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Fine-line structuring of microwave components on LTCC substrates

Low Temperature Co-fired Ceramics (LTCC) are used in a wide range of RF and microwave applications. The ceramic multilayer technology provides a truly three-dimensional circuit technology, hermetical sealing, hybrid integration, and favorable microwave properties at moderate costs. In order to take advantage of high frequencies with guided wavelengths of the order of millimeters, a precision of lines and spaces better than the resolution of 50 µm available with standard patterning methods is crucial.