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Modeling of stacked-coil inductor from silicon integrated passive device technology

Stacked-coil inductor could be realized on multilevel thin-film structure with the configuration of two or more coils placed in different levels but shared the same magnetic flux. The configuration results mutual inductance to increase total inductance per unit area, it could make inductor compact to meet requirement of circuit on novel consumer electronic terminators. The metal coils of inductor on different levels are isolated by polymers which is an important component of IPD technology. Mechanical properties of polymers have strong influence on electric characteristic, which should be considered in model and will present in this paper. The scalable parameters of model are also extracted to implement process design kit (PDK) with parameterized inductors which could be used in system in package (SiP) or 3D IC interposer for RF applications.