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High Thermal Conductive Semi-Sintering Die Attach Paste

Across the electronics spectrum, footprint miniaturization alongside expanded functionality is pushing power densities to the max, increasing heat generation and potentially impacting reliability. The examples are endless. From the growth of smartphone RF bands to the demands placed on data center systems to the proliferation of electronics content in automobiles – all of these illustrate the need for materials capable of managing the thermal load. While high performance thermal interface materials deliver this function at the board and component level, at the foundation of the package – the die level—current solutions either require complex processes or incorporate materials (namely solder) that will soon be phased out due to environmental legislation. This paper will discuss the development of a novel, regulation-compliant die attach paste with robust electrical and thermal performance.