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Polymers in electronics packaging

Integrated circuit packaging affects component performance, price, and reliability. Molded plastic packaging is cost-efficient compared to other packaging processes, and offers both quality and reliability. In recent years, AT&T Microelectronics has made significant improvements in package quality through a closely monitored quality program. Rapidly evolving device technology will make new demands on packaging to accommodate increases in device speed, miniaturization, and power dissipation. Packaging and interconnection will continue as significant factors affecting further advances in system performance. AT&T's expertise in packaging sophisticated, high lead-count devices has been achieved by focused development efforts and a packaging research program. New materials and process technology help AT&T package development engineers realize advanced designs for customer needs. Several new packaging technologies — including multichip modules, tape-based packages, and optical interconnection — will emerge in years to come, and could radically change the nature of packaging. AT&T will meet its customers' needs in microelectronics packaging by staying at the forefront of packaging design, materials and process technology.