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Interferometric techniques applied in packaged MEMS and MOEMS measurement

In this paper, first of all improved techniques are described to measure packaged MEMS or MOEMS surfaces through- transmissive-media (TTM) at higher magnifications. Secondly, a universal housing is presented for TTM-objective line and for different material and thickness of glass. Finally, the measurement results for low and high magnifications will be given for dispersion-compensated objectives, as well as some MEMS application examples.