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New method to fabricate diffractive blazed gratings by anisotropic etching on (110) silicon wafers

This paper describes a new method to fabricate the blazed gratings on oriented silicon by the anisotropic etching technique. Instead of making the multilevel gratings by the binary lithography or preparing the analog resist profiles by the e-beam direct-write, we propose a new sequence to obtain the blazed gratings with a continuous blaze surface. The key techniques include the oblique lapping/polishing and the time/portion control of potassium wet etching. This method has the advantages of easy facility, low cost, and large tolerance in gratings' design.