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Development of 3-dimensional module package, "System Block Module"

As the mobile electronics equipment moves toward higher performance and miniaturizing, each IC package is required to be stacked for saving a package mounting area on a system board. This paper describes a newly developed 3-dimensional module package using the technology of the silicon device thinning, micro flip chip bonding and two types of via connection of print circuit board for vertical wirings. These technology has realized the high density packaging of over 4 ICs stacking for practical use.