{'fraction_non_alphanumeric': 0.03099510603588907, 'fraction_numerical': 0.009787928221859706, 'mean_word_length': 4.961165048543689, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 1, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering

We demonstrated that Au/Pt/Ti (from top to bottom) metal multilayers enables wafer-level packaging of degassed assemblies and residual gas gettering. A hermetic sealing was fabricated by Au surfaces after degassing annealing at 200°C. In addition, the Ti underlayer atoms diffused to the internal surface by annealing at 450°C, enabling the gas in the package. As the Au/Pt/Ti layers have the functions of the bonding layer and gas getter, the proposed packaging technique can potentially simplify a vacuum sealing process.