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Carbon Nanotube Through-Silicon Via: Modeling, Design and Applications

This paper provides a brief description of research on the topic of carbon nanotube filled through-silicon vias (CNT TSVs). The impact of CNT kinetic inductance on the electrical performance of CNT TSVs is considered by utilizing the concept of effective complex conductivity. By virtue of the complex conductivity, the electrical characteristics of the CNT TSVs are obtained and analyzed. The multi-bit CNT TSVs are investigated for transmitting differential signal and improving the power integrity. Further, the variation in CNT kinetic inductance, which cause significant performance degradation,