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Electronics reliability prognosis through material modeling and simulation

Electronic systems, such as power supplies, are complex multilayered devices consisting of different materials with inherent variability. Thermal gradient cycling occurs during system operation which eventually results in thermo-mechanical fatigue induced material failure. Such material failures can result in immediate electronic system shutdown with no advanced fault or warning signals. This NAVAIR sponsored SBIR project uses state-of-the-art material modeling to predict degradation of circuit board elements as a means for "simulated fault detection". This effort has been focused on the specific aspect of solder fracture and fatigue since electronic industry statistics have attributed this failure issue as a driving factor in system reliability. This project demonstrates feasibility for using conventional sensing, combined with thermal modeling, to predict solder degradation due to thermal cycling as a means to prognosticate electronic power supply system reliability. Current status, as well as future plans, of electronic prognosis development is discussed