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Thermal modeling and optimization for electronic packages

QFP (Quad Flat Package) has been widely used in modern electronic packages and its reliability has been paid a lot of attention. A general thermal resistance network of QFP is presented in this paper and the total thermal resistance has been estimated. A 3D model of the QFP-48 has been established and the thermal simulation has been done in ANSYS software. The equivalent total thermal resistance has been calculated according to the simulated results and compared with the estimated value at the same time. Some methods about thermal optimization for QFP package have been put forward and verified. The conclusions presented here are expected to provide the thermal design guidelines for QFP package.