{'fraction_non_alphanumeric': 0.021883920076117985, 'fraction_numerical': 0.0, 'mean_word_length': 6.205479452054795, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Silicon Waferboard: Challenges And Opportunities For Low-cost Optoelectronic Subsystems

Optical technology is increasingly envisioned as a means for removing some of the performance bottlenecks in systems that heretofore were strictly electronic in nature. Examples of new applications include local loop telecommunications (fiber-to-the-home, fiber-to-the curb) and computer interconnects. In contrast to conventional long-haul telecommunications these systems are composed of many parallel optical channels and thus require large numbers of optoelectronic, electronic and optical components. The conventional approach of using individually-packaged components on printed circuit boards is unlikely to fulfill the high density and low cost requirements of these component-rich applications. New optoelectronic component integration and packaging approaches capable of accommodating the diverse physical, electrical, thermal and optical charac teristics of components such as lasers, photodetectors, integrated circuits and optical fibers are needed.