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An investigation of internal heat flux in SiC/AlN/Epoxy composites by mesoscopic simulation

Polymer-matrix composites play an important role as packaging material in superconducting equipment. The research on thermal conductivity of composites by combining computer numerical simulation and reference data can not only save the expenses but also shorten the period of material development. Herein, the internal heat flow of silicon carbide/aluminum nitride/Epoxy composites was simulated by COMSOL finite element software. And the thermal conductivity calculated by the finite element software is compared with the existing thermal conductivity mechanism. Meanwhile, the influence of the fraction, gap distance, interfacial thermal resistance, etc. on the thermal conductivity of composites was analyzed. In short, it can provide a reference for the thermal conductivity design of polymer composites.