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Influences on thermal fatigue reliability of QFP component solder joints based on physic-of-failure method

Physics-of-failure (POF) method based reliability prediction technology is one of the key technologies in prognostic and health management (PHM) field. Based on CalceSARA, a physics-of-failure based reliability assessment software developed by University of Maryland, influences on solder joints thermal fatigue reliability of QFP component were researched in detail, and the influences of six types of parameters such as package material, lead span, lead material, lead thickness, solder height and solder joints bond area on thermal fatigue life of solder joints were analyzed. The results indicated that under temperature cycle loading, the fatigue life of solder joints is positively correlated with solder height and solder joints bond area, and is negatively correlated with lead span and lead thickness, and the fatigue life of components with plastic package and copper alloy lead is longer than components with ceramic package and iron-nickel alloy lead. This study can provide guideline and reference for selection and usage of electronic components in reliability design.