{'fraction_non_alphanumeric': 0.02617801047120419, 'fraction_numerical': 0.017452006980802792, 'mean_word_length': 4.917525773195877, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
A self-compensating 130-GHz wire bond interconnect with 13% bandwidth

This paper shows experimental results of a wire bond interconnect for multi-chip modules. The interconnect can be used to connect highly integrated millimeter-wave transceiver ICs with package-integrated off-chip antennas. It uses a half-wavelength long air transmission line that is formed by three parallel wires. Thus a self-matching interconnect is realized that is feasible for frequencies above 100 GHz. Measurement results are shown that prove the high performance with a bandwidth of up to 13%.