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Development of high performance bonding machines with improved motion control and intelligent fine tuning algorithm

Motion related bonding accuracy study is needed to build up the correlation between motion tracking performance and bonding accuracy. Based on links between bonding specifications and motion performance, grading can be given to motion performance to represent acceptable bonding accuracy. A diagnostic tool is developed to check motion performance periodically and fine tune motion performance to healthy condition in case motion performance is not good or healthy enough for accurate bonding. An intelligent approach is promoted in this paper to fine tune parameters to satisfy multiple targets of dynamic and settling performance requirements. This intelligent fine tuning approach, with achievable multiple motion targets, provides a solution to optimize motion system performance on bonding machines, so as to further improve bonding performance. The idea proposed in this paper helps on development and smooth mass production of semiconductor packaging equipment.