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Assessment of CMP Fill Pattern Effect on the Thermal Performance of Interconnects in Integrated Circuits BEOL

This work analyzes the thermal characteristics of CMP square pattern layers and the added cooling effectiveness for activated interconnects in a multi-layered BEOL stack. An equivalent thermal resistive analysis is used to obtain the effective in-plane and through-plane thermal conductivities of the patterned MET layer. An extensive numerical thermal model is developed for modeling the full device using an ultra-fast self-adaptive multi-grid thermal engine TMX T°Solver®. The pattern-filled design is compared to the base design void of CMP fills. The simulation results are validated with experimental temperature measurements of samples using Thermoreflectance imaging system TMX T°Imager®. The results show visible thermal improvement in the stack with potential of using the fill patterns for embedded heat sink designs to improve heat dissipation of thermally critical components in the BEOL.