{'fraction_non_alphanumeric': 0.008488964346349746, 'fraction_numerical': 0.0, 'mean_word_length': 6.468354430379747, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Surface Quality Requirements And Inspection Techniques For Semiconductor Slices

Modern semiconductor device technology imposes increasing demands on the surface perfection of polished and epitaxial silicon slices. These requirements along with the need for statistical process control call for improved objective, automated and quantifiable inspection techniques. An overview is given over various imperfections of polished and epitaxial silicon slices. Current prevailant inspection techniques are discussed with emphasis on their shortcomings regarding the above mentioned requirements.