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Tektronix Component Solutions: Chip-on-Flex

Offering similar benefits to a chip-on-board solution, chip-on-flex (COF) technology shortens the signal path down to the substrate level, reducing interconnect length and associated parasitics. In addition to shortening interconnects, a chip-on-flex IC package is also able to bend, making it a good solution for devices with tight spacing requirements.

With precision die attach capabilities, advanced wire bonding services and a variety of encapsulation options - including low-cost glob - Tektronix Component Solutions can develop a custom chip-on-flex solution to enable your next generation system development.

Typical Chip on Flex Assembly Process:

Tektronix Component Solutions' typical COF assembly flow is as follows:

  1. Die Attach - Solder or epoxy die attach processes
  2. Wire Bond - Ball bond, wedge bond; aluminum or gold wire bond material
  3. Encapsulation - Low-cost glob and various other encapsulation options

Tektronix Component Solutions also offers chip-on-flex design and test services to provide a complete turnkey development solution.