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A primer to applying real time dispatching in semiconductor test operations

Balancing the capacity and effective use of tester equipment to fulfill customer orders in both wafer test and final test is an ongoing need. Challenges are growing in the coverage of die circuitry and probing, as well as validating chip performance against specification. Validation at the die test operation using the same tester equipment places added demand on manufacturing effectiveness. This paper describes how real-time dispatching in the wafer and die test improves overall factory performance at these test operations.