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System integration of smart packages using printed electronics

The last decade has shown enormous interest in additive and printed electronics manufacturing technologies, especially in intelligent packaging. Scientists and engineers all over the world are developing printed organic circuits. Despite their effort, the performance and yield of all-printed devices cannot replace silicon-based devices in smart package applications. Therefore, we have developed a hybrid interconnection platform to seamlessly integrate printed electronics with silicon-based electronics, close the gap between the two technologies, and to anticipate adaption of printed electronic technologies. We studied the suitability of a printed interconnection platform by fabricating a printed sensor-box that contains printed nano-Ag-interconnections on low-temperature plastic, a printable humidity sensor based on functionalized MWCNTs, a printed battery, conventional SMDs, and a silicon-based MCU.