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Fast 3d Laser Micromachining Of Silicon For Micromechanical And Microfluidic Applications

The application of laser direct etching of silicon in processing devices for microelectromechanical systems is discussed. The direct write system presented in this paper features high writing speed, high resolution, and large access range. The possibilities of micromachining truly three-dimensional structures, rapid prototyping, processing on non-planar substrates, complementary processing and post-processing through laser direct etching are demonstrated. Examples include prototypes of micromachined diffuser/nozzle elements illustrating the potential for microfluidic devices and structures cut out of a membrane, which both show the high flexibility of this process.