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Modeling and Simulation of Low-Cost Composite Fiber-to-Chip Edge Coupler for Photonics and MEMS Packaging Applications

Structural modeling and performance analysis are proposed for a novel low-cost composite fiber-to chip edge coupler based on tapered silicon nitride spot size converter(SSC) and glass/polymer cladding. Fiber-to-chip coupling efficiency using the edge coupler is modeled and analyzed through Finite Element Analysis(FEA) and EigenMode Expanion(EME) Method. fabrication process of the composite edge coupler is demonstrated. This low-cost and robust edge coupler is promising for the future photonics and micro-electro-mechanical(MEMS) packaging applications.