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A Novel Interconnect Structure for DSM Technologies

Interconnects are the basic need for any circuit completion. They can vary from size to size whether short or long. Where they are used to provide a connection between two or more blocks, they can also have certain issues that an IC designer faces while designing. One such issue can be technology scale down. With technology scale down, interconnects not only become closer with each other but their dimensions also change which can directly impact the circuit parameters. Certain wire (RC) models have already been defined to control these parameters but in this paper, a new structure is proposed to reduce delay and power consumption of interconnects. The complete circuits are modeled and simulated using SPICE tool. A comparison is done between the existing model and the proposed model in terms of overall speed.