{'fraction_non_alphanumeric': 0.01839080459770115, 'fraction_numerical': 0.0, 'mean_word_length': 5.507462686567164, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
An asynchronous wafer bonding method using spot pressing technique

A novel asynchronous wafer bonding method based on Spot Pressing Bonding (SPB) using thermo-compression bonding spot by spot with Ti/Au as intermediate layer is proposed and investigated. It is demonstrated that SPB is effective in bonding wafers with patterned, rough or contaminated surfaces. The SPB bonding mechanism is confirmed experimentally and theoretically.