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The next generation advanced MEMS& sensor packaging

The needs of ambient intelligence and miniaturization of electronics require extensive integration of semiconductor components such as MEMS and sensor. A MEMS/sensor package needs access to environment via open windows, which is a challenge for MEMS or sensor packaging/encapsulation. An exposed window is needed to access to the environment for encapsulated MEMS package like gas and liquid sensors. Generally, the exposed die and MEMS/sensor are brittle and can not stand large stress. By clamping the film around the chip's functional area, the surface of the chip is protected from the compound and will be bleed and flash free. Comparing to steel clamping, the clamping force can decrease dramatically with soft film conpensation. Boschman Film Assisted Molding (FAM) technology can meet the packaging demand of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the next generation advanced MEMS microsystem with low cost and excellent performance.