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A NOVEL DESIGN OF HEAT SINK WITH PCM FOR ELECTRONICS COOLING

Progress in microelectronic industry, which consists mainly in miniaturization, leads to simultaneous increase of the importance of thermal issues. Operation of contemporary microprocessors, which are used in PC computers, is associated with the need to release excess heat flux up to 100 W. Heat flux densities for microprocessors in desktop computers, due to small external surface area, can reach the levels of 106 W/m2, such heat fluxes occur e.g. on the surface of fuel elements in nuclear reactors. Such high heat fluxes must be removed to the environment with limited temperature of the device, to fulfill safety requirements surface temperature shouldn’t exceed 80–90°C.