{'fraction_non_alphanumeric': 0.03038674033149171, 'fraction_numerical': 0.03867403314917127, 'mean_word_length': 4.8, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Investigating micro-alloyed solders with thermal shock tests

This paper presents how the low Ag content and micro-alloys in solders can influence the quality and the reliability of joints during thermal shock tests. The solder joints of 0603 (1.6 × 0.8 mm) size surface mounted resistors were compared, while the thermal shock cycle number was increased up to 2000 cycles. The low Ag content, micro-alloyed solders, named mSAC1 and mSAC2, were compared to normal SAC305, SAC405 and 62Sn36Pb2Ag solders. Cross-sections were made to measure the Cu3Sn and the Cu6Sn5 intermetallic layers' average thickness. By inspecting the cross-sections, it is also revealed what kind of typical crack path has formed in the solder joints.