{'fraction_non_alphanumeric': 0.006772009029345372, 'fraction_numerical': 0.0, 'mean_word_length': 5.8307692307692305, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Cooling Microstructure for Automotive Electronic Module

The paper presents the general overview of the cooling microstructure concept dedicated for automotive electronic systems. It introduces the first design stage of the micro heat sink and presents preliminary simulations that consider adaptation of automotive coolants. The theoretical discussion is supported by simulations and calculations that were led with the aid of ANSYS software.