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Studies on MCM – D interconnections

In the context of the development of the ATLAS Pixel Detector [1], a multi chip module technology called MCM–D (multi chip module deposited) has been studied to implement the high density interconnect. The results of some first assemblies using ’standard’ sensor designs have been reported in [2]. The focus of this note is on the first results of assemblies optimized to the capabilities of this technology, namely the possibility to build uniformly segmented sensors. Special attention is spent to the studied option of an ’equal sized bricked’ sensor design.