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A study on the properties of heat conduction and tribology for the pair of copper and AlN film with phase change materials

It is well known that AlN still maintains stable in the high temperature conditions. This is quite attracted for the electrical engineering. Moreover, the heat conduction of AlN is several times efficacious than the other ceramics. Hence, it is widely used for the heat dissipation. The green technology of composite with PCM is always worked as a constant temperature cooler. Therefore, PCM has been thought to show great potential for saving energy and green environment. As a result, it is worth investigating in heat dissipative for the pair of copper and AlN film with PCM. However, the properties of this material pair will be quite complex. It is necessary to further theoretical analyze and experimental clarify for the reliability and the feasibility. Therefore, the thermal contact resistance of copper and AlN film with PCM were dynamic measured in this paper to investigate the heat conduction of the pair. Besides, the continuous variations of electrical contact resistance and friction coefficient were synchronous measured to study the tribological properties of the pair.