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Creep behavior of Innolot solder alloy using small lap-shear specimens

The paper is concerned with the development of a micro testing machine for solder joint specimens. The micro tester has been developed for testing a new solder alloy, namely Innolot (Sn-Ag3.7Cu0.65Bi3.0Sb1.43Ni0.15), under various cross-beam speeds and temperatures. In addition, the procedure for fabricating lap-shear solder joints, which will be tested under monotonic and creep loadings, is given. The effect of temperature is accounted for in all the tests. The results show that the properties of the Innolot solder alloy are strongly dependent on both the strain rate and the temperature. In addition, a creep constitutive model was derived to describe the creep behavior of Innolot lap-shear solder joints. The results suggest that the derived creep constitutive model is a good approximation of the real behavior of the solder alloy under different loading conditions (stress level, temperature).