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Stop‐Flow Lithography of Colloidal, Glass, and Silicon Microcomponents

The assembly of oxide and non-oxide microcomponents from colloidal building blocks is central to a broad array of applications, including sensors, optical devices, and microelectromechanical systems (MEMS), as well as to fundamental studies of granular materials. Progress in these areas has been hindered by the availability of colloidal microcomponents of precisely tailored size, shape, and composition. Hence, there is tremendous interest in developing new patterning methods for creating precisely tailored microcomponents composed of colloidal building blocks, amorphous or polycrystalline oxides, and silicon. For example, colloidal-based microcomponents produced in simple non-spherical shapes, such as discoid, triangular, cuboid, and rectangular, may serve as novel granular feedstock for ceramics, optical display technologies and pharmaceuticals. Traditional methods for producing colloidal granules, such as fluid bed granulation, high shear mixer granulation, and spray drying, do not provide adequate control over granule size, shape, or composition. Equally important is the need to create porous and dense oxide and non-oxide microcomponents for functional devices ranging from micro-mixers and heat exchangers to MEMS. Although several fabrication methods have been recently introduced, including lithography, electroplating and molding (LIGA), micro-extrusion, microinjection molding, micro-stereolithography, and microelectro-discharge machining, each lacks the materi-