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Candidate thermally enhanced polymer composite materials for cooling of electronic systems

Driven by the low density, corrosion resistance, manufacturability, and low raw material and manufacturing costs of polymer composites materials, considerable attention is currently being devoted to the innovation, characterization, and implementation of such materials. In this this study the thermal and mechanical properties, and injection moldability of a broad range thermally-enhanced, commercially-available polymeric composite materials are reviewed to help identify candidate materials that could replace conventional metal alloys in electronic cooling heat sink and heat exchanger applications. The material property characterization data reviewed essentially consists of vendor data generated in accordance with applicable characterization standards. From twenty five commercially-available polymeric composite materials, two promising candidate groups of materials, namely polyphenylene sulfide (PPS) and polyimide 66 (PA66), are identified.