{'fraction_non_alphanumeric': 0.026589595375722544, 'fraction_numerical': 0.0, 'mean_word_length': 5.765625, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Analysis of mechanical strength for flip-chip bonding of GaAs MMIC

Increased packaging demands in wireless communications, and military electronics has led to the use of flip-chips for RF and microwave applications. For a reliable bonding of flip-chip interconnection, proper knowledge of bonding parameters and bonding ability to different substrates is important. This paper depicts a comparative analysis of flip-chip bonding of GaAs MMIC (monolithic microwave integrated circuit) to thick/thin film metallization on ceramic substrates (hereinafter thick-film and thin-film), and organic substrates using anisotropic conductive film (ACF), thermo-compression (TC) bonding methods with different bonding parameters. The results from the optimization study of the parameter settings for mechanical reliability of ACF and TC with different substrates are presented