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Finite Element Modeling of Bond Formation in Cold Roll Bonding Processes

The paper aims to present a finite element model for the bond strength evolution in cold roll bonding processes. To accomplish this, first, the micro-mechanisms taking place along the cold welded joint interfaces are explained. Then, based on the microscopic description of cold welding processes, a bonding interface model is employed to describe the bond formation between the rolled metallic layers. The obtained bond strength is calculated based on the governing parameters of the bonding such as the degree of plastic deformation and the surface cleanness. The numerical simulation given in this paper includes the modelling of joining during cold roll bonding followed by the debonding process in Double Cantilever Beam (DCB) peeling test. Finally, the effects of two important factors on the bond formation, i.e. (1) the degree of plastic deformation and (2) the surface cleanness, are numerically investigated.