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Compact roll-pitch-yaw gyroscope implemented in wafer-level Epitaxial Silicon Encapsulation process

This paper presents for the first time the design and characterization of an ultra-compact 3-axis roll-pitch-yaw gyroscope which employs a single vibrational element with a torsional drive mode and a multi-directional sense modes. Implemented in wafer-level Epitaxial Silicon Encapsulation (Epi-Seal) process, device occupies an area of 1.2 mm2. Initial characterization reported in this paper includes a scale factor, a noise level, and a cross-axis error measurement.