{'fraction_non_alphanumeric': 0.011673151750972763, 'fraction_numerical': 0.0, 'mean_word_length': 6.054794520547945, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Advanced packaging technologies in MOSFETs for power management

The existing consumer electronic market demands an overall system miniaturization, and in particular miniaturization of power conversion circuits and their associated power MOSFETs. This has created a need for smaller devices with higher power performance, yet without sacrificing power performance. Advanced silicon technologies combined with surface mount power packages are designed to serve the ever-increasing demands placed on power designers.