{'fraction_non_alphanumeric': 0.02332657200811359, 'fraction_numerical': 0.0030425963488843813, 'mean_word_length': 6.204379562043796, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Application of solderable devices for assembling three-dimensional power electronics modules

Power semiconductor bond wires are known to cause high interconnection resistance, switching noise, parasitic oscillations, nonuniform current distribution, and fatigue failure. The wire-bonded device and modules are also limited to unidirectional heat dissipation that limits packaging density. Consequently, they are difficult to integrate into three-dimensional multichip packages that are expected to offer improved system performance. Our research and development efforts aim to investigate three-dimensional packaging of integrated power electronics modules (IPEMs) where interconnections are provided via bond-wireless techniques. This paper presents the application of solderable power devices for building 30 kW, 3-D bond-wireless IPEMs. Experimental results show that the solder interconnection of power devices in the modules significantly lowers resistance, parasitics, and noise.