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Thermal performance of a flat polymer heat pipe heat spreader under high acceleration

This paper presents the fabrication and application of a micro-scale hybrid wicking structure in a flat polymer-based heat pipe heat spreader, which improves the heat transfer performance under high adverse acceleration. The hybrid wicking structure which enhances evaporation and condensation heat transfer under adverse acceleration consists of 100 µm high, 200 µm wide square electroplated copper micro-pillars with 31 µm wide grooves for liquid flow and a woven copper mesh with 51 µm diameter wires and 76 µm spacing. The interior vapor chamber of the heat pipe heat spreader was 30×30×1.0 mm3. The casing of the heat spreader is a 100 µm thick liquid crystal polymer which contains a two-dimensional array of copper-filled vias to reduce the overall thermal resistance. The device performance was assessed under 0–10 g acceleration with 20, 30 and 40 W power input on an evaporator area of 8×8 mm2. The effective thermal conductivity of the device was determined to range from 1653 W (m K)−1 at 0 g to 541 W (m K)−1 at 10 g using finite element analysis in conjunction with a copper reference sample. In all cases, the effective thermal conductivity remained higher than that of the copper reference sample. This work illustrates the possibility of fabricating flexible, polymer-based heat pipe heat spreaders compatible with standardized printed circuit board technologies that are capable of efficiently extracting heat at relatively high dynamic acceleration levels.