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Contactless Air-Filled Substrate Integrated Waveguide

The contactless version of the air-filled substrate integrated waveguide (AF-SIW) is introduced for the first time. The conventional AF-SIW configuration requires a pure and flawless connection of the covering layers to the intermediate substrate. To operate efficiently at high frequencies, this requires a costly fabrication process. In the proposed configuration, the boundary condition on both sides around the AF guiding medium is modified to obtain artificial magnetic conductor (AMC) boundary conditions. The AMC surfaces on both sides of the waveguide substrate are realized by a single-periodic structure with the new type of unit cells. The PEC–AMC parallel plates prevent the leakage of the AF guiding region. The proposed contactless AF-SIW shows low-loss performance in comparison with the conventional AF-SIW at millimeter-wave frequencies when the layers of both waveguides are connected poorly.