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Enhanced Cooling of Multilayer PCB Motor Windings Using Thermal Vias

In this paper an enhanced cooling strategy for PCB motor windings is presented. It is proposed that using thermal vias for a parallel multilayer PCB winding system can achieve a higher current carrying capacity. Experimental measurements were performed under strict thermal boundary conditions. The results show a significant increase in current carrying capacity while using thermal vias in combination with a heat sink. Further optimization possibilities in respect to axial flux machines are discussed.