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Effect of a Ti capping layer on thermal stability of NiSi formed from Ni thin films deposited by metal–organic chemical vapor deposition using a Ni(iPr-DAD)2 precursor

Ni films were deposited by metal–organic chemical vapor deposition (MOCVD) using a novel Ni precursor, bis(1,4-di-isopropyl-1,3-diazabutadienyl)nickel [Ni(iPr-DAD)2], and NH3 gas. To optimize process conditions, the deposition temperature and reactant partial pressure were varied from 200 to 350 °C and from 0.2 to 0.99 Torr, respectively. Ni films deposited at 300 °C with a reactant pressure of 0.8 Torr exhibited excellent quality, and had a low carbon impurity concentration of around 4%. In addition, a sacrificial Ti capping layer was deposited by an in situ e-beam evaporator on top of the Ni films to enhance the thermal stability of the subsequently formed NiSi films. Both the Ti-capped and uncapped Ni films were annealed by a two-step method, with a first annealing conducted at 500 °C, followed by wet etching and then a second annealing carried out from 500 to 900 °C. The Ti capping layer did not affect the silicidation kinetic process, but by acting as an oxygen scavenger, it did enhance the morphological stability of the NiSi films and thus improve their electrical properties.