{'fraction_non_alphanumeric': 0.0149812734082397, 'fraction_numerical': 0.0, 'mean_word_length': 5.520325203252033, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Synchronous laser scanning IR imaging for chip bonding defect inspection

The quality of IC chip bonding directly affects the heat dissipation, which is especially important for high density or high power devices. The technique of synchronous laser scanning IR imaging utilizes a laser beam to apply periodic thermal excitation to IC chips and a progressive infrared camera records the temperature variation on the surface. By adjusting the synchronous relationship between the scanning of the laser and IR camera, the quick temperature variations can be captured and processed to unveil the thermal coupling defects. Compared with ultrasound microscopy, this technique is fast, non-contact, and non-contaminating, with images that directly represent the thermal dissipation capability of the devices.