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Preparation of solder plated patterns on paper and applying to RFID tags

In this study, we investigate the preparation of radio frequency identification tags on paper by using screen printing, solder plating, and self-alignment attachment. Waste-fluids are not produced in the proposed process. In addition, the process of preparing the tags involves fewer steps compared to the general process. Moreover, the prepared tags are heat resistant at temperatures greater than 200 °C.