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Schottky-barrier image sensor with 100% fill factor

A new concept, the Direct Schottky Injection (DSI), is described for a three-dimensional construction of infrared imagers with a continuous Schottky-barrier-detector surface on one side of a thinned (10 to 25 microns) silicon substrate and p-type buried-channel CCD readout structure on the other side. The DSI structure provides a 100-percent fill factor, a large charge-handling capacity, and a high-density pixel design. The construction and operation are described for DSI imagers with frame-transfer CCD (FT-CCD) and interline-transfer CCD(IT-CCD) readout. The operation of the IT-CCD DSI imager was demonstrated with a 128 x 128 focal plane array (FPA) with 50 x 50-micron pixels.