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The effect of voids at the Cu3Sn/Cu interface on the failure behavior of the Cu/Sn63Pb37 solder joints under high-speed shear loading

Solder joints between electrodeposited Cu pads on printed circuit boards and Sn63Pb37 solder balls are prepared, and static ball shear test and high-speed ball shear test of such solder joints are carried out. The effect of voids at the Cu3Sn/Cu interface on the mechanical properties of the solder joints is studied, especially on the failure behavior of the solder joints under high-speed shear loading. The results show that the fracture occurs inside the Sn63Pb37 eutectic solder matrix both under static shear loading and under dynamic shear loading, which implies that the voids at the Cu3Sn/Cu interface have negligible effect on the static and high-speed shear failure mode for the solder joints of Cu /Sn63Pb37.