{'fraction_non_alphanumeric': 0.03339882121807466, 'fraction_numerical': 0.019646365422396856, 'mean_word_length': 4.483870967741935, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Design of an On-Board ESD Protection for USB3 Applications

This paper describes the development of an on-board system level protection for high-speed cable connections (e.g., USB3) with 15 kV robustness and a signal transfer rate of up to 10 Gb/s. A dedicated bipolar process is developed, on a high-resistive substrate with optimized diffusion profiles and a special via-on-via metallization to meet the capacitance target of 0.25 pF. The protection is shown to work well with several popular USB3 chipsets.