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Nucleation and Growth of Stress Relief Patterns in Sputtered Molybdenum Films

Stress relief patterns in sputtered molybdenum films were studied by Nomarski differential interference contrast microscope. As a result of the very large biaxial compressive stress in the film plane, ranging from E/16 to E/130 (where E is Young's modulus), the films were partially buckled and detached from the substrate, exhibiting one of two modes of stress relief pattern, wrinkled spots or wavy ridges. The former mode is a nucleation pattern and the latter a growth pattern. The transition between the two can be interpreted in terms of the stress intensity factor K1 at the head of the gap formed due to stress between the film and the substrate. K1 can be regarded as measure of the bond strength between the film and the substrate.