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Minimizing electromagnetic interference in power-ground cavities

In this paper, electromagnetic interference (EMI) in power-ground cavities is quantified for conventional layer stack-ups used in low-cost electronic packaging. Traditional methods to minimize EMI and their limitations are discussed. Our novel approach to minimize EMI by minimizing/preventing the excitation of parallel-plate-modes in power ground cavities is then presented. Finally, the advantages of our approach in ensuring Electromagnetic Reliability (EMR) of microsystems are discussed.