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White Paper : Through-Silicon Via Interconnection Reliability Assurance System 1

Ridgetop Group is developing a solution addressing the quality and reliability problems of applications that deploy “2.5D” and “3D” packaging technology for integrated circuits (ICs). Ridgetop’s research seeks to deploy a combination of innovative techniques for improved verification of the quality and reliability of 2.5/3D IC packaging and to provide prognostics so that related interconnect operational faults can be determined before actual failure occurs.