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Demonstration of board-level optical link with ceramic optoelectronic multi-chip module

This paper demonstrates a complete short-distance parallel optical interconnection on PCB-level basing on ceramic transmitter/receiver modules for high-speed signal conversion, integrated polymeric waveguides and the optical coupling elements. The novel technology for the structuring of PCB-compatible high density parallel optical interconnects will be described in detail. The solution for the optical coupling into the integrated waveguides is based on a micro-optical indirect coupling element with wave guiding structures. The demonstrated optoelectronic modules are 4-channel BGA ceramic multi-chip modules with 4 × 10 Gbps transmission capacity.