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Interconnect Fabrication using Copper Oxide Particles by Photonic-sintering

Hybrid pastes containing copper oxide particles with nano-(NPO) and submicron sizes (SMPO) were successfully developed for conductor fabrication through photonic sintering. Subjected to 3 or 4 flash pulses, copper particle pastes can be transformed into conductive sintered structure. A optimal SMPO:NPO ratio of 3:1 to obtain low electrical resistivity was suggested. The additions of copper formate can further reduce the resistivity down to 64.6±5.7μΩ•cm. FTIR spectra indicate that copper formate is easier to dissociate by flash irradiation compared to cupric sulfate and cupric chloride. One of the salt dissociation products, metallic copper, contributes to better electrical conductance