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Thermal Properties of Laser‐Fabricated Copper–Carbon Composite Films on Polyimide Substrate

The growing demand for highly efficient heat management in flexible electronics requires fabrication of highly conductive flexible films. Herein, Cu–C film on a polyimide (PI) substrate is fabricated to form a layered Cu–C/PI composite conductive film using direct laser writing. Its oxidation resistance is significantly improved compared with the written Cu film due to the presence of a graphite shell on Cu particles in the Cu–C film. Furthermore, the Cu–C/PI composite film shows better thermal properties than Cu/PI. This work provides a one‐step method for rapidly fabricating Cu/PI and Cu–C/PI composites with good thermal stability and conductivity.