{'fraction_non_alphanumeric': 0.009414225941422594, 'fraction_numerical': 0.0010460251046025104, 'mean_word_length': 5.337748344370861, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Basic investigation of cooling performance at upstream side of bend to develop 1-dimensional thermal design scheme

This study describes a cooling performance in a rectangular bend that a sudden contraction or a sudden expansion simultaneously occurs. This flow pattern can be found in high-density packaging electronic equipment such as laptop or desktop computers. In order to predict cooling performance in electronic equipment using rapid thermal design scheme such as a thermal resistance network analysis, a prediction of heat transfer coefficient cannot be done easily by using conventional formulas for calculating the performance in simple ducts. This paper especially investigated the heat transfer in the upstream side of the bend in the rectangular duct with the sudden contraction or the sudden expansion through the CFD analysis. We found that the cooling performance was dependent on the cross-sectional area ratio of the bend significantly.