{'fraction_non_alphanumeric': 0.016516516516516516, 'fraction_numerical': 0.0, 'mean_word_length': 4.8, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Magnetic Current Imaging using multi path analysis for power short localization

Magnetic Current Imaging (MCI), a sub technique of Magnetic Field Imaging (MFI), has been used for more than a decade to localize shorts at the package as well as die and wafer level in a non-destructive way. One particular hard category of shorts to localize is a short between power and ground; the so called power shorts. We show in this paper that MCI can localize power shorts in a simple way by using a multi current path strategy through multiple scans by connecting different power and ground connections and using magnetic phase image analysis for sharper signal localization.