{'fraction_non_alphanumeric': 0.037366548042704624, 'fraction_numerical': 0.009786476868327402, 'mean_word_length': 4.9523809523809526, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
A novel CMOS compatible L-shaped impact-ionization MOS (LI-MOS) transistor

This paper reports a novel L-shaped impact-ionization MOS (LI-MOS) transistor technology that achieves subthreshold swing well below 60 mV/decade at room temperature. First, the LI-MOS transistor is CMOS process compatible, and requires little process modification for integration in a manufacturable process. Second, the LI-MOS structure employs raised source/drain (S/D) regions that enable controllability and scalability of the impact ionization region (I-region). Third, the LI-MOS has superior compactness over previously reported I-MOS device structures. Fourth, the LI-MOS enables the integration of novel materials for band gap and strain engineering to enhance the impact ionization rate in the I-region. Based on the above technology, we demonstrate a record subthreshold swing of 4.5 mV/decade at room temperature for a 100 run gate length device that incorporates a SiGe I-region. The smallest impact-ionization-based MOS device with a gate length of 60 nm is also demonstrated with a subthreshold swing that is well below 60 mV/decade