{'fraction_non_alphanumeric': 0.01218369259606373, 'fraction_numerical': 0.0, 'mean_word_length': 5.0, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Effect of Magnetic Field on Microstructure and Properties of Smart Solder

The smart solder has been developed for the geometry control by the external magnetic field, which could be attractive for the application in the electronic packaging industry. However, the knowledge about the smart solder is still in a preliminary stage. In this paper, for the soldering of smart solder under an external magnetic field, the effect of Ni content and magnetic field on the wetting and spreading of solder was studied by melting the smart solder balls on a polished copper plate. The mechanism of magnetic field was analyzed for the wetting and spreading process of smart solders. The interfacial IMC between the smart solder and the copper plate was studied. The influence of the magnetic field on the interface morphology and phase of the IMC was analyzed. The mechanical properties, interface IMC and fracture morphology of copper soldering were compared with and without magnetic field, and the effect of magnetic field on the soldering joint was comprehensively analyzed.