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Morphology and Chemical Composition of Ag/In/Ag Interconnections

One of the environment protection’s main aims is working out soldering materials able to replace the Sn-Pb solders commonly used so far. The joint obtained using diffusion soldering fulfills these conditions and takes up 6 times less space than in the case of conventional soldering. Moreover, it can work at the temperatures higher than 350 [°C] and it often shows mechanical and thermal stability at temperatures 2-3 times higher than the joining temperature. This paper presents the morphology and chemical composition Ag/In/Ag joint diffusion-soldered at 193 [°C] for 1.5 and 2 hours. Two intermetallic phases, namely AgIn2 and Ag2In were identified within the joint using an energy dispersive X-ray microanalysis and selected area electron diffraction techniques. Most probably the AgIn2 phase was formed during cooling of the joints from the soldering temperature because its melting point is 166 [°C]. On the other hand, the Ag2In phase is desired as its thermal stability is over 300 [°C]. This phase grows into the solder material (In) relatively fast. The exponential factor n determined from the appropriate kinetic equation was found to be 0.41, which suggests some contribution of the grain boundary diffusion process in addition to the volume diffusion (n=0.5).