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Process and technology choices for manufacturing high density interconnections on silicon surstrates for multichip modules

Multichip module technology provides an advanced method for connecting integrated circuit chips together to produce a circuit assembly with minimum chip-to-chip spacing. The naked IC chips are attached to a substrate which is provided with a dense pattern of interconnections. The metal track widths on this substrate are finer than those that are possible in conventional hybrid circuits. In this paper, the emphasis is placed on multichip modules based on silicon hybrid technologies where silicon substrates, metal tracks and organic inter level dielectric are used. Processes for manufacturing such substrates have been developed at GEC-Marconi Materials Technology. The type of alloys suitable for forming the metal tracks and the methods available for depositing and patterning such alloys will be discussed. The relative merits of these choices and their implications on the manufacturability of the substrate will be considered. The criteria for choosing an organic dielectric and the techniques which can be used for' patterning it to provide vias between the metal layers are also discussed. The multi-layer interconnect structures produced underwent structural analysis and the electrical integrity was assessed.