{'fraction_non_alphanumeric': 0.030176899063475548, 'fraction_numerical': 0.01040582726326743, 'mean_word_length': 5.2064516129032254, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
An on-Communication Multiple-TSV Defects Detection and Localization for Real-Time 3D-ICs

This paper presents "On Communication Through-Silicon-Via Test" (OCTT), an ECC-based method to localize faults without halting the operation of TSV-based 3D-IC systems. OCTT consists of two major parts named Statistical Detector and Isolation and Check. While Statistical Detector could detect open and short defects in TSVs that work without interrupting data transactions, the Isolation and Check algorithm enhances the ability to localize fault position. The Monte-Carlo simulations of Statistical Detector show ×2 increment in the number of detected faults when compared to conventional ECC-based techniques. While Isolation and Check helps localize the number of defects up to ×4 and ×5 higher. In addition, the worst case execution time is below 65,000 cycles with no performance degradation for testing which could be easily integrated into real-time applications.