{'fraction_non_alphanumeric': 0.027479091995221028, 'fraction_numerical': 0.0, 'mean_word_length': 5.072463768115942, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
A case study of the delamination analysis of plastic encapsulated microcircuits based on scanning acoustic microscope inspection

Delamination is a common defect of the Plastic encapsulated microcircuits (PEMs). So, delamination analysis is an important item in Screening, DPA and failure analysis of PEMs. This paper studies the delamination of a buffer in thin shrink small outline package (TSSOP) by using a scanning acoustic microscope (SAM). By using scanning modes of A-scan, B-scan, C-scan and X-scan of the SAM and analysis the result of the scanning, this paper obtained the delamination information of the buffer in detail. At last, this paper summarized a general method of delamination analysis, and the comparison between the method and the traditional method used in Screening, DPA and failure analysis of PEMs is provided.