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Random Vibration Simulation on Electronic Equipment with Micro-systems by Using the Substructure Method

With the rapid development of high-integrated packaging technology, micro-systems such as SiP (System in Package) and SoC (System on Chip) have been gradually used in aerospace electronic equipment. Meanwhile, because the micro-systems are usually complex in structure and important in function, their mechanical reliability has always been paid attention. Since the random vibration and transient shock load are particularly obvious during the spacecraft launching process, design in the structure and technique of micro-systems has become an important influencing factor for the mechanical reliability of aerospace electronic equipment and hence has been widely concerned. Currently, it has become an efficient method to carry out mechanical reliability analysis and identify the weakness of the structure on electronic equipment by simulation. However, if the entire model is meshed by using the traditional method, total elements and nodes will be huge since the mesh size of micro-system part (including leads and solder joints) is too small, inducing that the duration of calculation can’t be guaranteed. In this paper, the substructure method is applied to simulate and analyze the electronic equipment under random vibration conditions, to mainly study the mechanical reliability of the SiP micro-system structure and solve the contradiction between the accuracy and efficiency of the simulation calculation. Finally, it is shown that the simulation results obtained by using substructure method are consistent with the experimental ones, which indicates that the method is effective for analyzing the mechanical reliability of electronic equipment with complicated components.