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Theoretical and Experimental Research on Machining Movement of Multi-wire Sawing with Rocking and Reciprocating

： Multi-wire sawing with rocking and reciprocating has gradually become a main way to slice the hard and brittle material wafers due to its high efficiency and good accuracy. Three main motions in multi-wire sawing with rocking and reciprocating are analyzed. The theoretical models of three main motions are established. The theoretical derivation of the material removal rate ( Q ) and the material removal volume of new wire with per unit length ( R ) in the sawing process is proposed. The influence of processing parameters on Q and R is analyzed theoretically. A new concept of wire sawing with fixing R is proposed according the kinematics. The relevant process parameters variation curve in the wafer sawing process is derived inversely. It is found that the new sawing method improved the wafer sawing quality effectively compared with the actual sawing experimental results of the factory.