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Investigation of Impactors on Cell Degradation Inside Planar SOFC Stacks

The impactors on cell degradation inside planar SOFC stacks were investigated using both coated and uncoated Fe–16Cr alloys as the interconnects under stable operating conditions at 750 °C and thermal cycling conditions from 750 to 200 °C. It was found that cell degradation inside the stack is primarily dependent on the interfacial contact between the cathode current‐collecting layer and the interconnect. Additionally, cell degradation is found to be independent of the high‐temperature oxidation and Cr vaporization of the interconnects during stack operation, as the stacks are well sealed. The coating on the interconnect can further improve the contact between the cell cathode and the interconnect when the latter is properly embedded into the current‐collecting layer.