{'fraction_non_alphanumeric': 0.011879049676025918, 'fraction_numerical': 0.0, 'mean_word_length': 5.621428571428571, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
A novel platform for next generation pad conditioning

CMP pad conditioning has advanced rapidly in sophistication and robustness over the past couple of decades. The realization of the importance of pad conditioning in defining the pad asperity structure and the corresponding progression from adapting generalized diamond grinding tools to specialized designs for CMP has resulted in significant process improvements. In this paper, we will introduce a new, novel conditioning platform that incorporates a range of state-of-the-art design features including precise diamond placement, tip leveling and shape control as well as utilizing robust diamond crystals that are virtually impervious to fracture under typical CMP process conditions. This degree of control enables improved performance in terms of lifetime and consistency, as well as opening up previously unavailable design options such as mixed media conditioners.