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USING DYNAMIC MECHANICAL ANALYSES TO PROBE THE GLASSY STATE RESPONSE OF A Sub-Tg ANNEALED MODEL EPOXY NETWORK

Using dynamic mechanical analyzers the relaxation behavior of a loosely cross-linked model epoxy resin was investigated before and after room temperature aging. Preliminary results indicate a stiffening of the storage moduli occurs below –50 °C, the β relaxation temperature of the epoxy network, with a subsequent softening of the network above room temperature and a drop in the apparent glass transition temperature ( g T ). of the material