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A Novel Dispensing Head Fabrication Method for Precise Epoxy Dispensing

Dimensions of high frequency dies are typically less than 50 µm * 200 µm. It requires a micron scale adhesive dots dispensing method to the bonding area for micro assembly. In this paper, electrochemical-polishing and picosecond laser micro-machining were used to prepare such novel dispensing head. These needle-like dispensing heads with tip diameter of 5 µm can achieve 20 µm adhesive dot far smaller than 100 µm produced by standard industry equipment. The dispensing module was integrated into a custom-made motion stage with microscopy system to achieve higher dispensing accuracy.