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Optimization of Manifold Microchannel Heat Sink inside Interposer

In the past 60 years, integrated circuits have been developing in the direction of smaller size and higher integration under the guidance of Moore's law. However, the heat dissipation problem of the chip becomes prominent as the chip size decreases and the integration degree increases. Therefore, this paper presents a manifold microchannel interposer based on advanced packaging technology. Compared with traditional heat sink, the interposer has high heat dissipation performance, low flow resistance, strong compatibility with IC and small thickness. The micro-channel structure of the heat sink optimized by COMSOL™ simulation software and fabricated by etching, photolithography, silicon-silicon direct bonding, thin polishing and other microelectromechanical systems (MEMS). A stable and reliable thermal testing system is designed and tested for the thermal testing of heat sink. The test results show that when the input flow rate is 40 ml/min, the heat dissipation capacity can reaches 550 W/cm2, and the chip surface temperature is only 128 □.