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Characterization of TiAl diffusion bonds using Ni/Ti nanolayers

TiAl alloys exhibit a range of attractive properties and are good candidates to replace heavier alloys in areas where weight reduction is imperative, as in the transportation industry [1,2]. However, the application of these alloys depends on the development of new joining technologies. Due to the difficulties of joining these alloys, alternative approaches to conventional processes are necessary. Diffusion bonding and brazing are promising joining technologies to bond these alloys. The diffusion bonding with reactive multilayer has been successfully used in previous studies [3,4]. A common feature of these multilayers is the large amount of heat released during the reaction between the layers to form a new phase. Also, its nanometric structure confers an inherent high reactivity and diffusivity.