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Inverted E shaped dipole antenna with corrugated substrate for mm-wave applications

Abstract This paper presents a novel E armed dipole antenna for System On Chip (SOC) applications in the Sub-THz frequency band. The antenna is printed on a corrugated silicon substrate which suppresses surface waves and provides high efficiency and gain. The corrugated substrate also provides a better impedance matching. The antenna has a simulated gain of 5.4 dBi and 3 dB beam-width of 83.5 degree. The proposed antenna also has a very high radiation efficiency of 90%. Antenna resonates at 141.8 GHz and has an approximate −10 dB bandwidth of 1 GHz. To investigate the effects of different design parameters, some parametric analysis has been carried out and results have been shown. An equivalent circuit model has been reported. The equivalent circuit has been used to find the resonant frequency of the proposed dipole. The deviation of simulated and calculated resonant frequency is less than 0.5% which is well within the acceptable limits for antennas operating in mm-wave and sub-THz frequency band. This antenna is well suited for SOC, radar on-chip, high gain arrays, etc.