{'fraction_non_alphanumeric': 0.017829457364341085, 'fraction_numerical': 0.003875968992248062, 'mean_word_length': 4.894977168949771, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Investigation of Solder Void Improvement on Automotive Parts

As to fulfill the demand of the market on high voltage power application, an 8mm x 8mm footprint package are introduced. This package has the advantages of low resistance, high electrical efficiency, and space efficiency. Additionally, it passes both the automotive AEC-Q101 requirement and industrial grades, which make it robust for customer application. As a continuous improvement to increase the yield of this package, zero defect approach was in focused. One of the opportunities observed are at the reflow process, where unit are reflowed to solidify the solder for good connection. To ensure good connection, solder void is required to be as minimum as possible. Solder void are a natural behavior from the solder reflow process which is hard to control and minimize due to its material behavior. To reduce solder void, vacuum reflow oven are chosen for study due to the fact it is widely used in the semiconductor industry to give better void reduction. This paper will present the mechanism of vacuum oven in void reduction. In conclusion, vacuum reflow performs better in reducing the void size and occurrence rate compared to standard reflow process. Other than that, yield losses related to void were also improved.