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Microhardness and electrical resistivity of Au/TiC multilayer structures prepared by RF sputtering

Sequential RF sputtering has been utilised to produce Au/TiC multilayer structures up to 100 layers. Auger electron spectroscopy (AES) combined with an ion etching technique has been utilised to analyse these multilayer structures. The studies indicate no interfacial alloying. Microhardness and electrical resistivity measurements show that, whereas the microhardness is increased by a factor of 2.5-3, the electrical conductivity of the multilayer structures is very close to that expected from stacks of individual (30 nm) pure gold films.