{'fraction_non_alphanumeric': 0.020887728459530026, 'fraction_numerical': 0.0039164490861618795, 'mean_word_length': 5.445378151260504, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
58.2: Invited Paper: Suftla Flexible Microelectronics on Their Way to Business

“Suftla,” a technology that enables polycrystalline silicon thin film transistors to be transferred from one substrate to another, is on its way to commercialization. Realizing highly functional large‐scale integrated circuits on plastic, Suftla is on the verge of creating a new industry of flexible microelectronics. for the flexible microelectronics business to be viable, Suftla transfer yield must be as high as possible. In addition, devices formed on plastic must not be damaged during the fabrication process and must be durable enough for practical uses. Plastic engineering is one of the keys to solving thermal reliability problems faced by flexible microelectronics devices.