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Corrosion process of copper in chloride solution by optical interferometry

Holographic interferometry-based methods represent an interesting innovation for monitoring electrochemical corrosion processes. One of these techniques based on a Michelson interferometric configuration allows to obtain quantitative and qualitative information related to corrosion. This technique is based on simple inspection of intensity patterns with no direct physical contact with sample during reaction time, and physical preservation practically guaranteed. In this work the performance of Michelson interferometry for investigation of such phenomena on uncovered, partial and totally covered copper metallic samples is presented and experimental results suggest important information gathered about the type and mechanism of corrosion taking place.