{'fraction_non_alphanumeric': 0.017804154302670624, 'fraction_numerical': 0.0, 'mean_word_length': 5.837837837837838, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Static Properties Research of Grinding Dynamometer for Wafer Grinder

Grinding force is strongly related to grinding process, and the application of dynamometer for its measurement during machining is essential for investigating, monitoring and optimizing the grinding process. This paper presents an innovative dynamometer for triaxial grinding force measurement, specifically designed for an ultra-precision grinder. Two different kinds of spatial arrangements are discussed, including lozenge and square arrangement. The mathematical model is established and calculated. Furthermore, a series of static calibration tests have been conducted for the dynamometer, and static properties of the grinding area are also measured and analyzed. Eventually, on-line static tests of the dynamometer installed in silicon wafer grinder are performed. The results show that the grinding dynamometer has excellent properties, which reach the CIRP standards and meet the working requirements of the ultra-precision grinder.