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Apparatus for assessment of voids in solder and method for assessment of voids in solder

An apparatus for assessing voids in solder comprises: a function calculation unit that processes the pixels constituting an image of the interior of a piece of solder such that the pixels in the voids have a pixel value p i of 1 and the pixels not in the voids have a pixel value p i of 0 and uses a weighting function w (r i ) for the distance r i from the center of the piece of solder, the maximum of the function being at the center of the piece of solder (r i = 0) and the minimum being at the maximum radius (r i = r 0 ), to calculate the following void assessment function,

where i represents pixel number (1-N), p i represents pixel value (0 or 1), and w(r i ) represents the weighting function; and a void assessment unit which performs assessment for each piece of solder in a manner such that the greater the relative size of the assessment function the greater the influence of the voids.