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Immunity simulation method for automotive power module using electromagnetic analysis

This paper provides an immunity simulation method for product-level automotive power modules that contain printed circuit boards (PCBs). A stress-strength model is adopted as an estimation method for the susceptibility. The stress is the value of the RF power injected into a victim circuit, and the strength is the acceptance stress criteria of the victim circuit. By using electromagnetic simulation, the stress of the victim circuit is calculated. The strength of the victim circuit is determined by the DPI test result. By comparing the stress and strength of the victim circuit, the susceptibility thresholds can be predicted. The results show good agreement with the experimental results in the DPI test for a power module containing a complex product-level PCB and exhibit a good correlation with the BCI test for the power module.