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Free surface BCP self-assembly process characterization with CDSEM

A simple and common practice to evaluate Block copolymers (BCP) self-assembly performances, is on a free surface wafer. With no guiding pattern the BCP designed to form line space pattern for example, spontaneously rearranges to form a random fingerprint type of a pattern. The nature of the rearrangement is dictated by the physical properties of the BCP moieties, wafer surface treatment and the self-assembly process parameters. Traditional CDSEM metrology algorithms are designed to measure pattern with predefined structure, like linespace or oval via holes. Measurement of pattern with expected geometry can reduce measurement uncertainty. Fingerprint type of structure explored in this dissertation, poses a challenge for CD-SEM measurement uncertainty and offers an opportunity to explore 2D metrology capabilities. To measure this fingerprints we developed a new metrology approach that combines image segmentation and edge detection to measure 2D pattern with arbitrary rearrangement. The segmentation approach enabled to quantify the quality of the BCP material and process, detecting 2D attributes such as: CD and CDU at one axis, and number of intersections, length and number of PS fragments, etched PMMA spaces and donut shapes numbers on the second axis. In this paper we propose a 2D metrology to measure arbitrary BCP pattern on a free surface wafer. We demonstrate experimental results demonstrating precision data, and characterization of PS-b-PMMA BCP, intrinsic period L0 = 38nm (Arkema), processed at different bake time and temperatures.