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Decompositional electromagnetic analysis of digital interconnects

Essential elements of decompositional electromagnetic signal integrity analysis of PCB and packaging interconnects are introduced in the paper. Digital interconnects can be formally divided into transmission line segments and discontinuities or transitions in lines such as via-holes and connectors. Multiport models of the components can be built separately with the electromagnetic analysis and then united into a complete channel model. This technique is known as decompositional electromagnetic analysis. Bandwidth and quality of multiport models, broadband material models, localization of all elements of a channel and systematic validation process are outlined in the paper as the key elements of the decompositional interconnect analysis that lead to successful analysis to measurement correlation from DC up to 50 GHz.