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Fabrication of Feedthrough Atom Trapping Chips for Atomic Optics

We present a novel fabrication process for feedthrough atom trapping chips, which are used in atomic condensate optics. Copper electroplating is employed to vacuum seal the chip-through vias. The advantages of using feedthrough atom trapping chips are the simple microfabrication process and reduction of the overall chip area bonded to the glass atom trapping cell. The results demonstrate that current can be conducted through the vias while the vacuum can also be held under 1times10-9 torr.