{'fraction_non_alphanumeric': 0.00954653937947494, 'fraction_numerical': 0.0, 'mean_word_length': 5.453846153846154, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Photolithography For Integrated Thin Film Read/Write Heads

The lithographic processes involved in the fabrication of thin film heads are discussed. Because of the intrinsic features of huge topography and high aspect ratio, process requirements for film heads as opposed to semiconductor devices are identified. A process of conformal thick resist coating across a large step height is developed by optimizing resist coating parameters and the use of a resist with higher viscosity. Also planarization techniques are discussed with a specific example illustrated to planarize the topography associated with the fine and large cross-sectional coil pattern. Alignment accuracy proves to be the most critical parameter for further advances in the film head technology and several strategies are proposed to improve the alignment capability.