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High Thermal Conductivity Aluminum Powder Metallurgy Materials

High thermal conductivity aluminum has special advantages for electronic packaging and thermal management applications because of the combination of excellent thermal conductivity and relatively low density. Recent development of new press-and-sinter aluminum materials with low levels of alloying that sinters to a high density yielding a high thermal conductivity approaching the theoretical value for pure aluminum. The sintered materials possess thermal conductivity (TC) exceeding 200 w/m-oK (typically 215 – 230 w/m-oK), which makes it unique, since cast and wrought aluminum materials typically fall below 175 w/m-oK. This allows the benefits of powdered metal for low cost manufacturing at high volumes of parts to be realized. This unique combination of low cost and high TC makes these materials an attractive alternative to higher TC materials such as copper. In addition, a metal matrix composites (MMCs) press and sinter approach to tailoring the coefficient of thermal expansion (CTE) can also be used.