{'fraction_non_alphanumeric': 0.014795474325500435, 'fraction_numerical': 0.006092254134029591, 'mean_word_length': 5.052631578947368, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Electrostatic reduction of particulates for laser resistant hafnia coatings

We have reduced by 50% particulate defect density of hafnia coatings deposited onto silicon substrates through the use of electric fields, physical barriers and deposition rates. In an effort to reduce the number of hafnia particulates deposited onto silicon wafers, parallel plate electrodes were placed on either side of the evaporant plume. The particulate level was determined as the deposition rate was varied from 0.75 angstroms/sec to 12 angstroms/sec. Then, parallel plate electrodes were placed on either side of the plume as a way of electrostatically deflecting hafnia particulates away from the substrates. Later a single plate electrode was used in conjunction with a physical barrier placed over the hearth. The results of our study indicate that minimal defects occur when a parallel plate electric field is applied in conjunction with a fast deposition rate. Using a screen as a physical barrier, and/or a single electrode had little or no effect. This data may be useful in the manufacture of multilayer optical coatings with high laser damage thresholds.