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Abrasive-Free Chemical Polishing of Hard Disk Substrate with Benzoyl Peroxide-H2O2 Slurry

The effect of benzoyl peroxide (BPO) as an initiator in H2O2 slurry for abrasive-free chemical polishing of hard disk substrate was investigated. The results of abrasive-free polishing tests show that the introduction of BPO increases material removal rate (MRR) and decreases the value of Roughness (Ra). To further investigate the mechanism of abrasive-free polishing, electron spin-resonance spectroscopy (EPR) tests, auger electron spectrometer (AES) and electrochemical tests were conducted. Electron spin-resonance spectroscopy (EPR) tests show the concentration of radicals increase and promote the reaction on the surface of hard disk substrate. Auger electron spectrometer (AES) and electrochemical tests indicate chemical changes happen on the surface of hard disk substrate, and the formed oxide film may be sparse or porous. The results imply that the introduction of BPO can effectively improve the effect of abrasive-free polishing.