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Bonding Temperature Dependence of Optically Controlled Field-Effect Transistor Fabricated by Direct Wafer Bonding Technique

An optically controlled field-effect transistor (FET) in which the GaAs FET region and the GaInAs/InP light absorption region were directly bonded was demonstrated. The temperature dependence of the direct bonding and its effect on the performance of the optically controlled FET were examined. A maximum current modulation rate of 60% and a responsivity of more than 150(A/W) were obtained.