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Substrate layout evaluation for T-type three-level IGBT modules

As a recently emerged topology and due to its advantages, T-type three-level converters have been gaining rapidly growing applications. This paper investigates the method to evaluate both the electrical and thermal performances of the T-type module substrate layout design. Convenient and efficient methods to evaluate stray inductance and thermal behavior within the module are used instead of the time consuming approach such as Finite Element Analysis. A case study of the substrate layout designs for a 1200V/100A T-type module is given to present the implementation of the evaluation methods. Sample modules adopting the studied layout designs have been fabricated, and tests have been done to verify the evaluation of stray inductances.