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Thermal Analysis of Micro-Channel Evaporator for Power Microelectronics

The present study proposes an efficient small scale vapour compression refrigeration system to actively cool a high performance computer. This system includes several miniaturized components like a compressor, evaporator, and condenser which are part of a refrigeration system designed to fit in smaller scale power electronics. An array of micro- channels is used for the evaporator unit. Here various micro channels designs while miniaturizing the evaporator are consider for incorporating in the system and the performance is evaluated to maximize the heat transfer coefficient. This system is capable of maintaining a device temperature below 25˚C while dissipating heat of 100 W/cm 2 by incorporating a micro channel heat sink as an evaporator using 134 a refrigerant. In this study numerical results are used to get the thermal performance of a microchannel evaporator in relation to the performance of the refrigeration cycle. This study shows the effect of channel geometry on evaporator performance and it is observed that a channel with small width and increased height results in superior thermal performance with a small penalty in pressure drop.