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Analysis of interface cracks in layered piezoelectric composites by a SGBEM

Piezoelectric materials offer many possibilities in advanced engineering structures due to their inherent coupling effects between mechanical and electrical fields and are widely applied in smart devices and structures like transducers, actuators and sensors [2]. An important application of piezoelectric materials is related to layered or laminated composites because they can be optimized to satisfy the high‐performance requirements according to different in‐service conditions. Beside cracks inside homogeneous domains, one of the most dominant failure mechanisms in layered or laminated composites is the interface failure. Interface cracks and interface debonding may be induced by the mismatch of the mechanical, electrical and thermal properties of the material constituents during the manufacturing process and the in‐service loading conditions. This paper presents a hypersingular symmetric Galerkin boundary element method (SGBEM) for crack analysis in two‐dimensional (2D), layered and linear piezoelectric solids. (© 2011 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim)