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ADVANCES IN CMOS TECHNOLOGY ENABLES HIGHER SPEED TRUE 3 D-MEASUREMENTS

The challenge to improve fault coverage in the electronics production process now starts to demand full 3-D inspection in many areas. Well known application areas where 3D inspection is used include inspection of solder paste deposits, ball grid arrays and QFPs. The introduction of 3-D measurements of solder paste deposits enable the simultaneous measurement of both the volume and the area covered by these deposits. For BGA and QFP packages the leads can be individually inspected and the coplanarity of the leads can be measured, ensuring that all connectors can reach their respective solder pads. The result is robust and accurate quality control. In the past the main obstacle has been that conventional CCD technology does not provide the required speed for 3D inspection. Therefore inspection systems based on this technology creates bottlenecks in the production chain, or will only be able to use 3D scanning on small selected regions of the objects. Proprietary solutions exist, but they tend to be expensive and inflexible. Today the CMOS image sensor technology is widely available and provides the technology for very high speed 3D scanning. Unfortunately only a few of the CMOS image sensor manufacturers are using the technology to its full power by incorporating both sensor elements and signal processors on the same piece of silicon. Smart CMOS image sensors provides inspection solutions capable of running at 6000 frames per second with on-chip processing in excess of 600 million pixels per second. This concept represents a quantum-leap in the field of 3D acquisition which opens up a whole range of new possibilities for quality control in electronics and semiconductor production (as well as improved 3D inspection in many other areas).