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Semi-empirical stress/energy-based acceleration of temperature cycling failure

Acceleration models used in microelectronic packaging are important for determining failure estimates during a product's useful life. However, many of the models used in determining qualification requirements are based on empirically observed trends in historic fail modes and are parameterized based on extrinsic factors such as cycling temperature range. As new materials and packaging configurations lead to new failure modes, it is important that the acceleration is parameterized based on intrinsic factors such as stress, strain, and energy in order to accurately extrapolate end user failure rate estimates. This work proposes an acceleration model for thermomechanical cycling based on intrinsic accelerating factors.