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Evidence of dislocation loops as a driving force for self-annealing in electroplated Cu films

This paper demonstrates the existence of dislocation loops and their influence on the kinetics of self-annealing in electroplated Cu film. Plating with higher deposition rate produces more dislocation loops in the Cu film, resulting in faster self-annealing process. Kinetic calculations including this effect give a good correspondence to the experimental observations.