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Development of microtransformers using MCM and electronic packaging technologies

Several electronic systems such as implants and wireless sensors networks could benefit from compact transformers. In this paper, the development of microtransformers on a MCM (Multi Chip Module) platform is presented. The windings were manufactured using wirebonding of Au wires. Electrical characterization of the prototypes showed results as good as those built with printed circuit boards, providing coupling factor as high as 95,2% @10Vpp/1MHz, with the advantage of a dimensional reduction. An oscillator for energy harvesting was assembled in order to verify the functionality of the transformer. The circuit was able to operate with a minimum supply of 30 mV and could deliver 640 gW from a source of 100 mV.