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A quick correction method for the board-level finite element analysis of QFP device under vibration

Electronic devices often work under a variety of vibration loads, especially for aerospace devices. For this reason, the reliability under vibration loading has become a critical problem of modern electronic devices. In recent years, the finite element analysis method develops rapidly. Many researchers conducted vibration analysis through simulation methods. However, due to the material and device structure difference, there is a significant error between the simulated results and the actual value. In this paper, we report a quick correction method, eliminating the errors caused by material properties and structure. We use this method to correct the board model of the quad flat package (QFP) device. The results show that the relative error was within 2 % after correction. This method greatly improves the accuracy of the simulation results and provides a new route for the board-level vibration analysis of devices.