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Mechanical characterization of shape memory micromaterials

A characterization method based on beam-bending experiments and finite element simulations has been developed. Calibrated microweights are applied to double-beam test devices with typical beam widths of 100 micrometers and lengths of 2 mm to determine load-dependent displacements with a maximum resolution of about 2 (mu) N and 2 micrometers , respectively. The resulting characteristics are used to determine the corresponding stress-strain characteristics, transformation temperatures and stress-rates of the material. The method has been used to study test devices of TiNi thin sheets with thicknesses d between 160 and 20 micrometers and of sputtered thin films (d equals 8 micrometers ) microfabricated by laser cutting or electrolytic photoetching. The measurements did not show any influence of the microfabrication processes. An investigation of size effects in test devices with decreasing thicknesses revealed enhanced transformation hystereses for thicknesses in the order of the grain size.