits may be used in die 22A. Referring to FIG. 7, a first alternative input circuit 210 for die 22A includes a regulator 214 and a clock extractor 218. FIG. 8A shows an alternating signal (or a portion of one) received at contact 70A. FIG. 8B shows the regulator output at a conductor 224. FIG. 8C shows a clock output at a conductor 226.
Referring to FIG. 9, a second alternative input circuit 230 for die 22A includes a standard input buffer 234 in parallel with a data buffer 236. The alternating signal is received on a contact 70A (which may act as a row address strobe signal (RAS) contact pad). As an example, referring to FIG. 10A, the alternating signal includes signals in the low level range 248 or alternative low level range 252 at, for example, low or radio frequencies. The data input levels are invisible to standard input buffer 234 if above VIH or below VIL. Referring to FIG. 10B, an input signal 242 at contact 70A in unmodulated form within range 248 is received at a contact. Input buffer 234 passes VCC (or the RAS signal), and data buffer 236 passes the data-in signal.
Referring to FIG. 11, a third alternative input circuit 260 is similar to circuit 230 of FIG. 10, except that circuit 260 includes a second contact 262 that receives a reference level signal (shown in FIG. 12). A standard buffer 264 passes VCC and a buffer 266 passes the data-in signal from the alternating signal. Using contact 262 to pass a reference signal allows more information to be held off chip, but at a cost of an extra probe pad and conductive path.
Referring to FIG. 13, a fourth alternative input circuit 270 in which the data from contact 70A and data from contact 272 is fed into a differential buffer 274 such that a reference voltage is not needed. Buffers 276 and 278 produce individual control and/or data streams, as does differential buffer 274 through summing the signals at contacts 70A and 272. Referring to FIG. 14, the input signal to contacts 70A and 272 may be modulated with amplitude modulation (AM), frequency modulation (FM), pulse modulation (PM), or any other acceptable format at, for example, low frequency or radio frequency.
Referring to FIG. 15, a fifth alternative input circuit 280 receives the VCC and data-in signals at contact 70A. A standard buffer 282 passes VCC. A demodulator 284 includes a filter 286 and a detector 288 that extract the data-in signal, which is passed through buffer 290. Detector 288 may be, for example, an FM/PM discriminator or an AM detector. The detector design will vary with the method of modulation selected.
Referring to FIG. 16, a sixth alternative input circuit 300 receives the VCC and data-in signal from contact 70A and a reference local oscillator signal on a contact 302. The VCC signal is passed by standard buffer 304. A detector 308 provides the data-in signal to buffer 312 based on signals from filters 314 and 316. Again, supply of the reference signal from off chip makes the detector design easier. However, a carrier frequency local oscillator may be on or off the die.
Note that there is not necessarily any significance in providing different reference numerals for contacts 262, 272, and 302. For simplicity, the input circuits of FIGS. 7, 9, 11, 13, 15, and 16 do not necessarily include all well known circuitry.
There are various data formats of the alternating signal. An exemplary format may include a header, data packet, addressing, or a parity bit. Supplying an external clock via an additional contact tends to greatly simplify the circuit design.
The present invention may be used in connection with supervoltage test means and miscellaneous programming.
It is expected that the greatest utility for the present invention will be for dice at the wafer stage. In most cases, it is expected that the alternating signal will not be applied to a die after it is packaged and used in ordinary operation. However, the alternating signal may be applied and the die placed in modes or data communicated to the die after the die has been packaged and used in ordinary operation. Alternatively, the circuitry that responds to the alternating signals may be disabled prior to shipping the die for commercial use.
In any event, a chip assembly having a die constructed according to the present invention may be used in a computer system or other system. For example, FIG. 17 illustrates a computer system 320 that includes a computer chassis 324, a keyboard 326, and a display monitor 328. Computer chassis 324 includes various electronic components including at least one chip assembly 330. Chip assembly 330 includes a die constructed according to the present invention (i.e., a chip assembly that includes a die having circuitry designed to receive an alternating signal). Once packaged, or otherwise prepared for commercial use, die 22A would be part of such a chip assembly.
FIG. 18 illustrates an electronic device 340 that includes various electronic components including a chip assembly 344 (which may be the same as chip assembly 330). Chip assembly 344 includes a die constructed according to the present invention. Electronic device 340 may be any electronic device that includes dice, including, without limitation, memory devices, printers, displays, keyboards, computers (such as computer system 320), oscilloscopes, medical diagnostic equipment, and automobile control systems, to name only a few.
Substrate 14 may be formed of a variety of materials including silicon and gallium-arsenide. Wafer 10 is not limited to any particular shape or size, although currently 6″and 8″ diameter wafers are popular. The dice are not limited to any particular type of dice. For example, the dice may be formed of various materials including silicon and gallium-arsenide. The dice may be such as are used with any of various memory chips, microprocessors, or application specific integrated circuits (ASICs).
Factors to consider in determining the number of probe pads include limits to the amount of current passing through a single pad, expense, space available for probe pads, and avoiding complexity.
As used in the claims, the terms "connect," "connectable," or "connected" are not necessarily limited to a direct connection. For example, probe pad 32 is connected to die 22A, although indirectly through conductive path 52. Further, there may be intermediated electronic components along or in the conductive paths, for example, buffers or amplifiers. In such a case, probe pad 32 would still be connected to die 22A, although indirectly. However, as used herein, the word "connected" refers to an operational connection and not a mere indirect connection. For example, every portion of the wafer is directly or indirectly connected with every other portion, but not every portion is operationally connected to another portion.
The materials mentioned herein, such as probe pads, contacts, conductive paths, and portions of the die and system, may be constructed according to various well known techniques from various well known materials.
There may be various standard, well known circuits on the wafer 10, other than the dice. Also, there may be additional buffers or amplifiers on wafer 10 separate from the dice. Further, there may be reductant probe pads, conductive paths, and contacts under the design of the present invention.
Having thus described in detail preferred embodiments of the present invention, it is to be understood that the invention defined by the appended claims is not to be limited by particular details set forth in the above description as many apparent variations thereof are possible without departing from the spirit or scope thereof.
|Cited Patent
|Filing date
|Publication date
|Dec 12, 1974
|Jun 15, 1976
|International Business Machines Corporation
|Probe device having probe heads and method of adjusting distances between probe heads
|Dec 30, 1974
|Jul 26, 1977
|International Business Machines Corporation
|High density wafer contacting and test system
|May 4, 1981
|Feb 28, 1984
|Flight Systems, Inc.
|Apparatus for testing semiconductor devices and capacitors
|Sep 30, 1988
|Feb 6, 1990
|Micron Technology, Inc.
|Discrete die burn-in for nonpackaged die
|Nov 3, 1989
|Nov 6, 1990
|Motorola, Inc.
|Apparatus and method for burning in integrated circuit wafers
|Mar 12, 1990
|Apr 23, 1991
|Mitsubishi Denki Kabushiki Kaisha
|Wafer prober
|Nov 14, 1989
|Jul 23, 1991
|Leedy Glenn J
|Test device for testing integrated circuits
|Apr 28, 1989
|Jul 23, 1991
|Ets Gourdon
|Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support
|Jun 4, 1990
|Dec 3, 1991
|Texas Instruments Incorporated
|Full wafer integrated circuit testing device
|Jun 7, 1991
|Jun 23, 1992
|Texas Instruments Incorporated
|Non-destructive burn-in test socket for integrated circuit die
|Jul 31, 1991
|Mar 30, 1993
|Tokyo Electron Limited
|Electric probing-test machine having a cooling system
|Jun 29, 1990
|Mar 30, 1993
|Digital Equipment Corporation
|Integrated circuit test fixture and method
|Jul 26, 1991
|May 11, 1993
|International Business Machines Corporation
|Probe for wafer burn-in test system
|Dec 11, 1991
|Nov 30, 1993
|Mitsubishi Denki Kabushiki Kaisha
|Apparatus and method for testing semiconductor device
|Nov 2, 1992
|Feb 15, 1994
|National Semiconductor Corporation
|Individualized prepackage AC performance testing of IC dies on a wafer using DC parametric test patterns
|Nov 10, 1992
|Apr 12, 1994
|Micron Technology, Inc.
|Discrete die burn-in for non-packaged die
|Sep 11, 1992
|Jun 28, 1994
|Tokyo Electron Yamanashi Limited
|Probe apparatus
|Dec 10, 1991
|Jul 5, 1994
|Sharp Kabushiki Kaisha
|Integrated circuit device
|Dec 13, 1991
|Aug 16, 1994
|Fujitsu Ltd.
|Semiconductor memory device having a testing function and method of testing the same
|Nov 13, 1992
|Aug 30, 1994
|Micron Technology, Inc.
|Soft bond for semiconductor dies
|Jul 2, 1992
|Feb 14, 1995
|Lsi Logic Corporation
|Individually powering-up unsingulated dies on a wafer
|Jul 7, 1992
|Apr 25, 1995
|Sumitomo Electric Industries, Ltd.
|Semiconductor device testing apparatus
|Aug 23, 1993
|Jul 25, 1995
|Mitsubishi Denki Kabushiki Kaisha
|Method for testing semiconductor device
|Jul 2, 1992
|Aug 15, 1995
|Lsi Logic Corporation
|Testing and exercising individual, unsingulated dies on a wafer
|Mar 22, 1994
|Aug 29, 1995
|International Business Machines Corporation
|Memory device with programmable self-refreshing and testing methods therefore
|Jul 23, 1993
|Oct 10, 1995
|Micron Technology, Inc.
|Semiconductor array having built-in test circuit for wafer level testing
|Jan 12, 1995
|Oct 10, 1995
|Sumitomo Electric Industries, Ltd.
|Semiconductor device testing apparatus
|Mar 9, 1994
|Jan 9, 1996
|Micron Technology, Inc.
|Method for circuits connection for wafer level burning and testing of individual dies on semiconductor wafer
|Nov 21, 1994
|Apr 2, 1996
|Motorola Inc.
|Apparatus for performing wafer level testing of integrated circuit dice
|Apr 7, 1994
|Aug 27, 1996
|Samsung Electronics Co., Ltd.
|Method of manufacturing a known good die array
|Dec 3, 1996
|Jan 12, 1999
|Micron Technology, Inc.
|Circuit and method for configuring a redundant bond pad for probing a semiconductor
|Sep 13, 1996
|Apr 27, 1999
|Micron Technology, Inc.
|Reduced terminal testing system
|Oct 10, 1997
|Nov 2, 1999
|Micron Technology, Inc.
|Reduced terminal testing system
|Dec 19, 1997
|Nov 30, 1999
|Micron Technology, Inc.
|Reduced terminal testing system
|Dec 19, 1997
|Sep 12, 2000
|Micron Technology, Inc.
|Reduced terminal testing system
|Jul 29, 1999
|Sep 18, 2001
|Micron Technology, Inc.
|Reduced terminal testing system
|Aug 27, 2001
|Jul 23, 2002
|Micron Technology, Inc.
|Reduced terminal testing system
|Title not available
|Title not available
|U.S. Classification
|324/750.3, 324/762.03
|International Classification
|Cooperative Classification
|European Classification
|Mar 6, 2007
|Certificate of correction
|Apr 25, 2008
|Fee payment
Year of fee payment: 4
|Apr 18, 2012
|Fee payment
Year of fee payment: 8
|Jun 17, 2016
|Maintenance fee reminder mailed
|Nov 9, 2016
|Lapse for failure to pay maintenance fees
|Dec 27, 2016
|Expired due to failure to pay maintenance fee
Effective date: 20161109


text:
True enough
GOP Blames Scare Tactics for New York Loss.
WASHINGTONRepublican leaders, faced with the unexpected loss of a congressional seat in New York, said Wednesday that a GOP proposal to overhaul Medicare played a role in the election upset Tuesday.
But they accused Democrats of deploying scare tactics aimed at the Medicare plan that could sabotage bipartisan efforts to rein in federal spending and debt this year.
Democrat Kathy Hochul won the House seat from western New York, in a Republican-dominated district, after a campaign in which she consistently attacked the GOP Medicare plan.
She carried 47% of the vote, to 43% for Republican Jane Corwin and 9% for a third-party candidate.
In November, a Republican won the same House seat with 68% of the vote.
The victory emboldened Democrats on Wednesday to stand firm against changes in the program in coming budget talks. It is also solidifying their strategy of making their stance on Medicare a centerpiece of the party's 2012 campaign message.
Republicans tried to minimize the significance of the issue in the special election, but they acknowledged that the results signaled that they would have to do a better job of explaining their Medicare proposal to votersor else change the subject.
"It can be a powerful political weapon," Rep. Paul Ryan (R.,Wis.), said in an interview on MSNBC Wednesday, citing ads attacking the plan he authored. "People in the Republican Party are nervous because of these kinds of ads."
At a later appearance Wednesday, Mr. Ryan said Democrats were "shamelessly demagoguing and distorting" his plan. "We call it 'Mediscare.' "
He said the result could be "political paralysis'' as the two parties try to negotiate measures to reduce federal budget deficits. "That means nothing gets done. That means we go further down the path to debt," he said.
Under Mr. Ryan's plan, which the House approved last month on a near party-line vote, Medicare would no longer be a fee-for-service program. Instead future retirees would choose from a menu of private insurance plans, which would be subsidized by the government. People now age 55 and older would not be affected.
The special election in the New York district, between Rochester and Buffalo, was watched nationally because Democrats had framed it as a referendum on the Medicare overhaul.
Ms. Corwin, the GOP candidate, had endorsed the plan, drawing attacks from Ms. Hochul and from Democrats around the country.
"Medicare is huge," said Carol Kociela, a Democrat and retired Amherst, N.Y., bank executive who voted for Ms. Hochul. "When that whole issue started playing on the ads, you could tell immediately that people were very concerned and seriously considering whether or not they could vote for a conservative."
The results emboldened Democrats who have been arguing that their party should give no ground to the GOP on cutting Medicare in negotiations over a deficit-reduction package. Members of both parties say a spending-cut package is needed in order to build support in Congress for raising the nation's borrowing limit, a step the Treasury says must be done by Aug. 2 to avoid default.
Sen. Patty Murray (D., Wash.) chairwoman of the Democratic Senatorial Campaign Committee, said the New York results bolstered her plans to make the Medicare debate central to Senate races across the country in 2012.
"The results provide clear evidence that Democratic senators and Senate candidates will be able to play offense across the country by remaining focused on the Republican effort to end Medicare," said Ms. Murray.
Mr. Ryan, the House Budget Committee chairman, said at a conference on fiscal issues Wednesday that Republicans were holding back on a proposal to overhaul Social Security because they feared Democrats would use it to stir voter anger.
"We believe that if we put a Social Security plan out there, it would be too easy for Harry Reid and Nancy Pelosi to demagogue it,'' he said, referring to the Senate and House Democratic leaders.
In an earlier speech at that conference, former President Bill Clinton warned Democrats against standing pat and fighting proposals to rein in Medicare costs.
"You should draw the conclusion that people made the judgment that the proposal in the Republican budget is not the right one," he said. "But I'm afraid that Democrats will draw the conclusion that because Congressman Ryan's proposal is not the best one, we shouldn't do anything. I completely disagree with that."
Special elections sometimes foreshadow the results of the next general election. But just as often, they end up being completely unrelated to what's to come. Shortly before the 2010 election, for example, Democrats won a tough special election in Pennsylvania, only to lose dozens of House seats that year.
Rep. Pete Sessions (R., Texas), who is spearheading the Republican House campaigns, said Tuesday: "Obviously, each side would rather win a special election than lose, but to predict the future based on the results of this unusual race is naive and risky."
The election results come at time when some House Republicans have been trying to draw attention to their efforts to spur economic growth and stimulate job creation.
House Majority Leader Eric Cantor (R., Va.), who has given a series of speeches to argue that the GOP agenda is broader than cutting government spending, on Thursday will propose a package of job-creation measures that will include ideas about overhauling the tax code and curbing regulation.

subset: commoncrawl


text: Currently using black code 18 full set. Im thinking of softening up the string bed because i dont want to hurt her arm. I was told by someone on here to try the x one biphase and the blackcode as a hybrid. I was just wandering do you guys think i should put the black code as the mains or the x one as the mains. These strings are expensive so i dont wanna waste any. Also what do you guys think about using gut with the black code. I an using 18g because i know its a little better for her arm.


text:
April 4, 2013 - submitted by Jamie, United Kingdom
Q. Hi, The Mighty Oracle. I have just been listening to Coldplay's concert from Zurich on the 26th May, and before the band play Yellow, Chris dedicates the song to Phillip Schofield.
The Oracle replies:
This is an easy peasy one. Phillip and his missus were in attendance at that show so Chris dedicated Yellow to him.


text:
For the third consecutive year, Alabama will produce the first running back drafted in April. Eddie Lacy rumbled to MVP honors in the BCS title game against Notre Dame and left school early to follow Heisman Trophy winner Mark Ingram and Trent Richardson to the NFL.
In 2011, Ingram was the only running back taken in Round 1, No. 28 overall to the Saints. Last year, however, Richardson went No. 3 to the Browns. Before the round was complete, he had company from Doug Martin (Buccaneers at No. 31) and David Wilson (Giants at No. 32).
Although Richardson and Martin had strong rookie seasons, it was Alfred Morris, the Redskins' sixth-round pick, who finished behind only Minnesota's Adrian Peterson in rushing with 1,613 yards.
Lacy, with his strong combination of power and explosiveness, could have the special qualities to make at least one team use a high pick on him next month.
Starting with the Bengals at No. 21, Lacy has a good chance to go in the bottom of the first round. For the teams that prefer to wait to find their version of Morris, there also are some intriguing later-round options in this year's class:
1. Eddie Lacy, Alabama (5-11, 231 pounds). Lacy was a bruising runner with sudden bursts for the Crimson Tide. It helped he ran behind an NFL-caliber offensive line, including likely first-rounders in guard Chance Warmack and tackle D.J. Fluker. Some scouts see Lacy as an every-down back in Richardson's mold, while others see him a stronger red-zone finisher than Ingram. Wherever he goes, he'll have a chance to carry a load right away.
2. Giovani Bernard, North Carolina (5-8 3/8, 202). Every NFL team needs a speed option in its backfield. Bernard's elusiveness and ability to turn corners quickly put him in that mold. He's not quite as fast, however, as LeSean McCoy or Darren Sproles. He's a compact runner but will need to show he can gain more yards after contact to be a traditional three-down back.
3. Johnathan Franklin, UCLA (5-10, 205). Teams that like Franklin see what he can do as a quick, low-to-the-ground type runner. He also has the hands to be a consistent outlet receiver. Not much different from Bernard, the question is can he take the pounding over 20 touches a game.
4. Stepfan Taylor, Stanford (5-9 1/8, 214). The lasting image of Taylor from 2012 was how his push was ruled short of the goal line in the Cardinal's overtime loss at Notre Dame. He's a hard, determined runner who may not possess the ideal burst, but he can make up for it with relentless effort. He's probably looking at a situational role as a rookie.
5. Joseph Randle, Oklahoma State (6-0, 204). Randle's biggest assets are his speed and quickness. The trick is putting it together with his frame, so he's more than a dasher and becomes more of a power type, like Baltimore's Bernard Pierce. The kind of prospect he is now, Randle can be slotted in the late second or early third round.
6. Marcus Lattimore, South Carolina (5-11 1/4, 221). Lattimore is trying to come back from a devastating right knee injury (torn ACL, LCL and PCL) suffered last October. Although he likely won't be ready to be inserted into an NFL backfield right away, he's a worthy stash for a team that can afford sitting him. His work ethic and natural talent can't be questioned, and there is precedent for such a pick working (see Willis McGahee).
7. Montee Ball, Wisconsin (5-10 1/2, 214). Ball was a touchdown machine in 2011, before cooling off along with the whole Wisconsin offense last season. There's something smooth and effortless about his running style, even though there's nothing specific about his game that stands out. In the right (zone-blocking?) system, he has a chance to scratch the surface of his prolific college production.
8. Le'Veon Bell, Michigan State (6-1 3/8, 230). Bell can do a little bit of everything. His size and hard-charging running should get attention. He also can contribute more as a receiver than he did in college. The question is, despite his frame, if he can handle the licks that come with a tough load.
9. Kenjon Barner, Oregon (5-9 1/4, 196). Barner was the primary burner in Chip Kelly's offense last season, and his former Ducks teammate, LaMichael James snuck into the bottom of the second round (49ers) last year. Like with other smaller, faster backs in this class, teams must gauge how much pounding they think Barner can take and still be effective with his speed.
10. Mike Gillislee, Florida (5-11 1/4, 208). Gillislee held up well as the Gators' feature back because he had the patience to let his blocks develop but also had good instincts to burst decisively when the right holes became available. To see more significant work in the NFL, he must show he can do more on cutbacks.
11. Kerwynn Williams, Utah State (5-8 1/8, 195). Williams is the classic little guy who can fly. Teams seeking to use him as just that will slide him up their boards. He comes from a smaller school but was the Aggies' successor to Seahawks backup Robert Turbin. Williams' versatility has the potential to make him the steal of his class.
12. Theo Riddick, Notre Dame (5-10 1/8, 201). Riddick thrived in his conversion from wide receiver. He showed surprising toughness with his no-nonsense running. But removed from Notre Dame's fine blocking and lesser college competition, Riddick should and will get more consideration as a skilled pass-catching scatback.
13. Cierre Wood, Notre Dame (5-11, 213). Physically, Wood looks the part with explosiveness that teams would covet. Despite his talent, he couldn't maximize his position with the Fighting Irish, and he also carries some off-field character questions.
14. Jawan Jamison, Rutgers (5-7 3/8, 203). Not exactly Ray Rice, Jamison was off to the races as a smaller back for the Scarlet Knights in 2012 before being derailed by an ankle injury. Given he cuts well to the outside, he'll get middle-round looks a change-of-pace back.
15. Ray Graham, Pittsburgh (5-9 1/8, 199). Graham is a quick, shifty back with good hands. He looked special at times with the Panthers, but he's trying to overcome two things that happened late in the season -- a hamstring injury and an off-field (simple assault/conspiracy) incident involving a Pitt student.
16. Zac Stacy, Vanderbilt (5-8 3/8, 216). What you see is what you get with Stacy: a strong decisive runner who will operate well as a complementary back for a team with a sound, established line and blocking scheme.
17. Knile Davis, Arkansas (5-11 3/8, 227). Davis, like Lattimore, is trying to convince teams to look past recent injury history and take him based on the great power he showed with the Razorbacks during his sophomore year. The difference is there is already evidence from 2012 that Davis wasn't all that effective returning from a broken left ankle. Lattimore is a much better medical gamble.
18. Rex Burkhead, Nebraska (5-10, 214). Burkhead is looking to break away from a 2012 season that was marred by a sprained MCL. There's a lot to like about Burkhead when healthy, a hardnosed runner with a good history of production as the Cornhuskers' busy featured runner.
19. Michael Ford, LSU (5-9 1/4, 210). Ford has the good Tigers pedigree and comes with some all-around skills, including speed. He'll be a late-round project for a team hoping it can help him put it all together.
20. Onterio McCalebb, Auburn (5-10 1/4, 168). McCalebb is on the radar as a late-round pick and priority free agent because he ran the fastest 40-yard dash (4.34 seconds) of any back at the Combine. He'll be selected because of speed, and the team that adds him will go from there and see whether he can give more.


text:
BERLIN- The new Coastal Lacrosse Club began its inaugural season last weekend with a full slate of games at the Northern Worcester Athletic Complex in Berlin.
The Coastal Lacrosse Club formed earlier this year with the goal of offering another option for young players in the ever-growing field of youth lacrosse programs in the area. Coastal Lacrosse is a member of the Delaware Youth Lacrosse Foundation, a regional chapter of U.S. Lacrosse, and it offers league opportunities for boys and girls ages 7-14 as well as training programs for boys and girls in pre-K to second-grade. The program currently has around 135 members.
Last week, Coastal Lacrosse opened its very first season with league action against a team from Middletown, Del.


text:
ATLANTA — A Georgia-based carpet manufacturing company will open two facilities in the northwestern part of the state, creating about 2,400 jobs over the coming years, the office of Gov. Nathan Deal said Wednesday.
Engineered Floors will build the facilities in Whitfield and Murray counties under a plan that was expected to be finalized Wednesday, Deal's spokesman Brian Robinson said. The development was first reported by the Atlanta Journal-Constitution and WSB-TV.
"The story of Engineered Floors is the story of a Georgia-grown company's continued commitment to, and investment in, northwest Georgia," Deal said in a statement. He added that the floor covering industry is a cornerstone of the state's economy.
Northwest Georgia is internationally known as a carpet manufacturing hub, but the region lost thousands of jobs when the housing market stalled. More than 90 percent of all carpets sold in the U.S. and 54 percent of the country's carpet exports are made in the state, according to the Georgia Department of Economic Development.
"The expansion of Engineered Floors is uplifting news for Northwest Georgians, who have persevered through the recent years of economic hardship," U.S. Rep. Tom Graves, R-GA, said in a release. Graves, of Georgia's 14th Congressional District, represents Murray and Whitfield counties.
"Many families will be relieved to hear about the thousands of new job opportunities, and we're all proud to see Dalton and the surrounding area remain the Carpet Capitol of the World," he added.
The facility planned for Murray County will be a manufacturing plant and the Whitfield County facility will be a distribution center, according to Allison Tyrer, Georgia Department of Economic Development spokeswoman.
It was not immediately clear Wednesday where the two facilities would be built. A message for Engineered Flooring representatives was not immediately returned.
Bob Shaw, Engineered Floors CEO, is expected to invest $450 million in the expansion, and the plants are expected to employ 2,000 people over the next five years. The company has committed to creating 2,400 jobs in the state and is eligible for up to $69.7 million in tax credits, Tyrer said.
The benefits include mega project job tax credits and assistance from workforce training program Georgia Quick Start.
Tyrer said Engineered Floors will also be exempt from paying sales tax on energy used in the manufacturing process, and will be exempt from sales tax on construction materials.


text:
CHINA TOWNSHIP, Mich. -
The bags of remains were found near Allington Road and Fred Moore Highway. The sex and race of the body have yet to be determined.
The St. Clair County Sheriff's Office said the remains are being investigated as a homicide.
"We have three different scenes, at a minimum, of body parts. So it's horrific, gruesome for the detectives who have been on scene," said Sheriff Tim Donnellon.
The Sheriff says they believe the parts were dumped Thursday afternoon between noon and 4 p.m.
"We had a tip come in of someone who saw someone dumping garbage bags on the side of Allington Road, which is one of the crime scene locations, and we're looking for anyone who saw anything suspicious between about noon and 4 o'clock in the area of St. Clair Highway and Allington Road," said Donnellon.
A witness called to report a vehicle -- possibly a 1990s SUV -- dumping what they believed to be garbage. The vehicle is either white or gray in color, possible a GMC Jimmy or Chevrolet Trailblazer. The driver was a white, middle-aged woman, possibly obese.
The Michigan State Police Crime Lab has sent a team from Sterling Heights to assist in the investigation.
Anyone with information on this homicide should contact the Sheriff's Office at 810-985-8115.
Copyright 2014 by ClickOnDetroit.com. All rights reserved. This material may not be published, broadcast, rewritten or redistributed.


text:
Bulls have 1 game left tomorrow against the Cavs
The Spurs play the Suns tonight and the Warriors tomorrow night.
So obviously the Bulls have 49 wins and the Spurs have 48
I say both of them get 50 wins, thats impressive considering the shortened season. The Spurs deserve their props, they earned alotta respect. But I cant predict anything for the West playoffs. The Thunder, Spurs, and Lakers are all great teams and the Grizzlies will be tough. I think they'll beat the Clippers in the 1st round


text:
Yancey County's Public Works Department includes three areas: Convenience/Recycling Centers, Transfer Station, Facility and Grounds Maintenance.
Convienence/Recycling Centers
The Public Works Department provides six convenience centers to collect the County's residential solid waste and recyclables. The convenience centers are located at various locations throughout the county. The address and phone number of each convienence center is listed on the right. Residents can also use containers located at the Yancey-Mitchell Transfer Station off N.C. Highway 80 North, on Landfill Road.
All six of the centers are open Monday through Saturday from 7:00 a.m. until 7:00 p.m. The Transfer Station is open Monday through Friday 8:00 a.m. until 4:00 p.m. and Saturday 7:00 a.m. until 12:00 p.m.
The Convenience Centers and Transfer Station are closed on these holidays:
Each of the centers takes bagged household waste in addition to recycling newspapers, cardboard, aluminum cans, glass containers and plastic.
Used motor oil and tires are accepted at the East Yancey/Burnsville Center.
Transfer Station
Yancey-Mitchell Transfer Station accepts solid waste from the County's industries, from municipal and County waste collection facilities and from Yancey and Mitchell County residents. Yancey County manages the operations of the Transfer Station according to a joint agreement with Mitchell County.
From the Transfer Station, the solid waste is loaded into trailers and hauled to an approved landfill in Caldwell County, North Carolina area for disposal. The Transfer Station also operates a scrap metals and white goods recycling facility.
Also located at the Transfer Station is the award winning, Energy Xchange Project. This is a non-profit business incubator utilizing methane gas produced from the closed solid waste landfill. Yancey County was awarded a U.S. Department of Energy Grant in 2008, for the retrofitting of the existing EnergyXchange operations and additional green energy programming.
Facility and Grounds Maintenance
The Yancey County Maintenance Department has the responsibility of maintaining all County-owned buildings and grounds.
Contact Information
Sanitation and Recycling Superintentent
Office Location
130 Burnsville School RoadBurnsville, NC 28714828-682-5657
Contact Information
Sanitation and Recycling Superintentent
Office Location
130 Burnsville School RoadBurnsville, NC 28714828-682-5657
East Yancey/Burnsville Center 130 Burnsville School Road 828.682.5657
197N/Green Mountain Center 3805 State Highway 197 N 828.678.9809
Riverside Center 2030 US Highway 19-E 828.682.4447
Egypt/Ramseytown Center 8650 US Highway 19-W 828.682.4791
Pensacola/197S Center 8137 State Highway 197 S 828.682.9400
South Toe/NC 80S Center 300 Hickory Springs Rd 828.675.0967


text:
You will not achieve fulfillment and happiness until you allow God to be the architect of your reality. Imagine that with a few moments each day, you could begin the powerful transformation toward complete control of your own life and well-being through prayer.
You will be able to release all fear and doubt simply because you know that God gives you the strength. You can utilize this simple, proven technique to regain the lost comforts of joy, love, and fulfillment in your life.
God's gift of life is too short to be exhausted on thousands of everyday anxieties and fears. Sadly, the average person will get to the end of his life and realize that more than half of it was spent struggling with these kinds of problems. Because they didn't know what to do, many of these people never found any satisfaction in life. You can and will become bigger than those struggles by enhancing the positive energy that God already has flowing within you.
If you want to see positive change now, you'll find the quickest path to fulfillment with prayer through God's love. There is no time to spend on loss, negativity, and defeat when you can be achieving tangible, historically proven results with minimum time and effort invested.
There is no limit to changes that God can make in your life through the power of creating truth with prayer.
Listen to this audiobook now and change your life today!
©2017 PrayToTheWorld.com (P)2017 PrayToTheWorld.com
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text: I started in 1983 I was 11 years old. I raced BMX and the only way to pay for it was I had to earn it. Got that MTD mower of my dad's and balanced the gas can, Electric weedeater, and Power Cord on the mower got on my bike and pulled it all behind me. Went door to door all over my neigborhood. Would stop at any and all houses that looked like it needed mowed. Would get from $10 to $25 I was a SCRUB LOWBALLAR I then got all craftsman I was still in school and after HS I went into Marines got out started lawn work again from scratch started with craftman again this was in 93 worked for the city on the side then went to Toro and Shindowa in 95 also quit the city and was a Full time LCO had a new Toro 21" and 32" new trimmers, blower and 3 months went by guess what it all was stolen and I still owed on it with no insurance. Went into truck driving for 7 months quit that and joined the Army got out in 98 started working for the state of TX as a Correctional Officer. In 2001 started my lawn service again with craftsman again 2002 got Toro 21" and 36" WB trailer, stihl trimmers, blower, echo hedge trimmers. I had 40 customers last season and expect the same if not more this season. I focus on doing a good job and being paid good for it. I have got picky about who I will mow for. This year so far I have turned down 7 customers lawns. I look forward to what the next few years may bring for my lawn biz. Good luck to us all.


text:
Brown returns to Phillies' starting lineup
By Todd Zolecki / MLB.com
NEW YORK -- Domonic Brown is back in the Phillies' lineup.
He started Thursday afternoon against the Mets at Citi Field. It was his first start since Friday because of inflammation in his right Achilles. Phillies interim manager Ryne Sandberg said Wednesday that Brown had made good progress recently and was close to returning to action.
"It was a little stiff there later on in the game," Brown said after the Phillies' 11-3 loss to the Mets. "I need to make sure that I kept stretching it, making sure that my calves and hips were stretched out. I'm going to keep doing that. If I keep moving around I'm fine. I felt pretty good."
Brown went 2-for-4 on Thursday and is hitting .277 with 18 doubles, four triples, 27 home runs and 80 RBIs in 120 games.
Before Cubs, Ryno's career took root with Phils
NEW YORK -- Ryne Sandberg smiled this week as he recalled a few of his favorite stories from his playing days at Wrigley Field.
He played with the Cubs from 1982-97, where he established himself as a Hall of Fame second baseman. He returns to Wrigley on Friday as interim manager of the Phillies.
"I guess the first thing is I'll probably check out my flag out there on the right-field pole," Sandberg said.
Sandberg picked up his first big league hit at Wrigley on Sept. 27, 1981, but as a member of the Phillies. He recalled his own bats had not arrived yet, so he borrowed one from Phillies teammate Larry Bowa. He hit a flare to right field against Cubs pitcher Mike Krukow.
"I still have the bat and the ball," Sandberg said. "It was ... slightly off the end of the bat and the Rawlings writing on the ball came off on the bat. So I have the ball and the bat, and there's no writing on the ball. It's all on the bat."
Sandberg and Bowa talked Wednesday on MLB Network, where they shared a few stories. They recalled how a frustrated Bowa once took a bat to the urinal in the Cubs dugout, bashing it into a million pieces. Sandberg later said he never broke anything like that during his playing career, although he did admit to smashing a few batting helmets.
Bowa also recalled how he told Sandberg, once they became Cubs teammates in 1982, that because he had seniority over Sandberg that Sandberg had to take any popups hit between them.
And why is that?
Because the sun and wind at Wrigley Field could be so difficult, Bowa let Sandberg take on the challenge. Sandberg chuckled, recalling how he told future Cubs shortstop Shawon Dunston he had to take fly balls because he had seniority on him.
"We both go to Chicago, he takes me under his wing and teaches me everything about the game," Sandberg said of Bowa. "Having lunch with him every day pregame, talking about the pitcher that day, talking about at-bats the day before -- for the four years that I was with him, [I] really learned a lot about the game. Just being with him and spending the time after the game, having a beer and going to pregame lunch, talking about the game -- how to play catch right, working hand in hand pregame at shortstop, double play combinations, all that. That went a long way."
Asche day to day as Phils rest third baseman
NEW YORK -- Phillies third baseman Cody Asche tested his right hamstring in running drills before Thursday's 11-3 loss to the Mets, but he did not start as expected.
The Phillies said Asche suffered a mildly strained hamstring running to first base in the seventh inning in Wednesday's 6-2 victory at Citi Field. He felt some soreness in the morning, but passed the tests. He is day to day.
"He had a lot of treatments today, treatments throughout the game, which was a good thing," interim manager Ryne Sandberg said. "I wasn't going to use him today. He was pretty optimistic. He hit in the cage a little bit. It's basically a day-to-day thing. I'm hoping for tomorrow, wouldn't be surprised with tomorrow, but if it's a couple of days, it's a couple of days."
Asche is hitting .256 (22-for-86) with six doubles, one triple, two home runs and 14 RBIs in 25 games. Since a 1-for-17 start to his big league career, Asche has hit .304 (21-for-69).
Worth noting
• Major League Baseball suspended Phillies Minor League right-hander Gustavo Armas, who is on the Venezuelan Summer League Phillies, for 50 games without pay after testing positive for a metabolite Nandrolone.
Todd Zolecki is a reporter for MLB.com. This story was not subject to the approval of Major League Baseball or its clubs.


text:
Beyonce is opening up about her pregnancy and her miscarriage.
USA Today is reporting that in her upcoming HBO documentary, Beyonce opens up about the miscarriage she suffered before she got pregnant with her now 1-year-old daughter Blue Ivy. Also, Beyonce confronts rumors that she used a surrogate to carry Blue Ivy.
Watch Showbiz Tonight at 11 p.m. ET/PT on HLN!


text:
How to visit distant places from your home
Staycations in Paris, Mexico, China
by Alicia Z. Klepeis
Related Articles
|Stay-at-Home Vacation
An inexpensive vacation with kids? To many of us, that phrase seems like an oxymoron. Between the cost of gas (or even more dramatically, plane tickets), lodging, meals out, and entertainment, many families are opting for staycations. However, everyone likes to imagine going someplace exotic like Paris, Mexico, or even China. Why not do it all? Save money, have fun, and "travel" to the destination of your choice, all from home.
The two main ideas behind a staycation are economizing and enjoying life. Depending on the ages of your kids, it can be easy to get away from the norm and have a journey. The more creative you are, the more fun you can have. Whatever your "destination," you can follow the same steps as suggested in the Paris staycation described below. This is just one example of what can be done on your "holiday" away from home. Here are some tips for how to have your own international adventure, creature comforts intact:
1. Gather some information on your selected destination at your local library.
Since you'll be spending your weekend in Paris, you'll want a guidebook to the city and a French cookbook. If you really want to get in the spirit of things, grab a French phrasebook or a kid's book like First Hundred Words in French. Ask the librarian for picture books set in Paris. Two good ones are Adéle & Simon and Anatole. If your kids are slightly older (8-12), they might enjoy Charlotte in Paris or Postmark Paris: A Story in Stamps. Whether your staycation involves reading these books before bedtime or going to a local coffeehouse and ordering a café au lait for Mom and a hot chocolate for the kids, enjoying a book set in Paris will set everyone's imagination ablaze.
2. Decorate as much as you feel inspired to.
Kids love to be immersed in their surroundings. Why not have some fun and get out the craft supplies? It's easy enough to make an Arc de Triomphe out of construction paper and put it across your sliding glass door or in a window where everyone can see it. Kids can create Eiffel Towers from silver pipe cleaners. Add a string or two of white lights in the dining room or around a potted tree, which will be charming indeed. Let the kids browse your guidebook or find a website together with pictures of Paris. They will come up with some great ideas for how to "Frenchify" your home. A print of a painting by Monet or Cezanne will look great on the wall. Party stores sometimes have themed items too, such as Eiffel Tower-shaped place card holders. Keep it inexpensive and fun.
3. Enjoy food, glorious food!
If you are going to Paris for the weekend or a school vacation week, you must enjoy some French food. Make a simple quiche or try Beef Bourguignon if you are inspired. Too much work? If there is a kid-friendly French restaurant in the area, go for lunch. Share some entrees and try something new. Perhaps your local grocery store has an international aisle. Are there snack foods or candies from France available? How about a bottle of Perrier water and a four-pack of Orangina, which is citrus soda with just a little zest and pulp? A baguette is available at almost any grocery store in the country, as is Camembert or Brie cheese. Add some grapes, berries, or other fresh fruit and do a French picnic in the yard or somewhere scenic in your area. At the bakery, grab some éclairs, fruit tarts, and chocolate croissants for a delicious dessert (or decadent breakfast). If you want to set the table Parisian-style, put on a cream tablecloth, some candles, and a few fresh flowers and you'll feel like you're in some swanky bistro.
4. Use all your senses.
When you have your crepes for breakfast, put some French music on the stereo. Putumayo Presents: French Cafe is a great album to set the tone, so to speak. If you are in Mexico, having tortillas with eggs and refried beans, try some mariachi music. And why not do a movie night or afternoon on your staycation? Watch a travel show or DVD on your destination, or find a family-friendly movie set in your country. For example, a few family-friendly movies set in Paris include Ratatouille, Beauty and the Beast, The Red Balloon, and Linnea in Monet's Garden.
Another fun idea can be to download some podcasts of walking tours of your city. Listen to them on a ride in the car. Imagine you are looking up at Shanghai's skyscrapers, while eating dim sum or walking along Venice's canals while savoring hazelnut gelato. Your imagination is the only limit to where you go. Have fun!
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- For more on staycations, visit The Dollar Stretcher library.
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text:
This thread had been quiet.
I was wondering we were all going to get around and do nothing about.
Looks like we are all working hard and for what ? nothing......
I have posted nothing on this topic,at least,5 or 6 times,I think,maybe.
Here's something though:Canucks vs Flames tonight.
Sometimes,nothing is a real cool hand.
Bought a 95 GS today. Nothing really.
Ride Well
2010 Suzuki GSX1250SEA
ÔÇ£If you get in too far over your head, remember - full throttle and make it spectacular!ÔÇØ http://www.yearroundriders.com
Over 78,000 views and still nothing for people to look at.
Nothing to add, just noting that there hasn't been a post in 4 days.
Nobody has been uninspired enough to be stale and imaginative. That must mean Spring is here.
19 BMWMOA Nationals under my belt, and I have no idea what I am doing.
missed th etech day at Rapid Roy's, nothing to do with bikes, no riding, just nothingness....
2001 K1200LT "Zoot" RIP 10/14/2007
2009 K1200LT "Angus"
Cartoon Bears never wear pants!!
Can anyone claim to have read every post on this ridiculus thread? All 1400+ posts?
This means there has been a increase in.....or is it a decrease in the nothingness factor.
In theory we should be slowly disappearing yet we are showing an increase to 1.84 PPD's from 1.045 PPD's. Hmm? So if the average is going up then we should getting closer to nothingness, yet if it is going down.......
Or maybe all this is just plain nonsense
Square cap on a round peg. Almost nothing.
Original litter
Original owner
2012 Ural Gear Up
I finally had to do laundry, I had nothing to wear.
19 BMWMOA Nationals under my belt, and I have no idea what I am doing.


text:
With Neil Young currently in Austin, Texas, to deliver a SXSW keynote where's he expected to detail his Pono digital music service, a leaked press release has provided fans with an advance look inside both the service and its somewhat controversial player.
"It's about the music, real music. We want to move digital music into the 21st century and PonoMusic does exactly that," Young said in the release, which was posted on Neil Young News. "We couldn't be more excited about bringing PonoMusic to the market."
The service will entail both an online music store and the PonoPlayer, which comes in a long, triangular "Toblerone" shape as opposed to the usual flat look of most digital music players. The unorthodox design, according to the Pono Kickstarter page, enables the company "to use larger audio components and to separate them far enough apart to prevent electrical interference between the various subsystems. It also allowed us to use a large cylindrical battery that's much more efficient than a flat battery."
Made for audiophiles frustrated with the limited sound quality found on most digital music players, Pono offers potential users what they call the "highest resolution digital music available," with a music resolution rate that ranges from CD lossless, 44.1kHz/16 bit at the low end to 192kHz/24 bit high-resolution. That adds up to sound that at worst has "six times more musical information than a typical mp3" to as much as "30 times more data."
With more than a month left to pledge to help Pono get off the ground, more than half of the $800,000 had already been offered up (the pledge count was over $482,000 and climbing as of March 11).
— Scott Sterling, Radio.com


text:
Please help me identify this very strange long-necked bug seen in the Sumatran jungle of Indonesia. There were lots of them clustered in a fork in the tree and they didn't seem keen to move. Our Indonesian guide didn't know what they were either. Would be very grateful for anybody's help to ID them. This is my first post so hoping for a response!
Thank you!
It's a lantern bug of some sort. Here's a link to what may be the same species, but they haven't given it a name -
You're right! Thank you! In fact the link you sent did have the name: Zanna terminalis (when you scrolled over picture) a member of the Fulgoridae or planthopper family. I found this description of the long 'snout' on Wikipedia: 'The head of some species is produced into a hollow process, resembling a snout, which is sometimes inflated and nearly as large as the body of the insect, sometimes elongated, narrow and apically upturned.'
Thanks so much for a positive ID!
"In fact the link you sent did have the name: Zanna terminalis (when you scrolled over picture)"
Oh yes, I didn't notice that - glad we got it ID'd between us.
the link hasn't the same colours as yours, john whitton (but then it's a nymph) , but I've found 2 with same colours, http://www.projectnoah.org/spottings/16211756 ,without an ID, & http://www.loupiote.com/photos/6626462871.shtml , slightly less colorful, ID'd as Zanna terminalis nymph. This seems to me to indicate yours & Noah's as the adult, though http://eol.org/pages/240812/media shows 2 or 3 'unreviewed' types.


text:
CARSON, Calif. – The LA Galaxy may have begun their preseason slate on Friday with a 5-0 victory over the U.S. Under-17 national team, but they took time to offer their support to former LA Galaxy midfielder David Beckham, who signed with Paris St. Germain on Friday.
Beckham signed a five-month deal with PSG where he will offer his entire salary to a Parisian children's charity.
On Friday, Bruce Arena and Robbie Keane offered their thoughts to Beckham's move.
ARENA: "I think it's great. We wish him the very best. I hope it works out and he wins another championship, he has a good experience and he helps PSG and continues to move forward in the final years. I'll use plural because I'm never going to question him because he just keeps going."
KEANE: "It's great. He spoke to me yesterday; he said he was in a very charitable mood so I asked him for his Rolls Royce. He said no. I'm delighted for him, he loves playing and he obviously knows the manager very, very well. I'm sure he'll do well, they're a great team and it looks like they'll be successful for a long, long time and it's good for him to be a part of it."


text:
Conan O'Brien Can Prance Around in Jeggings If He Wants To
Previously, Conan declared he'd wear "jeggings" (a jean-legging hybrid mainly worn by ladies) on-air. Last night, he proclaimed "if I say I'm gonna do something, I do it!" and proceeded to deliver his monologue while wearing stone-washed colored ladies tights.
This is the kind of shameless, silly behavior that we love to see from Conan, and we're glad he's so at home on his new show. Now, here's four minutes of Conan's tall and lanky body modeling jeggings. Enjoy.


text:
This study is provided by ICPSR. ICPSR provides leadership and training in data access, curation, and methods of analysis for a diverse and expanding social science research community.
Contiguous County File, 1991: [United States] (ICPSR 9835)
Principal Investigator(s): United States Department of Commerce. Bureau of the Census
This file provides information on the locational relationship between counties (and statistically equivalent entities) in the United States. For purposes of this study, contiguous counties included those that were physically adjacent, those that were not physically adjacent but were connected by a major road, and those that were not physically adjacent but had significant economic ties. The file includes FIPS state and county codes, county names, and the type of relationship between contiguous counties.
Access Notes
Data in this collection are available only to users at ICPSR member institutions. Please log in so we can determine if you are with a member institution and have access to these data files.
Study Description
U.S. Dept. of Commerce, Bureau of the Census. CONTIGUOUS COUNTY FILE, 1991: [UNITED STATES]. Washington, DC: U.S. Dept. of Commerce, Bureau of the Census [producer], 1992. Ann Arbor, MI: Inter- university Consortium for Political and Social Research [distributor], 1992. https://doi.org/10.3886/ICPSR09835.v1
Persistent URL: https://doi.org/10.3886/ICPSR09835.v1
Export Citation:
- RIS (generic format for RefWorks, EndNote, etc.)
- EndNote XML (EndNote X4.0.1 or higher)
Scope of Study
Subject Terms: counties, economics, FIPS codes, geography
Geographic Coverage: United States
- 1991
Universe: Counties and statistically equivalent entities as recorded by the Census Bureau as of December 31, 1991.
Original ICPSR Release: 1992-10-31
Related Publications
Export Options: RIS/EndNote
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- Citations exports are provided above.
Export Study-level metadata (does not include variable-level metadata)
If you're looking for collection-level metadata rather than an individual metadata record, please visit our Metadata Records page.


text: These girls were a hit all right. With teased manes and faux-fur body-suits, Caitlyn Colleran, Nicole Viccora and Erin Colleran waved drivers into The Cat Depot Jan. 16 and Jan. 17 for its grand opening. A total of 17 cats were adopted over the weekend with 1,000 people attending. Visitors went home with either raffle prizes, free cat toys or a new furry friend.


text:
Queen 'not a fan of camera-phones'
Selfies may be all the rage but the narcissistic social media craze has reportedly not found favour at Buckingham Palace.
The Queen has apparently voiced her dismay that when she carries out engagements she is greeted by a sea of mobile phones.
The monarch, who famously "photobombed" a selfie taken by an Australian sportswoman at the Commonwealth Games, made the comments to US ambassador Matthew Barzun when he presented his credentials at Buckingham Palace in November.
In an interview for the October edition of Tatler magazine, the 43-year-old American said she made the remarks during a "nice chat" they had after the ceremony.
He told the magazine: "She was essentially saying 'I miss eye contact'."
The Queen attracts large crowds when she carries out engagements across the country and is often greeted by a sea of well-wishers straining to take pictures of her, both traditional and selfies.
She hit the headlines when she appeared in a photograph by Australian hockey player Jayde Taylor, smiling in the background over her shoulder as she posed with a teammate during the Commonwealth Games in Glasgow in July.
The Queen was also notably deluged with staff taking camera-phone pictures when she visited New Broadcasting House to officially open the BBC's headquarters in June last year.
Mr Barzun was a key figure in securing US President Barack Obama's two electoral victories.
In between the campaigns, the business executive, a Harvard history and literature graduate, served as US ambassador to Sweden.


text:
Project Description
The objectives of this Pennsylvania State University (Penn State) and Delphi project are to develop new fuel processing approaches for using select alternative and renewable fuels - commercial diesel fuel and anaerobic digester gas (ADG) - in solid oxide fuel cell (SOFC) power generation systems, and to conduct integrated fuel processor-SOFC system tests to evaluate the performance of the fuel processors and overall systems.
Project Benefits
This project assists the SOFCs program in meeting its cost and life targets by understanding the mechanisms that limit the reliability and durability of SOFC materials. The program will ultimately enable fuel cell-based near-zero emission coal plants with greatly reduced water requirements and the capability of capturing 97 percent or greater of carbon at costs not exceeding the typical cost of electricity available today. Achievement of this goal will have significant impact for the nation given the size of the market, expected growth in energy demand, and the age of the existing power plant fleet. It will also provide the technology base to enable grid-independent distributed generation applications. Federal funding support of this research is appropriate given the game changing nature of the technology, accompanied by risks higher than the private sector can accept.
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