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Packaging of radiation and particle detectors

Packaging of semiconductor detector modules has been one of the most promising research projects at Fraunhofer IZM. The applications vary from X-ray detection for medical diagnostics to particle detection for fundamental physical research. Starting from feasibility studies a high yield manufacturing process has been established. In this paper the bumping and assembly technology of pixel detector modules is exemplified by the manufacturing of modules for the setup of the ATLAS pixel detector at the large hadron collider (LHC) at CERN, Geneva. The pixel contacts and the interconnection bumps are deposited by electroplating. Yield is one of the most important parameters for the implementation of multichip module (MCM) concepts. Therefore a high yield manufacturing technology requires consistent electrical test and optical inspection on wafer level as well as on chip level running in parallel to the production process. A total module yield of 98% for packaging of 1000 MCMs each having 16 flip-chips has been achieved. Further examples of pixel detectors packaged at Fraunhofer IZM are presented in this paper. These are complex particle detector prototypes with diamond sensor material and pixel detector modules for X-ray imaging. The different amount of readout chips assembled on one sensor substrate and the amount of modules for the assembly of the whole detector require different manufacture technologies from single chip processing up to processing on wafer level