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Aquiring High-Quality Microscopic Images Through Silicon Without Damaging the Finished Product

Typical microelectronics failure-analysis protocol requires the ability to inspect circuit patterns through silicon, non-destructively, while maintaining the mechanical integrity of the finished product. Noninvasive techniques such as microscopic imaging in the near-IR spectrum provide inspection directly through silicon. Applications include inspection for short circuits within the product (burnout marks, stress indicators, and so on), bonding alignment (analysis of alignment marks between thinly bonded circuits), inspection after electrical testing (any type of failure), and chip damage (defects in materials, contamination, etc.).