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Application of modern quality improvement techniques to rapid thermal processing

Modem statistical modeling techniques are applied to the characterization and optimization of Rapid Thermal
Chemical Vapor Deposition. The problems of deposition during process ramps and thickness uniformity
modeling wafer are addressed. A two-phase fractional factorial experimental design is used to generate models
for the deposition rate, uniformity measures, and normalized time responses. A constrained algebraic
optimization algorithm is used to find the optimum settings for the reactor for the deposition of 2000A of
polysilicon. The methods that are developed to handle these problems are shown in an application to the
deposition of polysilicon in a LeiskTM reactor.