{'fraction_non_alphanumeric': 0.01557935735150925, 'fraction_numerical': 0.009737098344693282, 'mean_word_length': 4.976744186046512, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Sensitivity of SEM/EDX to Detect Small Particles on Substrates.

The characterization of microscopic particles on substrates is of interest in numerous scientific fields. One example is semiconductor device defect review, where the characterization of particles or defects on a device is an essential aid in tracing sources of contamination in the production process. With the ever decreasing component separation on the integrated circuits the sensitivity of SEM/EDX to detect small particles on substrates is an important issue. The minimum size of particles causing defects in semiconductor device manufacture is predicted to decrease from 0.12µm today to 0.02µm by the year 2010. The question of interest is how long the SEM/EDX analysis tool can continue to be used to identify elements present in “killer” defect particles of ever decreasing size? This paper attempts to address this question. It has already been shown that films as thin as a monolayer can be detected with WDX provided high beam currents are available.