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3D-IC technology and reliability challenges

Three-dimensional (3D) ICs using TSVs are the most promising candidate for high performance and low power computing since they have lots of advantages such as short wiring length, small chip size, and small pin capacitances, as shown in Fig. 1 [1]. Until now, several kinds of 3D-ICs including image sensor chip, shared memory, and retinal prosthesis chip have been fabricated successfully.