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Subgrain Formation and Subgrain Boundary Migration in Al-5Mg during High Temperature Deformation in the Range of Class A Behaviour in Comparison with Pure Aluminium

Observations of surface tilts due to migrating subgrain boundaries confirm that subgrains form and migrate during high temperature deformation not only in pure aluminium but also in solid solution hardened Al-5Mg in the range of class A behaviour characterized by viscous dislocation glide, a stress exponent of the steady state strain rate close to 3, and inverted transient behaviour. The contribution of subgrain boundary migration to the rate of steady state deformation is about 0.05 to 0.1 for Al as well as Al-5Mg. It is concluded that the difference in deformation behavior of the two materials is not due to their subgrain structure but to differences in dislocation kinetics.