{'fraction_non_alphanumeric': 0.017582417582417582, 'fraction_numerical': 0.002197802197802198, 'mean_word_length': 5.601449275362318, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Allocating solder-paste printing inspection in high-volume electronics manufacturing

The paper describes an optimization model for allocating solder-paste printing inspection that explicitly considers the economic tradeoff between board yield and inspection accuracy. The paper also shows that the use of a heuristic solution method for solving the post-printing inspection allocation model is effective and efficient for high-volume electronics manufacturing. The model has been developed using real production and visual inspection data provided by a high-volume electronics manufacturer located in Huntsville, AL. In addition, randomly generated problems are used to evaluate the performance of the proposed heuristic. Results from a large case study show that when compared with a full post-printing inspection, the heuristic approach provides a solution that can increase the total expected gains by 15%.