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Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies

For the further miniaturization of integrated circuits, the integration of passive components on the chip is one approach. In DC-DC converter applications, the integration of the inductor with high inductivity is one problem. This paper addresses this problem by proposing a new technique for fabricating a multilayer spiral coil that is also useful as part of electromagnetic MEMS (Micro-Electro-Mechanical Systems) actuators. The multilayer coil is made by stacking separately fabricated coil layers and joining them with a selective bonding and debonding technique.