{'fraction_non_alphanumeric': 0.015825169555388093, 'fraction_numerical': 0.0, 'mean_word_length': 5.64, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Enabling high reliability power modules: A multidisciplinary task

Reliability of power electronic systems is a major concern for application engineers in the automotive and power system sectors. Power electronic modules are one of the main sources of failure in wind energy conversion systems. Power electronic converters used in wind turbine electric drivetrains, railway traction, more-electric-aircrafts, marine propulsion and grid connected systems like FACTS/HVDC require reliable power devices and modules. Wide bandgap semiconductors like SiC have demonstrated enlarged electrothermal Safe-Operating- Areas compared with silicon devices. However, the reliability of SiC power modules and packages has been identified as an area of potential weakness. Traditional packaging systems have been developed for Si hence the different thermomechanical properties of SiC cause different stresses in the packaging thereby potentially causing reduced reliability. This paper identifies some of the key areas for the development of reliable power electronic systems using SiC. The focus is on condition monitoring, packaging system innovation and thermo-mechanical stress analysis as a function of the mechanical properties of Si and SiC. Power cycling experiments and finite element models have been used to support the analysis.