{'fraction_non_alphanumeric': 0.037549407114624504, 'fraction_numerical': 0.03162055335968379, 'mean_word_length': 4.633333333333334, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
High Frequency Multilayer Chip Inductors

High frequency multilayer chip inductors for the application in the radio frequency telecommunication terminals were fabricated using low temperature sintered dielectric material. The thick-film printing and green sheet lamination processes were used for the chip fabrication. The inductors of 4.7, 12, and 22 nH were made, which exhibit self-resonant frequency of 5.3 to 2.4 GHz. The size of these monolithic inductors is 2.0 mm/spl times/1.2 mm/spl times/0.8 mm.