{'fraction_non_alphanumeric': 0.02973977695167286, 'fraction_numerical': 0.020074349442379184, 'mean_word_length': 5.26046511627907, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
A novel fabrication process and measurement results of a 28GHz glass antenna with single TGV for 5G communication applications

Next generation 5G millimeter wave (mmWave) communications systems have recently generated a slew of novel device designs and fabrication approaches [1–2]. mmWave antenna on glass substrate with through-glass-vias (TGVs) structure is one of the promising candidates to achieve 2.5D interposer and 3D packaging applications. In this study, we developed a novel approach for fabricating a 1×4 mmWave phased array antenna on a selected low-loss glass substrate with a single (TGV) structure for 28 GHz 5G mmWave wireless communication applications. The new approach includes double-sided PVD Ti/Cu deposition, double-sided highly conformal Cu plating, double-sided lithography, TGV sidewall Cu protection, Ti/Cu wet etching and double-sided photoresist (PR) stripping. In addition, characterization results of the fabricated 1×4 series-connected patch antenna array are also presented in this article. The measured data shows antenna efficiencies greater than 70% and realized peak gains of at least 10 dBi at carrier frequencies ranging from 27.8 GHz to 28.85 GHz. These results confirm that good antenna performance can be achieved successfully through this novel fabrication approach on a low RF loss glass substrate.