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Small Silicon Condenser Microphone Improved with a Backchamber with Concave Lateral Sides

We have developed a very small, high-sensitivity silicon condenser microphone, in which a back chamber with concave lateral sides and a specific diaphragm were used as improvements. The concave sides increase the volume of the back chamber and thus solve the trade-off between chip downsizing and sensitivity. The novel back chamber was fabricated using a combination of isotropic and anisotropic etching. The diaphragm is supported only at the four corners to yield good deformation. The chip is 1.2 mmtimes1.3 mmtimes0.4 mm. The sensitivity is -41 dBV (8.8 mV/Pa) at 1 kHz and the frequency response is flat between 100 Hz and 10 kHz.