{'fraction_non_alphanumeric': 0.01828410689170183, 'fraction_numerical': 0.0, 'mean_word_length': 5.033898305084746, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Productivity improvement in the wafer bevel and backside cleaning before exposure

The Back-side Surface Treatment ("BST") is a module that cleans the backside of a wafer just before a process on the exposure system. To support immersion lithography, Tokyo Electron introduces a bevel cleaning function to this module. This enables cleaning of both wafer backside and bevel section at the same time. We evaluate the new BST module for wafer cleaning performance, wafer backside cleaning performance and wafer topside particle control performance. The effectiveness of the BST module is tested in an actual production line. It is proved that the introduction of the BST module reduces defocus and blocked images.