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Influence of Cu orientation on the growth of Cu-Sn intermetallics and interfacial reaction of Cu/Sn diffusion couple

The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of Cu3Sn grown quickly. There is less Cu3Sn at Cu(200)/Sn interface but the Cu6Sn5 grown quickly and quantities of voids gathered into cracks. The preferred orientations of the Cu substrates are believed to be the reasons of the different interfacial reactions phenomena.