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Fast laser writing technique for laser assisted selective electroless copper deposition on dielectrics surface for in-mold electronics applications

The selective surface activation induced by laser (SSAIL) for electroless copper deposition on PC-ABS blend is one of promoising technique of electric circuit formation on free-form dielectric surfaces, which broadens capabilities of 3D microscopic integrated devices (3D-MID). The process consists of laser excitation, chemical activation of laser-excited areas by dipping in a liquid and electroless copper deposition of laser-treated areas. The limiting factor to increase throughput of the technology is a laser activation step. Laser writing is performed by modern galvanometric scanners which reach the scanning speed of several meters per second. However, adverse thermal effects on PC-ABS polymer surface abridge the high-speed laser writing. In this work, an advantageous laser beam scanning technique by shifted pulse is used to overcome mentioned problems.