{'fraction_non_alphanumeric': 0.02165196471531676, 'fraction_numerical': 0.0008019246190858059, 'mean_word_length': 5.117647058823529, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Friction Force Analysis on Diaomond Lapping of Sapphire Wafers

This paper is to design and developing a friction sensor system (FSS) for prediction of endpoint detection (EPD) on diamond lapping of sapphire or mono-crystalline aluminum oxide wafers. The endpoint detection usually includes start region, lapping region, transient region and endpoint region to control the planarization procedure by diamond lapping with variant plate of copper, resin copper, or tin materials. Experiments have been performed with 9 tests composed by three kinds of viscosity of slurry lapping with three kinds of lap plates. The coefficient of friction (CoF) has been obtained by the designed FSS and then compared with different test parameters. The as-lapped sapphire wafers have also measured by coherence surface interferometer, CCI-Lite (Taylor Hobson, UK). Experimental results show that the hardness of plate and viscosity of slurry are critical factors for as-lapped wafer quality. The EPD of diamond lapping with resin copper plate can be determined by the CoF data and that can be used for justifying the appropriate lapping time of sapphire wafers. Future study can focus on the relationship of sub-surface crack caused by the diamond lapping process.