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Chip Package Interaction (CPI) Stress Modeling

In order to address the Chip-Package Interaction (CPI) risks associated with advanced silicon packaging, GLOBALFOUNDRIES has developed Finite Element (FE) models to simulate the mechanical stress in the Backend of Line (BEoL) and Far Back End of Line (FBEoL) during the flip-chip assembly process and multiple reflow (MR) cycling test. This paper discusses the complexity involved in the CPI mechanical performance and use of various modeling methods to assess and mitigate the CPI failure risk. The paper also highlights the quantitative package model validation against experimental data based on newly developed Cohesive Zone Material (CZM) modeling methodology.