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A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication

A sealing redistribution layer (RDL) approach for the interposer fabrication is developed to simplify the conventional bottom-up process flow. By using this approach, bottom-up plating can achieve the integration of Cu-filler plating and its bottom RDL simultaneously. In this paper, through-glass via in glass interposer or 3-D integration is fabricated using the proposed approach. The electrical measurement and reliability tests indicate that the proposed approach can be an attractive candidate for interposer fabrication with great performance.