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Dynamic Resistance of Series-Connected HTS Stacks Considering Electromagnetic and Thermal Coupling

When a high temperature superconductor (HTS) coated conductor carries a DC transport current within the background of an oscillating magnetic field, the effect of dynamic resistance takes place. Under the circumstance when the dynamic resistance effect is significant, heat dissipation will be generated to change the temperature of HTS tapes. The amplitude of the instantaneous dynamic resistance increases with time due to the rising temperature. The phenomenon is more obvious when it comes to the HTS stacks where superconducting tapes are assembled so close. This paper proposes a numerical model with electromagnetic and thermal coupling to study the dynamic resistance of the series-connected HTS stack. Experimental results have shown that the proposed numerical model can describe dynamic resistance more accurately than conventional models. Besides, investigations are carried out on how the insulation thickness in the stack and the frequency of AC magnetic fields impact the dynamic resistance of HTS stacks under the influence of Joule heat. This can provide a useful reference for the design of superconducting devices in which dynamic resistance occurs.