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Effect of mold resin on reliability in gold-aluminum bonding

Gold-aluminum wire bonds in LSI is drastically degraded by corrosion of the Au-Al intermetallic compound. This corrosion is due to bromine gas that is emitted when the encapsulant resin is exposed to a high temperature. In this study, temperature dependence of this bond degradation was investigated. Degradation starting times of Au-Al compounds as a function of annealing temperatures ranging from 180 to 280/spl deg/C were studied. The higher the annealing temperature was, the faster shear strength was degraded. Activation energy of this degradation behaviour was calculated to be 110 kJ/mol, which was similar to that of Au-Al intermetallic layer growth. It was found that intermetallic compounds formed with an Au-Al bond by high temperature annealing were corroded by bromine gas at room temperature.