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Flexible Pressure Sensor With High Sensitivity and Low Hysteresis Based on a Hierarchically Microstructured Electrode

Flexible pressure sensors are crucial for E-skins to enable tactile sensing capabilities. However, flexible pressure sensors often exhibit high hysteretic response caused by internal and external mechanical dissipations in flexible materials. The hysteresis gives rise to reliability issues, especially in the presence of dynamic stress. In this letter, we report a flexible capacitive pressure sensor design with hierarchically microstructured electrodes to obtain both high sensitivity and low hysteresis. The sparsely spaced large pyramid microstructure improves the sensitivity, whereas the small pyramid reduces the hysteresis caused by interfacial adhesion. The optimized sensor shows excellent performances in terms of high sensitivity (~3.73 kPa−1), ultralow detection limits (0.1 Pa), significantly reduced hysteresis (~4.42%), and enhanced sensing capability for pluses, which demonstrates its potential for advanced electronic skins.