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The Fabrication of the Low Loss Transmission Line and Low Pass Filter using Surface Microelectromechanical Systems Technology

In this study, we first fabricated a new GaAs-based dielectric-supported air-gap microstrip lines (DAMLs) by the surface microelectromechanical systems (MEMS) technology, and then fabricated the low-pass filter (LPF) for the Ka-band using those DAMLs. We elevated the signal lines from the surface in order to reduce the substrate dielectric loss and to obtain low losses at the millimeter-wave frequency band with a wide impedance range. We fabricated LPFs with DAMLs for Ka-bands, and we were able to reduce the insertion loss of LPFs by reducing the dielectric loss of the DAMLs. Miniaturization is essential for integrating LPFs with active devices, so we fabricated a LPF with the slot on the ground metal to reduce the size of the LPF. We compared the characteristics of the LPF with a slot and the LPF without the slot.