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FE Modeling and Analysis of Structural Adhesive T-Joint at Elevated Temperature

Adhesive bonding is a joining technique that offers great design flexibility as it can be effectively integrated into practically available industrial sequences of single-piece work. Adhesive is seldom used in high-temperature structural applications that exposed to extreme environment, particularly in the granulation application. Granulator fluidization bed is a main component of urea granulator system in fertilizer plant. Perforated plate and frame structure are normally joined together using plug welding techniques. However, this technique has been proven unreliable. Plug welding technique requires specific amount of heat and welding speed to avoid excessive metal melting (304L Stainless Steel) due to a thin perforated plate, i.e. 1.25 mm. Moreover, fluidization bed is exposed to operating temperature of 95°C. This research aims to examine adhesively-bonded T-joints in tension at temperatures between room temperature and 100°C. This is also to identify the effective bond thickness at different temperatures by testing specimens with various bond thicknesses. The experimental result obtained used for validation by FE model of adhesive T-joint.