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Effect of the annealing temperature on the long-term thermal stability of Pt/Si/Ta/Ti/4H–SiC contacts

The Pt/Si/Ta/Ti multilayer metal contacts on 4H–SiC are annealed in Ar atmosphere at 600 °C–1100 °C by a rapid thermal processor (RTP). The long-term thermal stability is evaluated by aging the annealed contact at 600 °C in air. The contact’s properties are determined by current–voltage measurement, and the specific contact resistance is calculated based on the transmission line model (TLM). Transmission electron microscope (TEM) and energy-dispersive x-ray spectrometry (EDX) are used to characterize the interface morphology, thickness, and composition. The results reveal that a higher annealing temperature is favorable for the formation of an Ohmic contact with a lower specific contact resistance, and causes the rapid degradation of the Ohmic contact in the aging process.