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High temperature creep deformation of nanocrystalline diamond films

Abstract Diamond displays a combination of unique properties, including the highest hardness among materials, chemical inertness and high thermal conductivity. Therefore, nanocrystalline diamond films offer a huge potential for industrial applications. In fine-grained ceramics as well as metallic materials, high temperature creep deformation is dominated by grain-boundary-deformation mechanisms that become increasingly important with decreasing grain size. In this work we demonstrate that it is possible to inelastically deform nanocrystalline diamond films at elevated temperatures and stresses that are significantly lower than those reported for single-crystal diamond. The initial, isothermal, transient creep flow exhibits a logarithmic character, typical of creep in general. The isothermal steady state creep deformation, which follows transient creep, is analyzed using a physics-based model for grain boundary sliding rate controlled flow.