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New process for the controlled formation of ultrathin PtSi films for infrared detector applications

A simple method for controlling the thickness of PtSi for infrared detectors is presented. Thicknesses of PtSi in the range of 2 - 5 nm can be controlled via the reaction kinetics of the silicidation. Compared to conventional furnace anneal, the thickness and homogeneity of the resulting PtSi-layers are independent of the deposited Pt-thickness. Superior uniformity, lower continuous film thicknesses of the PtSi-layers, and smoother PtSi/Si-interfaces than possible by conventional furnace anneal are achieved by applying this technique.