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Application of the microbond technique: Characterization of carbon fiber‐epoxy interfaces

Microbonding has been applied to measure the interfacial shear strength, τ, between single carbon fiber and microdroplets of epoxy resins. The effect of thermoset cure and resin modification on this initial parameter for composite performance have been studied. The interfacial shear strength for the host fiber/epoxy system (T-300/Epon 828) increased 3 fold from a B-stage for the host to a fully cured material. The addition of a toughening agent called fortifier P to the host resin system increased τ by 40%. Residual thermal stresses were calculated and their contribution to mechanical adhesion were related to friction components