Procedure – Wafer Identifier Scribing

Procedure – Wafer Identifier Scribing
The intent is to provide an identifier scribe on the backside of a wafer to keep identity throughout the
processing cycle in the clean room
1. Using a diamond scribe, located by the diamond dicing saw; scribe a small identifying mark
on the backside of the wafer.
2. Keep the marks small and near the major flat of the wafer
3. Use a initials and a different number for each wafer of your group
Diamond tip
Scribe a small set of
letters and
numbers to identify
your wafer. Use a
different number
for each wafer in
your group
Procedure – Wafer Identifying Scribe