{'fraction_non_alphanumeric': 0.01358695652173913, 'fraction_numerical': 0.002717391304347826, 'mean_word_length': 5.090909090909091, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
A 3D electrothermal simulation tool for integrated power modules

More and more compact converters with high current rates are required. Thus, the switch functions are composed of semiconductor chips associated in parallel within power modules. A safe and reliable conception requires one to consider the electrical side of the module and its cooling at the same time. A 3D electrothermal simulation tool was developed. It solves the heat conduction equation in stationary condition, and the electrical linear system of the parallel association which takes into account the thermal behaviour of each chip. Thus, a whole power module including its cooling can be conceived. Electrical and thermal imbalances of the module can be studied.