{'fraction_non_alphanumeric': 0.007864488808227465, 'fraction_numerical': 0.0, 'mean_word_length': 5.014545454545455, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Heat Reduction Scheme for Multimedia Display Device

The information technology is evolved to accomodate the ever changing end users request for new services. As the request for the high data rate multimedia contents explosively increases the related hardware, software and networking technologies are finding ways to effectively satisfy end users expectation. Aligned with this trend the display device becomes thinner to reduce the weight while supporting high resolution quality for both mobile and indoor usage. The LCD device is now an inevitable component in almost all the information processing appliances. The exothermic problem becomes one of the important issues which should be solved for various applications. In LCD adopted device the relative inside areas gets packed with various types of electronic devices as heat generation sources which include the display driver integrated circuit (IC). One of reasons for this problem is that more and more advanced display devices such as LCD and LED require driver ICs with higher degree of circuit integration within a limited area while demanding higher performances. Also a lot of efforts have been made to reduce the edge areas as the big screen display as well as portable mobile devices are getting popular in many fields. In this paper an enhanced heat sink method is proposed to reduce the heat generation problem caused by the driver ICs to maintain the stability of the operation and to protect the circuits in the chip on film package. The proposed method has advantages over the conventional ones in terms of the unit production price and no limitations on the arrangement of the IC.