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Antenna on chip design utilizing 3D integration for mixed signal applications

This paper proposes implementing an antenna operating in the millimeter wave band of 56–64 GHz on the backside of an Integrated Circuit (IC) that uses Through Silicon Via (TSV) technology for a System in Package (SiP) approach to mixed signal design. A folded monopole antenna that utilizes a coaxial TSV feed line is selected to implement the design on the backside of the silicon die. Furthermore, the initial design is modeled using Ansys's High Frequency Structure Simulator (HFSS) to measure appropriate antenna parameters including a directivity of 1.27 dB. The final design proposes using an artificial magnetic conductor as a reflector to improve antenna directivity by 4.87 dB and eliminates propagation of electromagnetic waves back into the substrate.