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Recent developments in micromachining of fused silica and quartz using excimer lasers

The characteristics and abilities of excimer lasers for micromachining of fused silica and crystal quartz are reviewed and their applications for making high‐precision and high‐quality microstructures are studied. In addition to the direct ablation technique, two special techniques: laser‐induced backside wet etching and laser‐induced plasma‐assisted ablation, are included in the review. In addition to the basic principle and equipment set‐up, the fundamental processing parameters for each technique are presented and evaluated. The importance of utilizing these parameters for micromachining is illustrated by developing specific formula for each technique in guiding each machining step for making different curved and arrayed structures for various industrial applications. The machined geometries and surface morphologies are also examined. The pros and cons of each technique are then discussed. Finally, recommendations for future efforts for better micromachining the fused silica and quartz are presented. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)