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Alumina surface recovery for the particle reduction.

The method for the alumina surface regeneration and the particle reduction in an inductively coupled plasma are described. Due to the chemical reaction between the alumina surface and the oxygen gas in high temperature plasma, the by product AI(OH)3 is formed. Then, it fell out to the wafer as the particle. Since the particles mainly generated from the alumina surface, the seasoning process was progressed after the photoresist (PR) strip process. As the results, the byproduct of the alumina surface changed from Al(OH)3 to Al2O3 after the seasoning process. Then, total number of the particles on the wafer was considerably reduced. For the surface analysis, X-ray Photoelectron Spectroscopy (XPS) and FT-IR were applied to comparing the status of the alumina surface before and after the seasoning process.