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Wafer‐Scale High‐Yield Manufacturing of Degradable Electronics for Environmental Monitoring

Degradable electronics that dissolve or disintegrate in the environment after completing target functions are highly desirable due to great capabilities to eliminate the disposal, retrieval, and recycling of electronic waste worldwide. Constructing electronic systems on water‐soluble substrates via transfer printing technology has emerged as a promising approach toward this goal. However, the current approach suffers from low yields and thus hinders the complexity and scale of the obtained system in practical applications. Here, a wafer‐scale manufacturing process is proposed for degradable systems with high yields. As a demonstration, chips based on carbon nanotube thin films are 100% successfully transferred to water‐soluble substrates with an average device yield of 96.6%. Great uniformity is also obtained in the transferred thin‐film transistors (TFTs) and integrated circuits with a minimum standard deviation of 55 and 60 mV in the threshold voltage of TFTs and switching threshold voltage of inverters, respectively. System‐level demonstration of real‐time environmental monitoring is implemented in a simulated ecosystem together with a degradation demonstration under artificial rain. With its combined great performance, processing robustness, and high yields, this technology provides new opportunities for batch manufacturing of degradable electronics and next‐generation ecofriendly sensing platforms for the coming Internet of Things era.