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HS3DPG: Hierarchical simulation for 3D P/G network

As different chips are stacked together in 3D ICs, the power/ground (P/G) network simulation becomes more challenging than that of 2D cases. In this paper, we propose a hierarchical simulation method suitable for 3D P/G network (HS3DPG), which can ensure full parallelism and good scalability with the number of tiers. In the IR drop analysis, when there are 9 tiers, the hierarchical method can be 6.5 times faster than the direct full network simulation. The accuracy of HS3DPG has been verified by a 3D P/G network from the industrial design. Besides, we introduce the “locality” property into HS3DPG to further simplify the simulation. Finally, HS3DPG is used to analyze the voltage distribution of a 3D P/G network with clustered TSVs.