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Synchrotron X-Ray Topography for Encapsulation Stress/Strain and Crack Detection in Crystalline Silicon Modules

In this paper, we present the first experiment to prove the capabilities of X-ray topography for the direct imaging and analysis of defects, stress, and strain affecting the cell within the laminated photovoltaic (PV) module. Cracks originating from grain boundaries structures have been detected, developing along the cleavage planes of the crystal. The strain affecting the cell is clearly visualized through the bending of the metallization line images and can be easily mapped. While the recording conditions need to be optimized to maximize image contrast, this experiment demonstrates how synchrotron facilities can enable PV industry and research to characterize full PV modules. Appropriate development of the technique could also lead to future use of laboratory-level X-ray sources.