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Numerical and experimental investigations of phase segragation effects in binary brazing solders

Solder materials occupy many of fields for technical application (e.g. solder joints in automotive control units or in microelectronic packages). They are required to provide electrical and mechanical connections between different components. Due to their wide range of applications solder alloys are subject to a great variety of microstructural changes such as phase separation and coarsening processes. The micromorphological variations influence strength and life expectation of solder materials, in particular, in very small components such as solder joints in microelectronic packages. In order to analyze the microstructural evolution with a diffusion theory of heterogeneous solid mixtures we employ an extended Cahn‐Hilliard phase field model. The diffusion equation under consideration constitutes a partial differential equation involving spatial derivatives of fourth order. Thus, the variational formulation of the problem requires approximation functions which are piecewise smooth and globally C1‐continuous. In our contribution we fulfil the continuity requirement by means of rational B‐spline finite element basis functions. To illustrate the versatility of this approach numerical simulations of phase decomposition and coarsening controlled by diffusion and by mechanical loading are discussed and compared with experimental results. (© 2010 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)