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Preparation and characterization of a copper@polyimide core–shell structure via an in situ induction/imidization route

Based on the combination of an in situ induction and imidization method for improving the interface bonding of an inorganic material and a polymer, copper@polyimide (Cu@PI) core–shell composite particles have been successfully prepared from poly(amic acid) ammonium salts (PAAS) and a Cu complex via a simple solvothermal process. The structures and the morphologies of the samples were characterized by X-ray photoelectron spectroscopy, X-ray diffraction, scanning electron microscopy and transmission electron microscopy (TEM), respectively. It was found that PAAS formed PI via a thermal imidization and subsequently precipitated in the solvent. Through crystallization induction, it then successfully coated on the surface of the formed Cu particles. Based on thermo gravimetric analyses curves and due to no Cu oxidation reactions taking place in the core coated with high-temperature-resistant PI, the weight increase was determined to be 106.4%, instead of up to 124.0% in samples consisting of pure Cu.