Processing of Ceramics (HTCC / LTCC)

High-Temperature Co-fired Ceramics


Low-Temperature Co-fired Ceramics


Elements, Components, and Composition of Ceramics

HTCC is a ceramic based on alumina (Al2O3) and aluminum nitride (AlN). LTCC is a ceramic which glass mixed into alumina, and is also called glass ceramics.

Features of Ceramics

Based on the electronics industry, the high-purity ceramics used in the diverse industry are called fine ceramics. Substrates made of ceramics are superior in heat tolerance, humidity resistance, and heat dispersion compared to resin substrates. Thus, they are used in areas which require environmental resistance. These ceramics excel in high-frequency characteristics, so they are also used inside communications equipment.

Manufacturing Method of Ceramics

HTCC substrates are cured at a temperature of 1500ºC or higher. In order to cure at a high temperature, tungsten (W) and molybdenum (Mo), which have a high resistance to the high temperature, are used for the circuit electrodes. For LTCC substrates, the curing temperature can be decreased down to 900ºC by mixing glass into the alumina ceramic. Thus, it is possible to use silver or copper, which have low conductivity, for wiring.

DISCO’s Solutions in manufacturing

DISCO’s dicing saws (dicing equipment using blades) are used to shape the HTCC and LTCC after curing.

Devices Which Adopt Ceramics

HTCC and LTCC are used for the substrates of high calorific value device packages, such as LED, power devices, and the substrates of equipment which requires high environmental performance including high-frequency circuit substrates and automotive devices.

DISCO’s Solutions for Manufacturing These Devices

DISCO’s dicing saws (dicing equipment using blades) are used to singulate and shape these devices in the substrate manufacturing process.

Processing Methods Which Use This Material