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Assessment of thermo-mechanics for an integrated power electronics switching stage

With the growing demands on the performance, cost, and the advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging and reduced electrical parasitic losses. On the other hand, thermal management of the 3D package and the influence of thermomechanical effects on the module reliability become important issues. This work assesses different shape and size configurations of the contact interface between the deposited copper metallization and the silicon device in a power electronic switching stage. Considering the thermal management and thermo-mechanically developed stresses, the best interconnect pattern is presented.