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Development of reflow soldering processes using heaters' operation control

Investigation deals with development of reflow soldering processes for some kinds of electronics components, difficult for soldering to PCBs, such as BGA (ball grid array) packages and LEDs mounted on metal substrates. Soldering processes for such kind of objects are complicated and failures are more probable. To solve these problems new kind of soldering equipment is proposed to be used. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. Experiments show that by proper control of the operation of the heaters, of gas flow circulation and by some small changes in the heating camera desirable temperature profiles can be realized and problems with soldering can be solved successfully.