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Effects of colloidal silica on the CMP of Molybdenum in the alkaline slurry

The effects of colloidal silica on the CMP of Molybdenum (Mo) are investigated in different slurries with H2O2 as oxidizer. It is found that both RR (removal rate) and SER (static etching rate) decrease after adding colloidal silica into the alkaline slurry. The adsorption between the colloidal silica particles and Mo film is observed. Raman spectra show that silicomolybdic acid forms from reaction between colloidal silica and Mo oxide. The mechanism of colloidal silica's inhibition on Mo removal is discussed.