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Thermal and electrical comparison of different joining techniques

After the enforcement of Restriction of Hazardous Substances Directive, one of the biggest problems in electronics is finding a substitution for led solders. Meanwhile, working conditions for the electronics are tougher and tougher – the temperatures the joints have to withstand can be much higher than working temperatures of the soft solders. In current article, the authors present the Low Temperature Joining Technique (LTJT) with the use of pastes based on the mixture of silver nanoparticles and silver microflakes. The authors also show the technology of joining, justify their sintering parameters selection and compare their silver joints with Pb solder and adhesive. The joints prepared with pastes containing silver nanoparticles have much better electrical and thermal properties than the ones made with other techniques.