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Strain measurements in industrial applications: A case study of solder bumps in semiconductor devices

Understanding strain and strain distribution in industrial materials is critical when studying phenomena as stress fatigue of welds or solder junctions. The microelectronics fields, in particular, struggle with fatigue problems that can accrue under cyclic thermo-mechanical loading. The presence of and plastic strain can lead to the development of a variety of defects, such as fracture and delamination. Ultimately, these defects can lead to microelectronic device failures.