{'fraction_non_alphanumeric': 0.00816326530612245, 'fraction_numerical': 0.0, 'mean_word_length': 6.014285714285714, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Characterization of copper voids in damascene processes

The introduction of copper Damascene processing into integrated circuits has brought about a host of new defectivity issues, especially those related to pitting and voiding. These defects must be understood and eliminated to achieve competitive manufacturing yields and assure device reliability. This paper reviews various defect inspection methodologies that are useful for characterizing copper voids and their electrical effects.