{'fraction_non_alphanumeric': 0.028546712802768166, 'fraction_numerical': 0.007785467128027681, 'mean_word_length': 6.012121212121212, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Structural and electronic characterization of Cu/Au(111) near-surface alloys

Geometrical structure and electronic characteristics of ultrathin metallic films of one metal on another are strongly influenced by factors such as lattice mismatch and formation of near-surface alloys. Doped systems often show modified chemico-physical properties which may be amenable to different reactivity routes. Copper–gold surface alloys have received the attention of several studies, only a few of which have been undertaken in an ultra-high vacuum environment, using surface sensitive techniques. In this contribution, systems produced upon room temperature deposition of copper on the (22 × √3)-Au(111) surface, at various copper loadings and annealed to different temperatures, are investigated using scanning tunneling microscopy and synchrotron radiation based techniques (X-ray photoelectron diffraction, photoemission), with comparison with some theoretical modeling. Overall the fcc lattice is essentially maintained on preparation. Upon thermal treatments structural and compositional changes, in favor of alloyed structures with tetragonal packing, are seen.