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Printing and Laser Curing of Ag and Cu Paste - Prospects and Challenges in Additive Manufacturing

This study depicts substantial characteristics of copper and silver pastes, dispensed and cured by oven processing. Different analyses, such as second electron microscopy (SEM), rheometry, thermogravimetric analysis (TGA), UV-VIS-NIR-spectroscopy and 4-point measurement were used. This work also will illustrate some results of computational design of experiment (DOE) and regression analyses for jet and mechanical printing processes.