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Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate

From the experimental measurements, the dominant charge source for a packaged IC chip during a charged-device model (CDM) ESD event is the capacitor between the die-attach plate and the metal bus line, CSUB. By adding a bonding wire between the die-attach plate and the Vss pin, a parallel inductor to the CSUB can be created. The CDM-robustness for the packaged IC chip is significantly improved because of this parallel LC resonance circuit.