{'fraction_non_alphanumeric': 0.023963133640552997, 'fraction_numerical': 0.004608294930875576, 'mean_word_length': 4.807486631016043, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure

Thermal management is a key issue for high-power light-emitting diodes (LEDs). In this study, a novel packaging structure was proposed to reduce the die-bonding interface thermal resistance and provided a new idea for LED heat-dissipation. The LED chip was embedded into a square groove at the lead-frame substrate. The gap between the edges of the LED chip and square groove was filled with boron nitride/silicone composite. So the heat generated from the chip could be dissipated from the side surfaces to the substrate. The experimental results show that the heat-dissipation ability of LEDs has been significantly improved by the new embedding packaging structure. The die-bonding interface thermal resistance can be reduced by more than 20%. The junction temperature rise can be reduced by 14%. Due to the fully embedding of LED chip in the square groove, the light intensity distribution is slightly shrunk and the light output power is slightly reduced by about 8%.