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A novel planar interconnection structure with substrate integrated waveguide

In this paper, a novel planar interconnection method with substrate integrated waveguide (SIW) is presented. This method can be used as planar microwave structure interconnection in millimeter wave band. It also provides a quick assembly and disassembly of interconnection with different modules without any soldering or wire bonding operations. A W-band SIW interconnection structure is simulated and experimented. The simulated and measured results show the SIW interconnection structure has a high constituency with the complete board on transmission and reflection properties.