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Study of electroless copper plating onto PVDF modified by radio frequency plasma treatment

Surface properties of polyvinylidene fluoride (PVDF) films have been modified by treatment in a radio frequency (RF) nitrogen plasma, at different treatment powers (25, 50 and 75 W). The surface properties of the PVDF films before and after RF plasma treatment, as well as the quality of the deposited copper layer, were investigated by various investigation methods (Scanning electron microscopy, atomic force microscopy, ATR-FTIR and contact angle measurements). RF plasma treatment significantly improved the adherence and the quality of the deposited metal layer. The results obtained for PVDF RF plasma treated were compared with those corresponding to a microwave plasma treatment.