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Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Bands

Antenna-in-Package (AiP) has emerged as a mainstream technology for millimeter-wave (mmWave) front-end modules driving it to meet future requirements. This paper discusses, for the first time, the design, modeling, and characterization of a slot bow-tie antenna (SBT) integrated into an embedded die enhanced quad flat no-lead (EDeQFN) package along with a comparison of a flip-chip version of the eQFN in WR8 (90GHz-140GHz) and WR5 (140GHz-220GHz) frequency bands. Further, a brief description of the design, modeling, and simulation results of mmWave chip-to-package transitions, transmission line structures, and antenna feed elements are provided. The insertion and return losses of these structures are less than 1.07dB and greater than 17dB, respectively for FCeQFN, less than 0.87dB, and greater than 22dB, respectively for EDeQFN package. The bandwidth and gain of the integrated SBT antenna in the above packages are 40GHz and 80GHz, with a peak gain of 7dBi and 7.7dBi in the WR8 and WR5 band, respectively. A brief description of the designed test vehicles, probing and measurement methodology for antenna bandwidth, and radiation pattern characterization in the WR5 frequency band is also presented.