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Thermal diffusivity measurement using thermographic method and performance evaluation by impedance spectroscopy for thermoelectric module

The thermal diffusivity of two bulk thermoelectric elements and a thermoelectric module was measured by an infrared camera using a thermographic method without any contact in air at room temperature. The estimated values for the elements (3.45 × 10−6 m2/s for a BiSb sample and 1.60 × 10−6 m2/s for a BiTe sample) were slightly larger than those measured in vacuum. The difference was explained as the effect of heat convection on the surface of the samples by solving the one-dimensional heat conduction equation numerically. The thermal diffusivity of thermoelectric elements in a thermoelectric module was also estimated using the thermographic method, and values of (1.1–1.7) × 10−6 m2/s in air were obtained, depending on the element. On the basis of the measurement results, the performance of the module was estimated using impedance spectroscopy, which can estimate not only the dimensionless figure of merit but also the thermal loss and response. The thermal response and thermal loss in air were similar to those in vacuum; however, the dimensionless figure of merit was 0.82 in vacuum and 0.70 in air.