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Process Modeling and Optimized Parameter Selection During Transient Liquid Phase Bonding

The kinetics during the transient liquid phase (TLP)-bonding process is numerically modeled by treating base metal dissolution, liquid phase isothermal solidification and solute homogenization as sequential processes. The numerical results are compared with analytical solutions and with actual experimental test results during TLP-bonding of single-crystal nickel base metal using Ni-19 at.% P filler metal. Based on this study, the optimum conditions during TLP-bonding occur when the solute diffusivities in the liquid and solid phases are increased, and when the highest bonding temperature is employed