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Design strategy of small topographical guiding templates for sub-15nm integrated circuits contact hole patterns using block copolymer directed self assembly

Block copolymer (BCP) directed self-assembly (DSA) is a promising extension of optical lithography for patterning irregularly positioned contact holes of integrated circuits. The small topographical templates are shown to guide the self-assembly off the natural geometry by strong boundary confinement [1-2], and has been demonstrated to pattern 22nm random logic circuits using [2-3]. Here we present a general template design strategy that relates the DSA material properties to the target technology node requirements and experimentally demonstrated DSA contact hole patterning for half adders at the 14 nm and 10 nm nodes.