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Numerical Simulation and Characterization of PCB Warpage

In this work an implicit finite element model of a Printed Circuit Board (PCB), connectors, and stiffener is developed. The effect of several parameters on the strain distribution on the board was analyzed. The PCB was bolted to an aluminum stiffener. The simulation went through several steps to consider the effect of the solder reflow process as well as bolt pretention forces and plug-in forces of the connectors. Based on the simulation, board warpage and bolt pretention forces had significant effect on board strain.