{'fraction_non_alphanumeric': 0.01462225832656377, 'fraction_numerical': 0.002437043054427295, 'mean_word_length': 5.588235294117647, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
New methods for measuring resistance and charge decay of worksurfaces

All microelectronic components are increasingly small, lightweight, thin, and short. This paper considers how to provide a better static control worksurface for the manufacturing area that handles very fine and highly sensitive microelectronic parts. The static sensitivity level for the microelectronic parts concerned is less than 100 V (HBM). We propose a new evaluation test method and guidance for new materials for use in highly susceptible microelectronics working areas. Unprotected devices with extremely thin oxide layers are very sensitive to electrostatic effects. Even some passive components such as capacitors, coils and resistors in surface mount packages are shown to be highly susceptible to electrostatic effects. Conventional static control methods are not always effective in protecting these modern parts, and thus it is time to re-evaluate static control methods and materials for the microelectronics market. In this paper, we consider the changes needed to ensure proper protection of extremely sensitive parts. We propose a new test methodology that better emulates the actual conditions encountered in microelectronics manufacturing.