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3-D floorplanning algorithm to minimize thermal interactions

An algorithm for including relative thermal interactions among different circuit modules within a 3-D system is introduced in this paper. Application of the proposed algorithm on MCNC and GSRC benchmark circuits is presented. The thermal behavior of a heterogeneous 3-D structure, consisting of a different number of modules and substrate materials, is evaluated to emulate the heat transfer characteristics of practical heterogeneous 3-D systems. The algorithm lowers thermal interactions between different modules while maintaining the peak temperature within a practical range. The thermal characteristics of the floorplan are evaluated using HotSpot and HotSpot Detailed 3-D and compared to a random floorplan. The recorded peak temperatures are within the practical range of on-chip temperatures.