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Route planning for two wafer fabs with capacity-sharing mechanisms

This paper formulates and solves a route planning problem for semiconductor manufacturing. In order to quickly respond to rising demand, a semiconductor company usually adopts a dual-fab strategy to expand capacity. That is, two fab sites are built as neighbours and can easily share capacity. Through the capacity-sharing design, a product may be produced by a cross-fab route. That is, some operations of a product are carried out in one fab and the other operations in the other fab. This leads to a routing planning problem, which involves two decisions–determining the cut-off point of the cross-fab route and the route ratio for each product–in order to maximise the throughput subject to a cycle time constraint. An LP-GA method is proposed to solve the route planning problem. We first use the LP module to make the cut-off point decisions, and proceed to use the GA module for making the decision on the route ratio. Experimental results show that the LP-GA method significantly outperforms other methods.