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Phase Transformation of Single Crystalline Silicon by Scratching

The relationship between the phase transformation and the stress applied on single-crystalline silicon wafer was studied by performing a scratch test. The cracks and phases were observed by optical microscopy and micro Raman spectroscopy, respectively. Various silicon polymorphs and crack shapes were observed as functions of speed and direction of the scratching, respectively. Atomic force microscopy was also carried out to analyze the morphology of the scratch grooves.