{'fraction_non_alphanumeric': 0.02032520325203252, 'fraction_numerical': 0.0, 'mean_word_length': 5.847222222222222, 'pattern_counts': {'":': 0, '<': 0, '<?xml version=': 0, '>': 0, 'https://': 0, 'lorem ipsum': 0, 'www.': 0, 'xml': 0}, 'pii_count': 0, 'substrings_counts': 0, 'word_list_counts': {'cursed_substrings.json': 0, 'profanity_word_list.json': 0, 'sexual_word_list.json': 0, 'zh_pornsignals.json': 0}}
Intelligent defect localization methodology through the use of photoemission spectral analysis

Point defects in CMOS circuits may generate single or multiple emission spots, not necessarily coincident with the physical defect. In this study we show how photoemission spectrum analysis (PSA) is used to discount secondary emissions. Spectrum-based defect layer judgements enable intelligent, targeted etch-back decisions. The feasibility of performing backside PSA analysis is also discussed.