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Modelling of the nanoindentation process of ultrathin films

Abstract A model of the nanoindentation process was elaborated using the finite-element method. The ADINA software was used in the computation of the load – displacement curve. The distribution of stresses in the TiN film on a smooth substrate (Si) was found. The influence of mechanical material properties of the film and substrate on the process of indentation and the stress distribution was considered. The effect of yield stress, tip’s radius and hardening modulus was discussed. The results were compared with the results of experimental nanoindentation tests performed for ultrathin films.