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Beyond ASTM D 5470 - The Impact of Boundary Conditions on Steady-State Thermal Interface Material Characterization

This paper addresses factors of the characterization process of thermal interface materials (TIMs) relevant for specific practical applications that are beyond the scope of the ASTM D 5470 standard. These factors include the thermal expansion of the test heads; the size, shape and tilt of the test clamp surfaces, as well as the stacking of samples to measure bulk conductivity. The influence of these factors was tested using the TIMA test stand, which offers testing capabilities within and beyond the scope of standard ASTM D 5470. It was found that these factors significantly influence the thermal performance of TIMs. This means that a measurement done in explicit conformance with ASTM D 5470 does not guarantee a result that represents the behaviour of the TIM in an application scenario.