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System power noise analysis using modulated CPM

As the semiconductor industry advances to ever smaller technology nodes, the power distribution network (PDN) is becoming an essential design factor to ensure system performance and reliability. The time domain simulations typically utilize the chip power model (CPM), generated by Ansys RedHawk, as the current load. The typical CPM only includes current consumption in a few clock cycles, which includes the high frequencies components (several hundreds of MHz), but losing mid to low frequencies. This paper describes a modulated CPM (MCPM) design and signoff process for PDN. The first step is frequency domain analysis of PDN to identify the die-package resonance frequency. Then the chip gate level simulation is performed over an extended period of time to generate the VPD (Value Change Dump plus) file, with realistic low to mid frequency current components. This information is then used to modulate the CPM as the current load for the system level time domain noise simulations. This PI analysis flow was validated using a set of three test cases, with reasonable simulation-measurement correlation achieved. This analysis flow enables more effective power/ground plane layout optimization and capacitor optimization in a timely manner.