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Effect of IC package on radiated susceptibility of board level interconnection

In this paper the effect of integrated circuit (IC) package on radiated susceptibility of board level interconnection is investigated. A closed form expression is derived for the induced voltage response of an IC pin in the frequency domain, which considered the loading effect of IC internal circuit and its package. The configuration is located on printed circuit board (PCB) exposed to an external electromagnetic field. Moreover, simulations have been done to verify the effect of package lead on susceptibility of IC. The influence of the wave frequency and the illumination angle on the amplitude of induced voltages is studied. The IC internal circuit and its package behave as a high pass filter. It attenuates the low frequency signals, but as frequency increases, the filter efficiency decreases.