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Equivalent surface impedance based mixed-potential integral equation for 3-D model of on-chip passive components

This paper proposes mixed-potential integral equation (MPIE) with equivalent surface impedance for 3-D model of on-chip passive components in multilayered media. The equivalent surface impedance model depicting the loss characteristics of conductors with finite-scale cross section is derived from boundary integral equation (BIE) in 2-D. The governing mixed-potential integral equation is solved through method of moments with Rao-Wilton-Glisson(RWG) and Rooftop basis functions. During the matrix filling procedure of method of moments (MoM), the spatial-domain Green's functions with observation and source points in different layers are interpolated from values in the adjacent layers, which has been precalculated using discrete complex image method. Numerical results validate the precision of the proposed method.