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Plasma Surface Modification of Polymer Backsheets: Origins of Future Interfacial Barrier/Backsheet Failure

Flexible polymer substrates coated with inorganic oxide moisture barriers are a potential replacement for glass backsheets in thin-film PV (photovoltaic) modules. Silicon oxynitride (SiOxNy ) deposited by plasma enhanced chemical vapor deposition (PECVD) on polyethylene terephthalate (PET) represents one potential new backsheet candidate. Barrier deposition runs at NREL have included a nitrogen-rich plasma pretreatment prior to barrier deposition with the intention of cleaning the PET surface and enhancing adhesion of the SiO xNy barrier film to PET; however, test coupons of PET/barrier/EVA/TPE failed after damp-heat exposure. (EVA is ethylene vinyl acetate and TPE is Tedlar-PET-EVA). PET substrates exposed to plasma conditions similar to those used in pretreatment were examined by X-ray photoelectron spectroscopy (XPS) to reveal that new low molecular weight PET fragments were created at the PET surface. These fragments are responsible for barrier/PET interfacial failure and barrier transfer to the EVA encapsulant side following damp heat exposure