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Low-stress packaging for a MEMS atmosphere pressure sensor

In this paper, a kind of plastic packaging for a MEMS pressure sensor is introduced. The materials and parameters of the packaging are selected and optimized to reduce additional stresses from packaging system so as to improve stability of the device. The packaging system is designed according to dimensions and functions of a kind of silicon piezoresistive pressure sensor. We choose silicon rubber as adhesive to bond chips onto lead-frames instead of epoxy to reduce stresses caused by thermal mismatch. Silicon gel is used to fill in the capsule to protect chip and wires, and the characters of the materials are studied for better stability.