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Instantaneous Generation of Many Flaked Particles by Impulsive Force of Electric Field Stress Acting on Inner Wall of Mass-Production Plasma Etching Equipment

To elucidate the mechanism of instantaneous generation of many flaked particles in plasma etching equipment, we investigate the relationship between the generation of flaked particles from deposited films (consisting of etching reaction products on the ground electrode) and the plasma stability under mass-production conditions. Many particles are observed with our particle monitoring system when plasma instability occurs. The generation of such flaked particles correlates well with the occurrence of a large, rapid change in floating potential on the chamber wall. Our results indicate that many flaked particles from films deposited on a ground electrode are generated by electric field stress acting instantaneously and working as an impulsive force.