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Physics-based device aging modelling framework for accurate circuit reliability assessment

An analytical device aging modelling framework, ranging from microscopic degradation physics up to the aged I-V characteristics, is demonstrated. We first expand our reliability oriented I-V compact model, now including temperature and body-bias effects; second, we propose an analytical solution for channel carrier profiling which-compared to our previous work-circumvents the need of TCAD aid; third, through Poisson's equation, we convert the extracted carrier density profile into channel lateral and oxide electric fields; fourth, we represent the device as an equivalent ballistic MOSFETs chain to enable channel “slicing” and propagate local degradation into the aged I-V characteristics, without requiring computationally-intensive self-consistent calculations. The local degradation in each channel “slice” is calculated with physics-based reliability models (2-state NMP, SVE/MVE). The demonstrated aging modelling framework is verified against TCAD and validated across a broad range of VG/VD/T stress conditions in a scaled finFET technology.