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Application of signal reconstruction techniques to shot count reduction in simulation driven fracturing

Traditionally, Variable Shape Electron Beam (VSEB) mask writing tools generate pixel-based optical proximity correction (OPC) or inverse lithography technology (ILT) masks by first simplifying them into a rectilinear polygon, and then partitioning the rectilinear polygon into shots. However, as these masks are complex and curvilinear, this approach results in an explosion of shot count and mask write time, and a loss of optimality of the OPC solution. In this work we propose an alternative fracturing approach to minimize mask write time in which the shot location, size, and dose are determined using the mask fabrication model. In doing so we allow shots to overlap in order to reduce the shot count while maintaining mask and wafer quality. Our approach is based on overcomplete signal expansion algorithms which have traditionally been used for sparse representation and compression of images and videos. Our simulation results on a 45nm random logic and contact hole circuit show shot count reduction by as much as 50%.