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Microstructure and electrical properties of Ni–Cr thin films fabricated by ion beam sputtering

Abstract By ion beam sputtering method, Ni–Cr films were fabricated. Then the films were characterised by X-ray diffraction (XRD), atomic force microscopy (AFM), Alpha-Step IQ profilers, four point probe (FPP) respectively. The thin film electrical properties and its microstructure have been probed into. The gauge factor (GF) of the Ni–Cr thin films was determined by cantilever beam method. The results show that the Ni–Cr thin films can be used as piezoresistive films, which present specific characteristics such as relative small temperature coefficient of resistance (TCR), good GF and high sheet resistance.