{'fraction_non_alphanumeric': 0.018698060941828253, 'fraction_numerical': 0.0, 'mean_word_length': 4.946502057613169, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Molecular dynamics simulations of isothermal reactions in Al/Ni nanolaminates.

Molecular dynamics simulations of reactions in Al/Ni layered systems have been carried out under isothermal conditions for a wide range of temperatures and several system sizes. An embedded atom method potential, known to reasonably reproduce the phase behavior of Al/Ni, was employed. Simulations revealed reaction mechanisms involving an initial fast process and much slower more complex longer-time reactions. The initial reaction process consists of diffusion of Ni from the pure solid Ni phase into the molten Al phase, resulting in the formation of an Al-rich Al/Ni liquid. The initial reaction ends when the Al/Ni liquid becomes saturated in Ni and solid Al/Ni phases begin to form at the interfaces between the pure solid Ni phase and the Al/Ni liquid. The growth of these solid phases is intrinsically slow compared to the formation of the liquid and is further slowed by the need for Ni to diffuse through the growing interfacial Al/Ni solid phases. Analysis of the initial Al/Ni liquid forming process indicates Fickian behavior with the Ni diffusion coefficient exhibiting Arrhenius temperature dependence. The longer-time slow reaction process(es) resulting in the growth of Al/Ni solid phases do not lend themselves to detailed numerical analysis because of the complex dependence of the Ni transport on the detailed nature of the interfacial layers.