{'fraction_non_alphanumeric': 0.017259978425026967, 'fraction_numerical': 0.003236245954692557, 'mean_word_length': 5.065359477124183, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Impact Force Characteristics of Package-level Solder Joints Under Ball Impact Test

The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around intermetallics, similar to that from a board-level drop test. We investigate numerically in this paper the effect of yield stress variations of solder alloy on transient structural responses of a single package-level solder joint subjected to ball impact test. This study focuses on the characteristics of the ascending part of the impact force profile. According to the piecewise linear stress-strain curve obtained for the Sn-4Ag-0.5Cu solder alloy, parametric studies are performed by varying either segmental moduli or characteristic stresses of the curve at fixed ratios, in regard to the lack of available rate-dependent material properties of solder alloys