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Thermal properties and electric field profile in metallized dielectric film adhesively bonded to substrate

For a metallized dielectric film glued to a substrate, we demonstrate the simultaneous determination of the electric field profile and the thermal diffusivity of the film and the heat transfer coefficient of the glue layer using the thermal pulse method and a voltage bias applied to the film. The temperature profile used is the solution of the heat conduction equation for an electroded, substrate-mounted sample with finite heat transfer to the substrate. Substrate mounting prevents unwanted vibrations. The effects of the metallic electrode on the temperature profile are considered. The field distribution due to dielectric charging is determined by deconvolution using the Tikhonov-regularization technique.