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The Influence of the Film Adjustment for Deep Trench Isolation (DTI) Filling on the Thermal Quality in CMOS Image Sensor

Backside deep trench isolation (B-DTI) technology for crosstalk reduction has been widely adopted in CIS production. The filling status and film stack are important for the thermal process. No crack or bubble is acceptable. As the DTI depth increase, the filling and thermal stability become difficult to control. In this paper, we adjusted the film stack and thickness for different DTI depth to realize crack-free, thus increasing the yield and improving the performance.